CN104821365B - A kind of fluorescent material coating unit for LED chip encapsulation - Google Patents
A kind of fluorescent material coating unit for LED chip encapsulation Download PDFInfo
- Publication number
- CN104821365B CN104821365B CN201510228756.6A CN201510228756A CN104821365B CN 104821365 B CN104821365 B CN 104821365B CN 201510228756 A CN201510228756 A CN 201510228756A CN 104821365 B CN104821365 B CN 104821365B
- Authority
- CN
- China
- Prior art keywords
- led chip
- fluorescent material
- pressure rod
- coating unit
- slip lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 title claims abstract description 42
- 239000011248 coating agent Substances 0.000 title claims abstract description 24
- 238000000576 coating method Methods 0.000 title claims abstract description 24
- 238000005538 encapsulation Methods 0.000 title claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 26
- 230000005684 electric field Effects 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000741 silica gel Substances 0.000 abstract description 14
- 229910002027 silica gel Inorganic materials 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 3
- 230000003068 static effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
The present invention relates to a kind of fluorescent material coating unit for LED chip encapsulation, belong to LED encapsulation technologies field.The technical problems to be solved by the invention are that when coating fluorescent material on LED chip surface using electric field method, the electrostatic of fluorescent material easily disappears, the skewness of the upper surface of LED chip and side the problem of.The present invention is by devising a kind of special coating unit, the device includes the parts such as fluorescence powder tank, pressure rod, dc source, when being coated using the device, silica gel phosphor mixture in fluorescence powder tank can be flowed into LED chip while pressure rod is pressed in wiring board, and by electric field action simultaneously, this operation can keep the fluorescent material of static electrification soon movably chip surface, and substantially uniform in the distribution of the side of chip and top surface.
Description
Technical field
The present invention relates to a kind of fluorescent material coating unit for LED chip encapsulation, belong to LED encapsulation technologies field.
Background technology
LED is semiconductor light-emitting-diode, is a kind of solid state semiconductor devices, and electricity directly can be converted into light by it.
LED electricity-saving lamps are to use high brightness white light-emitting diode light emitting source, and light efficiency is high, little power consumption, long lifespan, easy to control, non-maintaining, peace
Loopful is protected；It is solid cold light source of new generation.
LED is covered with fluorescent material in encapsulation, it is necessary to be applied on the surface of chip, but traditional dispensing method easily cause it is glimmering
Light powder is uneven in the covering of the surface of chip, and can have the problem of fluorescent material waste.Disclosed in patent CN102856473A
It is a kind of to make fluorescent material to moving on chip using extra electric field, and its is covered uniform technology.But this method is present
The shortcomings that following：Firstly, it is necessary to first fluorescent material and glue mixed liquor are stirred and then glue is poured on into chip list
Face, but due to partially short when electrostatic carries, carrying out after stirring operation is poured on chip again, the electrostatic on fluorescent material
Seldom, thus electric field effect unobvious；Secondly, after mixed solution is poured on chip, fluorescent material there are one
Fixed sedimentation, after mobile by electric field pressurization, the coated weight in the fluorescent material of chip powder both sides can be caused to be more than top
The coated weight in portion, the problem of there are fluorescent material skewness.
The content of the invention
The technical problems to be solved by the invention are：When coating fluorescent material on LED chip surface using electric field method, fluorescent material
Electrostatic easily disappear, the skewness of the upper surface of LED chip and side the problem of.The present invention is a kind of special by devising
With coating unit, during encapsulation, when being coated using the device, the fluorescent material of static electrification can be kept soon to move
Dynamic ground chip surface, and it is substantially uniform in the distribution of the side of chip and top surface.
Technical scheme：
A kind of fluorescent material coating unit for LED chip encapsulation, the main body of coating unit include fluorescence powder tank, fluorescence
The top of powder tank is provided with agitator；The both sides of bottom inside fluorescence powder tank are respectively arranged with side plate, and the top of side plate is mutual
Top plate is connected and composed, opening is all offered on side plate and top plate, slip lid, the side of slip lid are socketed with the outside of side plate and top plate
Face and top surface are both provided with flow export, are additionally provided with sealing-plug below the top of slip lid, on the position and top plate of sealing-plug
Aperture position it is corresponding, when the opening on sealing-plug and top plate fits, on the flow export and side plate on the side of slip lid
Opening do not connect；Heater block is additionally provided with above the flow export of the side of slip lid；Also set in the side of fluorescence powder tank
Body is equipped with, in the pressure rod that is internally provided with of body, pressure rod is to use conductive material, between the top of pressure rod and slip lid
It is fixedly connected, body top is additionally provided with dc source；When the opening on sealing-plug and top plate fits, the bottom of pressure rod
Less than the bottom of fluorescence powder tank, when pressure rod is in contact after moving upwards with the negative pole of dc source, the stream on the side of slip lid
Outlet is interconnected with the opening on side plate；Wire is additionally provided with the positive pole of dc source.
The material of described pressure rod is copper.
Thermal insulation layer is additionally provided with the outside of heater block.
Spring is additionally provided with pressure rod, limiting card is additionally provided with above spring, limiting card is fixed on body
Inwall.
The material of sealing-plug is rubber.
Beneficial effect
Using coating unit provided by the invention, during LED is encapsulated, the fluorescent material of static electrification can be kept quickly
Ground movably chip surface, and substantially uniform in the distribution of the side of chip and top surface.
Brief description of the drawings
Fig. 1 is the structure chart provided by the present invention for the fluorescent material coating unit of LED chip encapsulation；
Fig. 2 is the structure chart of said apparatus in a state of use.
Wherein, 1, LED chip；2nd, substrate；3rd, line layer；4th, fluorescence powder tank；5th, side plate；6th, top plate；7th, it is open；8th, it is sliding
Lid；9th, heater block；10th, thermal insulation layer；11st, sealing-plug；12nd, agitator；13rd, flow export；14th, body；15th, pressure rod；16th, bullet
Spring；17th, limiting card；18th, connecting rod；19th, dc source；20th, wire.
Embodiment
Embodiment 1
The present invention needs the LED structure such as conventional arrangement closed, and installs LED chip 1 on a substrate 2, while on a substrate 2
It is also provided with line layer 3, the cathode portion on line layer 3 is connected with the negative pole of LED chip 1.
As shown in fig. 1, the main body of coating unit includes fluorescence powder tank 4, fluorescence powder tank 4 to the general structure of coating unit
Top be provided with agitator 12；The both sides of bottom inside fluorescence powder tank 4 are respectively arranged with side plate 5, and the top of side plate 5 is mutual
Top plate 6 is connected and composed, opening 7 is all offered on side plate 5 and top plate 6, slip lid 8 is socketed with the outside of side plate 5 and top plate 6,
The side of slip lid 8 and top surface are both provided with flow export 13, and sealing-plug 11, sealing-plug are additionally provided with below the top of slip lid 8
11 position is corresponding with the aperture position on top plate 6, when the opening on sealing-plug 11 and top plate 6 fits, the side of slip lid 8
Flow export 13 on face does not connect with the opening 7 on side plate 5；It is additionally provided with and adds in the top of the flow export 13 of the side of slip lid 8
Thermal part 9；Body 14 is additionally provided with the side of fluorescence powder tank 4, pressure rod 15, pressure rod 15 are internally provided with body 14
It is to use conductive material, is fixedly connected between the top of pressure rod 15 and slip lid 8, the top of body 14 is additionally provided with dc source
19；When the opening on sealing-plug 11 and top plate 6 fits, the bottom of pressure rod 15 is less than the bottom of fluorescence powder tank 4, pressure rod
When being in contact after 15 upward motions with the negative pole of dc source 19, the flow export 13 on the side of slip lid 8 and the opening on side plate 5
7 are interconnected；Wire 20 is additionally provided with the positive pole of dc source 19.
Application method of the said apparatus when carrying out LED chip encapsulation is as follows：First, by the positive pole and base of dc source 19
Plate is connected by wire 20；The mixture of fluorescent material and silica gel, turn on agitator 12, in fluorescence are added in fluorescence powder tank 4 again
In the mixed process of powder and silica gel, due to needing constantly stirring, fluorescent material and silica gel can constantly rub, and fluorescent material belongs to
Inorganic matter, electronegativity is weak, and silica gel belongs to organic matter, and electronegativity is strong, and so during friction, fluorescent material can be positively charged,
And silica gel can be negatively charged, because fluorescent material is in distribution of particles in silica gel, therefore fluorescent material and silica gel this on the whole such as
If fruit adds an electric field, fluorescent material will move in electric field.When being kept stirring for the opening of device 12, by above-mentioned device
It is placed on substrate, side plate 5 and top plate 6 is surrounded LED chip 1, keep pressure rod 15 to be located at the top of line layer 3, due to pressing
Bar 15 is in the state of non-stress, and the bottom of pressure rod 15 is less than the bottom of fluorescence powder tank 4, when pressure rod 15 is pressed in line layer 3
It can move upwards afterwards, when pressure rod 15 is in contact after moving upwards with the negative pole of dc source 19, as shown in Fig. 2 slip lid 8
Flow export 13 on side is interconnected with the opening 7 on side plate 5, due to leaving sky between slip lid 8 and the both sides of fluorescence powder tank 4
Gap, then the silica gel phosphor mixture in fluorescence powder tank 4 can flow into LED chip 1 simultaneously from the opening 7 on top plate 6 and side plate 5
On, and be now connected due to LED chip 1 with line layer 3, and line layer 3 is connected to dc source further through press rods 15
19 negative pole, then electric field can be formed in LED chip 1, silica gel phosphor mixture is being had just enter into LED chip 1
Meanwhile the effect of electric field has just been received, sedimentation can first be occurred again by electric field action by overcoming mixture in the prior art
Shortcoming, and then improve distributing homogeneity of the fluorescent material on the surface of LED chip 1, and in this process when, can keep stirring
It is dynamic to mix not stalling for device 12, fluorescent material is overcome fluorescent material mixing in the prior art always with electric charge without producing decay
The problem of easy electric charge of thing disappears.After fluorescent material is completed in the cladding on the surface of LED chip 1, heater block 9 is opened,
Make the silica gel positioned at both sides is heated to solidify, then remove coating unit, whole LED-baseplate is placed in heating furnace again and enters one
The heating of step ground makes silica gel solid.
Embodiment 2
As shown in figure 1, as the improvement to above-mentioned device, in another embodiment, the outside of heater block 9 is also
It is provided with thermal insulation layer 10.The effect of thermal insulation layer 10 can prevent the heated effect of silica gel in fluorescence powder tank 4, prevent solid
Change.
Embodiment 3
As shown in figure 1, being additionally provided with spring 16 on pressure rod 15, limiting card 17 is additionally provided with the top of spring 16,
Limiting card 17 is fixed on the inwall of body 14.Due to the effect of spring 16, it is ensured that after coating unit is lifted, side plate 5
Closed rapidly with the opening 7 on top plate 6, prevent the waste of silica gel and fluorescent material.
Claims (5)
1. a kind of fluorescent material coating unit for LED chip encapsulation, it is characterised in that LED chip is installed on substrate, simultaneously
It is also provided with line layer on substrate, the cathode portion on line layer is connected with LED chip negative pole；The main body of coating unit includes
There is fluorescence powder tank (4), the top of fluorescence powder tank (4) is provided with agitator (12)；The both sides point of the internal bottom of fluorescence powder tank (4)
Side plate (5) is not provided with, top plate (6) is interconnected to constitute at the top of side plate (5), is all offered on side plate (5) and top plate (6)
It is open (7), slip lid (8) is socketed with the outside of side plate (5) and top plate (6), the side of slip lid (8) and top surface are both provided with flowing out
Mouthful (13), are additionally provided with sealing-plug (11) below the top of slip lid (8), the position of sealing-plug (11) with top plate (6)
Aperture position is corresponding, when the opening on sealing-plug (11) and top plate (6) fits, the flow export on the side of slip lid (8)
(13) do not connected with the opening (7) on side plate (5)；Heating is additionally provided with above the flow export (13) of the side of slip lid (8)
Part (9)；Body (14) is additionally provided with the side of fluorescence powder tank (4), pressure rod (15) is internally provided with body (14),
Pressure rod (15) is to use conductive material, is fixedly connected between the top of pressure rod (15) and slip lid (8), body (14) top is also
It is provided with dc source (19)；When the opening on sealing-plug (11) and top plate (6) fits, the bottom of pressure rod (15) is less than
The bottom of fluorescence powder tank (4), when pressure rod (15) is in contact after moving upwards with the negative pole of dc source (19), slip lid (8)
Flow export (13) on side is interconnected with the opening (7) on side plate (5)；It is additionally provided with the positive pole of dc source (19)
Wire (20)；The positive pole of dc source is connected, will applied when carrying out LED chip encapsulation by coating unit with substrate by wire
Coating device is placed on substrate, side plate and top plate is surrounded LED chip, is kept pressure rod to be located at the top of line layer；Work as pressure rod
Being pressed in line layer can move upwards afterwards, when pressure rod is in contact after moving upwards with the negative pole of dc source, the side of slip lid
On flow export be interconnected with side plate Shangdi opening, now because LED chip is connected with line layer, and line layer is further through pressure
Lever is connected to the negative pole of dc source, then electric field can be formed in LED chip.
2. the fluorescent material coating unit according to claim 1 for LED chip encapsulation, it is characterised in that：Described pressure
The material of lever (15) is copper.
3. the fluorescent material coating unit according to claim 1 for LED chip encapsulation, it is characterised in that：Heater block
(9) thermal insulation layer (10) is additionally provided with the outside of.
4. the fluorescent material coating unit according to claim 1 for LED chip encapsulation, it is characterised in that：In pressure rod
(15) spring (16) is additionally provided with, limiting card (17) is additionally provided with above spring (16), limiting card (17) is fixed on pipe
The inwall of body (14).
5. the fluorescent material coating unit according to claim 1 for LED chip encapsulation, it is characterised in that：Sealing-plug
(11) material is rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510228756.6A CN104821365B (en) | 2015-05-06 | 2015-05-06 | A kind of fluorescent material coating unit for LED chip encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510228756.6A CN104821365B (en) | 2015-05-06 | 2015-05-06 | A kind of fluorescent material coating unit for LED chip encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104821365A CN104821365A (en) | 2015-08-05 |
| CN104821365B true CN104821365B (en) | 2017-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510228756.6A Expired - Fee Related CN104821365B (en) | 2015-05-06 | 2015-05-06 | A kind of fluorescent material coating unit for LED chip encapsulation |
Country Status (1)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2017211773A1 (en) * | 2016-06-07 | 2017-12-14 | Philips Lighting Holding B.V. | Uv solid state output device |
| CN113573569B (en) * | 2021-07-28 | 2022-10-25 | 珠海博瑞通电子科技有限公司 | Visual doorbell PCBA board packaging equipment and packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7883387B2 (en) * | 2007-09-11 | 2011-02-08 | Atomic Energy Council-Institute Of Nuclear Energy Research | Pulsed high-voltage silicon quantum dot fluorescent lamp |
| CN201392848Y (en) * | 2009-03-26 | 2010-01-27 | 浙江联众光电科技股份有限公司 | White light-emitting diode with uniform light spots |
| CN102856473B (en) * | 2012-08-17 | 2015-04-29 | 上舜照明（中国）有限公司 | Packaging adjustment method of LED (light-emitting diode) light source |
| CN102983251B (en) * | 2012-11-27 | 2016-02-03 | 北京半导体照明科技促进中心 | The polarization method of polarized fluorescence powder, fluorescent material and the manufacture method of LED |
| US9586216B2 (en) * | 2013-10-28 | 2017-03-07 | Achrolux Inc. | Charged powder supply device |
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| CN104821365A (en) | 2015-08-05 |
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Effective date of registration: 20200522 Address after: 200120 101 (duplex), 102 (duplex), building 51, No. 1387, Zhangdong Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Silicon optoelectronic technology (Shanghai) Co., Ltd Address before: 075000, No. 24, Pioneer Road, Dongshan Industrial Park, Qiaodong District, Hebei, Zhangjiakou Patentee before: SIPHOTON TECHNOLOGY ZHANGJIAKOU Co.,Ltd. |
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Granted publication date: 20171128 Termination date: 20210506 |