CN104763902B - The LED light source module and its manufacture method of a kind of high reliability - Google Patents
The LED light source module and its manufacture method of a kind of high reliability Download PDFInfo
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- CN104763902B CN104763902B CN201510155167.XA CN201510155167A CN104763902B CN 104763902 B CN104763902 B CN 104763902B CN 201510155167 A CN201510155167 A CN 201510155167A CN 104763902 B CN104763902 B CN 104763902B
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- heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses the LED light source module and its manufacture method of a kind of high reliability, including light emitting source and heat-conducting seat, light emitting source is welded on substrate by heat-conducting layer one, and substrate is welded on heat-conducting seat end face by heat-conducting layer two, and heat-conducting layer one and heat-conducting layer two use gold-tin alloy material.The present invention will be welded using gold-tin alloy material to be welded together between light emitting source and substrate and substrate and heat-conducting seat, realize interstructural zero distance contact, the thermal conductivity ratio silicone grease thermal conductivity factor of tin is higher by 60 times, substrate uses copper base, the thermal conductivity factor of copper circuit board is 401w/mk, the heat that LED light source is produced quickly is transmitted to radiator, without the existing picture of hot stack, reduce light decay, substrate is integrally welded with radiator, the life-span of product and performance are guaranteed, pass through the obtained LED light source module that freezes, manufacture method is simple, product reliability is high, manufacture efficiency is high, and with simple and compact for structure, it is stable, the characteristics of good economy performance.
Description
Technical field
Patent of the present invention is related to a kind of LED light source module of high reliability, further relates to a kind of LED light source mould of high reliability
The manufacture method of group, belongs to LED technology field.
Background technology
Passed between the light emitting source and substrate and substrate and heat-conducting seat of existing LED light source module using heat conductive silica gel/fat
Heat, the thermal conductivity factor of heat conductive silica gel/fat is in 0.8 ~ 3w/mk（Common procurement is with 1.0 or so coefficient, and 3.0 costs are too high）, because in
One layer of heat-conducting silicone grease is spaced, the heat that LED is produced can not be transmitted to above radiator immediately, so that hot stack is formed, LED surface
Temperature is too high, causes light decay serious, and the silicone oil inside heat-conducting silicone grease is slowly vapored away after the work of constantly H/C in addition,
Silicone grease is caused to become powdering by paste, heat conduction function is lost completely to be made conductivity deteriorating, and last light decay is serious or light source is downright bad.
The content of the invention
The technical problem to be solved in the present invention is：The LED light source module and its manufacture method of a kind of high reliability are provided, letter
Single, rapid heat dissipation, light decay is small, good product performance, long lifespan, and manufacture method is simple, easy to operate, and method is reliable, and manufacture efficiency is high,
To overcome the shortcomings of prior art problem.
The technical scheme that the present invention takes is：A kind of LED light source modular structure of high reliability, including light emitting source and heat conduction
Seat, the heat-conducting layer one that the light emitting source is formed after being heated by solder is welded on substrate, after the substrate is heated by solder
The heat-conducting layer two of formation is welded on heat-conducting seat end face.
It is preferred that, above-mentioned heat-conducting layer one and heat-conducting layer two thickness is 0.1 ~ 0.3mm, can process real by chain-type sintering furnace
It is existing, process stabilizing, low cost.
It is preferred that, above-mentioned solder uses gold-tin eutectic solder, and the thermal conductivity factor of tin is 67w/mk, higher than silicone grease thermal conductivity factor
Go out 60 times, more preferable radiating effect can be played.
It is preferred that, above-mentioned heat-conducting seat sets air discharge duct between contacting surface with heat-conducting layer two, and air discharge duct ensure that heat-conducting layer
The gas produced during two solder welding is smoothly discharged, and prevents empty generation, and increases contact area, improves radiating effect.
It is preferred that, above-mentioned air discharge duct uses V-shape, is formed by milling, it is easy to manufacture, 0.8 ~ 1mm of upper end width, depth
0.30 ~ 0.5mm, length is more than length of the heat-conducting layer two on groove direction, can smoothly ensure the discharge of gas.
It is preferred that, radiator structure is provided with above-mentioned heat-conducting seat, is more conducively radiated, radiating effect is more notable.
It is preferred that, aforesaid substrate uses copper base, and the thermal conductivity factor of copper base is 401w/mk, and the heat that LED light source is produced is fast
Speed is transmitted to radiator, and the existing picture of no hot stack reduces light decay, it is ensured that the service life of light source module.
It is preferred that, above-mentioned heat-conducting seat uses aluminium alloy, and material price is cheap, easy processing, good heat dissipation effect.
It is preferred that, aforesaid substrate at least sets one piece, and the substrate with light emitting source can be connected in parallel polylith on heat-conducting seat,
So as to make board structure compact, a series of production with different capacity products is realized.
A kind of manufacture method of the LED light source module of high reliability, comprises the following steps：
（1）Substrate prints solder：Substrate is fixed on print station, regulation steel mesh position, allows steel mesh small opening and substrate connections
Overlap, solder cream was uniformly scraped to small opening region with scraper, substrate connections are uniformly coated with solder cream；
（2）Paste LED lamp bead：LED lamp bead is placed on the solder cream on solder joint, lamp bead cathode and anode directions are walked with base plate line
To consistent；
（3）Heat-conducting seat prints solder：Heat-conducting seat is placed into bottom surface even print solder cream, solder cream at substrate position with steel mesh
Thickness 0.2mm ~ 0.4mm；
（4）The substrate for posting LED lamp bead is placed at the heat-conducting seat placement substrate position for coating solder cream；
（5）Freeze light source module：Set chain-type sintering furnace before freezing to freeze temperature and chain speed, on chain-type sintering furnace panel
Six warm area design temperatures, 315 ~ 325 degrees Celsius of one temperature of warm area, 215 ~ 225 degrees Celsius of two temperature of warm area, the temperature of warm area three
178 ~ 188 degrees Celsius, 188 ~ 198 degrees Celsius of four temperature of warm area, 145 ~ 155 degrees Celsius of five temperature of warm area, the temperature 115 of warm area six ~
125 degrees Celsius, and " heating is opened " key is closed, the chaindriven motor speed of drive is set as 1470 ~ 1530r/min, closes " chain belt
Open " key, heat-conducting seat is placed on chain band after chain-type sintering furnace furnace body temperature constant temperature 15min, kept between heat-conducting seat and heat-conducting seat
Spacing is 50mm；
（6）It is automatically sent to cool down on cooling conveyer belt after heat-conducting seat after welding is come out of the stove, and is sent to test zone
Carry out performance test.
It is preferred that, above-mentioned steps（5）Nitrogen-hydrogen hybrid protection gas is filled with during freezing in middle chain-type sintering furnace,
Prevent from that heat-conducting seat and substrate from heating in engineering to aoxidize.
It is preferred that, above-mentioned steps（5）It is middle startup chain-type sintering furnace when simultaneously start cooling conveyer belt power supply, transfer rate with
The chain speed that freezes is identical, opens cooling fan switch.
Beneficial effects of the present invention：Compared with prior art, the present invention uses welding material by light emitting source and substrate and base
Weld together between plate and heat-conducting seat, allow between light emitting source and substrate and substrate and heat-conducting seat and be connected, zero distance contact, heat conduction
Performance is greatly improved, and the thermal conductivity factor of tin is 67w/mk, is higher by 60 times than silicone grease thermal conductivity factor, substrate uses copper base, copper-based
The thermal conductivity factor of plate is 401w/mk, and the heat that LED light source is produced is quick to be transmitted to radiator, and the existing picture of no hot stack reduces light
Decline, substrate is integrally welded with radiator, significantly, the life-span of product and performance are guaranteed radiating effect, set air discharge duct,
The gas produced during the solder welding for ensureing heat-conducting layer two is smoothly discharged, and prevents empty generation, and increases contact area, is improved
Radiating effect, LED light source module is made by the method freezed, and manufacture method is simple, and product reliability is high, and manufacture efficiency is high,
Efficiently solve that radiating effect present in prior art is bad, properties of product are poor, short life the problem of, and with structure letter
It is single it is compact, stably, good economy performance the characteristics of.
Brief description of the drawings
Fig. 1 is structural representation of the invention；
Fig. 2 is heat radiating fin structure schematic diagram of the invention.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment to invention be described further.
As shown in Fig. 1 ~ Fig. 2, a kind of LED light source modular structure of high reliability, including light emitting source 1 and radiator 3, light
Source 1 uses LED lamp bead illuminating module, and on the substrate 3, substrate 3 uses copper for the welding of heat-conducting layer 1 formed after being heated by solder
Substrate, the heat-conducting layer 24 formed after being heated by solder is welded on the end face of heat-conducting seat 5, and heat-conducting seat 5 uses aluminium alloy, heat conduction
Layer 1 and the thickness of heat-conducting layer 24 are 0.1 ~ 0.3mm, solder using golden tin welding material, using solder by light emitting source and substrate and
Weld together between substrate and heat-conducting seat, allow between light emitting source and substrate and substrate and heat-conducting seat and be connected, zero distance contact is led
Hot property is greatly improved, and the thermal conductivity factor of tin is 67w/mk, is higher by 60 times than silicone grease thermal conductivity factor, substrate uses copper base, copper
The thermal conductivity factor of substrate is 401w/mk, and the heat that LED light source is produced is quick to be transmitted to radiator, and the existing picture of no hot stack reduces light
Decline, substrate is integrally welded with radiator, the life-span of product and performance are guaranteed, and efficiently solve and exist in the prior art
Radiating effect it is bad, properties of product are poor, short life the problem of, and with it is simple and compact for structure, stably, the spy of good economy performance
Point.
It is preferred that, above-mentioned heat-conducting seat 5 sets air discharge duct 6 between contacting surface with heat-conducting layer 24, and air discharge duct 6, which ensure that, leads
The gas produced during the solder welding of thermosphere 24 is smoothly discharged, and prevents empty generation, and increases contact area, improves radiating
Effect, air discharge duct 6 uses V-shape, is formed by milling, it is easy to manufacture, 0.8 ~ 1mm of upper end width, 0.3 ~ 0.5mm of depth, long
Degree is more than length of the heat-conducting layer 24 on groove direction, can smoothly ensure the discharge of gas.
It is preferred that, radiator structure is provided with above-mentioned heat-conducting seat 5, radiator structure can use the fin of pectinate texture, such as
Shown in Fig. 2, into inverted " V " font, both sides are low, middle high, beneficial to cross-ventilation, better heat-radiation effect.
It is preferred that, aforesaid substrate 3 at least sets one piece, and the substrate 3 with light emitting source 1 can be connected in parallel polylith in heat-conducting seat
On 5, so as to make board structure compact, beneficial to processing and fabricating.
Embodiment 1：A kind of manufacture method of the LED light source module of high reliability, comprises the following steps：
（1）Copper base bronze printing tin alloy solder：Copper base is fixed on print station, regulation steel mesh position allows steel mesh to leak
Hole is overlapped with copper base solder joint, gold-tin eutectic solder cream is uniformly scraped into small opening region with scraper, copper base solder joint is uniformly coated with
Gold-tin eutectic solder cream；
（2）Paste LED lamp bead：LED lamp bead is placed on the gold-tin eutectic solder cream on solder joint, lamp bead cathode and anode directions and copper
Base plate line trend is consistent；
（3）Heat-conducting seat bronze printing tin alloy solder：Heat-conducting seat is placed into even print gold in bottom surface at copper-based Board position with steel mesh
Tin alloy solder cream, gold-tin eutectic solder cream thickness 0.2mm ~ 0.4mm；
（4）The copper base for posting LED lamp bead is placed on to the heat-conducting seat placement copper base position for coating gold-tin eutectic solder cream
Put place；
（5）Freeze light source module：Set chain-type sintering furnace before freezing to freeze temperature and chain speed, on chain-type sintering furnace panel
Six warm area design temperatures, 315 ~ 325 degrees Celsius of one temperature of warm area, 215 ~ 225 degrees Celsius of two temperature of warm area, the temperature of warm area three
178 ~ 188 degrees Celsius, 188 ~ 198 degrees Celsius of four temperature of warm area, 145 ~ 155 degrees Celsius of five temperature of warm area, the temperature 115 of warm area six ~
125 degrees Celsius, and " heating is opened " key is closed, the chaindriven motor speed of drive is set as 1470 ~ 1530r/min, closes " chain belt
Open " key, nitrogen-hydrogen hybrid protection gas is filled with sintering furnace, is prevented that heat-conducting seat and copper base from heating in engineering and is aoxidized, chain type is burnt
Heat-conducting seat is placed on chain band after freezing of a furnace furnace body temperature constant temperature 15min, it is 50mm to keep spacing between heat-conducting seat and heat-conducting seat, is opened
Start cooling conveyer belt power supply during dynamic chain-type sintering furnace simultaneously, transfer rate is identical with the chain speed that freezes, open cooling fan switch；
（6）It is automatically sent to cool down on cooling conveyer belt after heat-conducting seat after welding is come out of the stove, and is sent to test zone
Carry out performance test.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention, therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (5)
1. a kind of LED light source module of high reliability, including light emitting source（1）And heat-conducting seat（5）, it is characterised in that：It is described luminous
Source（1）The heat-conducting layer one formed after being heated by solder（2）It is welded on substrate（3）On, the substrate（3）After being heated by solder
The heat-conducting layer two of formation（4）It is welded on heat-conducting seat（5）On end face, the solder uses gold-tin eutectic solder, the substrate（3）Adopt
With copper base, the heat-conducting seat（5）With heat-conducting layer two（4）Contact sets air discharge duct between surface（6）, the air discharge duct（6）Using V
Font, 0.8 ~ 1mm of upper end width, 0.3 ~ 0.5mm of depth, length is more than heat-conducting layer two（4）Length on groove direction；
A kind of manufacture method of the LED light source module of high reliability comprises the following steps：
（1）Substrate prints solder：Substrate is fixed on print station, regulation steel mesh position allows steel mesh small opening to be overlapped with substrate connections,
Solder cream was uniformly scraped to small opening region with scraper, substrate connections are uniformly coated with solder cream；
（2）Paste LED lamp bead：LED lamp bead is placed on the solder cream on solder joint, lamp bead cathode and anode directions move towards one with base plate line
Cause；
（3）Heat-conducting seat prints solder：Heat-conducting seat is placed into bottom surface even print solder cream, solder cream thickness at substrate position with steel mesh
0.1mm~0.3mm；
（4）The substrate for posting LED lamp bead is placed at the heat-conducting seat placement substrate position for coating solder cream；
（5）Freeze light source module：Set chain-type sintering furnace before freezing to freeze temperature and chain speed, to six on chain-type sintering furnace panel
Warm area design temperature, 315 ~ 325 degrees Celsius of one temperature of warm area, 215 ~ 225 degrees Celsius of two temperature of warm area, the temperature 178 of warm area three ~
188 degrees Celsius, 188 ~ 198 degrees Celsius of four temperature of warm area, 145 ~ 155 degrees Celsius of five temperature of warm area, the temperature 115 ~ 125 of warm area six is taken the photograph
Family name's degree, and " heating is opened " key is closed, chain speed is set as 1470 ~ 1530 r/min, closes " chain belt is opened " key, chain-type sintering furnace body of heater
Heat-conducting seat is placed on chain band after thermostatic 15min, it is 50mm to keep spacing between heat-conducting seat and heat-conducting seat；
（6）It is automatically sent to cool down on cooling conveyer belt after heat-conducting seat after welding is come out of the stove, and is sent to test zone progress
Performance test.
2. a kind of LED light source module of high reliability according to claim 1, it is characterised in that：The heat-conducting layer one（2）
With heat-conducting layer two（4）Thickness is 0.1 ~ 0.3mm.
3. a kind of LED light source module of high reliability according to claim 1, it is characterised in that：The substrate（3）At least
Set one piece.
4. a kind of manufacture method of the LED light source module of high reliability according to claim 1, it is characterised in that：It is described
Step（5）Nitrogen-hydrogen gas mixture is filled with during freezing in middle chain-type sintering furnace.
5. a kind of manufacture method of the LED light source module of high reliability according to claim 1, it is characterised in that：It is described
Step（5）Start cooling conveyer belt power supply simultaneously during middle startup chain-type sintering furnace, transfer rate is identical with the chain speed that freezes, open cold
But fan swicth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510155167.XA CN104763902B (en) | 2015-04-03 | 2015-04-03 | The LED light source module and its manufacture method of a kind of high reliability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510155167.XA CN104763902B (en) | 2015-04-03 | 2015-04-03 | The LED light source module and its manufacture method of a kind of high reliability |
Publications (2)
| Publication Number | Publication Date |
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| CN104763902A CN104763902A (en) | 2015-07-08 |
| CN104763902B true CN104763902B (en) | 2017-07-11 |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4301178B2 (en) * | 2005-02-15 | 2009-07-22 | 株式会社デンソー | Liquid crystal display |
| TWI418062B (en) * | 2006-05-31 | 2013-12-01 | Denki Kagaku Kogyo Kk | LED light source unit |
| CN101994929A (en) * | 2009-08-20 | 2011-03-30 | 启耀光电股份有限公司 | Light emitting module |
| CN102254879B (en) * | 2011-07-05 | 2013-07-24 | 江苏捷捷微电子股份有限公司 | Controlled silicon for large-size silicon chip employing plastic entity package and packaging process thereof |
| US8587019B2 (en) * | 2011-10-11 | 2013-11-19 | Ledengin, Inc. | Grooved plate for improved solder bonding |
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