CN104769703A - 用于衬底材料的倒圆的对准柱 - Google Patents
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Abstract
本发明提供一种方法,包括生长包括集成电路的衬底材料。该方法包括在所述衬底材料上形成对准柱,并在所述对准柱上形成倒圆的顶部,以使连接器能够对准所述衬底材料。
Description
技术领域
背景技术
集成电路通常被形成在诸如晶片的硅衬底材料上。各种各样的化学和光刻工艺可被应用于晶片以形成用于相应电路的电路元件和信号迹线。在电路和信号迹线被形成后,所述晶片可被切割成单独的集成电路,其随后可被封装且被利用在给定的电气设计中。信号迹线通常被连接至所封装的集成电路的引脚,然后引脚在给定的应用中连接到该封装外侧的其它外围电路。在纯电气设计中,除了各自的引脚,不需要将所封装的集成电路内的信号迹线联接至任何其它外侧的连接。在电子-机械设计中,可能需要机械联接至衬底,除了在引脚处的联接,可能额外地需要将集成电路的单个电路元件联接至外部的部件。这种联接需求可引起在衬底和该外部部件之间做出适当的信号连接的问题。
发明内容
附图说明
图1示出衬底材料的示例,该衬底材料具有形成在其上的对准柱,以能够与连接器对准。
图2示出形成在衬底材料上的对准柱的示例,该对准柱用于将连接器对准至联接到该衬底材料的玻璃衬底材料。
图3示出衬底材料的示例,该衬底材料具有通过DRIE工艺形成在其上的对准柱,以能够与连接器对准。
图4示出衬底材料的示例,该衬底材料具有通过电镀工艺形成在其上的对准柱,以能够与连接器对准。
图5示出衬底材料的示例,该衬底材料具有通过应用第二材料和光刻工艺形成在其上的对准柱,以能够与连接器对准。
图6示出用于在衬底材料上形成对准柱的示例方法。
具体实施方式
对准柱可被形成在衬底材料上,以使该衬底材料能够平滑和有效地对准到其它结构,举例来说,比如连接器和/或其它衬底。在一个示例中,该衬底材料可以是硅衬底,且可经由一个或多个对准柱与来自连接器的外部信号精确地对准。该对准柱可通过各种各样的工艺被形成至该衬底材料上。在一个示例中,刻蚀工艺可被应用至衬底材料以形成对准柱的圆柱部分,该圆柱部分在刻蚀后被剩下而附接(left attached)至该衬底材料。倒圆的顶部可被施加于该对准柱的圆柱部分,以使其能够平滑地导入而使对准柱精确地适配(mate)到连接器上的适配腔。在一个示例中,多个对准柱被形成在衬底材料上,且被用于将该衬底材料与另一衬底材料对准,在对准后信号能够在各衬底和/或连接器之间交互。
图1示出衬底材料100的示例,衬底材料100具有形成在其上的对准柱110,以使其能够与连接器120对准。衬底材料100可包括集成电路130,该集成电路130可被形成在该衬底的顶表面132和/或底表面134上。其它分立的电子和/或光学部件也可被附接至衬底材料100的顶表面132和/或底表面134。衬底材料100通常为诸如硅的半导体材料,但是其它衬底材料也是可能的(例如锗)。对准柱110在一些应用中可以是单个的对准柱,或者在其它应用中被提供为多个对准柱。典型的光刻工艺产生诸如圆柱的具有平的顶表面的特征。进一步考虑圆柱形特征,从圆柱的顶表面至垂直的圆柱壁的过渡突然发生,具有锐利的过渡边缘。在柱和孔的特征均在其顶表面和侧表面之间具有锐利过渡的情况下,难以将一个部件上的圆柱形柱插入第二部件上的圆柱形孔中。当希望在两个连接部件之间实现精确对准时,在圆柱的直径仅略微小于孔的直径的情况下也是这样。通过在过渡处包含倒圆或角度(倒角)而减小该过渡的锐度,使此适配过程更容易。如图所示,倒圆的顶部140被提供在对准柱110上以便于过渡。
对准柱110包括形成在衬底材料100上的圆柱形部分,其中该对准柱包括形成在该圆柱形部分上的倒圆的顶部140。对准柱110的倒圆的顶部140有助于连接器120的适配腔150和对准柱110的圆柱形部分之间的接合。倒圆的顶部140的加入,在适配部件120和衬底材料100之间产生了更大的“捕获区”。对准柱圆柱和适配腔150的中心轴线比没有倒圆的顶部140的情况可彼此移位更大的距离。
如图所示,连接器120至衬底材料100的适配可通过连接器上的适配腔150实现,而且适配腔150在对准柱110和倒圆的顶部140的上方被引导。这种对准柱110上的倒圆可被称为用于将要适配到连接器120的适配腔150的对准柱的引入端。连接器120也可包括用于路由光信号的光波导。
在一些示例中,连接器120和衬底100之间的对准可以实现连接器上的电触头的对准,电触头则联接到衬底上的信号迹线。在另一示例中,连接器120中的例如在光纤中传输的光信号,能够被适配到形成在衬底材料100上的光学部件,诸如激光二极管或者光电探测器。在即将示出并在下面关于图2描述的又一示例中,诸如玻璃衬底的另一衬底材料可被联接至衬底材料100。在衬底材料100中可形成腔,以允许光信号在连接器120和玻璃衬底之间流动,其中衬底材料上的对准柱110允许来自连接器的光信号与形成在玻璃衬底上的透镜对准。
几种方法可被提供用于形成对准柱110和倒圆的顶部140。这可包括生长包括集成电路130的衬底材料100。在生长衬底后,该方法可包括通过以下描述的各种工艺在衬底材料100上形成对准柱110,并随后在对准柱上形成倒圆的顶部150以使连接器120能够对准衬底材料100。在一个示例中,方法可包括在对准柱110上施加液体聚合物,以形成倒圆的顶部140。在另一示例中,这可包括在对准柱110上施加液体焊料,以形成倒圆的顶部140。无论使用的是聚合物、焊料、或是其它倒圆材料,由于作用在材料和柱之间的表面张力和其它接触力能使倒圆材料在柱的顶部形成期望的形状,所以材料的流变能力受控使得该倒圆材料流至对准柱110的边缘而不会更远。
对准柱110可根据各种方法形成。在一个示例中,该方法可包括刻蚀衬底材料100以形成对准柱110。例如,这可包括利用深反应离子刻蚀(DRIE)以刻蚀衬底材料100,从而形成对准柱110。在另一柱构造工艺中,方法可包括诸如聚酰亚胺或者BCB聚合物的表面涂层的光刻掩膜和形成其图案,随后电镀衬底材料以形成对准柱。这可包括多个电镀工艺以在衬底材料100的顶部生长圆柱形状。在另一类型的柱构造工艺中,方法可包括对衬底材料100施加环氧树脂,以形成对准柱。这可进一步包括通过例如光刻工艺成形环氧树脂。如以下将关于图2所示的,方法可包括在衬底材料100中形成腔,以允许光通过连接器120穿过该腔。这可包括通过对准柱110将衬底材料100对准到另一衬底材料(例如玻璃衬底材料),其中来自该玻璃衬底材料的光信号可与衬底材料100的集成电路130相交互。
图2示出形成在衬底材料220上的对准柱210的示例,而且对准柱210被用于将连接器230对准到联接至该衬底材料的玻璃衬底材料240。连接器230可包括光缆250,用于将光信号路由穿过形成在衬底材料220中的腔260。透镜可被形成在玻璃衬底240上,以将光信号路由至玻璃衬底240上的不同位置。在一个示例中,透镜可路由光信号,使之耦联到被集成或者被附接至衬底220的诸如光电探测器的光学部件。透镜也可通过玻璃衬底240将光信号传输至位于玻璃衬底的远(无透镜)侧的光学部件。集成电路和迹线270可位于衬底材料的顶部,和/或衬底材料的底部及与玻璃衬底240之间。连接器230中的适配腔280可与对准柱210对准。适配腔280在一个示例中可以是矩形的或者在另一示例中为圆柱形腔。这样,来自光缆250的光信号可借助于对准柱210通过腔260并对准至玻璃衬底240上的透镜。
如上面所讨论的,深反应离子刻蚀(DRIE)工艺可被用于在硅中制造各种有用的几何形状,包括诸如孔、沟、凹陷的负形状(negative shapes),和诸如对准柱210的正形状(positive shapes)。在此示例中,柱和/或沟的组合可被制造在硅衬底220中,以便提供用于附接一个或多个光纤或连接器的精确对准接口。硅衬底220可被结合至玻璃衬底240,玻璃衬底240上形成有例如用于附接和对准诸如激光器或光电二极管的有源光学器件的透镜和电迹线。硅腔260提供间隙,光信号可通过该间隙穿过硅衬底220。对准柱210被事先形成并相对于玻璃透镜定位。其被用于为携带光纤的光学连接器230提供对准,此光纤与电连接至玻璃衬底240的有源器件连通。
DRIE工艺可形成精确一致的特征,诸如具有大约在几微米或更小范围变化的直径的对准柱210。由于前面提到的制造工艺,对准柱210可自然地具有平的顶表面。因此,对准柱210没有被优化以在对准过程期间帮助将光学连接器230引导入位。为了提供对连接器230的引导,对准柱210应当具有如上所示和所讨论的倒圆的顶部。DRIE工艺可不被优化以产生这些倒圆的几何形状。保持具有恒定直径的相对长的圆柱形柱形状,以便在柱和适配光学连接器230中的圆柱形腔280之间实现精确对准也是可取的。通过将柱的一些长度用于倒圆(通常称为引入端),对准的有效性可被降低。对准柱可被延长,以便提供用于对准和导入的更多材料。但是这增加了柱的制造工艺所需的时间及其成本。
在此描述的系统和方法能以有效的方式形成几乎完美的导入表面,是通过在对准柱210的顶表面上滴涂精确量的液体聚合物或液体焊料(或施加可在加热过程中被液化的固体材料),使该材料将固化成对准柱的弧形或倒圆的导入表面。例如,该聚合物可以是熔化的热塑性塑料或未固化的热固塑料。该焊料可被作为糊剂施加、被预先成形、喷溅或电镀到对准柱280的顶部上。通过控制聚合物或者焊料材料的成分和量,引入端可自然地流出至对准柱的边界。能量考虑可导致该材料呈现有利的弧形表面形状。在聚合物材料的情况下,合适的化学性质可使聚合物和对准柱280的顶表面之间在某种程度上形成坚固结合,以适于在多个连接周期期间经受导引光学连接器230的过程。图3、图4和图5,以及相关的讨论将例示用于将对准柱280构造至硅衬底220上的替代示例。
图3示出衬底材料300的示例,衬底材料300具有通过深反应离子刻蚀(DRIE)工艺形成在其上的对准柱,以能够与连接器对准。形成对准柱的第一步骤涉及向衬底施加抗蚀材料,如在310处由抗蚀剂箭头所示。这种抗蚀剂可以以圆形图案施加,使得随后在衬底上刻蚀之后,圆柱形柱在刻蚀后保留。在320处,DRIE刻蚀工艺被应用于衬底,其中箭头表示刻蚀图案的方向。在刻蚀后,圆柱形柱被形成在衬底材料300上事先施加了抗蚀剂的区域中。在330处,圆柱形柱具有用以在圆柱形对准柱的顶部形成倒圆的材料。如之前所述,例如,这种倒圆的材料可由液体聚合物或液体焊料施加。
图4示出衬底材料400的示例,衬底材料400具有通过电镀工艺形成在其上的对准柱,以能够与连接器对准。在410处,衬底材料400被示为具有形成在其上的电镀柱。例如,该电镀可以以连续工艺形成,以在衬底材料400的顶部生长圆柱形柱。通常,该工艺采用由抗蚀剂或其它聚合物制成的其中形成有柱的负形状的光刻成型模具。镀层可在形成于聚合物中的负形状内侧建立以产生柱。此工艺常被称为电铸。在420处,由电镀衬底产生的圆柱形柱具有用以在圆柱形对准柱的顶部形成倒圆的材料。与图3的示例类似,例如,这种倒圆的材料可由液体聚合物或液体焊料施加。
图5示出衬底材料500的示例,衬底材料500具有通过应用环氧树脂和光刻工艺形成在其上的对准柱,以能够与连接器对准。在此示例中,第二材料504可被形成在衬底材料504的顶部上。该第二材料504可包括例如环氧树脂的黏合剂,或者在另一示例中的聚酰亚胺环氧树脂。在520处,光抗蚀剂可被施加至第二材料504,其中所述光抗蚀剂形成用于圆柱形结构的刻蚀图案。在530处,圆柱形柱通过对第二材料504应用刻蚀工艺以形成柱而被形成。在540处,在530处产生的圆柱形柱具有用以在圆柱形对准柱的顶部形成倒圆的材料,而且圆柱形对准柱由环氧树脂和随后的刻蚀形成。与图3和图4的示例类似,例如,这种倒圆的材料可由液体聚合物或液体焊料施加。
鉴于以上描述的前述结构性和功能性特征,参照图6将更好地领会示例的方法。然而,为了说明的简单性,图6的示例方法被示出和描述为连续执行,应当理解和领会的是,本示例并不限于例示的顺序,因为一些动作在其它示例中可以以不同于在此示出和描述的顺序发生和/或同时发生。另外,为完成方法并非必须执行所有描述的动作。
图6示出用于在衬底材料上形成对准柱的示例方法600。在610处,方法600包括生长包括集成电路的衬底材料(例如,图1的衬底材料100和集成电路)。在620处,方法600包括在衬底材料上形成对准柱(例如图1的对准柱110)。方法600包括在对准柱上形成倒圆的顶部,以能够将连接器对准到衬底材料(例如图1的倒圆的顶部140)。方法600也可包括在对准柱上施加液体聚合物以形成倒圆的顶部。在另一示例中,该方法可包括在对准柱上施加液体或固体的焊料,以形成倒圆的顶部。
方法600也可包括刻蚀衬底材料,以形成对准柱。这可包括利用深反应离子刻蚀(DRIE)以刻蚀衬底材料,从而形成对准柱。在另一示例中,方法600可包括电镀衬底材料以形成对准柱。在另一示例中,方法600可包括向衬底材料施加环氧树脂以形成对准柱。这可包括通过光刻工艺成形环氧树脂。方法600也可包括在衬底材料中形成腔以允许光穿过该腔。这可包括通过对准柱将衬底材料与玻璃衬底材料对准,其中来自玻璃衬底材料的光信号可与衬底材料的集成电路交互。
以上已经描述的为示例。当然,不可能描述部件或方法学的每一个可想到的组合,但是本领域普通技术人员将会意识到,可能有许多进一步的组合和排列。因此,本公开意在包含落入包括所附权利要求的本申请范围内的所有这些替代、修改和变更。如在此使用的,术语“包括”意味着包括但不限于,术语“包含”意味着包括但不限于。术语“基于”意味着至少部分地基于。相应地,在本公开或权利要求列举“一”、“一个”、“第一”或“另一”元件,或者其等同物的情况下,其应当被解释为包括一个或多于一个这种元件,既不需要也不排除两个或更多个这种元件。
Claims (15)
1.一种方法,包括:
生长包括集成电路的衬底材料;
在所述衬底材料上形成对准柱;和
在所述对准柱上形成倒圆的顶部,以使连接器能够对准所述衬底材料。
2.如权利要求1所述的方法,进一步包括在所述对准柱上施加液体聚合物以形成所述倒圆的顶部。
3.如权利要求1所述的方法,进一步包括在所述对准柱上施加如同液体或固体的焊料以形成所述倒圆的顶部。
4.如权利要求1所述的方法,进一步包括刻蚀所述衬底材料以形成所述对准柱。
5.如权利要求4所述的方法,进一步包括利用深反应离子刻蚀(DRIE)以刻蚀所述衬底材料,从而形成所述对准柱。
6.如权利要求4所述的方法,进一步包括电镀所述衬底材料以形成所述对准柱。
7.如权利要求4所述的方法,进一步包括对所述衬底材料施加环氧树脂以形成所述对准柱。
8.如权利要求7所述的方法,进一步包括通过光刻工艺成形所述环氧树脂。
9.如权利要求1所述的方法,进一步包括在所述衬底材料中形成腔,以允许光穿过所述腔。
10.如权利要求9所述的方法,进一步包括将所述衬底材料通过所述对准柱对准光学透明的衬底材料,其中光信号能够通过所述光学透明的衬底材料被传输至在所述衬底材料的任意一侧上的部件。
11.一种装置,包括:
第一衬底材料,该第一衬底材料包括分立形式或集成形式的电子和光学部件;和
对准柱,包括形成在所述衬底材料上的圆柱形部分,所述对准柱包括形成在所述圆柱形部分上的倒圆的顶部,其中所述对准柱的所述倒圆的顶部提供用于将连接器适配至所述衬底材料的对准引导。
12.如权利要求11所述的装置,进一步包括结合至所述第一衬底材料的光学透明的衬底,其中在所述第一衬底材料中形成腔,以允许光穿过所述第一衬底材料。
13.如权利要求12所述的装置,其中所述对准柱将所述光学透明的衬底上的透镜与所述连接器中的光波导对准。
14.如权利要求13所述的装置,其中所述对准柱通过刻蚀工艺、电镀工艺或者聚合物扩展光刻工艺形成。
15.一种装置,包括:
第一硅衬底材料,该第一硅衬底材料包括集成的或分立的电子部件和电路,所述硅衬底材料具有形成在其中的腔,以允许光从光学连接器穿过所述衬底材料;
结合至所述第一硅衬底材料的光学透明的衬底材料,其中所述光学透明的衬底材料提供透镜,以接收从所述光学连接器穿过所述第一衬底材料的光;和
多个对准柱,每个对准柱包括形成在所述第一硅衬底材料上的圆柱形部分,每个对准柱包括形成在各自圆柱形部分上的倒圆的顶部,其中所述对准柱的所述倒圆的顶部提供用于将所述连接器适配至所述第一硅衬底材料和所述光学透明的衬底材料的对准。
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US10705303B2 (en) | 2016-02-26 | 2020-07-07 | Hewlett Packard Enterprise Development Lp | Optical connector assembly connectorized for non-permanent attachment to an optoelectronic substrate assembly |
US10678006B2 (en) * | 2016-09-30 | 2020-06-09 | Hewlett Packard Enterprise Development Lp | Optical interfaces with solder that passively aligns optical socket |
US10795091B2 (en) | 2017-07-14 | 2020-10-06 | Hewlett Packard Enterprise Development Lp | Adaptor for optical component of optical connector |
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- 2013-01-28 EP EP13872449.7A patent/EP2948975A4/en not_active Withdrawn
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