CN104818517A - Zinc and copper electroplating solution zinc ion control apparatus - Google Patents
Zinc and copper electroplating solution zinc ion control apparatus Download PDFInfo
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- CN104818517A CN104818517A CN201510160734.0A CN201510160734A CN104818517A CN 104818517 A CN104818517 A CN 104818517A CN 201510160734 A CN201510160734 A CN 201510160734A CN 104818517 A CN104818517 A CN 104818517A
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Abstract
The present invention discloses a zinc and copper electroplating solution zinc ion control apparatus, which comprises a work table, an electroplating jar, a concentration detector, a separation jar, water pumps, a water pipe, an electroplating anode, and an electroplating cathode. Compared with the apparatus in the prior art, the zinc and copper electroplating solution zinc ion control apparatus of the present invention has the following characteristics that: the zinc ion content in the electroplating solution in the electroplating jar can be accurately detected through the concentration detector, the solution in the electroplating jar can be pumped into the separation jar through the first frequency conversion water pump, the excess water is separated through the separator, and the separated solution is conveyed to the electroplating jar through the second frequency conversion water pump, such that it is ensured that the zinc ion content in the solution in the electroplating jar achieves the electroplating standard value so as to ensure the zinc plating layer thickness of the zinc and copper plating wire and improve the zinc and copper plating quality. The zinc and copper electroplating solution zinc ion control apparatus has characteristics of simple structure, powerful function, automatic improvement of the zinc ion content in the electroplating solution, and assurance of the zinc and copper plating quality requirement.
Description
Technical field
The present invention relates to a kind of setting device, particularly relate to a kind of tinned copper electroplating solution zine ion control device.
Background technology
Galvanized copper wire uses in a large number in industry and electron trade, galvanized copper wire copper cash is put into electroplating device plating processing, and to electroplate processing be by being connected on direct supply at anode and negative electrode, direct supply, anode, negative electrode and electroplating solution composition bar closed circuit, make the zine ion orientation movement in electroplating solution, zine ion and copper cash generation chemical reaction under the effect of electric current, obtain metallic zinc, and be adsorbed on copper line surface uniformly, complete zinc-plated processing, but the zine ion in electroplating solution is converted to metallic zinc, zinc ion content in electroplating solution is reduced, the galvanized layer thickness on the surface of copper cash is directly caused to reduce, have a strong impact on the quality of galvanized copper wire, cause quality product bad, in view of above-mentioned defect, be necessary to design a kind of tinned copper electroplating solution zine ion control device in fact.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of tinned copper electroplating solution zine ion control device, and the zinc ion content solved in electroplating solution reduces, and causes the problem that quality product is bad.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of tinned copper electroplating solution zine ion control device, comprise worktable, comprise plating cylinder, concentration detector, splitter cylinder, water pump, water pipe, galvanic anode, electroplating cathode, described plating cylinder is positioned at bench-top center, described plating cylinder is connected with worktable screw thread, described concentration detector is positioned on the downside of plating cylinder left end center, described concentration detector is connected with plating cylinder screw thread, the first described variable frequency pump is positioned at plating cylinder left end centre bottom, the first described variable frequency pump is connected with plating cylinder screw thread, described splitter cylinder is positioned at plating cylinder left end center, described splitter cylinder is connected with worktable screw thread, described separator is positioned at splitter cylinder inside center place, described separator is connected with splitter cylinder screw thread, the second described variable frequency pump is positioned on the upside of splitter cylinder right-hand member center, the second described variable frequency pump is connected with splitter cylinder screw thread, described galvanic anode is positioned on the left of plating cylinder top center, described galvanic anode is connected with plating cylinder screw thread, described electroplating cathode is positioned on the right side of plating cylinder top center, described electroplating cathode is connected with plating cylinder screw thread.
Further, described place of worktable bottom centre is also provided with return water tank, and described return water tank is connected with worktable screw thread.
Further, be also provided with water shoot on the left of described splitter cylinder bottom centre, described water shoot and splitter cylinder are weldingly connected.
Further, described plating cylinder top center place is also provided with agitator motor, and described agitator motor is connected with plating cylinder screw thread.
Further, the agitator motor lower center place stated also is provided with stir shaft, and described stir shaft is connected with agitator motor screw thread.
Further, be also provided with taper bucket on the right side of the splitter cylinder top center stated, described taper bucket is connected with splitter cylinder screw thread.
Compared with prior art, this tinned copper electroplating solution zine ion control device, first galvanic anode and electroplating cathode energising, plating processing is carried out to copper cash, the zinc ion content adding electroplating solution in man-hour in plating constantly reduces, can accurately the zinc ion content of electroplating solution in the place's of test plating cylinder by concentration detector, when the zinc ion content in solution is lower than plating standard, first variable frequency pump and the energising of the second variable frequency pump, make the first variable frequency pump will to electroplate in cylinder in solution suction splitter cylinder, by separator, too much water is separated, by the second variable frequency pump, the solution after separation is being transmitted back in plating cylinder, ensure that the zinc ion content of solution in plating cylinder reaches plating standard value, thus ensure that the galvanized layer thickness of galvanized copper wire, improve tinned copper quality, this assembling structure is simple, powerful, automatically the content of the middle zine ion of electroplating solution can be improved, ensure that the specification of quality of tinned copper.
Accompanying drawing explanation
Fig. 1 is tinned copper electroplating solution setting device sectional view
Cylinder 2 electroplated by worktable 1
Concentration determination device 3 first variable frequency pump 4
Splitter cylinder 5 separator 6
Second variable frequency pump 7 galvanic anode 8
Electroplating cathode 9 return water tank 101
Agitator motor 201 stir shaft 202
Water shoot 501 taper bucket 502
Following embodiment will further illustrate in conjunction with above-mentioned accompanying drawing.
Embodiment
Hereinafter, set forth multiple specific detail, to provide the thorough to the concept forming described embodiment basis.But to one skilled in the art, embodiment described obviously can be put into practice when not have in these specific detail some or all.In other cases, well-known treatment step is not specifically described.
As shown in Figure 1, a kind of tinned copper electroplating solution zine ion control device, comprise worktable 1, plating cylinder 2, concentration detector 3, first variable frequency pump 4, splitter cylinder 5, separator 6, second variable frequency pump 7, galvanic anode 8, electroplating cathode 9, return water tank 101, agitator motor 201, stir shaft 202, water shoot 501, taper bucket 502, described plating cylinder 2 is positioned at worktable 1 top center place, described plating cylinder 2 is connected with worktable 1 screw thread, described concentration detector 3 is positioned on the downside of plating cylinder 2 left end center, described concentration detector 3 is connected with plating cylinder 2 screw thread, the first described variable frequency pump 4 is positioned at plating cylinder 2 left end centre bottom, the first described variable frequency pump 4 is connected with plating cylinder 2 screw thread, described splitter cylinder 5 is positioned at plating cylinder 2 left end center, described splitter cylinder 2 is connected with worktable 1 screw thread, described separator 6 is positioned at splitter cylinder 5 inside center place, described separator 6 is connected with splitter cylinder 5 screw thread, the second described variable frequency pump 7 is positioned on the upside of splitter cylinder 5 right-hand member center, the second described variable frequency pump 7 is connected with splitter cylinder 5 screw thread, described galvanic anode 8 is positioned on the left of plating cylinder 2 top center, described galvanic anode 8 is connected with plating cylinder 2 screw thread, described electroplating cathode 9 is positioned on the right side of plating cylinder 2 top center, described electroplating cathode 9 is connected with plating cylinder 2 screw thread, described place of worktable 1 bottom centre is also provided with return water tank 101, described return water tank 101 is connected with worktable 1 screw thread, water shoot 501 is also provided with on the left of described splitter cylinder 5 bottom centre, described water shoot 501 is weldingly connected with splitter cylinder 5, described plating cylinder 2 top center place is also provided with agitator motor 201, described agitator motor 201 is connected with plating cylinder 2 screw thread, the agitator motor 201 lower center place stated also is provided with stir shaft 202, described stir shaft 202 is connected with agitator motor 201 screw thread, taper bucket 502 is also provided with on the right side of splitter cylinder 5 top center stated, described taper bucket 502 is connected with splitter cylinder 5 screw thread, wherein worktable 1 is the installation carrier of plating cylinder 2 and splitter cylinder 4, when the solution that the concentration of splitter cylinder 5 is high is transported in plating cylinder 2 by the second variable frequency pump 7, motor 201 drives stir shaft 202 to rotate, the solution electroplated in cylinder 2 is mixed, first variable frequency pump 4 will to be electroplated in cylinder 2 in electroplating solution suction splitter cylinder 5, through separator 6, too much moisture content is separated, return water tank 101 is entered by water shoot 501, taper bucket 502 is convenient to zine ion solid and is loaded the zinc ion content increasing solution in splitter cylinder 5, this tinned copper electroplating solution zine ion control device, first galvanic anode 8 and electroplating cathode 9 are energized, plating processing is carried out to copper cash, the zinc ion content adding electroplating solution in man-hour in plating constantly reduces, can accurately the zinc ion content of electroplating solution in the place's of test plating cylinder 2 by concentration detector 3, when the zinc ion content in solution is lower than plating standard, first variable frequency pump 4 and the second variable frequency pump 7 are energized, make the first variable frequency pump 4 will to electroplate in cylinder in solution suction splitter cylinder 5, by separator 6, too much water is separated, by the second variable frequency pump 7, the solution after separation is being transmitted back in plating cylinder 2, ensure that the zinc ion content of solution in plating cylinder reaches plating standard value, thus ensure that the galvanized layer thickness of galvanized copper wire, improve tinned copper quality, this assembling structure is simple, powerful, automatically the content of the middle zine ion of electroplating solution can be improved, ensure that the specification of quality of tinned copper.
The present invention is not limited to above-mentioned concrete embodiment, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion made, all drop within protection scope of the present invention.
Claims (6)
1. a tinned copper electroplating solution zine ion control device, comprise worktable, it is characterized in that comprising plating cylinder, concentration detector, splitter cylinder, water pump, water pipe, galvanic anode, electroplating cathode, described plating cylinder is positioned at bench-top center, described plating cylinder is connected with worktable screw thread, described concentration detector is positioned on the downside of plating cylinder left end center, described concentration detector is connected with plating cylinder screw thread, the first described variable frequency pump is positioned at plating cylinder left end centre bottom, the first described variable frequency pump is connected with plating cylinder screw thread, described splitter cylinder is positioned at plating cylinder left end center, described splitter cylinder is connected with worktable screw thread, described separator is positioned at splitter cylinder inside center place, described separator is connected with splitter cylinder screw thread, the second described variable frequency pump is positioned on the upside of splitter cylinder right-hand member center, the second described variable frequency pump is connected with splitter cylinder screw thread, described galvanic anode is positioned on the left of plating cylinder top center, described galvanic anode is connected with plating cylinder screw thread, described electroplating cathode is positioned on the right side of plating cylinder top center, described electroplating cathode is connected with plating cylinder screw thread.
2. a kind of tinned copper electroplating solution zine ion control device as claimed in claim 1, it is characterized in that described place of worktable bottom centre is also provided with return water tank, described return water tank is connected with worktable screw thread.
3. a kind of tinned copper electroplating solution zine ion control device as claimed in claim 2, it is characterized in that also being provided with water shoot on the left of described splitter cylinder bottom centre, described water shoot and splitter cylinder are weldingly connected.
4. a kind of tinned copper electroplating solution zine ion control device as claimed in claim 3, is characterized in that described plating cylinder top center place is also provided with agitator motor, and described agitator motor is connected with plating cylinder screw thread.
5. a kind of tinned copper electroplating solution zine ion control device as claimed in claim 4, it is characterized in that described agitator motor lower center place is also provided with stir shaft, described stir shaft is connected with agitator motor screw thread.
6. a kind of tinned copper electroplating solution zine ion control device as claimed in claim 5, it is characterized in that also being provided with taper bucket on the right side of described splitter cylinder top center, described taper bucket is connected with splitter cylinder screw thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510160734.0A CN104818517A (en) | 2015-04-07 | 2015-04-07 | Zinc and copper electroplating solution zinc ion control apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510160734.0A CN104818517A (en) | 2015-04-07 | 2015-04-07 | Zinc and copper electroplating solution zinc ion control apparatus |
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| CN104818517A true CN104818517A (en) | 2015-08-05 |
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| CN201510160734.0A Pending CN104818517A (en) | 2015-04-07 | 2015-04-07 | Zinc and copper electroplating solution zinc ion control apparatus |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105671622A (en) * | 2016-03-03 | 2016-06-15 | 佛山科学技术学院 | Electrogilding device |
| CN110318090A (en) * | 2019-08-08 | 2019-10-11 | 珠海市万顺睿通科技有限公司 | A kind of electroplating printed circuit board device and electro-plating method |
| CN110872724A (en) * | 2018-09-03 | 2020-03-10 | 东莞市脉拓表面处理科技有限公司 | Method and device for preparing electroplating liquid medicine |
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| JP2000160399A (en) * | 1998-12-02 | 2000-06-13 | Ebara Corp | Plating device |
| JP2003166100A (en) * | 2001-09-21 | 2003-06-13 | Tsurumi Soda Co Ltd | Copper powder used for copper plating, and method for using copper powder |
| JP2004162078A (en) * | 2002-11-08 | 2004-06-10 | Tsurumi Soda Co Ltd | Copper plating device |
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| CN203715761U (en) * | 2013-12-10 | 2014-07-16 | 中国航空工业标准件制造有限责任公司 | Electroplating device for galvanization by alkaline solution |
| CN104328475A (en) * | 2014-06-20 | 2015-02-04 | 商实企业有限公司 | Copper-plating system |
| CN204714938U (en) * | 2015-04-07 | 2015-10-21 | 安徽江南鸣放电子科技有限公司 | A kind of tinned copper electroplating solution zine ion control device |
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2015
- 2015-04-07 CN CN201510160734.0A patent/CN104818517A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000160399A (en) * | 1998-12-02 | 2000-06-13 | Ebara Corp | Plating device |
| JP2003166100A (en) * | 2001-09-21 | 2003-06-13 | Tsurumi Soda Co Ltd | Copper powder used for copper plating, and method for using copper powder |
| JP2004162078A (en) * | 2002-11-08 | 2004-06-10 | Tsurumi Soda Co Ltd | Copper plating device |
| CN101407934A (en) * | 2008-11-04 | 2009-04-15 | 中冶连铸技术工程股份有限公司 | Electro-galvanizing liquid automatic allocating and updating system |
| CN203715761U (en) * | 2013-12-10 | 2014-07-16 | 中国航空工业标准件制造有限责任公司 | Electroplating device for galvanization by alkaline solution |
| CN104328475A (en) * | 2014-06-20 | 2015-02-04 | 商实企业有限公司 | Copper-plating system |
| CN204714938U (en) * | 2015-04-07 | 2015-10-21 | 安徽江南鸣放电子科技有限公司 | A kind of tinned copper electroplating solution zine ion control device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105671622A (en) * | 2016-03-03 | 2016-06-15 | 佛山科学技术学院 | Electrogilding device |
| CN110872724A (en) * | 2018-09-03 | 2020-03-10 | 东莞市脉拓表面处理科技有限公司 | Method and device for preparing electroplating liquid medicine |
| CN110318090A (en) * | 2019-08-08 | 2019-10-11 | 珠海市万顺睿通科技有限公司 | A kind of electroplating printed circuit board device and electro-plating method |
| CN110318090B (en) * | 2019-08-08 | 2021-08-31 | 湖南金康电路板有限公司 | Electroplating device and electroplating method for printed circuit board |
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Application publication date: 20150805 |
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