CN104832889A - Direct type backlight module - Google Patents
Direct type backlight module Download PDFInfo
- Publication number
- CN104832889A CN104832889A CN201410047781.XA CN201410047781A CN104832889A CN 104832889 A CN104832889 A CN 104832889A CN 201410047781 A CN201410047781 A CN 201410047781A CN 104832889 A CN104832889 A CN 104832889A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- backlight module
- circuit
- light emitting
- type backlight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention discloses a direct type backlight module comprising a heat dissipation plate, a plurality of groups of lamp bars mounted on the heat dissipation plate, a coating layer and a group of primary power supply converting elements. Each light bar comprises a circuit board, a plurality of light-emitting diodes arranged on the circuit board and a plurality of connection wires electrically connected to a circuit of the circuit board and the light-emitting diodes. The coating layer coats the light bars and extends to the heat dissipation plate, so that the safety requirement can be met; and the heat energy generated by the running light-emitting diodes is converted to electromagnetic wave and is radiated outwards, thereby achieving the effective heat dissipation effect. The primary power supply converting elements are used for supplying high power supply converting efficiency to the overall module; by virtue of the application of high-power light-emitting diodes, the number of used light-emitting diodes is reduced, so that the overall cost is reduced.
Description
Technical field
The present invention relates to a kind of direct type backlight module, refer to a kind of direct type backlight module that can meet safety demand and also can reduce costs especially.
Background technology
Consult Fig. 1, existing downward back photo structure comprises several lamp bar 11, a slice being provided with multiple light emitting diode 1 and coated copper foil 14 and locks fixing metal backing 12 for described lamp bar 11, and one group of power source drive device 13 providing described lamp bar 11 electric energy.
Copper Foil 14 construction on this each lamp bar 11 has current conducting path (scheming not shown), and with the function of large area heat conduction, described light emitting diode 1 correspondence is arranged on this current conducting path, and start is luminous when obtaining electric energy, meanwhile, the used heat of described light emitting diode 1 start generation light then reaches this metal backing 12 through Copper Foil 14 and effectively dispels the heat.
Consult Fig. 2, the external AC power supplies 15 of this power source drive device 13 and provide described lamp bar 11 electric energy after converting this AC power supplies 15 to stable DC electric energy again.In more detail, because existing lamp bar 11 constructively belongs to the secondary side device that could drive again after needs are isolated, so this power source drive device 13 has one meet safety isolation effect to provide the direct current transducer 16 of stable dc power supply, and the electric pressure converter 17 of one group of boosting, and the direct current of described lamp bar 11 burning voltage can be provided, and then make described light emitting diode 1 start luminous.
Existing downward back photo structure does not have any shortcoming in application, but the lamp bar 11 due to existing direct type backlight module belongs to secondary side device and does not have the requirement in safety, therefore, just must adopt the power source drive device 13 with the direct current transducer 16 meeting safety isolation effect, and the overall power supply conversion efficiency of the power source drive device 13 so designed is lower, and design is higher with processing procedure cost, and cannot be applied in the machine of lower-order design.
Summary of the invention
The object of the present invention is to provide and a kind of the lamp bar with light emitting diode is considered as primary side device, and can under the prerequisite meeting safety, the direct type backlight module that design is all lower with processing procedure cost.
So direct type backlight module of the present invention comprises a slice heat sink, many group lamp bars, a coating, and one group of primary power source conversion element.
Described lamp bar is arranged on this heat sink, and each lamp bar comprise one piece of circuit board with circuit, many respectively to the circuit of circuit board being arranged at light emitting diode on this circuit board, and many are electrically connected the circuit of this circuit board and the connecting line of described light emitting diode respectively.
This coating is an insulation and thermal transition can be become the material of electromagnetic wave outside radiation, this coating does not cover described light emitting diode ground and is at least coated with on the board, and cover this circuit board in contrast to the upper surface, the circuit that connect this heat sink, and described connecting line.
This primary power source conversion element is electrically connected with described lamp bar, and can directly provide electric energy to make described lumination of light emitting diode.
Beneficial effect of the present invention is: utilize this insulating coating coated on described lamp bar and this heat sink to become electromagenetic wave radiation to go out the thermal power transfer produced during LED operation and dissipation or conduct to this heat sink, with heat radiation speed, and the primary power source conversion element borrowing this coated designs to make cooperation adopt meets safety demand, and reach the order ground reducing design and processing procedure cost simultaneously.
Accompanying drawing explanation
Fig. 1 is a stereogram, and existing direct type backlight module is described;
Fig. 2 is a circuit diagram, and auxiliary view 1 illustrates the power source drive device of existing direct type backlight module;
Fig. 3 is a stereogram, and a preferred embodiment of direct type backlight module of the present invention is described.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in detail.
Consult Fig. 3, a preferred embodiment of direct type backlight module of the present invention comprises a slice heat sink 5, many group lamp bars 2, one deck coating 3, and one group of primary power source conversion element 4.
This heat sink 5, and can heat by conduction fast made by the materials such as metal or alloy.
Described lamp bar 2 is arranged on this heat sink 5, and each lamp bar 2 comprise one piece of circuit board 21 with circuit, many respectively to should the circuit of circuit board 21 be arranged at light emitting diode 22 on this circuit board 21, many be electrically connected the circuit of this circuit board 21 and the connecting line 23 of described light emitting diode 22 respectively, and a slice is positioned at the heat conduction paper tinsel 24 between this circuit board 21 and heat sink 5.
This coating 3 adopts insulation and thermal transition can be become the material of electromagnetic wave outside radiation, and do not cover described light emitting diode 22 ground and be at least coated on this circuit board 21, specifically, be coated on described lamp bar 2 and the upper surface extending to this heat sink 5 forms, in more detail, the coating of this coating 3 covers this circuit board 21 in contrast to the upper surface connecting this heat sink 5, circuit, and described connecting line 23, and the scope Edge Distance 6 ~ 8 millimeters that to be wire and coating 3 nearest, and make connecting line 23 and heat sink 5 possess at creepage distance (creepagedistance) the safe distance district that meets safety, coating 3 more extends out on heat sink 5 from described circuit board 21 periphery, to guarantee safe distance district.
This primary power source conversion element 4 is electrically connected with described lamp bar 2 and can directly provides electric energy to make described light emitting diode 22 luminous.In more detail, lamp bar 2 is considered as primary side element by direct type backlight module of the present invention, so this primary power source conversion element 4 adopts non-isolation type power supply changeover device, makes overall power supply conversion efficiency higher, therefore the cost of converter capable of reducing power source.
When this primary power source conversion element 4 provides electric energy to described lamp bar 2, and go out current conducting path via the circuit of this circuit board 21 and this connecting line 23 construction and drive described light emitting diode 22, described light emitting diode 22 is operated.The used heat that light emitting diode 22 during work produces is passed to this heat sink 5 sheds via this circuit board 21, this heat conduction paper tinsel 24, and be transmitted to this coating 3 by described connecting line 23, the material behavior of this coating 3 is utilized to become electromagenetic wave radiation to go out and dissipation thermal power transfer, so the function of quick heat radiating can be reached.
Design due to this invention can make overall power supply conversion efficiency improve, and the effect of dispelling the heat efficiently can be reached, so described light emitting diode 22 can be replaced to the light emitting diode 22 of relatively high power, and the quantity of described light emitting diode 22 can be reduced, there is identical effect can reduce again the cost of described lamp bar 2 during to reach running.
In sum, this coating 3 is coated on described lamp bar 2 and this heat sink 5, with the requirement making this direct type backlight module meet safety, to increase the security in use.And the thermal power transfer that the light emitting diode 22 in work can be produced becomes electromagenetic wave radiation to go out and reaches quick heat radiating effect in large area, more because the primary power source conversion element 4 of the present invention power supply conversion efficiency that is supplied to integral module is higher, so described light emitting diode 22 is replaced with the light emitting diode 22 of relatively high power, therefore the quantity of described light emitting diode 22 can be reduced, so the cost that usefulness can reduce again described lamp bar 2 such as to reach, so really object of the present invention can be reached.
Claims (3)
1. a direct type backlight module, comprise: a slice heat sink, and the many groups of lamp bars be arranged on this heat sink, each lamp bar comprises one piece of circuit board with circuit, many respectively to the circuit of circuit board being arranged at light emitting diode on this circuit board, and many are electrically connected the circuit of this circuit board and the connecting line of described light emitting diode respectively, it is characterized in that:
This direct type backlight module also comprises one deck insulation and thermal transition can be become the coating of electromagnetic wave outside radiation, and one group is electrically connected with described lamp bar and directly can provides the primary power source conversion element that electric energy makes described lumination of light emitting diode, this coating does not cover described light emitting diode ground and is at least coated with on the board, and cover this circuit board in contrast to the upper surface, the circuit that connect this heat sink, and described connecting line.
2. direct type backlight module according to claim 1, is characterized in that: this coating is also coated on this heat sink from the outward extending safe distance district of described circuit board periphery.
3. direct type backlight module according to claim 2, is characterized in that: this each lamp bar also comprises a slice and is positioned at heat conduction paper tinsel between this circuit board and heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410047781.XA CN104832889A (en) | 2014-02-11 | 2014-02-11 | Direct type backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410047781.XA CN104832889A (en) | 2014-02-11 | 2014-02-11 | Direct type backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104832889A true CN104832889A (en) | 2015-08-12 |
Family
ID=53810953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410047781.XA Pending CN104832889A (en) | 2014-02-11 | 2014-02-11 | Direct type backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104832889A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101754538A (en) * | 2010-02-01 | 2010-06-23 | 佛山市伊戈尔电业制造股份有限公司 | Adjustable photocontrol circuit of LED (light-emitting diode) lamp |
| JP3173051U (en) * | 2011-05-11 | 2012-01-19 | ジョウチュウ テクノロジー シーオー エルティーディー | Light source device, backlight module, liquid crystal display |
| CN202746991U (en) * | 2012-05-11 | 2013-02-20 | 鹤山市银雨照明有限公司 | LED illuminating lamp |
| CN203202844U (en) * | 2013-05-04 | 2013-09-18 | 普罗旺斯科技（深圳）有限公司 | Novel liquid crystal display backlight device and display |
| CN103369806A (en) * | 2013-07-24 | 2013-10-23 | 深圳市朗文科技实业有限公司 | Electronic ballast of single stage circuit structure |
| CN203387732U (en) * | 2013-07-05 | 2014-01-08 | 东贝光电科技股份有限公司 | Ceiling lamp adopting non-isolated driving circuit |
-
2014
- 2014-02-11 CN CN201410047781.XA patent/CN104832889A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101754538A (en) * | 2010-02-01 | 2010-06-23 | 佛山市伊戈尔电业制造股份有限公司 | Adjustable photocontrol circuit of LED (light-emitting diode) lamp |
| JP3173051U (en) * | 2011-05-11 | 2012-01-19 | ジョウチュウ テクノロジー シーオー エルティーディー | Light source device, backlight module, liquid crystal display |
| CN202746991U (en) * | 2012-05-11 | 2013-02-20 | 鹤山市银雨照明有限公司 | LED illuminating lamp |
| CN203202844U (en) * | 2013-05-04 | 2013-09-18 | 普罗旺斯科技（深圳）有限公司 | Novel liquid crystal display backlight device and display |
| CN203387732U (en) * | 2013-07-05 | 2014-01-08 | 东贝光电科技股份有限公司 | Ceiling lamp adopting non-isolated driving circuit |
| CN103369806A (en) * | 2013-07-24 | 2013-10-23 | 深圳市朗文科技实业有限公司 | Electronic ballast of single stage circuit structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150812 |