CN104772988B - Fluid jetting head manufacture method, fluid jetting head and printing device - Google Patents
Fluid jetting head manufacture method, fluid jetting head and printing device Download PDFInfo
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- CN104772988B CN104772988B CN201410013328.7A CN201410013328A CN104772988B CN 104772988 B CN104772988 B CN 104772988B CN 201410013328 A CN201410013328 A CN 201410013328A CN 104772988 B CN104772988 B CN 104772988B
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Abstract
The present invention provides a kind of fluid jetting head manufacture method, fluid jetting head and printing device, and fluid jetting head manufacture method includes：Oscillating plate is formed on a surface of substrate, wherein, it is described formation oscillating plate the step of at least include using sol-gal process formed titanium dioxide zirconium layer the step of；Piezoelectric element is formed in the titanium dioxide zirconium layer.Fluid jetting head manufacture method, fluid jetting head and printing device that the present invention is provided, by titanium dioxide zirconium layer is formed on oscillating plate using sol-gal process, film layer heating temperature during formation is low, heated time is short, is not result in substrate deformation, and the stress for producing is little, film layer is not easily susceptible to cracking and comes off, and titanium dioxide zirconium layer is formed using sol-gal process, manufacturing process simplifies, cost relative reduction.
Description
Technical field
The present invention relates to the manufacturing technology of fluid jetting head, more particularly to a kind of fluid jetting head manufacture method, fluid jetting head and
Printing device.
Background technology
In prior art, the conventional piezoelectric element of fluid jetting head in printing device makes shower nozzle spray ink as vibration source
Drop.
Shower nozzle ink sprayed as vibration source by the use of piezoelectric element, it is main to have two types again：One kind is piezoelectricity unit
Part and oscillating plate are placed in the outside of the pressure chamber connected with the nozzle for discharging ink droplet, by the change of piezoelectric element and oscillating plate
Shape so that pressure chamber's volume changes, so as to drops out from nozzles is sprayed；Oscillating plate is arranged on pressure chamber by another kind
Inside, forms cantilever beam or vibration girder construction, by making conduct to the piezoelectric element applied voltage on cantilever beam or walking beam
There is vibration in the oscillating plate of cantilever beam or walking beam, ink is sprayed from inkjet mouth because of the vibration of oscillating plate.It is above-mentioned to make ink
In the method for ejection, all it is utilized on oscillating plate, arranging piezoelectric element, becomes oscillating plate by piezoelectric element applied voltage
There is vibration in shape.
Piezoelectric element typically adopts leaded piezoelectric, and such as lead zirconate titanate (PZT), the facial pallor in piezoelectric element easily expand
It is scattered to the silicon dioxide (SiO as oscillating plate2) layer, silicon dioxide layer fusing point can be reduced due to the diffusion of lead, and dioxy
SiClx layer can be heated when piezoelectric material layer is fired and melt.
At present, it is to solve the problem, zirconium dioxide (Zr0 is set in the silicon dioxide layer of oscillating plate2) layer, then in dioxy
Change zirconium layer on piezoelectric is set, will titanium dioxide zirconium layer be arranged between silicon dioxide layer and piezoelectric material layer, can prevent pressure
Lead composition in electric material is diffused in the silicon dioxide layer of oscillating plate.
As the substrate that will be formed with zirconium layer is mentioned in Chinese patent CN200480035810.5 with more than or equal to 200mm/
The speed insertion of min is heated to 800 DEG C --- and aoxidize in the thermal oxidation furnace of 1000 DEG C of temperature, form titanium dioxide zirconium layer, the technology
In scheme, the heating rate of zirconium layer is 300 DEG C/min；Annealing temperature is set at 800 DEG C, the time period be adjusted in from 0.5h to
Between 2h, at so high temperature and annealing time so length is easily caused：Zirconium layer is by stress produced during thermal oxide
Cause to occur crackle and titanium dioxide zirconium layer in titanium dioxide zirconium layer after the cooling period as the release of thermal stress causes oscillating plate and pressure
The deformation of power chamber makes titanium dioxide zirconium layer come off.And said method needs first to sputter layer of metal zirconium on silica, then
Zirconium layer is made to be oxidized to titanium dioxide zirconium layer, the crystallinity of the zirconium dioxide of such method manufacture is bad, is unfavorable for follow-up piezoelectricity unit
The planar orientation (100) of the crystalline orientation of part, such as piezoelectric lead zirconate titanate, and the planar orientation (100) of lead zirconate titanate is to piezoelectricity
The piezoelectric property of material is favourable.Simultaneously using sputtering layer of metal zirconium, then zirconium layer is made to be oxidized to the process cost of titanium dioxide zirconium layer
It is higher, complex procedures.
The content of the invention
The present invention provides a kind of fluid jetting head manufacture method, fluid jetting head and printing device, wherein the zirconium dioxide for being formed
Layer is not allowed easy to fall off and crackle occurs, and forms the operation of titanium dioxide zirconium layer simply, and cost is reduced.
One aspect of the present invention provides a kind of fluid jetting head manufacture method, including：Vibration is formed on a surface of substrate
Plate, wherein, it is described formation oscillating plate the step of at least include using sol-gal process formed titanium dioxide zirconium layer the step of；
Piezoelectric element is formed in the titanium dioxide zirconium layer.
Another aspect of the present invention provides a kind of fluid jetting head, using manufactured by fluid jetting head manufacture method as above.
Further aspect of the present invention provides a kind of printing device, includes fluid jetting head as above.
Fluid jetting head manufacture method, fluid jetting head and printing device that the present invention is provided, by being existed using sol-gal process
Titanium dioxide zirconium layer is formed on oscillating plate, film layer heating temperature during formation is low, and heated time is short, is not result in what is be located
Substrate deformation, and the stress for producing is little, film layer is not easily susceptible to cracking and comes off, and forms zirconium dioxide using sol-gal process
Layer, manufacturing process are simple, cost relative reduction.
Description of the drawings
Fig. 1 is the schematic flow sheet of the fluid jetting head manufacture method that the embodiment of the present invention one is provided；
Fig. 2 is the schematic flow sheet of the fluid jetting head manufacture method that the embodiment of the present invention two is provided；
The structure of silicon dioxide layer is formed in the shower nozzle manufacture method that Fig. 3 A are provided for the embodiment of the present invention two on substrate
Schematic diagram；
Structural representations of Fig. 3 B for formation titanium dioxide zirconium layer on the basis of the structure shown in Fig. 3 A；
Structural representations of Fig. 3 C for formation first electrode on the basis of the structure shown in Fig. 3 B；
Structural representations of Fig. 3 D for formation voltage body layer on the basis of the structure shown in Fig. 3 C；
Structural representations of Fig. 3 E for formation second electrode on the basis of the structure shown in Fig. 3 D；
Fig. 3 F are by performing etching the structural representation for being formed to the structure shown in Fig. 3 E；
Fig. 3 G are that the structural representation to form each chamber is performed etching on second substrate；
Fig. 3 H are the structural representation that fluid jetting head manufacture method provided in an embodiment of the present invention manufactures the fluid jetting head to be formed
Figure；
Fig. 3 I be Fig. 3 H in C to structural representation；
Fig. 3 J be Fig. 3 I in A-B to cutting structural representation；
Fig. 4 A are view of the fluid jetting head provided in an embodiment of the present invention when oscillating plate is away from nozzle bore；
Fig. 4 B are view of the fluid jetting head provided in an embodiment of the present invention when oscillating plate is near nozzle bore；
Fig. 4 C are view of the fluid jetting head provided in an embodiment of the present invention when oscillating plate resiles.
Specific embodiment
The embodiment of the present invention one provides a kind of fluid jetting head manufacture method, as shown in figure 1, the method includes：
101st, form oscillating plate on a surface of substrate, wherein, formed oscillating plate the step of at least include using molten
Sol-gel forms zirconium dioxide (Zr02) layer the step of；
102nd, piezoelectric element is formed in the titanium dioxide zirconium layer.
In the present embodiment, using sol-gal process formed titanium dioxide zirconium layer the step of include：It is multiple by sol-gal process
Zirconium dioxide membrane is formed, the zirconium dioxide membrane for repeatedly being formed forms titanium dioxide zirconium layer；
During zirconium dioxide membrane is formed every time, the zirconium dioxide membrane to being formed repeatedly is made annealing treatment,
So that the rapid crystalline film of zirconium dioxide membrane for being formed, in described multiple annealing, the temperature of annealing is less than every time
The temperature of annealing next time.
Its detailed process is as follows：
Weigh a certain proportion of zirconium iso-propoxide ((Zr [O (CH2)2CH3]4)) and ethylene glycol monomethyl ether (2-MOE), mixing shakes up
It is sufficiently mixed which, and stands several minutes；
Colloidal sol to preparing distills, and is heated to 115 DEG C, distills 2.5 to 3 hours in the case where being stirred continuously, makes
The part moisture contained in colloidal sol and gaseous impurity evaporation；
Colloidal sol is cooled to into 25 DEG C, a certain proportion of acetylacetone,2,4-pentanedione and acetic acid is added, and zirconium content is configured to for 0.4mol's
Colloidal sol, causes film peeling to prevent the presence of impurity, and the colloidal sol that finishes of configuration can be filtered, made by dioxy
Change zirconium thin film flawless；
With photoresist spinner after whirl coating on the substrate that need to form titanium dioxide zirconium layer, 200 DEG C of hot plate is placed on 1 minute, make molten
Agent is volatilized；
450 DEG C of hot plate is placed on again 1 minute, make colloidal sol produce cracking and form zirconium dioxide membrane；
Short annealing 1 minute in 700 DEG C of environment, forms the zirconium dioxide membrane of 70nm or so again.
Whirl coating operation is carried out again on the zirconium dioxide membrane for being formed, and carries out above-mentioned three after whirl coating is finished again moving back
Fiery step, so repeatedly, to form multilamellar zirconium dioxide membrane, till reaching desired thickness, is such as repeated 5 times, 5 times
The zirconium dioxide membrane gross thickness of formation is about 0.35um, zirconium dioxide of the zirconium dioxide membrane for repeatedly being formed for oscillating plate
Layer.
The fluid jetting head manufacture method that the present embodiment is provided, by titanium dioxide is formed on oscillating plate using sol-gal process
Zirconium layer, the method that film layer aoxidizes the titanium dioxide zirconium layer of formation during formation compared to existing technology at a higher temperature,
Film layer heating temperature is low, and heated time is short, and the stress of generation is little, is not result in substrate deformation, and film layer is not allowed easy to fall off yet and opened
Split, and, titanium dioxide zirconium layer is formed using sol-gal process, manufacturing process simplifies, cost relative reduction.
In addition, in the present embodiment, each zirconium dioxide membrane to being formed using sol-gal process carries out three-step annealing process,
Film-formation result can be made more preferably, because zirconium dioxide film forming it is very sensitive to the temperature height and time length of annealing process, if temperature
Too high or overlong time, causes solvent evaporation rate too fast, and colloidal sol cracking is uneven, and whole thin film composition is uneven, each position
Stress difference is excessive so as to easily ftractureing；If temperature is too low or the time is too short, it will cause solvent volatilization not exclusively, colloidal sol is not
Can crack to form Zr0 in time2Or cracking is insufficient, also easily makes film peeling.Therefore, we adopt 3 step annealing methods, 200 DEG C
Annealing 1 minute, makes solvent volatilize；450 DEG C are annealed 1 minute, are made colloidal sol produce cracking and are formed zirconium dioxide membrane；700 DEG C quick
Annealing 1 minute, is not easily susceptible to cracking the rapid crystalline film of zirconium dioxide membrane, the thin film for so being formed.
The embodiment of the present invention two also provides a kind of fluid jetting head manufacture method, as shown in Fig. 2 the method includes following step
Suddenly：
201st, form oscillating plate on a surface of substrate, wherein, formed oscillating plate the step of at least include using molten
The step of sol-gel forms titanium dioxide zirconium layer；
In the present embodiment, the step of form oscillating plate in be additionally included on substrate and form silicon dioxide layer, i.e., such as Fig. 3 A and
Shown in Fig. 3 B, before titanium dioxide zirconium layer 32 is formed, silicon dioxide layer 31 is first formed on substrate 1, specifically will be used as substrate 1
Silicon chip carry out high-temperature process in the oxidative environment containing oxygen or vapor, form silicon dioxide layer 31, then in dioxy
Titanium dioxide zirconium layer 32 is formed by sol-gal process on SiClx layer 31.Wherein, the thickness of silicon dioxide layer 31 can be 0.5～1.0 μ
M, the thickness of titanium dioxide zirconium layer 32 can be 0.2～0.6 μm.
Titanium dioxide zirconium layer is formed in the step of titanium dioxide zirconium layer is formed using sol-gal process and 101 step of above-described embodiment
The step of be identical, will not be described here.
202nd, piezoelectric element is formed in titanium dioxide zirconium layer；
Piezoelectric element includes first electrode, piezoelectric body layer and second electrode, as shown in Fig. 3 C- Fig. 3 E, in titanium dioxide zirconium layer
Piezoelectric element is formed on 32 first electrode 41, piezoelectric body layer 42 and second electrode are specifically sequentially formed in titanium dioxide zirconium layer 32
43。
Step a, the operation for forming first electrode 41 (such as Fig. 3 C)；
First electrode 41 is platinum (Pt) layer or iridium (Ir) layer or platinum and iridium composition formed in titanium dioxide zirconium layer 32
Composite bed, its thickness is 0.1～0.2 μm, specifically platinum or iridium etc. can be made to be attached to titanium dioxide zirconium layer 32 by sputtering method etc.
On.
To improve compactness of the first electrode 41 in titanium dioxide zirconium layer 32, can pass through before first electrode 41 is formed
Sputtering method or vacuum plater form the titanium layer (not shown) being made up of titanium, and first electrode 41 is formed on titanium layer.
Step b, the operation for forming piezoelectric body layer 42 (such as Fig. 3 D)；
Piezoelectric body layer 42 is formed by the composite that piezoelectric and zirconium dioxide are constituted, and in the present embodiment, forms piezoelectricity
The composite of body layer 42 is lead zirconate titanate-zirconium dioxide (PZT-ZrO2) composite, wherein, the lead zirconate titanate-dioxy
Change in zirconium composite material, the content of zirconium dioxide is less than the 10% of integral molar quantity.
In the present embodiment, piezoelectric body layer 42 is also to be formed using sol-gal process, and its thickness can be 1～2 μm, form pressure
The step of electrics layer 42, includes：
Lead zirconate titanate-zirconium dioxide composite material film is repeatedly formed by sol-gal process, the zirconium metatitanic acid for repeatedly being formed
Lead-zirconium dioxide composite material film forms the piezoelectric body layer；
During lead zirconate titanate-zirconium dioxide composite material film is formed every time, to the lead zirconate titanate-dioxy for being formed
Change zirconium composite material thin film repeatedly to be made annealing treatment, in the multiple annealing, the temperature of annealing was moved back less than next time every time
The temperature of fire.
Detailed process is as follows：
Prepare a certain proportion of acetate trihydrate lead ((Pb (CH3CO2)2.3H2O and ethylene glycol monomethyl ether (2-MOE) mixing shake up,
Which is made to be sufficiently mixed and stand several minutes；
Colloidal sol to preparing carries out processed, is heated to 120 DEG C, distills in the case where being stirred continuously, and removes acetic acid
Water of crystallization in lead；
Weigh a certain proportion of zirconium iso-propoxide ((Zr [O (CH2)2CH3]4)), metatitanic acid methyl ester (Ti [OCH (CH3)2]4) and second
Glycol methyl ether (2-MOE) mixing shakes up so as to is sufficiently mixed and stands several minutes；
Two kinds of colloidal sol mixing are distilled, are heated to 115 DEG C, are distilled 2.5 to 3 hours in the case where being stirred continuously,
The part moisture contained in making colloidal sol and gaseous impurity evaporation；
Colloidal sol is cooled to into 25 DEG C, adds a certain proportion of acetylacetone,2,4-pentanedione and acetic acid (lead content to be configured to for 0.75Mol's
Colloidal sol；
The lead content of above-mentioned making is taken according to a certain percentage to manufacture dioxy in the colloidal sol and above-described embodiment of 0.75Mol
The colloidal sol of made zirconium content for 0.4Mol when changing zirconium layer, such as PZT- that the molar content for obtaining zirconium dioxide is 10%
ZrO2Composite film layer, the then lead content for taking are 9 for the volume ratio of the colloidal sol of 0.4Mol for the colloidal sol and zirconium content of 0.75Mol：
1, it is sufficiently mixed.
Precursor film is being formed whirl coating after in first electrode 41 with photoresist spinner, be placed on 200 DEG C of hot plate 1 minute, make solvent
Volatilization；
450 DEG C of hot plate is placed on again 1 minute, make colloidal sol produce cracking and form PZT-ZrO2Thin film；
In 700 DEG C of environment, short annealing forms the PZT-ZrO of 200nm or so for 1 minute again2Thin film.
In the PZT-ZrO for being formed2Carry out whirl coating operation again, and carry out above-mentioned three after whirl coating is finished again moving back on thin film
Fiery step, so repeatedly, to form multilamellar PZT-ZrO2Thin film, till reaching desired thickness, is such as repeated 5 times, 5 times
The PZT-ZrO of formation2Overall film thickness is about 1um, the PZT-ZrO for repeatedly being formed2Thin film becomes piezoelectric body layer 42.
The present embodiment is formed as the PZT-ZrO of piezoelectric body layer 422In composite layer, ZrO2Content less than total
The 10% of mole, piezoelectric constant d33Improve, so as to the vibration displacement that can improve piezoelectric element, (displacement of piezoelectric element is proportional to
Piezoelectric constant d33, piezoelectric constant d33With ZrO2Molar content change：Work as ZrO2Molar content it is less when, the pressure of piezoelectric
Electric constant d33Increase).
In addition, the present embodiment is forming PZT-ZrO2During composite layer, PZT-ZrO is being formed every time2Thin film
Afterwards, using three-step annealing method to each PZT-ZrO for being formed2Thin film is made annealing treatment, and (100) planar orientation of PZT is preferably, sharp
In the vibration displacement for improving piezoelectric element.In this specification, alleged (100) planar orientation is referred to, will be in X-ray diffraction Radix Rumiciss method
Using the diffraction peak (XYZ) of the peak value (2 θ) corresponding to XYZ faces during CuKa lines, such as (100), (110), (002), (211).
Step c, the operation for forming second electrode 43 (such as Fig. 3 E)；
In the present embodiment, second electrode 43 is platinum (Pt) layer or iridium (Ir) layer or platinum formed on piezoelectric body layer 42
With the composite bed of iridium composition, its thickness is 50～100nm, and its is formationed is identical with the formation of first electrode 41, can also pass through to sputter
Method etc. forms platinum or iridium etc..
To improve compactness of the second electrode 43 on piezoelectric body layer 42, can be before second electrode 43 be formed, in piezoelectricity
The titanium layer (not shown) being made up of titanium is formed by sputtering method or vacuum plater on body layer 42, second is formed on titanium layer electric
Pole 43, the thickness of titanium layer can be 10～20nm.
203rd, the deformation space of oscillating plate deformation and the ink-feed channel of ink supply are formed on substrate；
Specifically, after oscillating plate 3 and piezoelectric element 4 is formed, can in second electrode 43 rotary coating erosion resistant, with
The erosion resistant of coating is exposed, development treatment as mask, then will be not coated with piezoelectric element 4 using the method for etching
The part for covering erosion resistant is removed, and as illustrated in Figure 3 F, then, coats erosion resistant, so in the titanium dioxide zirconium layer 32 of oscillating plate 3
After be exposed, develop, etching processing, form ink-feed channel 61, etching forms deformation space 8 on substrate 1.
204th, multiple pressure chamber are formed away from the side of deformation space in oscillating plate corresponding with the plurality of pressure chamber
Nozzle bore, and, form the public chamber that connects with the plurality of pressure chamber.
Crosslinkable polymeric material, the such as epoxy resin (photoetching of Photoimageable first can be coated on second substrate 5 specifically
Glue SU8 etc.), heliosensitivity silicones or photosensitive epoxy siloxanes etc., to be exposed as mask, development treatment, and carve
Eating away portion of material, as shown in Figure 3 G, forms the shapes such as nozzle bore 51, pressure chamber, public chamber.
Etched second substrate 5 is bonded in into oscillating plate 3 away from the side of substrate 1, as shown in figure 3h, multiple pressures is formed
Power chamber 2, public chamber 6 and nozzle bore 51, are additionally provided with restricted flow passage 7 between each pressure chamber 2 and public chamber 6, limit
Sectional area of the sectional area of circulation road 7 less than pressure chamber 2 (the concrete effect of restricted flow passage 7 sees below content).
In the present embodiment, as shown in figure 3h, cover plate 9 is also bonded with away from the side of oscillating plate 3 on substrate 1, to increase
The mechanical strength of substrate 1.
The present embodiment manufactures the arrangement of nozzle bore 51 in the fluid jetting head to be formed as shown in fig. 31, the spray on second substrate 5
Nozzle aperture 51 is dislocation arrangement.
The present embodiment manufactures the fluid jetting head to be formed, and as shown in figure 3j, is formed with multiple pressure chamber 2, nozzle bore 51 with
Each 2 correspondence of pressure chamber, the etched formation of piezoelectric element 4 multiple subdivisions respectively in each pressure chamber 2, each sub-portion
Tap receives voltage signal, to the stress that oscillating plate 3 is larger, makes oscillating plate 3 deform, by deforming each pressure chamber 2
In ink extruded by nozzle bore 51.
Below the course of work of the fluid jetting head manufactured by the fluid jetting head manufacture method that provided with the present embodiment is carried out
Explanation：
As shown in Figure 4 A, after piezoelectric element 4 receives voltage signal, the deformation of its moment can be larger to oscillating plate 3
Stress, now, oscillating plate 3 can be moved to the direction away from nozzle bore 51 together with piezoelectric element 4, and now oscillating plate concaves towards deformation
Space 8, forms " drawing " this process, at this moment the liquid level concave to pressure chamber 2 at nozzle bore 51, is formed " meniscus ".This first
The process of secondary " drawing ", make oscillating plate 3 deform away from nozzle bore 51, and the size of its deformation is proportional to the size for spraying drop.
Then piezoelectric element 4 is applied with the contrary voltage signal of " drawing " pattern, oscillating plate 3 can and piezoelectric element 4 to leaning on
Move at nearly nozzle bore 51, the ink in pressure chamber 2 is extruded at nozzle bore 51, and ink is discharged to outside nozzle bore 51
Face, forms " pushing away " this process as shown in Figure 4 B.In this process, outside ink flows in addition to nozzle bore 51, also
Part ink is flowed to public chamber 6 by restricted flow passage 7, produces the ink of backflow, due to the presence of ink restricted flow passage 7,
To be reduced to the ink that public chamber 6 flows by restricted flow passage 7, so as to there are more inks to flow out from nozzle bore 51, be reached
Reduce the purpose of the ink of return loss, and then reduce the time that ink is again filled with, shorten the injection cycle of ink droplet, carry
High print frequency.Simultaneously as there are more inks to flow out from nozzle bore 51, the vibration displacement of piezoelectric element 4 can be reduced
Can also reach and spray correspondingly sized ink droplet, improve the life-span of piezoelectric element 4, make printhead more durable.
After completing " pushing away " this process, and then piezoelectric element 4 is applied with identical voltage signal when " drawing " for the first time
When, oscillating plate 3 restores shape, and a part of ink is moved into each pressure chamber 2, and another part ink is continued to spray due to inertia
Nozzle aperture 51 is outer to be sprayed, and the ink being squeezed in outside nozzle bore 51 is broken, ink droplet is formed in Fig. 4 B, as shown in Figure 4 C, ink droplet by
It is ejected on print media in effect of inertia, at this moment completes the injection of single ink droplet.
Yet another embodiment of the invention provides a kind of fluid jetting head, and the fluid jetting head is provided using any embodiment of the present invention
Fluid jetting head manufacture method is fabricated by.
Further embodiment of this invention provides a kind of printing device, and the printing device includes any embodiment of the present invention and provides
Fluid jetting head.
Finally it should be noted that：Various embodiments above only to illustrate technical scheme, rather than a limitation；To the greatest extent
Pipe has been described in detail to the present invention with reference to foregoing embodiments, it will be understood by those within the art that：Its according to
So the technical scheme described in foregoing embodiments can be modified, or which part or all technical characteristic are entered
Row equivalent；And these modifications or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention technology
The scope of scheme.
Claims (20)
1. a kind of fluid jetting head manufacture method, it is characterised in that include：Oscillating plate is formed on a surface of substrate, wherein,
The step of formation oscillating plate, at least includes the step of forming titanium dioxide zirconium layer using sol-gal process；
Piezoelectric element is formed in the titanium dioxide zirconium layer；
Wherein, the step of employing sol-gal process forms titanium dioxide zirconium layer, including：
Zirconium dioxide membrane is repeatedly formed by sol-gal process, the zirconium dioxide membrane for repeatedly being formed forms titanium dioxide zirconium layer；
During zirconium dioxide membrane is formed every time, the zirconium dioxide membrane to being formed repeatedly is made annealing treatment, described
In repeatedly making annealing treatment, the temperature of annealing is less than the temperature of annealing next time every time.
2. fluid jetting head manufacture method according to claim 1, it is characterised in that the multiple annealing is specially three
Secondary, first time annealing temperature is 200 DEG C, and second annealing temperature is 450 DEG C, and third time annealing temperature is 700 DEG C.
3. fluid jetting head manufacture method according to claim 1, it is characterised in that the thickness of the titanium dioxide zirconium layer is
0.2～0.6 μm.
4. fluid jetting head manufacture method according to claim 1, it is characterised in that also wrap the step of the formation oscillating plate
Include：Silicon dioxide layer is formed on the substrate；
The titanium dioxide zirconium layer is formed in the silicon dioxide layer.
5. fluid jetting head manufacture method according to claim 4, it is characterised in that the thickness of the silicon dioxide layer is
0.5～1.0 μm.
6. fluid jetting head manufacture method according to claim 1, it is characterised in that the shape in the titanium dioxide zirconium layer
Into the piezoelectric element, specifically include：
First electrode, piezoelectric body layer and second electrode are sequentially formed in the titanium dioxide zirconium layer；
Wherein, the piezoelectric body layer is formed by the composite that piezoelectric and zirconium dioxide are constituted.
7. fluid jetting head manufacture method according to claim 6, it is characterised in that the composite wood of the composition piezoelectric body layer
Expect for lead zirconate titanate-zirconium dioxide composite, wherein, zirconium dioxide in the lead zirconate titanate-zirconium dioxide composite
Content less than integral molar quantity 10%.
8. fluid jetting head manufacture method according to claim 7, it is characterised in that the formation of the piezoelectric body layer, specifically
Including：
Lead zirconate titanate-zirconium dioxide composite material film is repeatedly formed by sol-gal process, the lead zirconate titanate-two for repeatedly being formed
Zirconium oxide composite material thin film forms the piezoelectric body layer；
During lead zirconate titanate-zirconium dioxide composite material film is formed every time, to the lead zirconate titanate-zirconium dioxide for being formed
Composite material film is repeatedly made annealing treatment, and in the multiple annealing, the temperature of annealing is less than annealing next time every time
Temperature.
9. fluid jetting head manufacture method according to claim 8, it is characterised in that the multiple annealing is specially three
Secondary, first time annealing temperature is 200 DEG C, and second annealing temperature is 450 DEG C, and third time annealing temperature is 700 DEG C.
10. fluid jetting head manufacture method according to claim 6, it is characterised in that the first electrode is the dioxy
Change the composite bed of the platinum layer or iridium layer or platinum and iridium composition formed in zirconium layer.
11. fluid jetting head manufacture methods according to claim 10, it is characterised in that the first electrode passes through sputtering method
Formed.
12. fluid jetting head manufacture methods according to claim 6, it is characterised in that before the first electrode is formed,
Also include：Titanium layer is formed in the titanium dioxide zirconium layer；
The first electrode is formed on the titanium layer.
13. fluid jetting head manufacture methods according to claim 6, it is characterised in that the second electrode is the piezoelectricity
The composite bed of the platinum layer formed on body layer or iridium layer or platinum and iridium composition.
14. fluid jetting head manufacture methods according to claim 13, it is characterised in that the second electrode passes through sputtering method
Formed.
15. fluid jetting head manufacture methods according to claim 6, it is characterised in that before the second electrode is formed,
Also include：Titanium layer is formed on the piezoelectric body layer；
The second electrode is formed on the titanium layer.
16. fluid jetting head manufacture methods according to claim 6, it is characterised in that the thickness of the piezoelectric body layer be 1～
2μm；
The thickness of the first electrode is 0.1～0.2 μm；
The thickness of the second electrode is 50～100nm.
17. according to the arbitrary described fluid jetting head manufacture method of claim 1-16, it is characterised in that also include：In the base
The deformation space of the oscillating plate deformation and the ink-feed channel of ink supply are formed on plate.
18. fluid jetting head manufacture methods according to claim 17, it is characterised in that also include：In the vibration backboard
Multiple pressure chamber nozzle bore corresponding with the plurality of pressure chamber is formed from the side of the deformation space；And, formed
The public chamber connected with the plurality of pressure chamber.
19. a kind of fluid jetting heads, it is characterised in that made using the arbitrary described fluid jetting head manufacture method of claim 1-18
Make.
20. a kind of printing devices, it is characterised in that include the fluid jetting head described in claim 19.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410013328.7A CN104772988B (en) | 2014-01-10 | 2014-01-10 | Fluid jetting head manufacture method, fluid jetting head and printing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410013328.7A CN104772988B (en) | 2014-01-10 | 2014-01-10 | Fluid jetting head manufacture method, fluid jetting head and printing device |
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| Publication Number | Publication Date |
|---|---|
| CN104772988A CN104772988A (en) | 2015-07-15 |
| CN104772988B true CN104772988B (en) | 2017-04-05 |
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| JP2019014229A (en) * | 2017-07-06 | 2019-01-31 | セイコーエプソン株式会社 | Piezoelectric device, liquid jet head and liquid jet device |
| JP7434976B2 (en) | 2020-02-10 | 2024-02-21 | セイコーエプソン株式会社 | Liquid ejection head and liquid ejection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1890103A (en) * | 2003-12-09 | 2007-01-03 | 精工爱普生株式会社 | Actuator device manufacturing method and liquid jet device |
| CN101290883A (en) * | 2008-05-29 | 2008-10-22 | 南京大学 | Soft chemistry method for preparing ultrathin HfO* or ZrO* gate dielectric membrane |
| CN102094170A (en) * | 2009-12-15 | 2011-06-15 | 沈阳天贺新材料开发有限公司 | Zirconium oxide thermal barrier coating for turbine buckets of gas turbine and preparation method thereof |
| CN103304235A (en) * | 2013-03-01 | 2013-09-18 | 苏州市职业大学 | Production method of fine-grain high-strength PMN-PZT (lead zirconate titanate) piezoelectric ceramic material |
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| JP4793568B2 (en) * | 2005-07-08 | 2011-10-12 | セイコーエプソン株式会社 | Actuator device, liquid jet head, and liquid jet device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1890103A (en) * | 2003-12-09 | 2007-01-03 | 精工爱普生株式会社 | Actuator device manufacturing method and liquid jet device |
| CN101290883A (en) * | 2008-05-29 | 2008-10-22 | 南京大学 | Soft chemistry method for preparing ultrathin HfO* or ZrO* gate dielectric membrane |
| CN102094170A (en) * | 2009-12-15 | 2011-06-15 | 沈阳天贺新材料开发有限公司 | Zirconium oxide thermal barrier coating for turbine buckets of gas turbine and preparation method thereof |
| CN103304235A (en) * | 2013-03-01 | 2013-09-18 | 苏州市职业大学 | Production method of fine-grain high-strength PMN-PZT (lead zirconate titanate) piezoelectric ceramic material |
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