CN104726033A - Hot-press bonding splice - Google Patents
Hot-press bonding splice Download PDFInfo
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- CN104726033A CN104726033A CN201410791201.8A CN201410791201A CN104726033A CN 104726033 A CN104726033 A CN 104726033A CN 201410791201 A CN201410791201 A CN 201410791201A CN 104726033 A CN104726033 A CN 104726033A
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Abstract
The invention relates to a hot-press bonding splice 100 for LCD module adhesive bonding technology. The hot-press bonding splice 100 comprises a base layer 110 formed by polyimide or Poly(ethylene naphthalate), a bottom coating layer 120 coating the top surface of the base layer 110, and a terminal conductive silicone layer 120 coating the top surface of the bottom coating layer 120. According to the invention, the bottom coating layer is coated in order to enhance interlayer chemical bonding intensity and prevent delamination for multi-time compression. Further, a fluorosilicone layer is used for maximizing a demolding effect between the sheet and a film pasted on the sheet.
Description
Invention field
The present invention relates to and be hot bonding sheet.More specifically, the present invention relates to and be hot bonding sheet for bonding LCD module.
Background technology
In LCD (liquid-crystal display) module technique for sticking, be hot bonding sheet be between the bonding working life of being undertaken by ACF jointing machine by apply heat and pressure uniform transfer heat conductive sheet.
In the manufacturing process of LCD, this sheet that is hot bonding is widely used in having the electrical contact between the TCP (carrier package) of film-type driving circuit and LCD or joint.In this case, anisotropic conductive film (ACF) is mainly used to being hot bonding sheet.
The example being hot bonding sheet is tetrafluoroethylene (PTFE) film, is also referred to as " Teflon " sheet material.Tetrafluoroethylene (PTFE) film is excellent in thermal distoftion temperature and anisotropy, but has leafing with having problem, and this makes to realize it and reuses, that is, repeatedly compress, ultimately increase the production cost of LCD.
The manufacturing process of LCD is roughly divided into OLB technique, PCB technology, COG technique etc.Tetrafluoroethylene (PTFE) film does not carry out suitable design for various technique, thus cannot be applicable to various technique.In addition, PTFE film has poor dimensional stability due to its elongation of about 300%, make it cannot apply tension force uniformly, and center is tending towards sagging when it has larger width.Due to this reason, PTFE film cannot be used for the LCD of large width.
On the other hand, the patented technology in association area proposes the silicon rubber sheet material of hot pressing wiring for Electrical and Electronic parts and technique for sticking.Described silicon rubber sheet material is prepared by following process: I) on the side of substrate cloth (it is the woven fiber glass being filled with silicone resin), be coated with thermally conductive silicone rubber; To the opposite side silicon-coating protective layer of described substrate cloth; Or II) on the side of described substrate cloth, be coated with thermally conductive silicone rubber layer; Silicon-coating protective layer again on thermally conductive silicone rubber layer; Or III) on the side of substrate cloth, be coated with thermally conductive silicone rubber layer; Silicon-coating protective layer again on thermally conductive silicone rubber layer; Silicon-coating protective layer on the opposite side of substrate cloth; Or IV) silicon-coating protective layer on the side of thermally conductive silicone rubber layer; Or V) on the either side of substrate cloth, be coated with thermally conductive silicone rubber layer respectively, and on each thermally conductive silicone rubber layer silicon-coating protective layer (see patent documentation 1) again.
[prior art document]
No. 2012-0040668, [patent documentation 1] Korean Patent No
Summary of the invention
In order to solve the problem of prior art, the object of this invention is to provide one and be hot bonding sheet, it has the higher interlayer Chemical bond intensity being suitable for LCD module technique, even if also can not cause leafing when reusing thus, and it has excellent numerical value in thermotolerance and weather resistance.
According to the first illustrative embodiments of the present invention, in order to realize object of the present invention, providing one and being hot bonding sheet, it, for being hot bonding sheet 100, comprising: the basic unit 110 be made up of polyimide or PEN; Be applied to the undercoat 120 of the end face of described basic unit 110; With the thermal conductivity layer of silicone 130 of end face being applied to described undercoat 120.
According to the second illustrative embodiments of the present invention, in order to realize object of the present invention, provide one and be hot bonding sheet, its for for LDC module bonding be hot bonding sheet 200, described in be hot bonding sheet 200 and comprise: the basic unit 210 be made up of polyimide or PEN; Be applied to the end face of described basic unit 210 and the undercoat 220 and 230 of bottom surface respectively; And be applied to the thermal conductivity layer of silicone 240 and 250 of the end face of described undercoat 220 and the bottom surface of described undercoat 230 respectively.
In this regard, basic unit 110 and 210 can process with plasma body from the teeth outwards.
In addition, thermal conductivity layer of silicone 130,240 and 250 can comprise at least one additive in the group being selected from and being made up of graphite, Graphene, copper, aluminium, aluminium nitride, boron nitride, silicon nitride and hybrid material.
In addition, be hot bonding sheet described in and can comprise the additional fluorosilicone layer 140,260 and 270 being applied to the side of described thermal conductivity layer of silicone 130,240 and 250 further.
In addition, fluorosilicone layer 140,260 and 270 can comprise at least one additive in the group being selected from and being made up of tetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP) multipolymer, perfluoro alkoxy (PFA) and ethylene-tetrafluoroethylene (ETFE) as fluorine releasing agent.
In addition, thermal conductivity layer of silicone 130,240 and 250 can contain static inhibitor.
In addition, thermal conductivity layer of silicone 130,240 and 250 can be made up of metal chlorosilane or chlorosilane.
In addition, the thickness that sheet can have 0.03mm ~ 5mm is hot bonding described in.
the effect of invention
According to the present invention, use undercoat or plasma body with Chemical bond intensity between enhancement layer, even if its after repeated also can preventing layer from generation, and repeatedly to compress, the final production cost reducing LCD.In addition, thermal conductivity layer of silicone contains additive, such as graphite, Graphene, copper, aluminium, aluminium nitride, boron nitride, silicon nitride or hybrid material (being coated with high heat radiating metal), to realize excellent thermotolerance and weather resistance.In addition, fluorosilicone layer is used to be maximized by the stripping result between sheet material and the film adhering to described sheet material.In addition, static inhibitor is added, to prevent the electronic unit be arranged on LCD and TCP to be subject to the infringement of the electrostatic accumulated during being hot bonding process to thermal conductivity layer of silicone.
Accompanying drawing explanation
Fig. 1 is the figure that be hot bonding the layer structure of sheet of display according to the first illustrative embodiments of the present invention.
Fig. 2 is the figure that be hot bonding the layer structure of sheet of display according to the second illustrative embodiments of the present invention.
Embodiment
Hereinafter, with reference to the accompanying drawings the preferred embodiment of the present invention is described in detail.In addition, in the following description of the present invention, when theme of the present invention may be made quite not know, the detailed description being incorporated to known function herein and configuration will be omitted.
Fig. 1 is the figure that be hot bonding the layer structure of sheet of display according to the present invention first illustrative embodiments, Fig. 2 is the figure that be hot bonding the layer structure of sheet of display according to the present invention second illustrative embodiments.
The sheet that is hot bonding of the present invention has following technological concept, and it has the interlayer Chemical bond intensity strengthened for being suitable for LCD module technique for sticking, and shows excellent thermotolerance and weather resistance thus, enables repeatedly to use.
As shown in Figure 1, in order to desirably for LCD module technique for sticking, the sheet 100 that is hot bonding according to the first illustrative embodiments of the present invention is made up of basic unit 110, undercoat 120, thermal conductivity layer of silicone 130 and fluorosilicone layer 140.
Basic unit 110 as substrate layer can be made up of polyimide or PEN.
To the end face painting bottom coating 120 of basic unit 110, to strengthen interfacial bonding strength, thus can repeatedly compress.
To the end face coating thermal conductivity layer of silicone 130 of undercoat 120.
Fluorosilicone layer 140 containing fluorine releasing agent so that by stripping result maximization, and is applied to the end face of thermal conductivity layer of silicone 130.
The example of fluorine releasing agent can comprise tetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP) multipolymer, perfluoro alkoxy (PFA), ethylene-tetrafluoroethylene (ETFE) etc., and they are all excellent in chemical resistant properties.
As shown in Figure 2, in order to desirably for LCD module technique for sticking, the sheet 200 that is hot bonding according to the second illustrative embodiments of the present invention is made up of basic unit 210, undercoat 220 and 230, thermal conductivity layer of silicone 240 and 250 and fluorosilicone layer 140,260 and 270.
Basic unit 210 as substrate layer can be made up of polyimide or PEN.
Respectively to end face and the bottom-surface coated undercoat 220 and 230 of basic unit 210, to strengthen interfacial bonding strength, thus can repeatedly compress.
Respectively to the end face of undercoat 220 and the bottom-surface coated thermal conductivity layer of silicone 240 and 250 of undercoat 230.
Fluorosilicone layer 260 and 270 containing fluorine releasing agent so that by stripping result maximization, and is applied to the end face of thermal conductivity layer of silicone 240 and the bottom surface of thermal conductivity layer of silicone 250 respectively.
The example of fluorine releasing agent can comprise tetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP) multipolymer, perfluoro alkoxy (PFA), ethylene-tetrafluoroethylene (ETFE) etc., and they are all excellent in chemical resistant properties.
On the other hand, the sheet 100 and 200 that is hot bonding of the present invention can have surface with plasma treated basic unit 110 and 210, thus strengthens interfacial bonding strength further.
In addition, thermal conductivity layer of silicone 130,240 and 250 can contain high heat sink material, such as graphite, Graphene, copper, aluminium, aluminium nitride, boron nitride, silicon nitride or hybrid material (being coated with high heat radiating metal) etc., to strengthen thermotolerance and weather resistance.Dispersed in order in thermal conductivity layer of silicone, high heat sink material preferably has micron-sized granularity.
Preferably, thermal conductivity layer of silicone 130,240 and 250 contains static inhibitor, to prevent the electronic unit be arranged on LCD and TCP to be subject to the infringement of the electrostatic accumulated during being hot bonding process.
Specifically, thermal conductivity layer of silicone 130,240 and 250 can be made up of silicone, such as metal chlorosilane, chlorosilane etc.
Preferably, be of the present inventionly hot bonding the thickness that sheet 100 and 200 has about 0.03mm ~ 5mm, make any other form that it can be made form of film or provide buffering effect rightly.
As mentioned above, sheet 100 and 200 undercoat or the Cement Composite Treated by Plasma of being hot bonding of the present invention is with Chemical bond intensity between enhancement layer, even if its after repeated also preventing layer from generation, and can repeatedly to compress thus, the final production cost reducing LCD.
In addition, thermal conductivity layer of silicone 130,240 and 250 is containing additive, and such as graphite, Graphene, copper, aluminium, aluminium nitride, boron nitride, silicon nitride or hybrid material (being coated with high heat radiating metal) are to realize excellent thermotolerance and weather resistance.
In addition, fluorosilicone layer 140,260 and 270 is coated with to be maximized by the stripping result between sheet material 100 and 200 and the film adhering to described sheet material.
In addition, thermal conductivity layer of silicone 130,240 and 250 contains static inhibitor, to prevent the infringement being arranged on the electrostatic that the electronic unit on LCD and TCP is accumulated.
For reference, the sheet 100 and 200 that is hot bonding of the present invention can be used for LCD module technique (such as, PCB is bonding, OLB is bonding and COG bonding) and is applicable to the products such as such as TV, watch-dog, notebook computer, panel computer, PDP.
Above description of the present invention provides for the purpose of illustration and description, and it is not intended to carry out limit or limit the invention to disclosed precise forms, obviously can have multiple amendment and modification according to above-mentioned instruction.
Select and describe embodiment to explain principle of the present invention and practical application thereof best, thus the utilization enabling others skilled in the art best is suitable for the various embodiment of the concrete purposes imagined and has the present invention of various remodeling.Although the present invention discloses with reference to its preferred implementation, after reading this specification sheets, one skilled in the art will recognize that, when not departing from the scope and spirit of above-mentioned and claimed hereinafter of the present invention protection, can carry out changing and revising.Scope of the present invention should be limited by claims.
100,200: be hot bonding sheet
110,210: basic unit
120,220,230: undercoat
130,240,250: thermal conductivity layer of silicone
140,260,270: fluorosilicone layer
Claims (9)
1. be hot bonding a sheet, it comprises:
The basic unit (110) be made up of polyimide or PEN;
Be applied to the undercoat (120) of the end face of described basic unit (110); With
Be applied to the thermal conductivity layer of silicone (130) of the end face of described undercoat (120).
2. be hot bonding sheet as claimed in claim 1, wherein, described in be hot bonding sheet (200) bonding for LCD module, and to comprise:
The basic unit (210) be made up of polyimide or PEN;
Be applied to the end face of described basic unit (210) and the undercoat (220 and 230) of bottom surface respectively; And
Be applied to the end face of described undercoat (220 and 230) and the thermal conductivity layer of silicone (240 and 250) of bottom surface respectively.
3. be hot bonding sheet as claimed in claim 1 or 2, wherein, described basic unit (110 and 210) is from the teeth outwards with plasma treated.
4. be hot bonding sheet as claimed in claim 1 or 2, wherein, described thermal conductivity layer of silicone (130,240 and 250) comprises at least one additive in the group being selected from and being made up of graphite, Graphene, copper, aluminium, aluminium nitride, boron nitride, silicon nitride and hybrid material.
5. be hot bonding sheet as claimed in claim 1 or 2, it comprises further:
The additional fluorosilicone layer (140,260 and 270) being applied to the side of described thermal conductivity layer of silicone (130,240 and 250).
6. be hot bonding sheet as claimed in claim 5, wherein, described fluorosilicone layer (140,260 and 270) comprises at least one additive in the group being selected from and being made up of tetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP) multipolymer, perfluoro alkoxy (PFA) and ethylene-tetrafluoroethylene (ETFE) as fluorine releasing agent.
7. be hot bonding sheet as claimed in claim 1 or 2, wherein, described thermal conductivity layer of silicone (130,240 and 250) is containing static inhibitor.
8. be hot bonding sheet as claimed in claim 1 or 2, wherein, described thermal conductivity layer of silicone (130,240 and 250) is made up of metal chlorosilane or chlorosilane.
9. be hot bonding sheet as claimed in claim 5, wherein, described in be hot bonding the thickness that sheet has 0.03mm ~ 5mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0160014 | 2013-12-20 | ||
| KR20130160014 | 2013-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104726033A true CN104726033A (en) | 2015-06-24 |
| CN104726033B CN104726033B (en) | 2017-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410791201.8A Active CN104726033B (en) | 2013-12-20 | 2014-12-18 | Hot-press bonding splice |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109880542A (en) * | 2019-03-11 | 2019-06-14 | 江苏斯迪克新材料科技股份有限公司 | A kind of ultra-thin one-faced tapes and double faced adhesive tape of High directional thermal conductivity |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1497035A (en) * | 2002-10-04 | 2004-05-19 | ��Խ��ѧ��ҵ��ʽ���� | Heat-conduction silicon rubber compound sheet |
| CN102529230A (en) * | 2010-10-19 | 2012-07-04 | 信越化学工业株式会社 | Silicon rubber sheet for thermal compression and method for joining electrical and/or electronic device members |
-
2014
- 2014-12-18 CN CN201410791201.8A patent/CN104726033B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1497035A (en) * | 2002-10-04 | 2004-05-19 | ��Խ��ѧ��ҵ��ʽ���� | Heat-conduction silicon rubber compound sheet |
| CN102529230A (en) * | 2010-10-19 | 2012-07-04 | 信越化学工业株式会社 | Silicon rubber sheet for thermal compression and method for joining electrical and/or electronic device members |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109880542A (en) * | 2019-03-11 | 2019-06-14 | 江苏斯迪克新材料科技股份有限公司 | A kind of ultra-thin one-faced tapes and double faced adhesive tape of High directional thermal conductivity |
| CN109880542B (en) * | 2019-03-11 | 2021-06-01 | 江苏斯迪克新材料科技股份有限公司 | Directional high-heat-conduction ultrathin single-sided adhesive tape and double-sided adhesive tape |
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| Publication number | Publication date |
|---|---|
| CN104726033B (en) | 2017-04-12 |
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