CN104826821B - Chip electronic component checks selecting device - Google Patents
Chip electronic component checks selecting device Download PDFInfo
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- CN104826821B CN104826821B CN201510063513.1A CN201510063513A CN104826821B CN 104826821 B CN104826821 B CN 104826821B CN 201510063513 A CN201510063513 A CN 201510063513A CN 104826821 B CN104826821 B CN 104826821B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- General Physics & Mathematics (AREA)
- Sorting Of Articles (AREA)
- Engineering & Computer Science (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
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- General Engineering & Computer Science (AREA)
Abstract
The present invention relates to chip electronic components to check selecting device.It provides and checks that the chip electronic component for sorting small chip electronic component checks that the inspection of the chip electronic component of selecting device sorts the realization that the efficiency of operation improves, the improvement of the generation for the reduction for inhibiting inspection precision at a high speed using being required.Chip electronic component checks that selecting device includes the chip electronic part conveyance disk being pivotally supported by base station in a manner of revolvable, the component supply receiving portion for the open-work for making the supply of chip electronic component be contained in conveyance disk being sequentially arranged along the rotating path of conveyance disk, the inspection portion of the electrical characteristic of chip electronic component, and check the division for finishing chip electronic component, the device is characterized in that, the chip electronic component removing unit that the abnormal chip electronic component of housed state being equipped in making open-work supplying front position of the back-end location of receiving portion to inspection portion from chip electronic component and in the position of the rotating path along conveyance disk is detached from from open-work.
Description
Technical field
The present invention relates to check its electrical characteristic to each chip electronic component for having electrode in opposed end face
Then based on the inspection result come the chip electronic component inspection selecting device for sorting chip electronic component of classifying.
Background technology
Along with the output of the small-sized electric product such as portable phone, smart phone, LCD TV, electronic game machine
Increase, the output for being programmed into the small chip electronic component of such electric product significantly increases.Chip electronic component
Each electrode having generally by main part and in two opposed end faces of main part is formed, such as chip capacitor
（Also referred to as sheet capacitor）, chip resistor（Including chip rheostat）And the electronic unit quilt that chip inductor etc. is small
Widely utilize.
In recent years, the electric product being incorporated into corresponding to chip electronic component miniaturises and is programmed into electrical production
The increase of the quantity of the chip electronic component of product, miniaturising for chip electronic component are being in progress.For example, about chip
Capacitor uses minimum size in recent years（For example, being referred to as the size of 0.2mm × 0.2mm × 0.4mm of 0402 chip）'s
Capacitor.Such small chip electronic component is a collection of with tens thousand of ~ hundreds thousand of such unit quilts by mass production
Production.
In the electric product that chip electronic component is incorporated into, generally in order to reduce the defect due to chip electronic component
Electric product percent defective and the chip electronic component to largely manufacturing carry out exhaustive test.For example, about chip electricity
Container, generally to its total inspection for carrying out the electrical characteristics such as static capacity, leakage current.
The inspection of the electrical characteristic of a large amount of chip electronic component needs to carry out at high speed, as carrying out the high speed
The device of inspection, in recent years, generally using having the conveyance disk to be formed there are many open-work（Chip electronic component temporarily holds plate）
Chip electronic component electrical characteristic inspection and the device that sorts（After, sometimes referred to as chip electronic component inspection is selected
Other device）.In the conveyance disk, many open-works of the interim chip electronic component for accommodating check object are circumferentially to press a row
Or the state that multiple row is arranged is formed.Then, in chip electronic component inspection selecting device in use, implementing
Following operation：Chip electronic component is accommodated temporarily in the open-work of the conveyance disk in rotation status, to the housed state
Chip electronic component makes the rotating path along the conveyance disk and a pair of electrodes terminal for setting up（Inspection contact shoe）Contact
The defined electrical characteristic that the chip electronic component is measured in each electrode of chip electronic component, subsequently, based on the measurement knot
Fruit makes chip electronic component eject and sorted in a manner of being accommodated from the open-work of conveyance disk to defined container（Or point
Class）.
That is, it includes that the chip electronic component of lower part such as is examined that the inspection selecting device of chip electronic component, which is generally possible into,
Look into selecting device：Base station；Chip electronic part conveyance disk, is pivotally supported in a manner of revolvable by base station, but in the chip
Electronic unit conveyance disk, which is circumferentially formed with each more than two that can be housed in opposed end face temporarily, has electricity
The open-work of the chip electronic component of pole；And it is supplied along the chip electronic component that is sequentially arranged of rotating path of the conveyance disk
To receiving portion, electrical characteristic inspection portion and division, chip electronic component supply receiving portion makes chip electronic component supply
The open-work of the conveyance disk is given and is contained in, electrical characteristic inspection portion carries out the inspection of the electrical characteristic of chip electronic component
It looks into, the division is classified based on inspection result come the chip electronic component finished to inspection.
For example, in the case where carrying out the inspection of static capacity of chip capacitor, by electrical characteristic inspection portion from piece
Formula electronic unit checks that the detector that selecting device has applies to have via inspection terminal electrode to chip capacitor and advises
The inspection voltage of fixed frequency.Then, by detector come by detecting the application due to the inspection voltage in sheet capacitor
The current value for the electric current that device generates, the chip that check object is carried out based on the voltage value of the detection current value and inspection voltage
The inspection of the static capacity of capacitor.
The example that selecting device is checked as general chip electronic component above-mentioned, can enumerate patent document 1 and be remembered
The device of load.That is, in patent document 1, disclosing to many electric circuit components（For example, chip electronic component）It is tested
（It checks）Then the electric circuit part handler classified to electric circuit component according to test result.The electric circuit portion
Part processor has：There are many component platforms for setting（Open-work）Plate-like breadboard（Chip electronic part conveyance disk）, configuration
Upside contact and downside contact in the position of each component platform close to breadboard（A pair of electrodes terminal）And it is electrically connected to each
The tester of contact（Detector）.Breadboard for example diametrically to vacate interval each other between outer peripheral edge in its center
Mode has 72 row, 4 component platforms in the circumferential direction（Open-work）Row.So that the breadboard is rotated and is being accommodated in its component platform
In the state of electric circuit component, the multiple electric circuit components for the component platform for being contained in each row are carried out as one group electrical
The inspection of circuit block.
Other examples that selecting device is checked as general chip electronic component above-mentioned, can enumerate patent document
Device recorded in 2.That is, in patent document 2, disclosing the small of the inspection selecting device that can be programmed into chip electronic component
Type component supplies carrying device.The small parts carrying device be include device such as lower part：Movable part, in part conveyance face
Conveyance direction along chip electronic component described in small parts, that is, this specification is configured with disperseing many through holes and structure
At hole row；Component absorbing unit, by make near the through hole of the part conveyance face opposite side of the movable part
Air decompression by conveyance in small parts be adsorbed in part conveyance face to temporarily hold；Transfer path lid, in order to transport
The small parts and so that the open surface in the space accommodated is sliding freely connected on the part conveyance face；And component
Agitating unit stirs air of the small parts injection after the nozzle being set in the transfer path lid pressurizes
Mix the small parts in transfer path lid.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Application Publication 2000-501174 bulletins
Patent document 2：Japanese Unexamined Patent Publication 2001-26318 bulletins.
Invention content
The subject that the invention solves
Implement chip electronic component checking selecting device using the chip electronic component with various structures above-mentioned
Inspection/sort operation when, first, make chip electronic part conveyance disk on one side（Hereinafter sometimes referred to simply as conveyance disk）Between
Have a rest ground or continuously rotate, carry out on one side by chip electronic component supply receiving portion（It is accommodated hereinafter sometimes referred to simply as supply
Portion）To being formed in open-work supply chip electronic component and the operation of receiving of conveyance disk.The supply of the chip electronic component is received
Hold operation for example to carry out by following method：Chip electronic component is supplied to the surface of the conveyance disk under rotation,
Chip electronic component is then set to pass through the surface of the conveyance disk for acting on vane electronic unit of receiving gravity to open-work
The method for rotating to be contained in open-work successively；Or chip electronic component is made to suspend in air with stirring, it will then hang
The chip electronic component floated attracts and is contained in the method in open-work etc. successively.
Inspection in order to carry out chip electronic component at high speed sorts, and needs to carry out the conveyance under rotation at high speed
The open-work of disk accommodates（Or assembly）Small chip electronic component.But chip electronic component is needed with defined state
The conveyance disk being contained under rotation.Herein, it is specified that state mean the side of chip electronic component and the inner wall of open-work
The state being assembled substantially in parallel.By the way that chip electronic component is contained in open-work with such defined state, to i.e.
Make in the stroke of the rotary motion of conveyance disk then, also chip electronic component can be made not fall off from open-work, and smoothly
Ground carries out and the contact of the inspection terminal electrode in inspection portion.In commercially available chip electronic component checks selecting device, it is
Successfully carry out the supply and receiving to the chip electronic component in the lower open-work for transporting disk of rotation, and in advance about
Supply receiving condition has carried out accurate adjustment.However, the significant microminiaturization of chip electronic component in recent years is selected with inspection
Other high speed as a result, distinguished actual chip electronic component check selecting device in chip electronic component confession
During receiving, chip electronic component is not with defined state（That is, normal state）It is contained in the open-work of conveyance disk
Failure is occurred with many frequency.As such with abnormal housed state（That is, abnormal housed state）Chip electricity
Subassembly can be enumerated to the representative state of the assembly of open-work and carry out aftermentioned such, chip electricity in the present specification
Subassembly is contained in the state of open-work in a slanted state.The chip electronic portion of the open-work of conveyance disk is contained in heeling condition
Part falls off in the rotating distance of conveyance disk then from open-work sometimes, and additionally, there are become difficult in progress and inspection portion
Inspection terminal electrode smoothly contact the case where, should as a result, bringing the inspection of the electrical characteristic of chip electronic component
Look into the reduction of the efficiency, precision that sort operation.
Thus, the issue of the present invention is to provide make it possible for being required to check and sort small chip at a high speed
The chip electronic component of electronic unit checks selecting device to realize that the inspection of chip electronic component sorts carrying for the efficiency of operation
The improvement of the generation of reduction that is high, inhibiting inspection precision.
Solution for solving the problem
The present inventor studied for the purpose of solving above-mentioned project as a result, being found that can pass through
Supplying front position of the back-end location of receiving portion to inspection portion from chip electronic component and along chip electronic
The position setting of the rotating path of part conveyance disk makes the abnormal chip electronic component of the housed state in open-work from open-work
The chip electronic component removing unit of disengaging solves the problem above-mentioned, to obtain the present invention.
Thus, the present invention is a kind of chip electronic component inspection selecting device, including：Base station；Chip electronic part conveyance
Disk is pivotally supported in a manner of revolvable by base station, but is circumferentially formed with two in the chip electronic part conveyance disk
The open-work of a above each chip electronic component with electrode that can be housed in opposed end face temporarily；And along this
Chip electronic component supply receiving portion, electrical characteristic inspection portion and the classification that the rotating path of conveyance disk is sequentially arranged
Portion, chip electronic component supply receiving portion makes chip electronic component supply and is contained in the open-work of the conveyance disk, described
Electrical characteristic inspection portion carries out the inspection of the electrical characteristic of chip electronic component, and the division is based on inspection result come to checking
The chip electronic component finished is classified, and the chip electronic component checks that selecting device is characterized in that, from the chip
Electronic unit supplies the back-end location of receiving portion between the front position in inspection portion and along chip electronic part conveyance
The position setting of the rotating path of disk makes the piece that the abnormal chip electronic component of the housed state in open-work is detached from from open-work
Formula electronic unit removing unit.
The chip electronic component for describing the present invention below checks the preferred mode of selecting device.
（1）Above-mentioned chip electronic unit removing unit is the abnormal chip of the housed state physically contacted in open-work
The end of electronic unit is come the unit that makes chip electronic component be detached from from open-work.
（2）Above-mentioned chip electronic unit removing unit is along opposite with the direction of rotation of chip electronic part conveyance disk
The rotating brush that direction rotates.
（3）Near above-mentioned chip electronic unit removing unit, it is provided with the chip electronic component for making to be detached from from open-work
Return to the unit of chip electronic component supply receiving portion.
Invention effect
Can selecting device be checked by using the chip electronic component of the present invention to realize a large amount of small chip electricity
The high speed of the electrical characteristic of subassembly and it is high-precision inspection sort.
Description of the drawings
Fig. 1 be by taking chip capacitor as an example come show check object chip electronic component structure stereogram.
Fig. 2 is to show that chip electronic component checks the front elevation of an integrally-built example for selecting device.
Fig. 3 shows that chip electronic component checks the chip electronic part conveyance disk of selecting device and justifies in the conveyance
The rotating path of disk supplies receiving portion along the chip electronic component that its direction of rotation configures in order（Supply receiving domain）, it is electrical
Characteristic check portion（Check domain）And electronic unit division（Sorting field）.
Fig. 4 is the front elevation of chip electronic part conveyance disk and section of conveyance disk and the supporting construction of its behind
Face figure.
Fig. 5 shows the front elevation and side view of chip electronic component supply receiving portion.Further more, in order to show chip electronic
Component supplies the internal structure of receiving portion and adds and depict dotted line.
Fig. 6 is the bailing bucket for showing chip electronic component supply receiving portion and having（bucket）In-built figure,（a）
It is the in-built front elevation for showing bailing bucket,（b）It is the side cross-sectional views of bailing bucket.Further more, being cut in the side of the bailing bucket of the latter
Conveyance disk is also shown in the figure of face and transports the substrate that the behind of disk has（Standard station）Side section.
Fig. 7 is to show to supply open-work supply and receiving chip electronic of the receiving portion to conveyance disk by chip electronic component
The sectional view of the state of component, that is, show circumferentially in arc-shaped to arrange on conveyance disk and receive in the open-work that configures
Hold and transport the figure of the state of chip electronic component.Arrow shows the direction of rotation of conveyance disk（The moving direction of open-work）.
Fig. 8 is the electrical characteristic for showing to check the chip electronic component for the open-work for being contained in conveyance disk by inspection portion
State sectional view.
Fig. 9 is to show to be contained in the open-work of conveyance disk by division discharge and be finished by the inspection in inspection portion
Chip electronic component state figure.
Figure 10 is to be shown according to the present invention and supplying the back-end location of receiving portion from chip electronic component to inspection portion
It is electric as chip between front position and set by the position of the rotating path along chip electronic part conveyance disk
The figure of the structure and work of the rotating brush of one example of subassembly removing unit.
Figure 11 is the stereogram of rotating brush.
Specific implementation mode
The following chip electronic component for abouting the present invention while with reference to attached drawing checks that the configuration example of selecting device carries out
Explanation.Further more, according to a viewpoint, can the chip electronic component of the present invention being checked to, selecting device is said into and be related to general structure
Chip electronic component check selecting device（Also referred to as chip electronic component checks sorter）Improvement device, therefore,
Illustrate that the chip electronic component used in the past checks the configuration example of selecting device with reference first to Fig. 1 to Fig. 9 of attached drawing.
Fig. 1 is to show standing for its structure by taking general chip capacitor as an example as the chip electronic component of check object
Body figure, chip electronic component 19 include the capacitor main body 21 being made of dielectric and are opposed to be set to a pair of electricity at its both ends
Pole 22a, 22b.Common chip capacitor 19 is that ceramics are used as dielectric chip ceramic capacitor.Further more, common
The surface of the electrode of chip electronic component is additionally provided with the layer of the installation to the various substrates of chip electronic component.
It, can as the typical example for the chip electronic component for checking selecting device inspection by the chip electronic component of the present invention
Enumerate chip capacitor, chip resistor（Including chip rheostat）And chip inductor.
The chip electronic component of check object is manufactured according to same specification, to show defined identical electrical spy
Property.
Thus, the chip electronic component of above-mentioned check object is mostly the component of same manufacture batch, but can also be at this
The chip electronic component of other batches is mixed in the chip electronic component of the same manufacture of sample batch.But the chip of two manufactures batch
Electronic unit is generally manufactured according to same specification（In general, being made using for the purpose of being peddled as mutually the same product
It makes）, to show mutually the same electrical characteristic.
Fig. 2 is to show that chip electronic component checks that the front elevation of the configuration example of selecting device, Fig. 3 show chip electronic portion
Part check selecting device chip electronic part conveyance disk and the conveyance disk rotating path along its direction of rotation
The chip electronic component supply receiving portion configured in order（Supply receiving domain）, electrical characteristic inspection portion（Check domain）, Yi Ji electricity
Subassembly division（Sorting field）.Further more, the chip electronic component of Fig. 2 checks that selecting device is to transport disk along its circumference
Many open-works are arranged in the device of the configuration of 6 row, and the conveyance disk of Fig. 3 is to be arranged in 3 row along many open-works of its circumference
Device.Fig. 4's（a）It is the front elevation of chip electronic part conveyance disk shown in Fig. 3, and Fig. 4（b）It is that conveyance circle is shown
The sectional view of disk and its supporting construction of behind.
Chip electronic component shown in Fig. 2 checks in selecting device 10, can accommodate chip electronic component temporarily（Example
Such as, chip capacitor）The configurations that are circumferentially arranged on the surface of discoid material of more than two open-work 11a and
The chip electronic part conveyance disk of formation（Hereinafter sometimes referred to simply as conveyance disk）11 can carry out the plane along disk
The mode of rotation be pivotally supported by base station 41.As shown in figure 3, in the rotating path of conveyance disk 11, it is set with chip electronic portion
The supply receiving portion of part（Supply receiving domain）101, the inspection portion of chip electronic component electrical characteristic（Check domain）102 and piece
The division of formula electronic unit（Sorting field）103.In inspection portion 102, in each open-work 11a respectively arranged close to conveyance disk 11
The positions of two opening portions have a pair of electrodes terminal.Detector 14a, 14b are electrically connected to electrode terminal, also, had
It is electrically connected to detector and checks the controller 15 for handling relevant signal to be supplied to detector.Further more, the piece of check object
Formula electronic unit enters hopper 47, from chip electronic component supply mouth 31 via bailing bucket（With reference to Fig. 5,6）It is supplied to conveyance circle
Disk 11.
The open-work 11a of chip electronic part conveyance disk 11 is usually in the surface configuration of conveyance disk in multiple concentric circles
The position of the first-class segmentation concentric circles.
In device 10 shown in the drawings, it is provided with and is diametrically arranged between the center and periphery of conveyance disk 11
Add up to 6 open-works, often 6 chip electronic components is added up to carry out the electrical of chip electronic component to be contained in each open-work
The inspection of characteristic.The quantity of the open-work diametrically arranged between the center and periphery of conveyance disk 11 is preferably 2 ~ 20
In a range, more preferably in 3 ~ 12 ranges.
Disk 11 is transported with can be via such as substrate（Standard station）45 and the mode that is rotated of central shaft 42 be arranged
（It is fixed）In base station 41, make interval around central shaft 42 by making the rotating driving device 43 for being disposed in its back side work
Ground rotates.
Receiving portion 101 is supplied by chip electronic component, check object is accommodated temporarily in the open-work 11a of conveyance disk 11
Chip electronic component, for checking its electrical characteristic.
The detailed construction of chip electronic component supply receiving portion 101 is shown in fig. 5 and fig..Chip electronic component supplies
It is also referred to as bailing bucket portion to receiving portion 101, is the chip electronic for making to supply from outside by chip electronic component supply mouth 31
Component is contained in the region of the open-work 11a of conveyance disk 11 via bailing bucket 32.In fig. 5 and fig., bailing bucket 32 is as to setting
The open-work group for being placed in 3 row of conveyance disk 11 is supplied the structure of chip electronic component and is formed to be used using the separation of spaced walls 33
In 3 slots arranged for making chip electronic component decline in arc-shaped with 3 row.Being supplied by chip electronic component supply mouth 31,
In the chip electronic component that the inside of bailing bucket 32 declines along spaced walls 33 by via being formed near the bottom of bailing bucket 32
Substrate（Standard station）45 gas attracts access 45a to be brought to the strong attraction for the open-work 11a for transporting disk 11 and be attracted
And it accommodates and arrives open-work 11a.Further more, usually making rotating circular disk become stationary state justify to the conveyance of the chip electronic component
The attraction and receiving of the open-work 11a of plate 11.
Fig. 7 shows the state that chip electronic component attracts and accommodates to the open-work 11a of conveyance disk 11.That is, in bailing bucket
32 bottom nearby the chip electronic component 19 that gathers by via being formed in substrate（Standard station）45 gas attracts access 45a
It is brought to the strong attraction of the open-work 11a of conveyance disk 11 and is attracted and accommodates open-work 11a.Further more, in the bailing bucket 32
Bottom nearby attraction from the chip electronic component 19 that gathers to open-work 11a and receiving when, in order to successfully carry out chip electronic
The attraction and receiving of component, and preferably from outside be blown into air-flow near the bottom of bailing bucket 32 so that chip electronic component 19 with
Stirring suspends.It is such for example to be schemed near the bottom of bailing bucket 32 from external being blown into for air-flow using Fig. 6
The air blowing portion 37 shown carries out.
As described above, in the back side of chip electronic part conveyance disk 11 or the rear side of device（It is right side in the figure 7）
It is equipped with substrate 45.It is formed in substrate 45 and attracts access in multiple gases of the surface opening of the side of conveyance plectane 11 respectively
45a.Each gas attracts access to be connected to the gas suction device 46 for supplying strong attraction to open-work.Attract when making gas
When device 46 works, gas attracts the gas in access 45 by strong attraction gravitational attraction, is formed in conveyance disk 11 and substrate 45
Between gap become decompression state.
When viaing chip electricity while so that the direction shown in the arrow that Fig. 7 is charged to of conveyance disk 11 is rotated intermittently
Subassembly supply mouth 31 and bailing bucket 32 supply chip electronic component to the surface of conveyance disk and make 46 work of gas suction device
Make come when the gap between conveyance disk 11 and substrate 45 being made to become decompression state, chip electronic component 19 is attracted and accommodates
Transport each of the open-work 11a of disk 11.
By the moving in rotation of the interval of above-mentioned conveyance disk 11, it is contained in the chip of the open-work 11a of conveyance disk 11
Electronic unit 19 is subsequently passed to Fig. 2 and inspection portion 102 shown in Fig. 3.Further more, the gap between conveyance disk 11 and substrate 45
Receiving in from the open-work 11a to chip electronic component 19 complete after until conveyance disk 11 is rotated and makes to be contained in
Until the chip electronic component 19 of open-work 11a moves arrival division 103 in turn to inspection portion 102, it is all made into weak decompression
State.Therefore, the chip electronic portion that receiving portion 101 is contained in the open-work 11a of conveyance disk 11 is supplied by chip electronic component
Part 19 is until the rotation after transporting disk 11 reaches division 103 via inspection portion 102, all not from saturating
The case where hole 11a falls off.
As shown in figure 8, in order to which chip electronic component to be electrically connected to the detector of its electrical characteristic, and in inspection portion
It is configured with a pair of electrodes terminal 12a, 12b close to the position of two opening portions of the open-work 11a of conveyance disk 11.
Electrode terminal 12a is fixed on substrate 45 via the cylinder for being disposed in surrounding electrical insulating property.Electrode terminal 12a
Usually it is made into smooth plane using attrition process etc. with the surface of the conveyance disk side of substrate 45.
Electrode terminal 12b is fixed on electrode terminal support plate 53.
So that electrode terminal support plate 53 is moved to the side of conveyance disk 11, is supported as a result, by electrode terminal support plate 53
Electrode terminal 12b is also moved to the side of conveyance disk 11 simultaneously.Pass through the movement of electrode terminal 12b, chip electronic component quilt
It is clipped between electrode terminal 12a, 12b and becomes contact condition.Therefore, the electrode 22a of chip electronic component is electrically connected to electrode
Terminal 12a, and electrode 22b is electrically connected to electrode terminal 12b.As a result, chip electronic component via a pair of electrodes terminal 12a,
12b is electrically connected to detector.
Further more, two opening portions " close proximity " of each open-work for the conveyance disk being configured with a pair of electrodes terminal are anticipated
Refer to the position that each electrode terminal when chip electronic component is accommodated in each open-work is electrically connected to the electrode of each chip electronic component,
Or it can be electrically connected to by keeping each electrode terminal mobile in the case where each electrode terminal is made into mobile structure
The position of the electrode of chip electronic component.
Then, in inspection portion 102, match to being accommodated in a manner of being arranged in a row along the diametric(al) for transporting disk 11
Each of 6 chip electronic components 19a, 19b, 19c, 19d, 19e, the 19f set checks defined electrical characteristic.
Have checked the chip electronic component after electrical characteristic then by transport disk 11 interval moving in rotation by by
It is sent to the division 103 of Fig. 2 and chip electronic component shown in Fig. 3.
As shown in figure 9, being equipped with the front side of surface side or device in conveyance disk 11 in division 103（In fig.9
For left side）It is formed with the piping support lid 61 of multiple open-work 61a.The pipe 62 for constituting the drain passageway of chip electronic component 19a connects
In each of the open-work 61a of piping support lid 61.Further more, illustrating only the open-work 61a for being connected to piping support lid 61 in fig. 2
The pipe 62 of each among a part pipe.
In addition, in the rear side for the back side or device for being configured at conveyance disk 11（It is right side in fig.9）Substrate 45
It is formed in the region of division 103 respectively in multiple gas feeding path 45b of the surface opening of the side of conveyance disk 11.
Each gas feeding path 45b is connected to pressurized gas supply device 63.
When making pressurized gas supply device 63 work, gas-pressurized is supplied to gas feeding path 45b, is removed to being contained in
Send the chip electronic component 19a injection gas-pressurizeds of the open-work 11a of disk 11.Chip electronic component is discharged to pipe 62 as a result,.
Chip electronic component 19 is for example, by the place among being formed in multiple open-work 61a of piping support lid 61 shown in Fig. 2
Add up to 10 open-work 61a in the outermost side.10 open-work 61a are connected to the receiving of chip electronic component via pipe 62 respectively to be held
Device 64.
Thus, in the chip electronic component that division 103 is discharged by open-work via being connected to 10 of piping support lid 61
Open-work 61a's adds up to either one or two of 10 pipes 62 to be contained in the electrical characteristic and predetermined that the result based on inspection is distinguished
Formula electronic component storing container 64.
Next, being explained in detail while referring to Fig.1 0 and Figure 11 dress is sorted as the chip electronic component of the present invention
The chip electronic component removing unit for the characteristic structural set.
Figure 10 is and Fig. 6（b）Corresponding figure shows that chip electronic component supplies in a manner of discreet portions are omitted
Conveyance disk 11, substrate 45 in receiving portion and bailing bucket 32.Also, in the open-work 11a receivings of conveyance disk 11（Assembly）Have
Chip electronic component.The arrow for being logged into the top of figure shows the direction of rotation of conveyance disk 11（It is equivalent to the movement of open-work
Direction）.Component 19m, component 19p and component among chip electronic component being supplied from bailing bucket 32, being contained in open-work
19q is assemblied in open-work with normal state, and component 19n and component 19r are assembled with abnormal state of affairs.In fig. 10, it is illustrated that
Component 19n by with the rotating brush of being used as chip electronic component removing unit（It is rotated along the direction of arrow）34 brush element
It contacts and strokes the state for falling and being detached from from open-work.The chip electronic component being detached from from open-work is direct or is dropping to sloping platform for the time being
Bailing bucket 32 is returned to after 35 surface.Further more, around rotating brush 34, the chip electronic component that is detached from order to prevent disperses
And preferably it is previously provided with rotating brush lid 36.Further more, in Fig. 10, rotating brush 34, which is configured in, is being contained in conveyance disk 11
Chip electronic component just due to conveyance disk 11 rotation and from chip electronic component supply receiving portion abjection after be contacted with
The position of position as the end of chip electronic component, such rotating brush 34 is preferred position.
Figure 11 is the figure that rotating brush 34 is portrayed as to stereogram.The rotating brush 34 is designed to using having be in concentric circles
The chip electronic component of the conveyance disk of the open-work of 6 row configured to shape checks selecting device.Preferably, the brush portion of rotating brush 34
Point each as shown in Figure 11 by the board-like material divided by many gaps or make many staple fibers side by side and
The set fiber that one end is bonded to each other is constituted.Preferably, the brush element of rotating brush 34 by soft material particular according to
The viewpoint that electrostatic prevents is by conductive material（For example, electric conductivity synthetic resin, metal wire, metal slivers）It is formed.
" keep the housed state in open-work abnormal as the chip electronic component inspection selecting device for being set to the present invention
The chip electronic component removing unit that is detached from from open-work of chip electronic component ", preferably Figure 10, rotation as shown in Figure 11
Brush（The rotating brush that especially brush element is formed by the material with flexibility）.That is, this is because by using rotating brush（It is special
It is not the rotating brush that brush element is formed by the material with flexibility）, about the chip electricity for being contained in open-work with normal state
Subassembly remains in open-work in the case where not damaged to the electrode of its end, on the other hand, easily causes not with normal
State receiving（Assembly）In the reliable disengaging of the chip electronic component of open-work.But it is removed as chip electronic component single
Member, additionally it is possible to utilize plate object being made of flexible material etc. and " the abnormal chip electronic component of housed state in open-work "
Nose portion physical contact occurs and causes unit of the chip electronic component from the disengaging of open-work, or to " in open-work
The method etc. of the nose portion blowing gas stream of the abnormal chip electronic component of housed state ".
Further more, in the present specification, being transported with the chip electronic unit of configuration in vertical direction recorded in patent document 2
Disk and illustrate chip electronic component for the device that works and check the explanation of the structure of selecting device and as this hair
The explanation of bright provided structure improved chip electronic component removing unit, but the chip electronic of the object as the present invention
Component inspection selecting device can certainly be as described in Patent Document 1, chip electronic part conveyance disk with inclined
The device that state is pivotally supported by base station.Also, as structure improved chip electronic component removing unit provided by the present invention
It can carry out the deformation that those skilled in the art are readily apparent that and be assemblied in chip electronic part conveyance disk in a slanted state
The chip electronic component being pivotally supported by base station checks selecting device.
Reference sign
10 chip electronic components check selecting device
11 chip electronic part conveyance disks
11a open-works
19 chip electronic components（Chip capacitor）
19a, 19b, 19c chip electronic component（Chip capacitor）
19d, 19e, 19f chip electronic component（Chip capacitor）
21 capacitor main bodies
22a, 22b electrode
31 chip electronic component supply mouths
32 bailing buckets
33 spaced walls
34 rotating brushes
35 sloping platforms
36 rotating brush lids
41 base stations
42 central shafts
43 rotating driving devices
45 substrates（Standard station）
101 chip electronic components supply receiving portion（Supply receiving domain）
102 electrical characteristic inspection portions（Check domain）
103 electronic unit divisions（Sorting field）.
Claims (2)
1. a kind of chip capacitor checks selecting device, including：
Base station；
Chip capacitor transports disk, is pivotally supported by base station in a manner of revolvable, but transports disk in the chip capacitor
Circumferentially it is formed with the saturating of more than two each chip capacitor with electrode that can be housed in opposed end face temporarily
Hole；And
The chip capacitor supply receiving portion that is sequentially arranged along the rotating path of the conveyance disk, electrical characteristic inspection portion,
And division, chip capacitor supply receiving portion make chip capacitor supply and are contained in the open-work of the conveyance disk,
Electrical characteristic inspection portion carries out the inspection of the electrical characteristic of chip capacitor, and the division is based on inspection result come to inspection
The chip capacitor finished is looked into classify,
The chip capacitor checks that selecting device is characterized in that, in the back-end location for supplying receiving portion from the chip capacitor
To between the front position in inspection portion and in the position for the rotating path for transporting disk along chip capacitor, being provided with makes
The chip capacitor removing unit that the abnormal chip capacitor of housed state in hole is detached from from open-work, but the sheet capacitor
Device removing unit be by along with chip capacitor transport the opposite direction in the direction of rotation of disk rotate come with the receipts in open-work
The makes physical contact of the abnormal chip capacitor of appearance state and so that chip capacitor is detached from from open-work conductive
Rotating brush, in addition around rotating brush configured with dispersing for chip capacitor that the open-work from conveyance disk is detached from can be prevented
Rotating brush lid.
2. chip capacitor according to claim 1 checks selecting device, wherein in the close of chip capacitor removing unit
Side is provided with the unit for making the chip capacitor being detached from from open-work return to chip capacitor supply receiving portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-022509 | 2014-02-07 | ||
| JP2014022509A JP6312200B2 (en) | 2014-02-07 | 2014-02-07 | Chip capacitor inspection and sorting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104826821A CN104826821A (en) | 2015-08-12 |
| CN104826821B true CN104826821B (en) | 2018-08-31 |
Family
ID=53805225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510063513.1A Active CN104826821B (en) | 2014-02-07 | 2015-02-06 | Chip electronic component checks selecting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6312200B2 (en) |
| KR (1) | KR102233793B1 (en) |
| CN (1) | CN104826821B (en) |
| TW (1) | TWI640787B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6727651B2 (en) * | 2016-09-30 | 2020-07-22 | 株式会社ヒューモラボラトリー | Continuous inspection method for electrical characteristics of chip electronic components |
| JP7149249B2 (en) * | 2019-10-31 | 2022-10-06 | Ｔｏｗａ株式会社 | Transfer module, cutting device, and method for manufacturing cut product |
| JP7075139B2 (en) * | 2020-06-02 | 2022-05-25 | 株式会社ヒューモラボラトリー | Chip electronic component transfer disk for chip electronic component inspection and sorting equipment |
| JP7107589B2 (en) * | 2020-08-28 | 2022-07-27 | 株式会社ヒューモラボラトリー | Equipment with roller electrode contacts for chip electronic component inspection |
| CN114516539B (en) * | 2022-03-25 | 2024-04-30 | 江苏徐工工程机械研究院有限公司 | Workpiece clamping device and workpiece cleaning equipment |
| CN117067505A (en) * | 2023-10-17 | 2023-11-17 | 成都宝利根创科电子有限公司 | Feeding device for sheet insert injection molding |
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| JP2004182456A (en) * | 2002-12-06 | 2004-07-02 | Murata Mfg Co Ltd | Chip component aligning and feeding device |
| JP4039324B2 (en) * | 2003-06-26 | 2008-01-30 | 株式会社村田製作所 | Electronic parts transfer device |
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- 2014-02-07 JP JP2014022509A patent/JP6312200B2/en active Active
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2015
- 2015-01-22 TW TW104102099A patent/TWI640787B/en active
- 2015-02-04 KR KR1020150017199A patent/KR102233793B1/en active IP Right Grant
- 2015-02-06 CN CN201510063513.1A patent/CN104826821B/en active Active
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|---|---|---|---|---|
| CN1820899A (en) * | 2005-02-18 | 2006-08-23 | 户津胜行 | Method and apparatus for screw bolt automatically lining up and feeding |
| CN100470753C (en) * | 2005-12-09 | 2009-03-18 | 东京威尔斯股份有限公司 | Work transporting device |
| CN201482736U (en) * | 2009-08-18 | 2010-05-26 | 深圳市奥科斯特自动化有限公司 | Sorting mechanism and test sorting machine thereof |
| CN102049392A (en) * | 2009-10-27 | 2011-05-11 | 慧萌高新科技有限公司 | Characteristic inspection and classification apparatus for sheet-like electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102233793B1 (en) | 2021-03-29 |
| JP2015147196A (en) | 2015-08-20 |
| JP6312200B2 (en) | 2018-04-18 |
| KR20150093596A (en) | 2015-08-18 |
| TW201534936A (en) | 2015-09-16 |
| CN104826821A (en) | 2015-08-12 |
| TWI640787B (en) | 2018-11-11 |
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