CN104781940A - Method for producing an LED module comprising a heat sink - Google Patents

Method for producing an LED module comprising a heat sink Download PDF

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Publication number
CN104781940A
CN104781940A CN201380055616.2A CN201380055616A CN104781940A CN 104781940 A CN104781940 A CN 104781940A CN 201380055616 A CN201380055616 A CN 201380055616A CN 104781940 A CN104781940 A CN 104781940A
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CN
China
Prior art keywords
circuit board
cooling body
led
laser beam
described circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380055616.2A
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Chinese (zh)
Inventor
乔治·罗森鲍尔
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Siemens AG
Original Assignee
Osram GmbH
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Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of CN104781940A publication Critical patent/CN104781940A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/323—Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Abstract

The invention relates to a method for producing an LED module, in which a laser weld (5.1) is produced between a heat sink (1) and a printed circuit board (2) carrying at least one LED (3).

Description

For the manufacture of the method for LED module with cooling body
Technical field
The present invention relates to a kind of method of LED module for the manufacture of having cooling body.
Background technology
For decades known and employ the LED (light-emitting diode) of the semiconductor component as luminescence, and also propagate wider now.Actual semiconductor component, so-called chip, by standard be furnished with " encapsulation " (such as have the pottery of weld pad, plastics or metal loading material, for UV ray being converted to the possible luminous material layer of light, and the transparent possible lens be made up of Merlon or silicones or optical element).Semiconductor component is called as LED diode together with encapsulation, and is connected with the circuit board as loading material.Circuit board such as can be made up of FR4, a kind of epoxy resin impregnated glass fibre cushion material, or circuit board also can be metal core circuit board.Way circuit plate also can be used in more than one LED diode.
In addition in the prior art, also known use cooling body, discharges heat for from LED diode and circuit board.Although LED achieves reasonable efficiency, it still produces used heat.This cooling body can have complicated three-dimensional structure, to derive particularly well and to release heat.In the prior art, circuit board utilizes bolt, rivet, double-sided adhesive film or adhesive to be fixed on cooling body.
Hereinafter referred to LED module, the construction unit that is made up of at least one LED diode, circuit board (or more than one circuit board) and cooling body, now can be arranged in different equipment, such as also be arranged in illuminations, in such as so-called modification lamp, i.e. LED-based illuminations, it utilizes its structure form roughly and lamp socket thereof to come corresponding with the traditional lighting instrument being such as incandescent lamp.But LED module also can be arranged in complete light-emitting device.
Summary of the invention
The present invention is based on following problem, a kind of manufacture method of improvement of the LED module for having cooling body is provided.
This problem is realized by a kind of method for the manufacture of LED module, wherein, connect by laser welding manufacturing machine, for manufacturing or improving the thermal coupling between cooling body and the circuit board carrying at least one LED, and realized by a kind of LED module of corresponding manufacture.
Inventor draws to draw a conclusion, that is, known method of attachment cost consumption in cooling body and circuit board mutually being assembled is large, and is not special applicable Machine automated well.In addition he also confirms, and by utilizing Energy Coupling and the correspondingly alloying material part of the concentration of local of laser, can manufacture extraordinary mechanical connection between cooling body and circuit board.
Because need not manual manipulation as the independent component of rivet, bolt, double-sided adhesive film or adhesive, so laser welding can automation better, wherein can also notice, laser can be deflected simply by mobile minute surface or other optical element, and therefore, it is possible to simply and promptly change solder joint in position.In addition, Energy Coupling can carry out very shortly, make for LED module and particularly LED diode itself energy input no problem.
In addition, when laser welding, along with manufacturing multiple mechanical connection point, the extra consumption that causes is fewer, and namely such as than the much less when utilizing automatic screw lathe or placing multiple bolt with hand, this equally also has advantage for reason also to be set forth for mechanical connection.At this, the object of mechanical connection is the thermal coupling be manufactured between cooling body and circuit board, effectively to discharge the heat from LED diodes conduct to circuit board.
Finally avoid the buying for additional member and logistics cost, and the method can completely touchless ground and promptly perform especially.
In preferred design, cooling body and circuit board are directly connected when laser welding, namely do not have intermediate member in the middle of connect.In other words, when laser welding, the material component of cooling body and the material component of circuit board fuse mutually.As long as together the melting yet with the material component of circuit board and be mutually mixed with of cooling body not is forcibly eliminate welding.Certainly preferably, the direct welding not having additional bond-pads is also set.
In principle, fusible material, i.e. also such as thermoplastic plastics can be welded by laser welding, or there is the material of fusible composition, namely such as there is the reinforced plastics of thermoplastic adhesive or thermoplastic matrix.Such as, the plastic-faced metal core circuit board of tool can be made to weld with plastics cooling body, the capacity of heat transmission of plastics cooling body such as have benefited from as glass fibre or carbon additive can the packing material of heat conduction.But, preferably make the material component of metal mutually fuse.It can be metal coating, but also can be " solid " component or metal-cored.
Close ground especially and therewith, metal core circuit board is preferred.On the one hand, such as by make the nonmetallic coating at corresponding site place enough thin, do not exist or remove, metal-cored also can be used in welding.On the other hand, the metal-cored circuit board that makes has the good capacity of heat transmission, and circuit board possesses Heat transmission function between LED diode and cooling body.Metal-cored preferred material is aluminium and copper, comprises aluminium alloy and comprises copper alloy.
In addition, also with metal solder independently, it is preferred for having cooling body that is metal-cored or that be made of metal completely.Certainly, this also relates to the capacity of heat transmission at this.In metal-cored cooling body in metal solder, be suitable for the foregoing embodiments for metal core circuit board and coating thereof by its meaning.
In addition preferably, cooling body has the 3D shape for its function, is not that is or not only smooth plate simply.Such as, cooling body can have rib, or carrys out dimensionally structuring with other forms contributing to improving Heat transmission and/or improving heat emission.
As described in, circuit board again with the directly thermal coupling of LED diode.Preferably, between circuit board and LED diode, fixing and/or set by heat trnasfer material is only existed for, such as solder, adhesive or heat conduction thing.LED diode and circuit board also can directly mutual against.
In the preferred design of one, laser beam is from the side sensing circuit board having installed LED on circuit boards.At this, laser beam is directed to not to be had in the region of LED, namely such as when being assembled with two LED diodes between these diodes.Then laser beam is mapped to circuit board self, and LED diode does not have impaired or impaired ignoring.At this, according to intensity and the material structure of circuit board, laser beam can melt circuit board completely in the degree of depth (certainly not to be had at area from this side, that is the extension perpendicular to thickness direction does not melt), and then below circuit board, also melt a part for cooling body, be welded to connect to set up.
In this case, can the thinning position (such as thin 20% to 80%, the preferably thickness of 30% to 70% or 40% to 60%) thinning even for this purpose and specially in other words of selection circuit plate.Thereby simplify from circuit board until relative to the penetrating of boundary face of cooling body.
In addition, in this variant of the present invention, also can use the edge of circuit board, the outward flange that such as cooling body flushes at Qi Chu or slightly stretches out from side, or be for this purpose or for other reasons edge in the hole arranged in the circuit board.Now, circuit board can be melted in this edge, and (by laser beam self or the circuit board material by fusing) melts a part for cooling body.
In other design, laser beam is from contrary side sensing cooling body.At this, also can penetrate cooling body completely in principle, wherein, cooling body is so thick in many cases, makes it now be particularly suitable for selecting or manufacturing thinning position.Can make from this side in addition laser alignment cooling body with lower limb, circuit board flushes at this place or stretches out.
Reference example is described in detail in detail.
Finally, in the connection between circuit board and cooling body, according to laser welding of the present invention can also with other combined measure.Particularly can be arranged in shape adaptive contact material between circuit board and cooling body, this material thin (compared with its planar extent) and flatly placing between.Adhesive or the good material (" heat-conducting interface material thermal interface material ") of thermal conductivity can be related at this.
Certainly, be additional to direct mechanical connection (it creates inevitable air gap really in practice), the material of energy heat conduction improves heat trnasfer.
When adhesive, additionally or instead, the improvement of mechanical connection can be realized.Such as can reduce the quantity of laser solder joint or laser welding section thus.Especially may arching upward between laser welding fixed position for worried other, such as, when these fixed positions are only arranged on edge, be suitable for have above-mentioned.Now can be avoided due to the caused spacing or eliminate its defect of arching upward between circuit board and cooling body by the additional connection of adhesive (or fill can material of heat conduction).
In another kind combination, pin retaining element can be set.This upperseat concept such as refers to bolt or rivet, and himself has been known as the retaining element between circuit board and cooling body.Which ensure that, although laser welding according to the present invention has bolt or rivet, also advantage can be realized, such as due to the quantity of laser solder joint or laser welding section can be reduced, and bolt or rivet (perhaps only several or quantity are little) itself are also significant for other reasons, such as, for making whole LED module be fixed on housing place or for making optical element be fixed on LED module place.Above content is also applicable to other pin retaining element, such as kayser pin or clip fixing pin in meaning, its similar pin ground clamping or can work together with the flexible member of self expandable.These also can be made of plastics especially.
Accompanying drawing explanation
Fig. 1 to 11 shows the generalized section according to LED module of the present invention with side perspective respectively, for setting forth manufacturing method according to the invention, namely according in the first to the 8th embodiment.
Embodiment
Fig. 1 shows the first embodiment.Wherein, Reference numeral 1 represents metal cooling body, and its three-dimensional structure has rib and obviously more complicated than drawn.But this structure self is known and believes that those skilled in the art also know this.
Cooling body 1 is flatly placed with circuit board 2, namely there is the metal core circuit board of aluminium core (copper core is equally also preferred) and insulating barrier, be printed with electric lead on the insulating layer.Two LED diodes 3 are welded on the circuit board 2, or rather in known manner.LED diode 3 is formed primarily of the epitaxial substrate of welding and encapsulation at this, and epitaxial substrate, from previous epitaxy technique, defines the real efficient semiconductor layer of LED in epitaxy technique.
In this case, cooling body is made up of aluminum diecasting alloy, but also can make by being molded into the steel plate of rolling of cooling body, aluminium sheet, copper coin or other metallic plate.Typical wall thickness when die casting cooling body at 1mm to 6mm, when plate cooling body at 0.5mm to 3mm.Especially, in plate cooling body, consider the coating at least one side with insulant, thus can cooling body be assembled with insulating.In order to shaping, deep-drawing technique can be considered especially.Diecasting alloys cooling body also particularly can carry out pressure injection-moulded encapsulating by plastics in Fig. 1 down in the () plane not touching circuit board.
The plastic coating of circuit board such as can at the bottom of the thick aluminium of usual 1.6mm on insulator is provided, now such as deposited thereon for 35 μm of printed conductor thick layers of copper, solder mask and welding resistance paints (Reflow Soldering for LED is assembled).The typical thickness of metal core circuit board is between 0.4mm and 3mm.
Middle arrow represent infrared laser, the laser beam 4 vertically downward of the Nd:YAG laser (wavelength 1.06 μm) of such as pulse.This laser can have such as between 10J to 100J, in the pulse energy of this such as 40J, its have in the magnitude of 10ms to 100ms, as the pulsewidth of 20ms.Typical pulse power between 1kW to 9kW, such as 2kW.
Laser beam melts circuit board 2 metal-cored, and fusing run through circuit board 2 until cooling body 1 metal or metal-cored till.The plastic coating possibility Local Damaged of circuit board 2, but this is not just problem when considering that printed conductor structure also has LED3 certainly, because can select suitable region.In the drawings with 5 represent and in approximate funnel shaped (almost taper) melting range, mix with the material component of the metal of cooling body 1 of circuit board 2, and form firmly local mechanical connection after hardening.
As described in, also can imagine the plastic-faced metal-cored cooling body of tool (being made up of aluminum diecasting alloy or aluminium sheet alloy) in this as cooling body; Plastic coating now can with similar mode in circuit board 2 by local failure, or natively can not to be present in the contact area of the fragility between cooling body 1 and circuit board 2 for the reason of the capacity of heat transmission.
Also other IR laser is considered, such as CO2 laser (10.6 μm), diode laser, fibre laser, disc type laser device or other solid state laser as laser.When the cooling body of welding plastic coating, (CW-) laser of non-pulse proves applicable.
The advantage of the present embodiment is, laser beam is injected on conventional assembly direction, namely need not rotate and need not process LED module from below in other words.If produce certain particle contamination when laser beam incident, then this pollution does not redirect on the optical element of laser due to gravity.By the laser welding of " from above ", solder joint can be made in a straightforward manner to calibrate (namely locating) on circuit board 2 and LED3.At this, also achieve with corresponding plain mode and be multiplely welded to connect 5, such as, repeatedly arrive on (Linear-moving or autorotation) LED module of movement continuously, wherein, according to the repetition rate of laser pulse, can produce into line or to be isolatedly welded to connect.Utilize the dividing plate of scanning optical part, machinery and/or mobile workpiece holder can also produce into grid or the subregion in face.
First the method is applicable to thin laminate circuit, but magnitude may be needed at such as every pulse 40J or more, higher laser energy at this.Compared with other embodiment, larger smoke which or splashings may be had thus to fall on LED lens (not shown), therefore may need corresponding precautionary measures, such as good suction.Advantageously, in the region that laser welding in the future connects 5, there is not welding resistance paint in advance, thus avoid ambient atmosphere to be correspondingly loaded with dense smoke.Based on circuit board thickness, there is larger solder joint core, thus few number of welds can be kept.
The intensity that can reach can match in excellence or beauty known method completely.
In addition, this technique also can be washed by protection air-blowing and be improved, to prevent the zone oxidation relating to heat input.In principle, LED3 itself is because the short-time characteristic of heat input and local restricted gender can not be dangerous, as long as no meeting it or not working at its direct neighbor place.
The following examples are different from the first embodiment respectively in concrete form, and set forth in these differences.In addition, above-mentioned applicable by its meaning.
In fig. 2, simpler in order to make to be welded to connect, the position be incident in circuit board 2 at laser beam 4 arranges depressed part 6 in advance.
Make the residual thickness of circuit board 2 obviously less thus, such as, lack about 50%.
This is realized by other mechanical processing steps when manufacturing circuit board, such as, by milling step.Although this additional procedure of processing self has certain unfavorable, due to can voltinism and lower relevant cost instead of king-sized shortcoming automatically.
Correspondingly, need less laser energy, produce less cigarette and less splash risk, and the solder joint core formed is less, this can make the layout of solder joint core simpler.However still recommend suction, and because of being welded to connect the less embodiment (namely not only on area but also in the degree of depth) of 5.2, the quantity of each solder joint also may promote slightly relative to the first embodiment.But (, generally, also can imagine the present invention and have being welded to connect of smallest number when small-sized being welded to connect or only have several and be welded to connect, moreover, and the fixed system traditional with other combines.)
The 3rd embodiment in Fig. 3 conforms to the second embodiment substantially; But in circuit board 2, be not only provided with depressed part at this, but also porose.This hole can be generated when manufacturing circuit board by mechanical processing steps equally, such as, by simple perforation, this relative to milling step also more easily because need not the degree of depth be noted.
In this case, laser beam 4 is angularly injected from top, to be mapped to seamed edge, the material area of the material area of circuit board 2 and cooling body 1 can be made together to melt at this seamed edge place.This is in figure 3 by being welded to connect 5.3 expressions.In the present embodiment, because clearly marked hole in advance relative to remaining board area, the danger cutting off printed conductor so unexpected is little especially.By the boundary face between circuit board 2 and cooling body 1 is directly welded, form even also few especially compared with the second embodiment cigarette and little splash, and only need few laser energy.At this, also recommend typical case's more solder joint compared with the first embodiment.Such as, this embodiment can be equally with the second embodiment between 3 to 10 solder joints, on the contrary, and typical case preferably 2 to 6 in a first embodiment.
In the 4th embodiment in the diagram, replace the seamed edge in the hole 7 in Fig. 3, the outer seamed edge of circuit board is the target of laser beam 4.Therefore, be welded to connect and be retained in well beyond printed conductor region especially, and hole 7 need not be pointed to.At this, also should arrange than slightly more solder joint in a first embodiment, preferably or between 3 to 10.In order to consider the different gradients of laser beam relative to LED module, LED module such as can rotate around vertical axis, thus can manufacture two welding regions 5.4 drawn in the diagram when not changing laser beam.In addition, this execution mode is particularly suitable for and additional center fixed Combination, such as, combine with the 3rd embodiment or combine with bolt, rivet or locking-type or clip fixing pin in a conventional manner.Also can be recommended in the adhesive (or a kind of that there is good adhesion, that thermal conductivity is good material) between circuit board 2 and cooling body 1, thus avoid because the problem that causes of arching upward between circuit board 2 and cooling body 1.
As the set forth below the 6th, the 7th is the same with the 8th embodiment, the 5th embodiment in Fig. 5 and the difference of front four embodiments are, laser beam 4 from " below ", namely points to circuit board from the side away from circuit board 2 of cooling body 1 at this.According in first variant of Fig. 5, melt the whole thickness of cooling body at this.Therefore, this variant is suitable for the smaller material thickness of cooling body 1, such as, in the embodiment made at the sheet material by drawing.Work with on the side away from common assembling side and need the relative advantage of the shortcoming in principle of higher laser energy to be, away from the side of LED3 producing cigarette and producing splash.Because now (in common layout) gravity is downward and therefore substantially points to the direction of laser optical part, must be noted that the optical element not polluting laser to the particle fallen.In addition, need the controlled melting degree of depth more exactly in this embodiment, thus do not cut off may be thinner circuit board 2.
The difference of the 5th embodiment in next embodiment in Fig. 6 and Fig. 5 is similar to the difference of the second embodiment in Fig. 2 and the first embodiment in Fig. 1.That is, in cooling body 1, depressed part 8 is provided with from below at this, such as, by milling process or by carrying out corresponding moulding when die casting.
The 7th embodiment in Fig. 7 is corresponding with the 3rd embodiment of Fig. 3 in a similar fashion, and therefore, cooling body 1 is perforation or states as at large and be furnished with hole 9, and this hole such as also can be manufactured by the arrangement when casting forming.In addition, be welded to connect accordingly and be welded to connect 5.3 in 5.7 extremely similar Fig. 3, be certainly wherein suitable for for the 5th with the description relevant with the laser orientation of " from below " of the 6th embodiment.
Correspondingly, last 8th embodiment in Fig. 8 is corresponding with the 4th embodiment in corresponding Fig. 4, wherein, different from Fig. 4 at this, at least at involved position, circuit board 2 must protruding slightly over cooling body 1 (instead of conversely, as in Fig. 4).Seamed edge place is between provided with and is welded to connect 5.8.When considering the particularity worked from below, be suitable for the description to the 4th embodiment.It is also applicable to the risk that arches upward especially, and is particularly suitable for and the mechanical connection of " in plane " between circuit board 2 and cooling body 1 combines.
To this (but also in order to combine with other embodiments of the present invention), such as suitable adhesive.But, when combining with the present invention, the solidification of adhesive or forcibly need not become the significant drawback of production drying time, because the mechanical connection between circuit board 2 and cooling body 1 just can be manufactured on by one or several laser solder joints.Between circuit board 2 and cooling body 1 arrange adhesive now can place time or at the latest run LED module time and then occur raise temperature time solidify, additional supporting can be obtained and prevent from arching upward.In addition, adhesive can also bridge joint air gap, and therefore improves thermo-contact.In view of in surface, especially may inevitably out-of-flatness in the surface of cooling body 1, particularly suitable is above-mentioned.Also can adopt so-called heat-conducting interface material at this, itself or only improve heat trnasfer or there is the adhering performance of additional improvement (such as having the additional adhesive improving the additive of heat conduction).
Equally, also can combine with the fixed mechanical component of such as bolt or rivet, these elements advantageously also can be used in other connection purposes, such as fixed optics parts, hide lens or housing parts.Especially, the fixture of the deflection center arrangement of unique or smallest number just can solve the described problem that arches upward, and namely main being applicable to combines with the 5th or the 8th embodiment.Above-mentionedly be equally applicable to rivet and special formed plastic fixtures, its clamp with the form of similar pin or form fit (expanding by making element) connect.All these retaining elements are all known substantially, therefore need not be shown specifically.
Fig. 9 shows following instance, and it has the bolt of central authorities or the fixture 10 of rivet or similar pin, and it penetrates in central authorities and is connected to cooling body 1 and circuit board 2.In addition, be suitable for the description to the 4th embodiment in Fig. 4, be particularly welded to connect in 5.4.
Figure 10 and 11 shows two other examples, it has bonding connection 11 between cooling body 1 and circuit board 2, or rather on the one hand in Fig. 10 be welded to connect 5.4 combinations in such as Fig. 4, and 5.8 to be combined with being welded to connect according to Fig. 8 in fig. 11.

Claims (15)

1. the method for the manufacture of LED module (1-3), wherein, (5.1-5.8) is connected, for manufacturing or improving the thermal coupling between cooling body (1) and the circuit board (2) carrying at least one LED (3) by laser welding manufacturing machine.
2. method according to claim 1, wherein, in the region of being melted by laser welding (5.1-5.8), the material component of described cooling body (1) and the material component of described circuit board (2) fuse mutually.
3. method according to claim 2, wherein, the described material component of fusion is mutually metal.
4. according to method in any one of the preceding claims wherein, wherein, described circuit board (2) is metal core circuit board.
5. according to method in any one of the preceding claims wherein, wherein, described cooling body (1) is metal or has that at least one is metal-cored.
6. according to method in any one of the preceding claims wherein, wherein, the directly thermal coupling and carry described substrate of described circuit board (2) and substrate (3), what deposited at least one LED on the substrate has active layer.
7. according to method in any one of the preceding claims wherein, wherein, described laser beam (4) is aimed at described circuit board (2) and is directed to not having in the region of LED of described circuit board (2) from LED side.
8. method according to claim 7, wherein, described laser beam (4) points to the position (6) thinning relative to the adjacent area of described circuit board (2) of described circuit board (2).
9. method according to claim 7, wherein, described laser beam (4) points to the edge of described circuit board (2).
10. method according to any one of claim 1 to 6, wherein, described laser beam (4) points to described cooling body (1) from the side reverse with the LED side of described circuit board (2) of described cooling body (1).
11. methods according to claim 10, wherein, described laser beam (4) points to the position (8) thinning relative to the adjacent area of described cooling body (1) of described cooling body (1).
12. methods according to claim 10, wherein, described laser beam points to the edge of described cooling body (1).
13. according to method in any one of the preceding claims wherein, wherein, before laser welding, between described circuit board (2) and described cooling body (1), be provided with thin, smooth contact material, particularly adhesive adaptive in shape or Heat Conduction Material.
14. according to method in any one of the preceding claims wherein, wherein, described circuit board (2) and cooling body (1) additionally utilize at least one pin retaining element to be mechanically connected, and particularly utilize bolt (10), rivet (10) or locking-type or clip fixing pin (10) to be mechanically connected.
15. 1 kinds of LED modules (1-3) by manufacturing according to method in any one of the preceding claims wherein, have cooling body (1) and carry the circuit board (2) of LED (3), described cooling body is connected (5.1-5.8) with described circuit board by laser welding and is connected and is thermally coupled.
CN201380055616.2A 2012-10-30 2013-10-16 Method for producing an LED module comprising a heat sink Pending CN104781940A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014218968B4 (en) * 2014-09-22 2016-12-15 Bayerische Motoren Werke Aktiengesellschaft Method for welding a ball to a first component, method for connecting two components, correspondingly manufactured component and component connection
DE102015205354A1 (en) 2015-03-24 2016-09-29 Osram Gmbh Optoelectronic assembly and method for manufacturing an optoelectronic assembly
DE102022204292A1 (en) * 2022-05-02 2023-11-02 Robert Bosch Gesellschaft mit beschränkter Haftung Contact arrangement with a welded flexible circuit board

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469929A (en) * 1981-09-21 1984-09-04 Siemens Aktiengesellschaft Method for securing optical and electro-optical components
US20030161112A1 (en) * 1999-12-13 2003-08-28 Fujitsu Limited Semiconductor device and method of producing the same
JP2005109147A (en) * 2003-09-30 2005-04-21 Fujitsu Ltd Semiconductor device and manufacturing method thereof
CN1918715A (en) * 2003-11-18 2007-02-21 瓦莱奥电子联络系统公司 Device for cooling an electrical component and production method thereof
JP2007149978A (en) * 2005-11-28 2007-06-14 Miyachi Technos Corp Semiconductor laser package device, and method of manufacturing same
CN101278603A (en) * 2005-09-29 2008-10-01 皇家飞利浦电子股份有限公司 Method for fixing a light-emitting diode to a metallic heat-radiating element
US20100181891A1 (en) * 2009-01-20 2010-07-22 Cheng-Shih Lee Package Structure for Solid-State Lighting with Low Thermal Resistance
CN102403419A (en) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 Manufacturing technology of high-power LED radiating structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2834901B2 (en) * 1991-04-26 1998-12-14 ローム株式会社 Method for manufacturing stem for semiconductor laser device
DE4221564A1 (en) * 1992-07-01 1994-01-13 Siemens Ag Solder connection method for joining e.g. LED chip and flat copper component - preheating solder, positioning chip, melting solder by short-term temp. increase and lowering chip into position before cooling
US6392778B1 (en) * 1999-03-17 2002-05-21 Koninklijke Philips Electronics N.V. Opto-electronic element
FR2853200B1 (en) * 2003-03-27 2005-10-07 Valeo Vision METHOD FOR FIXING A POWER LIGHT EMITTING DIODE ON A RADIATOR, AND A SIGNALING DEVICE COMPRISING SUCH A DIODE
DE102010050343A1 (en) * 2010-11-05 2012-05-10 Heraeus Materials Technology Gmbh & Co. Kg Chip-integrated via contacting of multi-layer substrates

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469929A (en) * 1981-09-21 1984-09-04 Siemens Aktiengesellschaft Method for securing optical and electro-optical components
US20030161112A1 (en) * 1999-12-13 2003-08-28 Fujitsu Limited Semiconductor device and method of producing the same
JP2005109147A (en) * 2003-09-30 2005-04-21 Fujitsu Ltd Semiconductor device and manufacturing method thereof
CN1918715A (en) * 2003-11-18 2007-02-21 瓦莱奥电子联络系统公司 Device for cooling an electrical component and production method thereof
CN101278603A (en) * 2005-09-29 2008-10-01 皇家飞利浦电子股份有限公司 Method for fixing a light-emitting diode to a metallic heat-radiating element
JP2007149978A (en) * 2005-11-28 2007-06-14 Miyachi Technos Corp Semiconductor laser package device, and method of manufacturing same
US20100181891A1 (en) * 2009-01-20 2010-07-22 Cheng-Shih Lee Package Structure for Solid-State Lighting with Low Thermal Resistance
CN102403419A (en) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 Manufacturing technology of high-power LED radiating structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王天曦 等: "《电子技术工艺基础》", 31 August 2009 *

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