CN104751261B - The method that the variation of technological process, the technological process to change are monitored - Google Patents
The method that the variation of technological process, the technological process to change are monitored Download PDFInfo
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- CN104751261B CN104751261B CN201310745816.2A CN201310745816A CN104751261B CN 104751261 B CN104751261 B CN 104751261B CN 201310745816 A CN201310745816 A CN 201310745816A CN 104751261 B CN104751261 B CN 104751261B
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Abstract
The method that variation the present invention relates to technological process and the technological process to change are monitored.The variation of the technological process includes：Chipset is carried out in advance in batches, to obtain some chip batches；The chip batch of the applicable modification application is selected according to current modification application, the chip of the chip batch includes benchmark chip；Change chip of the selection in addition to the benchmark chip from the chip batch of the selected applicable modification application, to obtain chipset result in batches；Based on the chipset, result performs the technological process in batches.The present invention can reduce the change repetitive rate and Change cost of technological process.
Description
Technical field
The present invention relates to IC manufacturing field, the more particularly to variation of technological process and the technique stream to change
The method that journey is monitored.
Background technology
In the manufacturing of integrated circuit, each chip (Wafer) from raw material ultimately form product be required for by
Hundreds or even thousands procedure, all process steps that chip is passed through constitute technological process.Under normal circumstances, chip is according to pre-
The technological process first set performs each procedure length by length, that is to say, that every in pre-set technological process
The content of one procedure, the content of each procedure further include specific technological parameter, also pre-set each procedure
The time sequencing of execution, technological process drive engine to perform successively each according to pre-set technological process, control chip
Procedure.
But with the complication of integrated circuit manufacture process, the continuous renewal of technique manufacture, life of the change in the work in integrated circuit
Can frequently it occur during production.These change the improvement to integrated circuit manufacture process, the lifting of semiconductor technology yield and production effect
The raising of rate has the meaning of decision.
Change in the work relates generally to the change of technological process, including technique change (process engineering
Change), and program (procedure) or OI change.Under many circumstances, chip needs to be existed according to the requirement of engineer
Handled on a certain procedure or a few procedures in technological process according to the technological parameter after change.
A kind of variation of technological process includes：When going to certain procedure, one group of chip is divided into some batches
(Lot), several are artificially selected to be manufactured according to former technological parameter, and other batches are according to the technological parameter system after change
Make.The prior art further includes the method that the technological process to change is monitored, including the technological parameter after change is tested
Card, to ensure the raising of product yield.
It is existing but the mode of the technological process of semiconductor and its complexity, change various parameters or processing procedure is more extensive
Only artificially choosing batch carries out chip the change of technological process to technology, then carried out by the testing result of the technological process to change
Verify and rechange, to obtain Expected Results.This mode of change in batches be difficult take into account process in choosing batch involved by chip and
Coverage between process, artificially carries out chip choosing batch change, can largely improve the change weight of technological process
Multiple rate and Change cost, the change of particularly mistake can also reduce the yield of product, cause the low of production efficiency.
The content of the invention
The technical problem that technical solution of the present invention is solved is：How to reduce the change repetitive rate of technological process and be altered to
This.
In order to solve the above-mentioned technical problem, technical solution of the present invention provides a kind of variation of technological process, is based on
Modification application at least once, including：
Chipset is carried out in advance in batches, to obtain some chip batches；
The chip batch of the applicable modification application, the chip of the chip batch are selected according to current modification application
Including benchmark chip；
Change of the selection in addition to the benchmark chip from the chip batch of the selected applicable modification application
Chip, to obtain chipset result in batches；
Based on the chipset, result performs the technological process in batches.
Optionally, the chip batch includes the chip batch of the first change grade and the wafer batch of the second change grade
It is secondary；The chip batch of the first change grade can only be applicable in a modification application, the chip of the second change grade at the same time
Batch can be applicable in multiple modification application at the same time.
Optionally, the current modification application of the basis selects the chip batch of the applicable modification application to include：
Search ongoing modification application list；
Detect the whether applicable ongoing modification application list of this chip batch：
When the chip batch that this described chip batch is the first change grade, check whether this chip batch is answered
For in other modification application lists：If then replace next chip batch to continue to detect or wait this chip batch in other changes
Using finishing in more request slip, if otherwise selecting chip batch of this chip batch for the applicable modification application；
When the chip batch that this described chip batch is the second change grade, this chip batch is selected to be fitted to be described
With the chip batch of the modification application.
In order to solve the above-mentioned technical problem, technical solution of the present invention additionally provides a kind of variation of technological process, base
In modification application at least once, including：
Chipset is carried out in advance in batches, to obtain some chip batches；
The chip batch of the applicable modification application, the chip of the chip batch are selected according to current modification application
Chip including benchmark chip and the applicable modification application；
Selected from the chip of the applicable modification application of the chip batch of the selected applicable modification application
Change chip is selected, to obtain chipset result in batches；
Based on the chipset, result performs the technological process in batches.
Optionally, the chip batch includes the chip batch of the first change grade and the wafer batch of the second change grade
It is secondary；The chip batch of the first change grade can only be applicable in a modification application, the chip of the second change grade at the same time
Batch can be applicable in multiple modification application at the same time；
Chip includes the first change grade in addition to the benchmark chip in the chip batch of the second change grade
The chip of chip and the second change grade, the chip of the first change grade can only be applicable in a modification application at the same time, described
The chip of second change grade can be applicable in multiple modification application at the same time.
Optionally, the current modification application of the basis selects the chip batch of the applicable modification application to include：
Search ongoing modification application list；
Detect the whether applicable ongoing modification application list of this chip batch：
When the chip batch that this described chip batch is the first change grade, check whether this chip batch is answered
For in other modification application lists：If then replace next chip batch to continue to detect or wait this chip batch in other changes
Using finishing in more request slip, if otherwise selecting chip batch of this chip batch for the applicable modification application；
When the chip batch that this described chip batch is the second change grade, this chip batch is selected to be fitted to be described
With the chip batch of the modification application.
Optionally, when the chip batch that the chip batch of the applicable modification application is the first change grade, institute
The chip for stating the applicable modification application is the chip in the chip batch in addition to the benchmark chip；
When the chip batch of the applicable modification application is the second chip batch for changing grade：
If chip is the first chip for changing grade in addition to the benchmark chip in the chip batch, described applicable
The chip of the modification application in addition to the benchmark chip, be not applied to the chips of other modification applications；
If chip is the second chip for changing grade in addition to the benchmark chip in the chip batch, described applicable
The chip of the modification application is the chip in addition to the benchmark chip.
In order to solve the above-mentioned technical problem, technical solution of the present invention additionally provides a kind of variation of technological process, base
In modification application at least once, including：
Chipset is carried out in advance in batches, to obtain some chip batches；
The type of the chip batch include first change grade chip batch, second change grade chip batch and
The chip batch of 3rd change grade, the type based on the chip batch is from the chip batch of the applicable modification application
Selection change chip, to obtain chipset result in batches；
Based on the chipset, result performs the technological process in batches.
In order to solve the above-mentioned technical problem, what the technological process that technical solution of the present invention is additionally provided to change was monitored
Method, including：
Variation based on technological process as described above performs technological process；
Obtain in the technological process implementation procedure chipset in batches result and with the benchmark chip in the chip batch
With change chip relevant information；
By the Parameters variation of the benchmark chip compared with changing the Parameters variation of chip, with the work to the change
Skill flow is monitored.
The beneficial effect of technical solution of the present invention includes at least：
Technical solution of the present invention passes through to selecting the chip batch suitable for current modification application, the choosing of make a change chip
Select, and with this obtain chipset in batches as a result, technological process is performed based on the result in batches, so as to complete technological process
Change.Different from the prior art, the not artificial selection of chip batch of technical solution of the present invention, but based on current change Shen
It please make choice, it can avoid the change with other modification applications from conflicting, and reduce the influence power to technological process, secondly, this
The result in batches of inventive technique scheme further includes the information of change chip, improves the validity of information transmission；Based on above-mentioned, sheet
Inventive technique scheme both ensure that the change process of technological process will not be influenced be subject to other changes, in turn ensure that technique changes
The utilization of process maximal efficiency, can reduce change repetitive rate and Change cost, there is provided the production efficiency of product.
In alternative, technical solution of the present invention additionally provides a kind of mode classification of chip batch, for system area
Divide and select the chip batch of the applicable modification application., being capable of high-speed decision based on the mode classification of above-mentioned chip batch
The chip batch of the applicable modification application, and chip batch can be assigned to make full use of rate, it is ensured that technological process
Effectively operation.
In the another technical solution of the present invention, the chip batch and change chip of technical solution of the present invention are root respectively
Made choice according to current modification application, not only prevent the execution conflict of chip batch, also from change chip, more meticulously
The changed content of technological process has been distinguished, has further reduced technique influence caused by change chip, has improved the generation effect of generation
Rate, reduces manufacturing cost.
In alternative, technical solution of the present invention additionally provides a kind of mode classification based on chip batch and chip,
So that the chip batch of the applicable modification application is distinguished and selected to system and distinguishes and select the applicable change Shen
Change chip please.Mode classification based on above-mentioned chip batch and chip, being capable of the applicable modification application of high-speed decision
Chip batch and the applicable modification application change chip, and meticulously implement per wafer utilization, maximize
Ground carries out the change of technological process using vacant batch and chip, and reduces change chip with minimizing to other technological processes
Perform influence, it is ensured that effective operation of technological process.
In addition, when the result in batches based on acquisition carries out technological process, also re-started according to the result in batches
The carrying of chip batch, the chip batch for updating technological parameter are redistributed, so as to ensure that technological process can be stringent
According to the result in batches performed in batches, complete related process flow change, it is ensured that the change of technological process can
Perform effectively.
Technical solution of the present invention also by technological process change implementation procedure in chipset in batches result and with the crystalline substance
Benchmark chip and change chip relevant information in piece batch, timely and accurately carry out the analysis on altered project of technological process, and will divide
Analysis result feeds back to altering system, realizes the monitoring of the technological process to change, is conducive to change the acquisition of information of technological process
And improve.The analysis result is that the parameter of change chip can be obtained based on benchmark chip and change chip relevant information
Change the entire effect power to technological process.Further, it is also possible to WAT test datas and CP in combined process flow implementation procedure
Test data carries out Comprehensive Evaluation to the technological process implementation status of change, obtains the change conclusion of technological process, is conducive to subtract
The change number of few technological process, save Change cost, so as to improve the production efficiency of product.
Brief description of the drawings
Fig. 1 is a kind of flow diagram of the variation for technological process that technical solution of the present invention provides；
Fig. 2 is a kind of method flow schematic diagram of chip batch for selecting the applicable modification application；
Fig. 3 is a kind of schematic diagram for the selection menu for changing chip；
Fig. 4 is another schematic diagram for the selection menu for changing chip；
Fig. 5 is that result performs a kind of method flow schematic diagram of the technological process in batches based on the chipset；
Fig. 6 is a kind of schematic diagram to the distribution menu of manufacture board distribution chip batch；
Fig. 7 is another schematic diagram to the distribution menu of manufacture board distribution chip batch；
Based on the chipset, result performs another method flow schematic diagram of the technological process to Fig. 8 in batches；
Fig. 9 is the flow diagram of the variation for another technological process that technical solution of the present invention provides；
Figure 10 is a kind of method flow schematic diagram of selection change chip；
Figure 11 is the flow diagram of the variation for another technological process that technical solution of the present invention provides；
Figure 12 is that the flow for the method that a kind of technological process to change that technical solution of the present invention provides is monitored is shown
It is intended to；
Figure 13 is a kind of schematic diagram of the tables of data based on distribution data sample；
Figure 14 is a kind of structure diagram of the altering system for technological process that technical solution of the present invention provides；
Figure 15 is a kind of structure diagram for system that technical solution of the present invention provides.
Embodiment
In order to enable the purpose of the present invention, feature and effect more obvious understandable, below in conjunction with the accompanying drawings to the present invention's
Embodiment elaborates.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
Implemented using other different from mode described here, therefore the present invention is from the limitation of following public specific embodiment.
Embodiment 1
A kind of variation of technological process, based on modification application at least once, as shown in Figure 1, including：
Step S100, carries out in advance in batches chipset.
Chip is carried out it is pre- in batches the result is that obtaining some chip batches.Chip batch is closed by one or more chips
And into, by the processing procedure of a succession of manufacture board, to be finally made as integrated circuit.Each manufacture board would generally be by
The chip batch specified is assigned to, performs one of single chip manufacturing operation.Such as can be on a specific manufacture board
Film (layering) operation, patterning (patterning) operation, doping (doping) operation or heat treatment are performed on chip
(thermal treatment) operation.Each manufacture board performs chip manufacturing operation according to defined operation procedure.This
Embodiment meaning technological process, can include the execution of above-mentioned manufacturing operation.
The modification application can graphically be received by the management system of technological process or one using interface, and with
The form of modification application list realizes, the specification of the technological process of change, the technological process of change are may include in modification application list
The information such as classification grade, manufacturing process and board operation.Modification application can in the form of modification application list, acquisition request change
The chip batch that technological process is influenced, and select the chip in chip batch.So change of the technological process of the present embodiment
Method further includes：
Step S101, the chip batch of the applicable modification application is selected according to current modification application.
Artificially selection different from the prior art is applicable in the chip batch of modification application, and the present embodiment is based on change Shen
Please or the applicable current modification application of modification information search in modification application list chip batch：Include in modification information
To the classification situation of the chip batch：
The chip batch includes the chip batch of the first change grade and the chip batch of the second change grade：
The chip batch of the first change grade can only be applicable in a modification application, the chip of the first change grade at the same time
Batch be mainly in view of its change influence power it is larger, influence that may be to other technological processes is more serious, to itself and its chip
Make a change is operated, it is necessary to be determined according to whether it is suitable for other modification applications or modification application list, such as, for
For the chip batch of the first change grade of other modification application lists, then not reselection is asked in current change, and is to continue with searching
Other chip batches of rope.
The chip batch of the second change grade can be applicable in multiple modification application, the wafer batch of the second change grade at the same time
Secondary its change influence power that is mainly in view of is smaller with respect to the first change grade, and the influence to other technological processes is not serious,
When being operated to its make a change, the chip batch of the second change grade can be ignored in other modification applications or modification application list
Service condition, and be directly applied for this modification application or modification application list.Such as having been used for other modification applications
Single second changes the chip batch of grade, then current change request selecting chip batch.
Understood based on above-mentioned, for current modification application or modification application list, can according in modification information to the chip
The classification situation of batch, obtains the chip batch of the applicable modification application.
Based on above-mentioned analysis, with reference to figure 2, the current modification application of the basis selects the crystalline substance of the applicable modification application
Piece batch includes：
Step S110, searches ongoing modification application list.
Step S120, detects the whether applicable ongoing modification application list of this chip batch；Wherein, when described
This chip batch is the chip batch of the first change grade, then performs step S121；When this described chip batch is second
The chip batch of grade is changed, then performs step S122.
Step S121, checks whether this chip batch has been applied in other modification application lists：If under then replacing
One chip batch continues to detect or waits this chip batch in other modification application lists using finishing, if otherwise selecting this
Chip batch is the chip batch of the applicable modification application.
Step S122, when the chip batch that this described chip batch is the second change grade, selects this chip batch
For the chip batch of the applicable modification application.
With continued reference to Fig. 1, the variation of the technological process of the present embodiment further includes：
Step S102, the chip batch includes benchmark chip and other chips in addition to the benchmark chip, from institute
Change chip of the selection in addition to the benchmark chip in the chip batch of the applicable modification application of selection.
Benchmark chip is the non-variable more chip in chip batch, and it is brilliant that it is selected as change in no instance
Piece.It is a kind of with reference to chip when benchmark chip is to the change chip make a change.The benchmark chip of the chip batch can
Selected based on random algorithm from the chip batch.
The change chip can be all wafers in addition to the benchmark chip, it is possible to have the piece number limits.This reality
The change chip for applying example is based on having the piece number limitation, it selects the piece number to be based on input the piece number.
Selection for changing chip, can input the piece number by system in the crystalline substance in addition to the benchmark chip based on described
Randomly choosed in piece, hand picking can also be carried out in the chip in addition to the benchmark chip.
Fig. 3 is chip batch (the lot ID to the selected applicable modification application：E35024), based on input chip
Number (split wafer Qty：5) (split wafer method, are randomly choosed：Automatic) numbering is " #06 ", " #
13 ", the schematic diagram for selecting menu p1 for changing chip of " #21 ", " #23 ", " #24 "；
Fig. 4 is chip batch (the lot ID to the selected applicable modification application：E35024), based on input chip
Number (split wafer Qty：5), hand picking (split wafer method：Manual) the change chip in chip batch
Selection menu p2 schematic diagrames, wherein, the numbering of alternative chip is " #01 ", " #02 " ..., " #24 ", " #25 ".
With continued reference to Fig. 1, the variation of the technological process of the present embodiment further includes：
Step S103, chip is obtained according to the chip batch of the selected applicable modification application and its change chip
Component batch result.
Chipset in batches the result is that including being selected the information of chip batch and the information of change chip：
In the present embodiment, the information of the chip batch mainly corresponds to the modification information.The modification information includes every
The modification information of one chip batch, the modification information of chip batch are related to：Lot identification codes (lotidentity), change request
Identification code (ECR identity) and other and the relevant description information of technological process change.Each change request can lead to
The modification information of the lot identification codes, change request identification code or the one or more chip batches of a variety of identification codes association is crossed,
To form the modification information of the change request.
The information of the change chip is primarily referred to as changing the information of corresponding change wafer technique parameter because of change request,
In other words, asked based on change, being will be to the technological process parameter make a change of the change chip.The technological process
Parameter refers mainly to the content of every procedure performed by every batch of chip and the technological parameter per procedure, the technological process parameter
It is related to the execution of chip batch.
With continued reference to Fig. 1, the variation of the technological process of the present embodiment further includes：
Step S104, based on the chipset, result performs the technological process in batches.
Performing the technological process can be according to the chip batch information and change changed in chipset in batches result
Wafer data is changed to carry out.The chip batch information of the change refers mainly to change request and passes through the identification in chip batch information
A kind of information of code and the chip batch association for the applicable modification application chosen, the change wafer data master of the change
Refer to the information for changing corresponding change wafer technique parameter.
Further, since the execution of technological process it is a succession of manufacture board on carry out, chip batch can be allocated to
Corresponding manufacture board, after the above-mentioned chipset of acquisition in batches result, it is also necessary to chip batch (the chip batch of change of change
Change including the change to chip batch information and to change wafer data) carry out board distribution.This distribution realization can be with
Performed by batch execution system (Splict Runcard, Split RC), to smoothly complete the execution of technological process.
Specifically, with reference to figure 5, described based on the chipset, result performs the technological process including walking as follows in batches
Suddenly：
Step S140, updates and preserves the chip batch information and change wafer data of change.
Step S141, by the chipset, result is transmitted to the batch execution system in batches.
Step S142, list is performed based on modification application exhalation in batches, and single offer change is performed in batches to described
The odd numbers of request slip, and the selected chip batch of the modification application is obtained automatically.
Step S143, performs list and corresponds to the chip batch got to manufacture board and carry out carrying wafers in batches.
Step S144, according to each chip of chip batch described in the technological process parameter configuration of each chip.
Step S145, sets each chip of chip batch to be in working condition.
This race goods process of the batch execution system realizes the carrying of the selected chip batch of modification application, energy
Enough being based strictly on chipset, result performs chip in batches in batches.
It can also be utilized using above-mentioned batch execution system and perform list in batches, simplified manufacture board and obtain its corresponding chip
The acquisition process of batch and chip：As shown in fig. 6, with reference to Fig. 7, it was found from distribution menu p3 and its distribution portion p30, if excluding
Batch execution system is applicable in, then needs to apply for (STR) and batch particular applications (MSTR) Coordination Decision ability by special test
Get and perform single and chip batch distribution (in Fig. 6, list is performed in batches described in Runcard representatives) in batches；List is performed in batches
Numbering is 0409112400012, and corresponding chip batch is E36636), but can be in the distribution menu p4 under batch execution system
It is interior, directly obtained by system perform in batches list (referring to selected section p40, perform monocular record catalogue in batches,
0409112400012) single corresponding chip batch and with this is performed in batches.
In other embodiments, batch execution system can not also be related to, as shown in figure 8, described above be based on the crystalline substance
Piece component batch result, which performs the technological process, directly to be realized with following steps：
Step S140 ', updates and preserves the technological process parameter that chip is changed in the chip batch；
Step S141 ', the selected chip batch of modification application are carried to corresponding board；
Step S142 ', according to each chip of chip batch described in the technological process parameter configuration of each chip；
Step S143 ', sets each chip of chip batch to be in working condition.
At this time, the handling process of step S141 ' is the list selection course of execution in batches based on Fig. 6, that is, is needed by special survey
Examination application (STR) and batch particular applications (MSTR) Coordination Decision can just be got performs single and chip batch distribution in batches.
Embodiment 2
A kind of variation of technological process, based on modification application at least once, as shown in figure 9, including：
Step S200, carries out in advance in batches, to obtain some chip batches chipset.
The embodiment of this step refers to embodiment 1.
Step S201, the chip batch of the applicable modification application is selected according to current modification application.
The selection mode of the chip batch of the applicable modification application refers to embodiment 1, and the present embodiment is also right
The chip batch is classified, i.e., the chip batch and second that described chip batch includes the first change grade changes grade
Chip batch.
Step S202, the chip of the chip batch include benchmark chip and the chip of the applicable modification application, from
Selection change chip in the chip of the applicable modification application of the chip batch of the selected applicable modification application.
Different from embodiment 1, the change chip of the present embodiment is the chip of the applicable modification application, i.e., not removes institute
State the chip that all wafers beyond benchmark chip belong to the applicable modification application, the chip batch of the present embodiment
In chip include two classes, i.e., the chip batch of the chip batch of the first change grade and the second change grade.In other words, originally
Embodiment is on the premise of chip batch is classified, also to removing the benchmark chip in the chip batch of the second change grade
Chip has carried out the classification of wafer-level again in addition, in the chip batch of the second change grade in addition to the benchmark chip chip
The chip of chip and the second change grade including the first change grade, the chip of the first change grade can be only applicable at the same time
Modification application, the chip of the second change grade can be applicable in multiple modification application at the same time.
Above-mentioned wafer sort mode be different from chip batch mode classification, its be to change chip influence power again
Assessment, to build control power of the system for change workflow；Particularly, for the change chip limited containing the piece number, this
Kind wafer sort mode can preferably assess influence of the selected change chip for system, and selection influences less chip conduct
Change chip.
Based on above-mentioned, with reference to figure 10, the chip batch from the selected applicable modification application it is applicable
Selection change chip includes step in the chip of the modification application：
Step S220, judges the classification of the chip batch of the selected applicable modification application：When described applicable
The chip batch of the modification application is the chip batch of the first change grade, then performs step S221；When the applicable institute
The chip batch for stating modification application is the chip batch of the second change grade, then performs step S222；
Step S221, the chip of the applicable modification application be in the chip batch in addition to the benchmark chip
Chip, change chip therein is selected according to the piece number of input；
Step S222, judges the chip classification of the chip in addition to the benchmark chip in the described chip batch：It is if described
Chip classification is the chip of the first change grade, then performs step S223, if the chip classification is the crystalline substance of the second change grade
Piece, then perform step S224；
Step S223, the chip of the applicable modification application are in addition to the benchmark chip, are not applied to
The chip of other modification applications, change chip therein is selected according to the piece number of input；
Step S224, the chip of the applicable modification application is the chip in addition to the benchmark chip, according to
The piece number of input selects change chip therein.
With continued reference to Fig. 9, the variation of the technological process of the present embodiment, further includes：
Step S203, chip is obtained according to the chip batch of the selected applicable modification application and its change chip
Component batch result.
Step S204, based on the chipset, result performs the technological process in batches.
The further contents of step S203 to S204 refer to embodiment 1.
Embodiment 3
A kind of variation of technological process, based on modification application at least once, as shown in figure 11, including：
Step S300, carries out in advance in batches, to obtain some chip batches chipset.
Step S301, chip batch of the type of the chip batch including the first change grade, second change grade
The chip batch of chip batch and the 3rd change grade, the type based on the chip batch is from the applicable modification application
Selection change chip in chip batch.
The present embodiment is based on the applicable current modification application of modification information search in modification application or modification application list
Chip batch, wherein, the classification situation to the chip batch is included in modification information, this gives the chip
Another mode classification of batch, this mode classification combine the class of embodiment 1 and embodiment 2 for chip batch and chip
Type distributes：
The chip batch includes the chip batch of the first change grade, the chip batch of the second change grade and the 3rd change
The chip batch of more grade.
The wafer batch of the first change grade is equal to embodiment 1 to be determined for the chip batch of the first change grade
Justice.
When the chip batch that current wafer batch is the described first change grade, the crystalline substance of the applicable modification application
Piece batch and change chip selection course include：All ongoing modification application lists are searched, whether check current wafer batch
Have been used in other modification application lists.If used, user is reminded to go to replace chip batch or wait this
Change chip is made choice again after the completion of other modification application lists of chip batch.
The chip batch of the second change grade can be applicable in multiple modification application at the same time, and its change influence power is with respect to the
One change grade is smaller, and the influence to other technological processes is not serious, when being operated to its make a change, can ignore the
The chip batch of two change grades is applied to this change Shen in other modification applications or the service condition of modification application list
Please or modification application list.But a characteristic of the chip batch of the second change grade is that its chip only can be suitably used for once becoming
More application or a modification application list.
When the chip batch that current wafer batch is the described second change grade, the wafer batch of the applicable modification application
Secondary and change chip selection course includes：All ongoing modification application lists are searched, check the chip of current wafer batch
Service condition in modification application list, i.e. which chip are used by other modification application lists, which chip is not by it
What his modification application list used, which chip is benchmark chip；The chip number inputted further according to user, from present lot its
In the chip that his modification application list uses, suitable chip is selected as change chip.
The chip batch of the 3rd change grade can be applicable in multiple modification application at the same time, and its chip also can be suitably used for it is more
Secondary modification application, the chip batch and its chip of the 3rd change grade are minimum for the influence power of other technological processes.
When the chip batch that current wafer batch is the described 3rd change grade, the wafer batch of the applicable modification application
Secondary and change chip selection course includes：Check the benchmark chip that current wafer batch defines, the change needed further according to user
The number of more chip, in all available chips from the chip in addition to benchmark chip, selects suitable change chip.
Herein, the classification of chip batch not only contributes to the selection whether applicatory of chip batch, also to the shadow of chip
Force characteristic is rung to be marked.The present embodiment be substantially by embodiment 2 for wafer sort defined label to chip batch
Classification, and by embodiment 2 to its second change grade chip batch first change grade chip and second change etc.
The chip and the classification information of its chip batch of level are combined, to improve system identification power and processing speed.
With continued reference to Figure 11, the variation of the technological process of the present embodiment further includes：
Step S302, obtains brilliant according to the chip batch of the applicable modification application and selected change chip
Piece component batch result.
Chipset in batches the result is that including by the information of the chip batch of the applicable modification application and change
The information of chip.The specific descriptions of the information of the chip batch and the information of change chip refer to embodiment 1.
Step S303, based on the chipset, result performs the technological process in batches.
The particular content of step S303 refers to embodiment 1, and the present embodiment repeats no more.
Embodiment 4
A kind of method that technological process to change is monitored, can perform the variation based on technological process
Technological process is monitored, as shown in figure 12, including：
Step S400, performs the change of technological process.
The concrete mode of technological process change refers at least one of embodiment 1 to 3 mode.
Step S401, obtains during the technological process change chipset result in batches.
The chipset in batches the information of the chip batch of result including the applicable modification application and with it is described
Benchmark chip and change chip relevant information in the applicable modification application.
The execution of technological process change process based on the chipset got according to the change mode in batches as a result,
Namely batch data.
The execution of allotment or execution system based on batch execution system, the acquisition of batch data can be based on as shown in figure 13
Distribution data sample, i.e. tables of data d0.Tables of data d0 illustrates first batch data, and that includes perform list (figure in batches
In 13, eRunCard is represented described performs list in batches), corresponding with execution list in batches be applied to change the chip batch asked
The data message of change chip (Wafer) and benchmark chip (BaseLine) in (Lot ID), the chip batch.For example compile
Number for 137715857 execution in batches, singly corresponding chip batch is E36191, and it is " #01 ", " #02 ", " # that it, which changes chip,
04”、“#05”、“#06”；Benchmark chip is " #03 ", " #08 ", " #13 ", " #14 ", " #17 ", " #18 ", " #19 ", " #20 ", " #
22”、“#23”、“#25”。
With continued reference to Figure 12, the method being monitored to the technological process of change of the present embodiment further includes：
Step S402, by the Parameters variation of the benchmark chip compared with changing the Parameters variation of chip, with to institute
The technological process for stating change is monitored.
Step S400 to S402 is mainly monitored the core data during the change of technological process：Technological process
The most crucial data of change be exactly by the above-mentioned chipset that is obtained to chip batch and its chip make a change in batches as a result,
Namely batch data, including the chip batch or chip of which project are changed, and which chip is as benchmark chip
(with reference to chip) is without participating in this change.
Except the monitoring of above-mentioned batch data, with continued reference to Figure 12, the technological process to change of the present embodiment is supervised
The method of control further includes：
Step S403, gathers WAT test datas and CP test datas in the technological process implementation procedure.
The WAT test datas are the test data that WAT is electrical conformity testing, and CP test datas are that CP tests are yield
The test data of test.
Step S404, Parameters variation and change chip based on the WAT test datas, CP test datas and benchmark chip
Parameters variation comparative result obtain the change technological process change conclusion.
Step S405, feed back the change technological process change conclusion to the change technological process.
Step S403 to S405 contrasts the relevant parameter of benchmark chip with reference to WAT test datas and CP test datas
Change between change chip relevant parameter, changes the final conclusion of execution.Alteration would know that by the conclusion, with
Whether the change execution to technological process succeeds.
Above-mentioned monitoring process can be realized using yield analysis system, wherein, WAT test datas and CP test datas are all
In the data that yield analysis system is provided.
Embodiment 5
A kind of altering system of the technological process of corresponding embodiment 1, as shown in figure 14, including：
Suggesting system for wearing (FECP) is changed, is adapted for carrying out step S100 to S103；
Runtime (Split RC) in batches, is adapted for carrying out in step S104, the board assigning process of chip batch；
Manufacturing execution system (MES), suitable for chip batch and its chip based on distribution to board, performs the technique stream
Journey.
More specifically, corresponding step S140 to S145, the change suggesting system for wearing (FECP) of technological process are further adapted for performing
Step S140 and S141, in batches runtime (Split RC) be adapted for carrying out step S142 to S144, manufacturing execution system (MES)
It is adapted for carrying out step S145.
Similar, in other embodiments, it can also provide：
A kind of altering system of the technological process of corresponding embodiment 2, including：
Suggesting system for wearing (FECP) is changed, is adapted for carrying out step S200 to S203；
Runtime (Split RC) in batches, is adapted for carrying out in step S204, the board assigning process of chip batch；
Manufacturing execution system (MES), suitable for chip batch and its chip based on distribution to board, performs the technique stream
Journey.
Wherein, system integration component plays the role of the connection and communication between system.
A kind of altering system of the technological process of corresponding embodiment 3, including：
Suggesting system for wearing (FECP) is changed, is adapted for carrying out step S300 to S302；
Runtime (Split RC) in batches, is adapted for carrying out in step S303, the board assigning process of chip batch；
Manufacturing execution system (MES), suitable for chip batch and its chip based on distribution to board, performs the technique stream
Journey.
Embodiment 6
A kind of system, as shown in figure 15, including：
Change suggesting system for wearing (FECP)；
Runtime (Split RC) in batches；
Manufacturing execution system (MES)；And
Yield analysis system, is adapted for carrying out monitoring process as described in Example 4, and monitored results are fed back to technique stream
The change suggesting system for wearing (FECP) of journey.
The monitored results can be the comparison knot of the Parameters variation and the Parameters variation of change chip of the benchmark chip
At least one data in the change conclusion of the technological process of fruit and the change.
The specific execution content of change suggesting system for wearing, in batches runtime and the manufacturing execution system of the technological process can
The discussion of reference implementation example 5.
Although the present invention is disclosed as above with preferred embodiment, it is not for limiting the present invention, any this area
Technical staff without departing from the spirit and scope of the present invention, may be by the methods and technical content of the disclosure above to this hair
Bright technical solution makes possible variation and modification, therefore, every content without departing from technical solution of the present invention, according to the present invention
Any simple modifications, equivalents, and modifications made to above example of technical spirit, belong to technical solution of the present invention
Protection domain.
Claims (18)
- A kind of 1. variation of technological process, based on modification application at least once, it is characterised in that including：Chipset is carried out in advance in batches, to obtain some chip batches；The chip batch of the applicable modification application is selected according to current modification application, the chip of the chip batch includes Benchmark chip, the chip batch include the chip batch of the first change grade and the chip batch of the second change grade, and institute State and select the chip batch of the applicable modification application to include according to current modification application：Search ongoing modification application It is single；Detect the whether applicable ongoing modification application list of this chip batch：When this described chip batch is first The chip batch of grade is changed, checks whether this chip batch has been applied in other modification application lists：If then replace Next chip batch continues to detect or waits this chip batch in other modification application lists using finishing, if otherwise selection is originally Secondary chip batch is the chip batch of the applicable modification application；When this described chip batch is the second change grade Chip batch, select chip batch of this chip batch for the applicable modification application；Change chip of the selection in addition to the benchmark chip from the chip batch of the selected applicable modification application, To obtain chipset result in batches；Based on the chipset, result performs the technological process in batches.
- 2. the variation of technological process as claimed in claim 1, it is characterised in that the wafer batch of the first change grade Secondary to be only applicable in a modification application at the same time, the chip batch of the second change grade can be applicable in multiple modification application at the same time.
- 3. the variation of technological process as claimed in claim 1, it is characterised in that the benchmark chip of the chip batch is Selected based on random algorithm from the chip batch.
- 4. the variation of technological process as claimed in claim 1, it is characterised in that selected change chip has the piece number Limitation, the selection the piece number of the change chip are based on input the piece number.
- 5. the variation of technological process as claimed in claim 4, it is characterised in that selected change chip is based on described Input the piece number is automatically selected or artificial selection.
- 6. the variation of technological process as claimed in claim 1, it is characterised in that described to be tied in batches based on the chipset Fruit, which performs the technological process, to be included：Update and preserve the technological process parameter that chip is changed in the chip batch；The chip batch is carried to respective board respectively；According to each chip of chip batch described in the technological process parameter configuration of each chip；Each chip of chip batch is set to be in working condition.
- 7. the variation of technological process as claimed in claim 6, it is characterised in that described to remove the chip batch respectively Being transported to respective board includes：Based on the chipset in batches as a result, pair list that performs corresponding with the modification application provides in batches The chip batch of required execution.
- A kind of 8. variation of technological process, based on modification application at least once, it is characterised in that including：Chipset is carried out in advance in batches, to obtain some chip batches；The chip batch of the applicable modification application is selected according to current modification application, the chip of the chip batch includes Benchmark chip and the chip of the applicable modification application, the chip batch include the chip batch and the of the first change grade The chip batch of two change grades, and the current modification application of the basis selects the chip batch of the applicable modification application Including：Search ongoing modification application list；Detect the whether applicable ongoing modification application list of this chip batch： When the chip batch that this described chip batch is the first change grade, check whether this chip batch has been applied to other In modification application list：If then replace next chip batch to continue to detect or wait this chip batch in other modification application lists Middle application finishes, if otherwise selecting chip batch of this chip batch for the applicable modification application；When described Secondary chip batch is the chip batch of the second change grade, selects this chip batch as the applicable modification application Chip batch；Select to become from the chip of the applicable modification application of the chip batch of the selected applicable modification application More chip, to obtain chipset result in batches；Based on the chipset, result performs the technological process in batches.
- 9. the variation of technological process as claimed in claim 8, it is characterised in that the wafer batch of the first change grade Secondary to be only applicable in a modification application at the same time, the chip batch of the second change grade can be applicable in multiple modification application at the same time；Chip includes the chip of the first change grade in addition to the benchmark chip in the chip batch of the second change grade With the chip of the second change grade, the chip of the first change grade can only be applicable in a modification application at the same time, and described second The chip of change grade can be applicable in multiple modification application at the same time.
- 10. the variation of technological process as claimed in claim 9, it is characterised in that when the applicable change Shen Chip batch please is the chip batch of the first change grade, and the chip of the applicable modification application is the chip batch In chip in addition to the benchmark chip；When the chip batch of the applicable modification application is the second chip batch for changing grade：It is described applicable described if chip is the first chip for changing grade in addition to the benchmark chip in the chip batch The chip of modification application in addition to the benchmark chip, be not applied to the chips of other modification applications；It is described applicable described if chip is the second chip for changing grade in addition to the benchmark chip in the chip batch The chip of modification application is the chip in addition to the benchmark chip.
- 11. the variation of technological process as claimed in claim 8, it is characterised in that the benchmark chip of the chip batch Selected based on random algorithm from the chip batch.
- 12. the variation of technological process as claimed in claim 8, it is characterised in that selected change chip has piece Number limitation, the selection the piece number of the change chip are based on input the piece number.
- 13. the variation of technological process as claimed in claim 12, it is characterised in that selected change chip is based on institute Input the piece number is stated to be automatically selected or artificial selection.
- 14. the variation of technological process as claimed in claim 8, it is characterised in that described to be based on the chipset in batches As a result performing the technological process includes：Update and preserve the technological process parameter of chip in the change chip batch；The chip batch is carried to respective board respectively；According to each chip of chip batch described in the technological process parameter configuration of each chip；Each chip of chip batch is set to be in working condition.
- 15. the variation of technological process as claimed in claim 14, it is characterised in that described to distinguish the chip batch Being carried to respective board includes：Based on the chipset in batches as a result, pair in batches perform corresponding with the modification application singly carries For the chip batch of required execution.
- A kind of 16. variation of technological process, based on modification application at least once, it is characterised in that including：Chipset is carried out in advance in batches, to obtain some chip batches；The type of the chip batch includes the chip batch of the first change grade, the chip batch and the 3rd of the second change grade The chip batch of grade is changed, the type based on the chip batch is selected from the chip batch of the applicable modification application Change chip, to obtain chipset in batches as a result, when current wafer batch for described first change grade chip batch, it is described The chip batch of the applicable modification application and the selection course of change chip include：Search all ongoing modification applications It is single, check whether current wafer batch has been used in other modification application lists, if used, remind user to go more Change chip batch or wait and make choice change chip again after the completion of other modification application lists of this chip batch；When current wafer batch for described second change grade chip batch, the chip batch of the applicable modification application and The selection course of change chip includes：All ongoing modification application lists are searched, check that the chip of current wafer batch is becoming Service condition in more request slip, i.e. which chip are used by other modification application lists, which chip is not become by other More request slip uses, which chip is benchmark chip；The chip number inputted further according to user, from other changes of present lot In the chip that more request slip uses, suitable chip is selected as change chip；When current wafer batch for the described 3rd change grade chip batch, the chip batch of the applicable modification application and The selection course of change chip includes：Check the benchmark chip that current wafer batch defines, the change needed further according to user is brilliant The number of piece, in all available chips from the chip in addition to benchmark chip, selects suitable change chip；Based on institute Stating chipset, result performs the technological process in batches.
- 17. a kind of method that technological process to change is monitored, it is characterised in that including：Variation based on claim 1 to 16 any one of them technological process performs technological process；Obtain in the technological process implementation procedure chipset in batches result and with the benchmark chip in the chip batch and change More chip relevant information；By the Parameters variation of the benchmark chip compared with changing the Parameters variation of chip, with the technique stream to the change Journey is monitored.
- 18. the method that the technological process to change is monitored as claimed in claim 17, it is characterised in that further include：Gather the WAT test datas and CP test datas in the technological process implementation procedure；Parameters variation and the Parameters variation of change chip based on the WAT test datas, CP test datas and benchmark chip Comparative result obtains the change conclusion of the technological process of the change；The change conclusion of the technological process of the change is fed back to the technological process of the change.
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| CN1855358A (en) * | 2005-04-18 | 2006-11-01 | 力晶半导体股份有限公司 | Reserved chip batching method and system for computer |
| CN1975616A (en) * | 2005-11-29 | 2007-06-06 | 台湾积体电路制造股份有限公司 | Wafer-based planning methods and systems |
| CN103425066A (en) * | 2013-08-02 | 2013-12-04 | 上海华力微电子有限公司 | Wafer batch operation dynamic processing system and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1855358A (en) * | 2005-04-18 | 2006-11-01 | 力晶半导体股份有限公司 | Reserved chip batching method and system for computer |
| CN1975616A (en) * | 2005-11-29 | 2007-06-06 | 台湾积体电路制造股份有限公司 | Wafer-based planning methods and systems |
| CN103425066A (en) * | 2013-08-02 | 2013-12-04 | 上海华力微电子有限公司 | Wafer batch operation dynamic processing system and method |
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