CN104849218B - 分组来自抛光基板的光谱数据 - Google Patents

分组来自抛光基板的光谱数据 Download PDF

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Publication number
CN104849218B
CN104849218B CN201410578917.XA CN201410578917A CN104849218B CN 104849218 B CN104849218 B CN 104849218B CN 201410578917 A CN201410578917 A CN 201410578917A CN 104849218 B CN104849218 B CN 104849218B
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China
Prior art keywords
spectrum
several
substrate
group
computer
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CN201410578917.XA
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English (en)
Chinese (zh)
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CN104849218A (zh
Inventor
J·D·戴维
B·A·斯韦德克
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN104849218A publication Critical patent/CN104849218A/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201410578917.XA 2013-10-25 2014-10-24 分组来自抛光基板的光谱数据 Active CN104849218B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/063,740 US10012494B2 (en) 2013-10-25 2013-10-25 Grouping spectral data from polishing substrates
US14/063,740 2013-10-25

Publications (2)

Publication Number Publication Date
CN104849218A CN104849218A (zh) 2015-08-19
CN104849218B true CN104849218B (zh) 2019-09-13

Family

ID=52996349

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410578917.XA Active CN104849218B (zh) 2013-10-25 2014-10-24 分组来自抛光基板的光谱数据

Country Status (4)

Country Link
US (2) US10012494B2 (ko)
JP (1) JP6466131B2 (ko)
KR (1) KR102279663B1 (ko)
CN (1) CN104849218B (ko)

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* Cited by examiner, † Cited by third party
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US10012494B2 (en) 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
JP7023062B2 (ja) * 2017-07-24 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
US11577356B2 (en) 2018-09-24 2023-02-14 Applied Materials, Inc. Machine vision as input to a CMP process control algorithm
JP7389718B2 (ja) * 2020-06-29 2023-11-30 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
WO2022005916A1 (en) 2020-06-29 2022-01-06 Applied Materials, Inc. Film thickness estimation from machine learning based processing of substrate images

Citations (5)

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CN101770584A (zh) * 2009-12-30 2010-07-07 重庆大学 高光谱遥感数据鉴别特征提取方法
CN101960580A (zh) * 2008-02-29 2011-01-26 应用材料公司 利用近红外线光谱反射的先进处理感测与控制
CN102884613A (zh) * 2010-05-05 2013-01-16 应用材料公司 用于终点检测的动态或适应性追踪光谱特征
CN102893377A (zh) * 2010-05-12 2013-01-23 应用材料公司 垫窗插入
CN103155110A (zh) * 2010-08-06 2013-06-12 应用材料公司 将测量光谱匹配至参考光谱以进行原位光学监测的技术

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US6271047B1 (en) 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
US6361646B1 (en) 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
TW398036B (en) 1998-08-18 2000-07-11 Promos Technologies Inc Method of monitoring of chemical mechanical polishing end point and uniformity
US6358327B1 (en) 1999-06-29 2002-03-19 Applied Materials, Inc. Method for endpoint detection using throttle valve position
US6491569B2 (en) 2001-04-19 2002-12-10 Speedfam-Ipec Corporation Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP
US6676482B2 (en) 2001-04-20 2004-01-13 Speedfam-Ipec Corporation Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling
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KR101593927B1 (ko) * 2005-08-22 2016-02-15 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
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US10012494B2 (en) 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
CN101960580A (zh) * 2008-02-29 2011-01-26 应用材料公司 利用近红外线光谱反射的先进处理感测与控制
CN101770584A (zh) * 2009-12-30 2010-07-07 重庆大学 高光谱遥感数据鉴别特征提取方法
CN102884613A (zh) * 2010-05-05 2013-01-16 应用材料公司 用于终点检测的动态或适应性追踪光谱特征
CN102893377A (zh) * 2010-05-12 2013-01-23 应用材料公司 垫窗插入
CN103155110A (zh) * 2010-08-06 2013-06-12 应用材料公司 将测量光谱匹配至参考光谱以进行原位光学监测的技术

Also Published As

Publication number Publication date
JP6466131B2 (ja) 2019-02-06
US20150120242A1 (en) 2015-04-30
US20180321026A1 (en) 2018-11-08
US11774235B2 (en) 2023-10-03
KR102279663B1 (ko) 2021-07-19
US10012494B2 (en) 2018-07-03
JP2015091616A (ja) 2015-05-14
CN104849218A (zh) 2015-08-19
KR20150048073A (ko) 2015-05-06

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