CN104808880B - 触摸检测电路以及具备该触摸检测电路的半导体集成电路 - Google Patents
触摸检测电路以及具备该触摸检测电路的半导体集成电路 Download PDFInfo
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- CN104808880B CN104808880B CN201510045155.1A CN201510045155A CN104808880B CN 104808880 B CN104808880 B CN 104808880B CN 201510045155 A CN201510045155 A CN 201510045155A CN 104808880 B CN104808880 B CN 104808880B
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- 238000001514 detection method Methods 0.000 title claims abstract description 131
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 239000003990 capacitor Substances 0.000 claims description 36
- 230000005611 electricity Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 240000002853 Nelumbo nucifera Species 0.000 claims description 5
- 235000006508 Nelumbo nucifera Nutrition 0.000 claims description 5
- 235000006510 Nelumbo pentapetala Nutrition 0.000 claims description 5
- 230000035945 sensitivity Effects 0.000 abstract description 6
- 230000009471 action Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 238000007689 inspection Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 238000012544 monitoring process Methods 0.000 description 5
- 101710170231 Antimicrobial peptide 2 Proteins 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000013519 translation Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2605—Measuring capacitance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
- G06F3/04182—Filtering of noise external to the device and not generated by digitiser components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Position Input By Displaying (AREA)
- Electronic Switches (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-013942 | 2014-01-29 | ||
JP2014013942A JP2015141556A (ja) | 2014-01-29 | 2014-01-29 | タッチ検出回路及びそれを備える半導体集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104808880A CN104808880A (zh) | 2015-07-29 |
CN104808880B true CN104808880B (zh) | 2019-09-17 |
Family
ID=53679030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510045155.1A Active CN104808880B (zh) | 2014-01-29 | 2015-01-29 | 触摸检测电路以及具备该触摸检测电路的半导体集成电路 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9557853B2 (zh) |
JP (1) | JP2015141556A (zh) |
CN (1) | CN104808880B (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106775143B (zh) * | 2015-12-31 | 2020-01-03 | 深圳市汇顶科技股份有限公司 | 积分电路及电容感测电路 |
JP6615683B2 (ja) * | 2016-04-14 | 2019-12-04 | ローム株式会社 | 容量測定回路、それを用いた入力装置、電子機器 |
CN106452139A (zh) * | 2016-10-31 | 2017-02-22 | 上海新时达电气股份有限公司 | 检测交流电压中的直流分量的电路及其消除装置 |
TWI621984B (zh) * | 2016-12-02 | 2018-04-21 | 瑞鼎科技股份有限公司 | 電容値量測電路及電容値量測方法 |
KR102596607B1 (ko) | 2016-12-20 | 2023-11-01 | 엘지디스플레이 주식회사 | 터치회로, 터치 센싱 장치 및 터치 센싱 방법 |
JP7175552B2 (ja) | 2017-04-28 | 2022-11-21 | シナプティクス・ジャパン合同会社 | 半導体装置、表示装置、及び、方法 |
JP6960769B2 (ja) | 2017-05-19 | 2021-11-05 | クリエイティブ レジェンド セミコンダクター (ホンコン) リミテッド | 半導体装置、表示装置及びその動作方法 |
US10976796B2 (en) * | 2017-07-26 | 2021-04-13 | Qualcomm Incorporated | Dynamic range enhancement for self-capacitance measurement |
JP6908493B2 (ja) * | 2017-10-11 | 2021-07-28 | ローム株式会社 | タッチパネルの制御回路、制御方法、それを用いたタッチ式入力装置、電子機器 |
CN109496273B (zh) | 2018-01-24 | 2021-05-11 | 深圳市汇顶科技股份有限公司 | 电容检测电路、触摸检测装置和终端设备 |
EP3543716B1 (en) * | 2018-01-24 | 2021-03-03 | Shenzhen Goodix Technology Co., Ltd. | Capacitance detection circuit, touch apparatus, and terminal device |
TWI678650B (zh) * | 2018-06-07 | 2019-12-01 | 李尚禮 | 觸控感測裝置與觸碰感測訊號的感測方法 |
JP2020149543A (ja) * | 2019-03-15 | 2020-09-17 | シャープ株式会社 | タッチ入力システム |
KR102302879B1 (ko) * | 2019-05-22 | 2021-09-17 | 어보브반도체 주식회사 | 채널별 정전용량 자동 보정 장치 및 방법 |
JP7294896B2 (ja) * | 2019-06-07 | 2023-06-20 | ローム株式会社 | タッチ検出回路、入力装置、電子機器 |
CN111801584B (zh) * | 2020-03-06 | 2022-05-03 | 深圳市汇顶科技股份有限公司 | 电容检测电路、触控装置和终端设备 |
CN113126817B (zh) * | 2021-03-12 | 2024-08-27 | 汇顶科技私人有限公司 | 电容感测电路、相关芯片及触控装置 |
CN113985225B (zh) * | 2021-10-13 | 2024-09-24 | 中国南方电网有限责任公司超高压输电公司昆明局 | 电容放电及测量装置 |
US11855623B1 (en) * | 2022-06-30 | 2023-12-26 | Hycon Technology Corp. | Capacitive touch sensor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102830882A (zh) * | 2012-09-04 | 2012-12-19 | 北京集创北方科技有限公司 | 一种电容触摸屏触摸检测方法和检测电路 |
CN103443731A (zh) * | 2011-03-24 | 2013-12-11 | 密克罗奇普技术公司 | 用于检测到手持式装置的接近的测量装置及方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69324067T2 (de) * | 1992-06-08 | 1999-07-15 | Synaptics Inc | Objekt-Positionsdetektor |
US20080088594A1 (en) * | 2006-10-12 | 2008-04-17 | Hua Liu | Two-substrate layer touchpad capacitive sensing device |
JP5352905B2 (ja) | 2009-05-28 | 2013-11-27 | ルネサスエレクトロニクス株式会社 | 半導体装置およびそれを用いたタッチセンサ |
TWI409683B (zh) * | 2010-02-04 | 2013-09-21 | Chunghwa Picture Tubes Ltd | 觸控面板偵測電路 |
TWI433015B (zh) * | 2010-03-08 | 2014-04-01 | Chunghwa Picture Tubes Ltd | 電容偵測電路 |
JP2013242699A (ja) | 2012-05-21 | 2013-12-05 | Renesas Electronics Corp | 半導体装置 |
US8717325B1 (en) * | 2013-02-18 | 2014-05-06 | Atmel Corporation | Detecting presence of an object in the vicinity of a touch interface of a device |
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2014
- 2014-01-29 JP JP2014013942A patent/JP2015141556A/ja active Pending
-
2015
- 2015-01-28 US US14/607,913 patent/US9557853B2/en active Active
- 2015-01-29 CN CN201510045155.1A patent/CN104808880B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103443731A (zh) * | 2011-03-24 | 2013-12-11 | 密克罗奇普技术公司 | 用于检测到手持式装置的接近的测量装置及方法 |
CN102830882A (zh) * | 2012-09-04 | 2012-12-19 | 北京集创北方科技有限公司 | 一种电容触摸屏触摸检测方法和检测电路 |
Also Published As
Publication number | Publication date |
---|---|
JP2015141556A (ja) | 2015-08-03 |
CN104808880A (zh) | 2015-07-29 |
US9557853B2 (en) | 2017-01-31 |
US20150212650A1 (en) | 2015-07-30 |
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