CN104752552A - 泡沫金属负载的铜铟硫半导体光伏材料制备方法 - Google Patents
泡沫金属负载的铜铟硫半导体光伏材料制备方法 Download PDFInfo
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- 239000006260 foam Substances 0.000 title claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 31
- 239000002184 metal Substances 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- LCUOIYYHNRBAFS-UHFFFAOYSA-N copper;sulfanylideneindium Chemical compound [Cu].[In]=S LCUOIYYHNRBAFS-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 238000002848 electrochemical method Methods 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000003792 electrolyte Substances 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229910000846 In alloy Inorganic materials 0.000 claims description 11
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 9
- 238000005987 sulfurization reaction Methods 0.000 claims description 8
- 150000002471 indium Chemical class 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- 238000004062 sedimentation Methods 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- 239000005864 Sulphur Substances 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 claims description 3
- CEYULKASIQJZGP-UHFFFAOYSA-L disodium;2-(carboxymethyl)-2-hydroxybutanedioate Chemical compound [Na+].[Na+].[O-]C(=O)CC(O)(C(=O)O)CC([O-])=O CEYULKASIQJZGP-UHFFFAOYSA-L 0.000 claims description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- 229910002651 NO3 Inorganic materials 0.000 claims description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 230000009466 transformation Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000007832 Na2SO4 Substances 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- 239000003708 ampul Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004073 vulcanization Methods 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052951 chalcopyrite Inorganic materials 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- -1 nanometer rods Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- IWZKICVEHNUQTL-UHFFFAOYSA-M potassium hydrogen phthalate Chemical compound [K+].OC(=O)C1=CC=CC=C1C([O-])=O IWZKICVEHNUQTL-UHFFFAOYSA-M 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 231100000701 toxic element Toxicity 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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Abstract
本发明涉及一种铜铟硫半导体光伏材料制备方法,属于材料领域。其特征在于:采用电化学方法在泡沫金属基体上均匀连续负载3纳米至1微米的铜铟硫半导体层。该材料具有很高的光电转换效率。
Description
技术领域
本发明涉及一种铜铟硫半导体光伏材料的制备方法,属于材料领域。
背景技术
黄铜矿型I-III-VI2族半导体具有良好的光电转换性能,Cu(In,Ga)Se2薄膜太阳能电池的光电转换效率高达20.3%;但是,由于硒元素有毒,因而限制了其应用。尽管CuInS2薄膜太阳能电池的光电转换效率目前只有13%,但是CuInS2是直接禁带半导体,带隙能约1.5eV,与太阳光谱十分匹配,而且吸收系数高(105cm-1);更重要的是,CuInS2中不使用有毒元素,具有环境友好的特征。因此,CuInS2是最具发展前途的光伏材料之一。
由于高比表面积低维纳米结构可以有效促进光吸收和电荷分离,因而CuInS2半导体纳米晶、纳米线、纳米棒、纳米管等具有较高的光电转换效率。但是,半导体晶粒间界面阻力导致光生电子不能有效传输到外电路,因而限制了CuInS2光电转换效率的进一步提高。
泡沫金属不仅具有高比表面积,而且具有高的导电性。为此,本发明提出在泡沫金属上负载均匀连续的CuInS2半导体光伏材料,形成以三维互通金属线为芯的半导体管状结构,从而提高收集和传输光生电子的能力。
发明内容
本发明提供一种泡沫金属负载的铜铟硫半导体光伏材料制备方法,其特征在于:采用电化学方法在泡沫金属基体上均匀连续负载3nm~1μm的铜铟硫半导体层。
泡沫金属基体包括单一金属和金属合金,例如泡沫铜、泡沫铝、泡沫镍、泡沫铁、泡沫黄铜、泡沫铁镍铬。
在泡沫金属基体上首先通过电化学方法制备铜铟硫半导体层。可以采用一步电沉积法制备铜铟硫半导体层,也可以采用分步法制备铜铟硫半导体层。采用一步法时,可在含有Cu2+、In3+、S2O3 2 −的电解液中进行。采用分步法时,可先沉积铜金属层,再沉积铟金属层,然后再硫化;也可以先沉积铜铟合金层,然后再硫化。
在泡沫金属基体上通过恒电位共沉积的方法制备铜铟合金膜时,电解液中铜盐和铟盐的浓度均为2~20mM,铜盐和铟盐的摩尔比为2:1~1:2,铜盐和铟盐可采用氯化物、硫酸盐、硝酸盐、乙酸盐,但不局限于这些种类的盐。电解液中络合剂三乙醇胺的加入量为0~0.5M;也可以采用邻苯二甲酸氢钾做络合剂,加入量为0~0.1M。电解液中柠檬酸钠的加入量为0~0.1M。电解液pH值控制在2.0~5.0,沉积电位为-800~ -1100mV(相对于饱和甘汞电极),沉积时间为10~60min,电解液温度为20~50℃。
铜铟合金膜的硫化退火过程中,以升华硫为硫源,退火温度控制在300-500℃之间;退火时间为15-120min。
该发明提供的泡沫金属负载铜铟硫半导体光伏材料,形成以三维互通金属线为芯的半导体管状结构,而不是半导体量子点。与传统导电基体上制备的半导体光伏材料相比,泡沫金属负载铜铟硫半导体光伏材料的光电转换性能显著提高。
附图说明
图1是在铟锡氧化物(ITO)导电玻璃上沉积的铜铟硫薄膜电极的电流-电位曲线。
图2是泡沫镍负载的铜铟硫半导体电极的电流-电位曲线。
具体实施方式
对比例
在50mL 5mM氯化铜溶液中加入0.2M的三乙醇胺作为络合剂,0.01M柠檬酸钠作为缓冲剂,用浓硫酸将电解液pH值调至5.0左右,然后加入5mM氯化铟,用氢氧化钠溶液将溶液pH值调至4.00。
以1cm×1cm铟锡氧化物(ITO)导电玻璃作为工作电极,铂网为对电极,饱和甘汞电极(SCE)为参比电极,室温下在-1000mV恒电位沉积30min。
待薄膜干燥后对其进行硫化热处理,将薄膜置于管式炉的石英管中,称取2g硫粉放在石英管的进气口方向,以5℃/min的升温速率将温度升至400℃煅烧90min,得到铜铟硫半导体薄膜。
以CuInS2薄膜作为工作电极,碳棒作为辅助电极,SCE作为参比电极,在0.1M Na2SO4水溶液中测量暗态和光照(100mW/cm2)条件下电流-电位曲线。测量结果见图1。
实施例
以0.5mm厚的1cm×1cm泡沫镍作为工作电极,电解液组成、电沉积条件、硫化热处理条件同对比例,得到泡沫镍负载的铜铟硫半导体光伏材料。
以泡沫镍负载的铜铟硫半导体材料作为工作电极,碳棒作为辅助电极,SCE作为参比电极,在0.1M Na2SO4水溶液中测量暗态和光照(100mW/cm2)条件下电流-电位曲线。测量结果见图2。
Claims (10)
1.一种泡沫金属负载的铜铟硫半导体光伏材料制备方法,其特征在于:采用电化学方法在泡沫金属基体上均匀连续负载3nm~1μm的铜铟硫半导体层。
2.根据权利要求1所述的泡沫金属负载的铜铟硫半导体光伏材料制备方法,其特征在于:泡沫金属基体包括泡沫铜、泡沫铝、泡沫镍、泡沫铁、泡沫黄铜、泡沫铁镍铬。
3.根据权利要求1所述的泡沫金属负载的铜铟硫半导体光伏材料制备方法,其特征在于:在泡沫金属基体上首先通过恒电位共沉积制备铜铟合金膜,然后通过硫化退火的方法得到泡沫金属负载的铜铟硫半导体层。
4.根据权利要求3所述的在泡沫金属基体上通过恒电位共沉积制备铜铟合金膜的方法,其特征在于:电解液中铜盐和铟盐的浓度为2~20mM,铜盐和铟盐的摩尔比为2:1~1:2,铜盐和铟盐可采用氯化物、硫酸盐、硝酸盐、乙酸盐。
5.根据权利要求3所述的在泡沫金属基体上通过恒电位共沉积制备铜铟合金膜的方法,其特征在于:电解液中络合剂三乙醇胺的加入量为0~0.5M。
6.根据权利要求3所述的在泡沫金属基体上通过恒电位共沉积制备铜铟合金膜的方法,其特征在于:电解液中柠檬酸钠的加入量为0~0.1M。
7.根据权利要求3所述的在泡沫金属基体上通过恒电位共沉积制备铜铟合金膜的方法,其特征在于:电解液pH值控制在2.0~5.0。
8.根据权利要求3所述的在泡沫金属基体上通过恒电位共沉积制备铜铟合金膜的方法,其特征在于:沉积电位为-800~ -1100mV(相对于饱和甘汞电极),沉积时间10~60min,电解液温度为20~50℃。
9.根据权利要求3所述的通过硫化退火得到泡沫金属负载的铜铟硫半导体层的方法,其特征在于:铜铟合金膜的硫化退火过程中,以升华硫为硫源,退火温度控制在300~500℃之间。
10.根据权利要求3所述的通过硫化退火得到泡沫金属负载的铜铟硫半导体层的方法,其特征在于:铜铟合金膜的硫化退火过程中,退火时间为15~120min。
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