CN211713240U - Device for eliminating copper ions in high-temperature anti-oxidation solution of copper foil - Google Patents

Device for eliminating copper ions in high-temperature anti-oxidation solution of copper foil Download PDF

Info

Publication number
CN211713240U
CN211713240U CN201922485605.5U CN201922485605U CN211713240U CN 211713240 U CN211713240 U CN 211713240U CN 201922485605 U CN201922485605 U CN 201922485605U CN 211713240 U CN211713240 U CN 211713240U
Authority
CN
China
Prior art keywords
zinc
copper
copper foil
solution
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201922485605.5U
Other languages
Chinese (zh)
Inventor
王海军
杨兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Huayuan new energy Co.,Ltd.
Original Assignee
Zhejiang Huayuan New Energy Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Huayuan New Energy Co ltd filed Critical Zhejiang Huayuan New Energy Co ltd
Priority to CN201922485605.5U priority Critical patent/CN211713240U/en
Application granted granted Critical
Publication of CN211713240U publication Critical patent/CN211713240U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The utility model discloses an eliminate device of copper ion in anti-oxidation solution of copper foil high temperature, wherein the copper foil carries out high temperature resistant anti-oxidation treatment in the zinc-plating solution circulating slot that the splendid attire has zinc-plating solution, the device is including the zinc ball that is arranged in replacing the copper ion in the zinc-plating solution and the replacement basket of splendid attire zinc ball, the replacement basket including dip in zinc-plating solution in the zinc-plating solution circulating slot immersion portion and with the fixed part that zinc-plating solution circulating slot is fixed, the immersion portion is equipped with and makes zinc-plating solution react in getting into the immersion portion with the zinc ball to can filter the filter screen of the copper powder that the zinc ball surface dropped. The utility model discloses a mode of copper ion reaches to eliminate or reduce copper ion in the anti-oxidation solution of high temperature in the zinc-ball replacement galvanizing solution, guarantees to handle the anti-oxidation performance stability of paper tinsel high temperature.

Description

Device for eliminating copper ions in high-temperature anti-oxidation solution of copper foil
Technical Field
The utility model relates to an electrolytic copper foil processing field, concretely relates to technology of copper ion in eliminating copper foil surface treatment high temperature anti-oxidation solution.
Background
The surface of the copper foil is very smooth, the surface of the copper foil which is not treated can not be pressed with resin basically, and special surface treatment needs to be carried out on the surface of the copper foil in order to improve the bonding force between the copper foil and the substrate. In addition, the copper foil is treated by the roughening and curing copper plating processes to improve the peeling strength of the copper foil, and high-temperature anti-oxidation treatment is also required. The high-temperature oxidation-resistant treatment aims to prevent the copper foil from being oxidized and discolored when the copper foil is pressed with resin at high temperature, once the copper foil is oxidized, the conductivity of the manufactured circuit copper foil is influenced, and therefore, the high-temperature resistance is a necessary item for the delivery of the copper foil.
The copper foil is generally galvanized on both sides of the copper foil in a high-temperature and oxidation-resistant manner, and a zinc layer and copper form zinc brass with strong corrosion resistance under a high-temperature condition. However, after the copper foil is treated by the previous copper plating process, trace copper ions still remain on the surface of the copper foil, the content of the copper ions brought in the high-temperature anti-oxidation zinc plating solution is gradually increased along with the increase of the electroplating time, and when the amount of the copper ions is accumulated to a certain concentration, the high-temperature oxidation performance of the copper foil is reduced, and the finished product is scrapped. Although the high-temperature anti-oxidation current density can be increased, the increase of the current density leads to the increase of the zinc content and can ensure the high-temperature performance of the copper foil, the increase of the zinc content of the plating layer leads to the change of the surface color of the copper foil and also leads to the unqualified shipment of the copper foil.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a device of copper ion in the anti-oxidation solution of elimination copper foil high temperature is provided, guaranteed the stability of copper foil at the anti-oxidation in-process solution of surface treatment high temperature.
In order to solve the technical problem, the utility model adopts the following technical scheme: a device for eliminating copper ions in a high-temperature anti-oxidation solution of a copper foil is characterized in that the copper foil is subjected to high-temperature-resistant anti-oxidation treatment in a galvanizing solution circulating tank containing a galvanizing solution, the device comprises a zinc ball for replacing the copper ions in the galvanizing solution and a replacement basket for containing the zinc ball, the replacement basket comprises an immersion part immersed in the galvanizing solution circulating tank and a fixing part fixed with the galvanizing solution circulating tank, and the immersion part is provided with a filter screen which can enable the galvanizing solution to enter the immersion part to react with the zinc ball and can filter copper powder falling from the surface of the zinc ball.
Optionally, the diameter of the zinc ball is 20 mm.
Optionally, the filter screen is a 500-mesh titanium screen.
Optionally, the fixing portion is made of U-shaped steel, and both ends of the U-shaped steel are supported on both sides of the galvanizing solution circulation tank.
The utility model discloses a technical scheme, in the immersion part that will replace the basket dip galvanizing solution in the galvanizing solution circulation groove, adopt the zinc ball to replace the mode of copper ion in the galvanizing solution and reach and eliminate or reduce copper ion in the anti-oxidation solution of high temperature, guarantee to handle the anti-oxidation performance stability of paper tinsel high temperature.
Therefore, the following beneficial effects are achieved:
the stability of the high-temperature anti-oxidation solution of the copper foil is realized, the high-temperature resistance and anti-oxidation performance of the copper foil are ensured, and the requirements of the copper foil on high temperature in the production process of a circuit board for a high-temperature pressing plate and the production baking process of a lithium battery are met.
By eliminating copper ions in the high-temperature anti-oxidation solution of the copper foil, the requirement that the copper foil is not oxidized and discolored at 40 min at the high temperature of 210 ℃ is met, and the stability of the high-temperature resistant quality of the copper foil is ensured.
The utility model discloses a specific technical scheme and the beneficial effect that brings will give detailed disclosure in the following embodiment in combination with the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
The technical solutions of the embodiments of the present invention are explained and explained below with reference to the drawings of the embodiments of the present invention, but the embodiments described below are only preferred embodiments of the present invention, and not all embodiments. Based on the embodiments in the embodiment, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.
The high-temperature anti-oxidation solution adopts a conventional alkaline zinc plating process, the concentration of Zn2+ is 3-5 g/L, K4P2O7, the concentration of Zn is 80-120 g/L, PH 10.5.5-11.0, the temperature is 35-40 ℃, the polar distance is 50-55 mm, the current density is 40-45A/dm 2, and the operation speed is 25 m/min. Under the process conditions, the new preparation solution is operated for 15 days generally along with the electroplating time, the content of copper ions in the solution reaches 60mg/L, the high-temperature oxidation resistance of the treated copper foil is reduced, and the surface of the copper foil is oxidized and discolored after the copper foil is heated at 210 ℃ for 40 minutes.
In order to eliminate copper ions in the high-temperature anti-oxidation solution of the copper foil, the device for eliminating the copper ions in the high-temperature anti-oxidation solution of the copper foil shown in fig. 1 is adopted, and comprises zinc balls for replacing the copper ions in the galvanizing solution and a replacement basket 1 for containing the zinc balls, wherein the replacement basket 1 comprises an immersion part 11 immersed in the galvanizing solution in a galvanizing solution circulating tank and a fixing part 12 fixed with the galvanizing solution circulating tank, and the immersion part 11 is provided with a filter screen 13 which can enable the galvanizing solution to enter the immersion part to react with the zinc balls and can filter copper powder falling from the surfaces of the zinc balls.
Wherein, the method of replacing copper ions in the galvanizing solution by zinc balls with the diameter of 20mm is adopted to eliminate or reduce the copper ions in the high-temperature anti-oxidation solution, and the stability of the high-temperature anti-oxidation performance of the treated foil is ensured. The specific measures are that zinc balls with 99.999 percent of zinc content are filled in a titanium basket and are arranged in the titanium basket at a position of 6m3In the galvanizing solution circulation tank, because the contact area of the zinc ball is large, copper ions in the solution can be efficiently replaced, and the reaction principle is as follows: zn + Cu2+=Zn2++ Cu, metal copper is attached to the surface of the zinc ball and is cleaned regularly every month. In addition, the metal titanium has good corrosion resistance, and prevents the pollution to the galvanizing solution.
Preferably, the filter screen is a 500-mesh titanium screen. Can prevent the fine copper powder on the surface of the zinc ball from entering the solution to cause the surface defect of the copper foil. The fixing part is made of U-shaped steel, and two ends of the U-shaped steel are supported on two sides of the galvanizing solution circulating tank and can be fixed by bolts.
Of course, it can be understood that the titanium basket zinc balls need to be cleaned regularly, and the weak copper powder on the surfaces of the zinc balls is washed away, so that the replacement efficiency between zinc and copper is ensured.
The results of the actual production verification are shown in the following table.
Figure DEST_PATH_GDA0002618128560000041
Through practical production verification, the method is simple to operate, can efficiently reduce the concentration of copper ions in the high-temperature anti-oxidation solution, and ensures the stability of the high-temperature anti-oxidation performance of the copper foil.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that the present invention includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification which does not depart from the functional and structural principles of the present invention is intended to be included within the scope of the claims.

Claims (4)

1. A device for eliminating copper ions in a high-temperature anti-oxidation solution of a copper foil, wherein the copper foil is subjected to high-temperature resistant anti-oxidation treatment in a galvanizing solution circulating tank containing a galvanizing solution, is characterized in that: the device is including the zinc ball that is arranged in the copper ion of replacement galvanizing solution and the replacement basket of splendid attire zinc ball, the replacement basket is including the immersion part that immerses in galvanizing solution in the galvanizing solution circulating slot and with the fixed part that galvanizing solution circulating slot is fixed, the immersion part is equipped with and makes galvanizing solution get into in the immersion part and react with the zinc ball to can filter the filter screen of the copper powder that the zinc ball surface dropped.
2. The device for eliminating the copper ions in the high-temperature anti-oxidation solution of the copper foil according to claim 1, wherein: the diameter of the zinc ball is 20 mm.
3. The device for eliminating the copper ions in the high-temperature anti-oxidation solution of the copper foil according to claim 1, wherein: the filter screen uses a 500-mesh titanium screen.
4. The device for eliminating the copper ions in the high-temperature anti-oxidation solution of the copper foil according to claim 1, wherein: the fixing part is made of U-shaped steel, and two ends of the U-shaped steel are supported on two sides of the galvanizing solution circulating groove.
CN201922485605.5U 2019-12-30 2019-12-30 Device for eliminating copper ions in high-temperature anti-oxidation solution of copper foil Active CN211713240U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922485605.5U CN211713240U (en) 2019-12-30 2019-12-30 Device for eliminating copper ions in high-temperature anti-oxidation solution of copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922485605.5U CN211713240U (en) 2019-12-30 2019-12-30 Device for eliminating copper ions in high-temperature anti-oxidation solution of copper foil

Publications (1)

Publication Number Publication Date
CN211713240U true CN211713240U (en) 2020-10-20

Family

ID=72821804

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922485605.5U Active CN211713240U (en) 2019-12-30 2019-12-30 Device for eliminating copper ions in high-temperature anti-oxidation solution of copper foil

Country Status (1)

Country Link
CN (1) CN211713240U (en)

Similar Documents

Publication Publication Date Title
US9388371B2 (en) Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil
CN102605400B (en) Steel strip continuous copper plating process
CN104674316A (en) Treatment technique for enhancing peel strength of electronic copper foil
CN103668357A (en) Alkaline cyanide-free high-speed copper plating solution
CN106319585A (en) Surface treatment method of high-precision blackened rolled copper foil
CN103501580B (en) A kind of surface treatment copper foil and preparation method thereof
CN110344105A (en) A kind of two-sided surface treatment method of rolled copper foil
CN103924276A (en) Electroplating system and electroplating method for surface-mounted light emitting diode support
CN102732938A (en) Electroplating device for dynamically adjusting anode power-supply area and method thereof
CN105088289A (en) Method for electroplating or deplating aluminum-based copper-inlaid workpiece
CN211713240U (en) Device for eliminating copper ions in high-temperature anti-oxidation solution of copper foil
CN102808202A (en) Electrocoating process manufacturing method for tin plate for large plastic deformation processing
CN112176371B (en) Electroplating process for plating gold on beryllium copper surface
CN100576377C (en) Termination electrode of a kind of sheet type ferrite inductor and preparation method thereof
CN111636077A (en) Process for preventing ceramic chip from being plated with nickel or gold by creeping plating
CN104419952A (en) Method for copper electroplating, nickel chemical plating and nickel electroplating on the surface of magnesium alloy
CN106757229A (en) A kind of electro-plating method
CN103358614A (en) Steel sheet with stanniferous coating and preparation method thereof
CN1218520A (en) Tin plating method and bath having wide optimum current density range
CN110528042B (en) Semiconductor device electroplating method and activation tank for electroplating
CN104562101A (en) Method for electroplating copper clad aluminum wires
CN105386100A (en) Method for electroplating copper and sliver on iron-nickel alloy frame
CN101960055B (en) Method for plating RF equipment and RF equipment manufactured therefrom
CN204714938U (en) A kind of tinned copper electroplating solution zine ion control device
JP7456578B2 (en) Copper surface processing equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 322121 Huayuan village, Nanma Town, Dongyang City, Jinhua City, Zhejiang Province

Patentee after: Zhejiang Huayuan new energy Co.,Ltd.

Address before: 322121 Huayuan village, Nanma Town, Dongyang City, Jinhua City, Zhejiang Province

Patentee before: ZHEJIANG HUAYUAN NEW ENERGY Co.,Ltd.