CN105671622A - Electrogilding device - Google Patents
Electrogilding device Download PDFInfo
- Publication number
- CN105671622A CN105671622A CN201610121848.9A CN201610121848A CN105671622A CN 105671622 A CN105671622 A CN 105671622A CN 201610121848 A CN201610121848 A CN 201610121848A CN 105671622 A CN105671622 A CN 105671622A
- Authority
- CN
- China
- Prior art keywords
- cylinder
- electroplating
- electrogilding
- plating cylinder
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Abstract
The invention discloses an electrogilding device. The electrogilding device comprises a workbench. The workbench is provided with an electroplating cylinder, a concentration detector, an electroplating anode, an electroplating cathode, a gold solution tank, a water pump and a water pipe. The concentration detector and the electroplating anode are arranged in the electroplating cylinder. The electroplating cathode is located above the electroplating cylinder and inserted in the electroplating cylinder. The gold solution tank and the electroplating cylinder are connected through the water pipe, and the water pipe is provided with the water pump. The content of gold ions in an electroplating solution in the electroplating cylinder is increased, the content of the gold ions in the electroplating solution reaches the standard electroplating content value all the time, and therefore the thickness of an electrogilding layer of a surface belt or a surface shell is guaranteed, and the electrogilding quality is improved. The device is simple in structure, powerful in function and capable of automatically increasing the content of the gold ions in the electroplating solution, the electrogilding quality requirement is guaranteed, the manual operation intensity is lowered, and the electrogilding layer quality is higher.
Description
Technical field
The present invention relates to a kind of electroplating device, particularly relate to a kind of electrogilding device
Background technology
Gold plate solidity to corrosion is excellent, having good ductility, solderability, electroconductibility and thermal conductivity, and chemical property is stablized, anti-tarnishing ability is good, therefore, electrogilding technique has now been widely used in the electronic components fabrication such as electrical equipment, printed circuit board (PCB), science and techniques of defence and essence decorations manufacture field.
But, owing to the gold ion content in electroplating solution reduces, directly cause plated thickness to reduce, seriously affect the quality of Gold plated Layer, cause quality product bad, in view of above-mentioned defect, be necessary to design a kind of electrogilding device in fact.
Summary of the invention
Instant invention overcomes shortcoming of the prior art, it provides a kind of electrogilding device, it ensures the gold ion content in electroplating solution, makes constant product quality.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions:
A kind of electrogilding device, comprise worktable, described worktable is provided with plating cylinder, concentration detector, galvanic anode, electroplating cathode, gold solution groove, water pump and water pipe, described concentration detector and galvanic anode are located in described plating cylinder, described electroplating cathode is positioned at above described plating cylinder, and inserting described plating cylinder, described gold solution groove and described plating cylinder are connected by water pipe, and described water pipe is provided with described water pump.
Further, being also provided with splitter cylinder bottom described worktable, described splitter cylinder top connects the bottom of described plating cylinder by pipeline, and described pipeline is provided with water valve in the bottom of described plating cylinder, and described splitter cylinder also connects described plating cylinder by backflow water pump.
Further, described plating cylinder is also provided with stir shaft, and described stir shaft is as electroplating cathode, and described stir shaft is provided with agitator motor.
Further, described plating cylinder is connected with worktable screw thread, and described plating cylinder is positioned at bench-top center.
Further, described concentration detector is connected with plating cylinder screw thread, and described water pipe is weldingly connected with plating cylinder, and is connected with water pump screw thread.
Further, described concentration detector is positioned on the downside of plating cylinder left end center.
Further, described galvanic anode is connected with plating cylinder screw thread, and described electroplating cathode is positioned at plating cylinder top center, and described electroplating cathode is connected with plating cylinder screw thread.
Further, described gold solution groove is connected with worktable screw thread, and described water pipe is connected with plating cylinder screw thread.
Further, described water pump is variable frequency pump.
Compared with prior art, the invention has the beneficial effects as follows:
A kind of electrogilding device of the present invention, first anode and negative electrode energising, carry out plating processing, when electroplating the gold ion content adding electroplating solution in man-hour and reduce, concentration detector can accurately test the gold ion content of the electroplating solution in plating cylinder, when gold ion content is lower than the standard electroplated, automatically power to variable frequency pump, variable frequency pump is operated, solution high for gold ion content in gold solution groove is transported in plating cylinder by water pipe, from the content of the electroplating solution gold ion that improve plating cylinder, the gold ion content in electroplating solution is made to reach plating standard content value all the time, thus ensure that the plated thickness of watchband or watchcase, improve gold plating quality, this apparatus structure is simple, powerful, can automatically improve the gold ion content in electroplating solution, ensure that gold-plated specification of quality.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, together with embodiments of the present invention for explaining the present invention, is not construed as limiting the invention, in the accompanying drawings:
Fig. 1 is the structural representation of the present invention.
In figure, 1 worktable; 2 plating cylinders;
3 concentration determination devices; 4 gold solution grooves;
5 variable frequency pumps; 6 water pipes;
7 first galvanic anodes; 8 the 2nd galvanic anodes;
101 splitter cylinder; 102 backflow water pumps;
201 agitator motors; 202 electroplating cathodes;
203 water valves.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described, it will be appreciated that preferred embodiment described herein, only for instruction and explanation of the present invention, is not intended to limit the present invention.
As shown in Figure 1, a kind of electrogilding device of the present invention, comprise worktable 1, plating cylinder 2, concentration detector 3, gold solution groove 4, variable frequency pump 5, water pipe 6, first galvanic anode 7, 2nd galvanic anode 8, splitter cylinder 101, backflow water pump 102, agitator motor 201, stir shaft (electroplating cathode) 202, water valve 203, plating cylinder 2 is positioned at worktable 1 top center place, plating cylinder 2 is connected with worktable 1 screw thread, concentration detector 3 is positioned on the downside of plating cylinder 2 left end center, concentration detector 3 is connected with plating cylinder 2 screw thread, gold solution groove 4 is positioned at plating cylinder 2 left end center, gold solution groove 4 is connected with worktable 1 screw thread, variable frequency pump 5 is positioned at gold solution groove 4 top center place, variable frequency pump 5 is connected with gold solution groove 4 screw thread, water pipe 6 is positioned at variable frequency pump 5 top center place, water pipe 6 is weldingly connected with plating cylinder 2, and it is connected with variable frequency pump 5 screw thread, first galvanic anode 7 is positioned on the left of plating cylinder 2 top center, first galvanic anode 7 is connected with plating cylinder 2 screw thread, 2nd galvanic anode 8 is positioned on the right side of plating cylinder 2 top center, 2nd galvanic anode 8 is connected with plating cylinder 2 screw thread, place of worktable 1 bottom centre is also provided with splitter cylinder 101, splitter cylinder 101 is connected with worktable 1 screw thread, splitter cylinder 101 left end center is also provided with backflow water pump 102, backflow water pump 102 is connected with worktable 1 screw thread, plating cylinder 2 top center place is also provided with agitator motor 201, agitator motor 201 is connected with plating cylinder 2 screw thread, agitator motor 201 lower center place is also provided with stir shaft (electroplating cathode) 202, stir shaft 202 is connected with agitator motor 201 screw thread, electroplate on the left of cylinder 2 bottom centre or water valve 203, water valve 203 is connected with plating cylinder 2 screw thread, wherein worktable 1 is the installation carrier of plating cylinder 2 and gold solution groove 4.
When opening water valve 203, solution in plating cylinder 2 flows in splitter cylinder 101, water in solution can be separated by splitter cylinder 101, thus improve the content of GOLD FROM PLATING SOLUTION ion, by backflow water pump 102, solution is withdrawn in plating cylinder 2 again, reach re-using, when the solution that the concentration of gold solution groove 4 is high is transported in plating cylinder 2 by variable frequency pump 5, motor 201 drives stir shaft 202 to rotate, the solution electroplated in cylinder 2 is mixed, this electrogilding device, first the first galvanic anode 7, 2nd galvanic anode 8 and electroplating cathode 202 are energized, plating processing is carried out to watchband or watchcase, when electroplating the gold ion content adding electroplating solution in man-hour and reduce, concentration detector 3 can accurately test the gold ion content of the electroplating solution in plating cylinder 2, when gold ion content is lower than the standard electroplated, power automatically to variable frequency pump 5, variable frequency pump 5 is operated, solution high for gold ion content in gold solution groove 4 is transported in plating cylinder 2 by water pipe 6, from the content of the electroplating solution gold ion that improve plating cylinder 2, the gold ion content in electroplating solution is made to make to reach plating standard content value all the time, thus ensure that electrogilding layer thickness, improve gold plating quality, this apparatus structure is simple, powerful, can automatically improve the content of the middle gold ion of electroplating solution, ensure that the specification of quality of electrogilding.
Finally it is noted that these are only the preferred embodiments of the present invention; it is not limited to the present invention; although with reference to embodiment to invention has been detailed description; for a person skilled in the art; technical scheme described in foregoing embodiments still can be modified by it; or wherein part technology feature is carried out equivalent replacement; but it is within the spirit and principles in the present invention all; any amendment of being done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. an electrogilding device, comprise worktable, it is characterized in that: described worktable is provided with plating cylinder, concentration detector, galvanic anode, electroplating cathode, gold solution groove, water pump and water pipe, described concentration detector and galvanic anode are located in described plating cylinder, described electroplating cathode is positioned at above described plating cylinder, and inserting described plating cylinder, described gold solution groove and described plating cylinder are connected by water pipe, and described water pipe is provided with described water pump.
2. a kind of electrogilding device according to claim 1, it is characterized in that: bottom described worktable, be also provided with splitter cylinder, described splitter cylinder top connects the bottom of described plating cylinder by pipeline, described pipeline is provided with water valve in the bottom of described plating cylinder, and described splitter cylinder also connects described plating cylinder by backflow water pump.
3. a kind of electrogilding device according to claim 1, it is characterised in that: described plating cylinder is also provided with stir shaft, and described stir shaft is as electroplating cathode, and described stir shaft is provided with agitator motor.
4. a kind of electrogilding device according to claim 1, it is characterised in that: described plating cylinder is connected with worktable screw thread, and described plating cylinder is positioned at bench-top center.
5. a kind of electrogilding device according to claim 1, it is characterised in that: described concentration detector is connected with plating cylinder screw thread, and cylinder is weldingly connected described water pipe with electroplating, and is connected with water pump screw thread.
6. a kind of electrogilding device according to claim 5, it is characterised in that: described concentration detector is positioned on the downside of plating cylinder left end center.
7. a kind of electrogilding device according to claim 1, it is characterised in that: described galvanic anode is connected with plating cylinder screw thread, and described electroplating cathode is positioned at plating cylinder top center, and cylinder screw thread is connected described electroplating cathode with electroplating.
8. a kind of electrogilding device according to claim 1, it is characterised in that: described gold solution groove is connected with worktable screw thread, and cylinder screw thread is connected described water pipe with electroplating.
9. a kind of electrogilding device according to claim 1, it is characterised in that: described water pump is variable frequency pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121848.9A CN105671622A (en) | 2016-03-03 | 2016-03-03 | Electrogilding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121848.9A CN105671622A (en) | 2016-03-03 | 2016-03-03 | Electrogilding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105671622A true CN105671622A (en) | 2016-06-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610121848.9A Pending CN105671622A (en) | 2016-03-03 | 2016-03-03 | Electrogilding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105671622A (en) |
Citations (14)
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|---|---|---|---|---|
| US4564432A (en) * | 1983-07-25 | 1986-01-14 | Nanao Kogyo Co., Ltd. | Apparatus for recovering metals dissolved in a solution |
| EP1300486A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| EP1308541A1 (en) * | 2001-10-04 | 2003-05-07 | Shipley Company LLC | Plating bath and method for depositing a metal layer on a substrate |
| CN2828067Y (en) * | 2005-06-09 | 2006-10-18 | 福州大学 | Real-time monitoring device for concentration of additive in electrolyte |
| JP2009173992A (en) * | 2008-01-23 | 2009-08-06 | Asahi Plating Co Ltd | Method of manufacturing plated material and electroplating method |
| CN101532160A (en) * | 2008-03-11 | 2009-09-16 | 上村工业株式会社 | Continuous copper electroplating method |
| CN102021622A (en) * | 2010-12-09 | 2011-04-20 | 北京航空航天大学 | Method and device for plating cladding magnetic material on microorganism surface |
| CN102148390A (en) * | 2010-02-10 | 2011-08-10 | 大连融科储能技术发展有限公司 | Battery system for distributing flow energy storage current or voltage and control method |
| CN201990747U (en) * | 2010-12-27 | 2011-09-28 | 嘉兴市天器新材料科技有限公司 | Nano electroplating bath |
| CN103741179A (en) * | 2013-12-26 | 2014-04-23 | 中国电子科技集团公司第五十五研究所 | Three-dimensional stereoscopic gold-electroplating device and method for semiconductor silicon wafer with through holes |
| CN104805493A (en) * | 2015-04-07 | 2015-07-29 | 安徽江南鸣放电子科技有限公司 | Zinc plated copper electroplating solution regulating device |
| CN104818517A (en) * | 2015-04-07 | 2015-08-05 | 安徽江南鸣放电子科技有限公司 | Zinc and copper electroplating solution zinc ion control apparatus |
| CN204714937U (en) * | 2015-04-07 | 2015-10-21 | 安徽江南鸣放电子科技有限公司 | A kind of tinned copper electroplating solution setting device |
| CN204714938U (en) * | 2015-04-07 | 2015-10-21 | 安徽江南鸣放电子科技有限公司 | A kind of tinned copper electroplating solution zine ion control device |
-
2016
- 2016-03-03 CN CN201610121848.9A patent/CN105671622A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4564432A (en) * | 1983-07-25 | 1986-01-14 | Nanao Kogyo Co., Ltd. | Apparatus for recovering metals dissolved in a solution |
| EP1300486A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| EP1308541A1 (en) * | 2001-10-04 | 2003-05-07 | Shipley Company LLC | Plating bath and method for depositing a metal layer on a substrate |
| CN2828067Y (en) * | 2005-06-09 | 2006-10-18 | 福州大学 | Real-time monitoring device for concentration of additive in electrolyte |
| JP2009173992A (en) * | 2008-01-23 | 2009-08-06 | Asahi Plating Co Ltd | Method of manufacturing plated material and electroplating method |
| CN101532160A (en) * | 2008-03-11 | 2009-09-16 | 上村工业株式会社 | Continuous copper electroplating method |
| CN102148390A (en) * | 2010-02-10 | 2011-08-10 | 大连融科储能技术发展有限公司 | Battery system for distributing flow energy storage current or voltage and control method |
| CN102021622A (en) * | 2010-12-09 | 2011-04-20 | 北京航空航天大学 | Method and device for plating cladding magnetic material on microorganism surface |
| CN201990747U (en) * | 2010-12-27 | 2011-09-28 | 嘉兴市天器新材料科技有限公司 | Nano electroplating bath |
| CN103741179A (en) * | 2013-12-26 | 2014-04-23 | 中国电子科技集团公司第五十五研究所 | Three-dimensional stereoscopic gold-electroplating device and method for semiconductor silicon wafer with through holes |
| CN104805493A (en) * | 2015-04-07 | 2015-07-29 | 安徽江南鸣放电子科技有限公司 | Zinc plated copper electroplating solution regulating device |
| CN104818517A (en) * | 2015-04-07 | 2015-08-05 | 安徽江南鸣放电子科技有限公司 | Zinc and copper electroplating solution zinc ion control apparatus |
| CN204714937U (en) * | 2015-04-07 | 2015-10-21 | 安徽江南鸣放电子科技有限公司 | A kind of tinned copper electroplating solution setting device |
| CN204714938U (en) * | 2015-04-07 | 2015-10-21 | 安徽江南鸣放电子科技有限公司 | A kind of tinned copper electroplating solution zine ion control device |
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Application publication date: 20160615 |
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