CN107471783A - A kind of hot pressing buffer substrate tablet and preparation method thereof - Google Patents

A kind of hot pressing buffer substrate tablet and preparation method thereof Download PDF

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Publication number
CN107471783A
CN107471783A CN201710610621.5A CN201710610621A CN107471783A CN 107471783 A CN107471783 A CN 107471783A CN 201710610621 A CN201710610621 A CN 201710610621A CN 107471783 A CN107471783 A CN 107471783A
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Prior art keywords
fiber
sticker
fabric
glass
teflon
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CN201710610621.5A
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Chinese (zh)
Inventor
贾忠杰
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SUZHOU ZHONGLEXIN MATERIAL TECHNOLOGY Co Ltd
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SUZHOU ZHONGLEXIN MATERIAL TECHNOLOGY Co Ltd
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Priority to CN201710610621.5A priority Critical patent/CN107471783A/en
Publication of CN107471783A publication Critical patent/CN107471783A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/10—Layered products comprising a layer of natural or synthetic rubber next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M10/00—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements
    • D06M10/02—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements ultrasonic or sonic; Corona discharge
    • D06M10/025—Corona discharge or low temperature plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

Abstract

The invention discloses a kind of hot pressing buffer substrate tablet and preparation method thereof, the hot pressing buffer substrate tablet and preparation method thereof includes Teflon glass-fiber-fabric, sticker and heat conduction silicone, Teflon glass-fiber-fabric surface scribbles sticker, and sticker forms adhesion coating, and the sticker is made up of the material of following mass fraction：Organic-silicon-modified silicon resin 30~40%, silane coupler 30~40%, organic solvent 10~20% and liquid refractory agent 10~20%, heat conduction silicone is provided with adhesion coating, the heat conduction silicone is kneaded and is made by the heat conductive silica gel, 0.2~3% A/B platinums vulcanizing agent or double 24 or the 1~5% of 1~5% double 25,5~30% conducting resinl or 5~30% conductive powders, 2~5% CNT, nano-titanium oxide and silica gel wetting agent that mass fraction is 100%.By the above-mentioned means, the present invention has good heat resistance, wire-conducting performance and release, delamination, service life length are not easy.

Description

A kind of hot pressing buffer substrate tablet and preparation method thereof
Technical field
The present invention relates to LCD, LED, TCP Bonding, PCB Bonding, the fender in the processing procedure such as PWB Bonding Material, more particularly to a kind of hot pressing buffer substrate tablet and preparation method thereof.
Background technology
Hot pressing buffer substrate tablet, it is mainly used in LCD, LED, TCP Bonding, PCB (Printed Circuit Board) On Bonding, PWB (Printed Wiring Board) Bonding processing procedure, buffering in the hot pressing as anisotropic conductive film Use, (a kind of electrically conductive microparticle of anisotropy conductive film is evenly distributed on adhesive films therein), it is therefore intended that by thermal head High temperature, which conducts, to be softened it to ACF and produces adhesion effect, and the contact padded coaming as thermal head, traditional hot pressing are delayed Rush material and be generally adopted by heat-conducting silica gel sheet as padded coaming, its shortcoming is to be not easy to leave type after height press against easily by silicon For glue residua on product, the low easily Qi of its tensile strength is broken and press against that number is low typically to press against number 3 to 15 times or so, Low production efficiency on module, PCB processing procedure.
The content of the invention
The present invention solves the technical problem of a kind of hot pressing buffer substrate tablet and preparation method thereof is provided, there is well resistance to Hot, wire-conducting performance and release, it is not easy delamination, service life length.
In order to solve the above technical problems, one aspect of the present invention is：A kind of hot pressing buffer substrate tablet, the heat are provided Pressure buffering includes Teflon glass-fiber-fabric, sticker and heat conduction silicone, and the thickness of the Teflon glass-fiber-fabric is 0.1~3.0mm, Width is 1.5~4.0mm, and Teflon glass-fiber-fabric surface scribbles sticker, and sticker forms adhesion coating, and the sticker is by following The material of mass fraction is made：Organic-silicon-modified silicon resin 30~40%, silane coupler 30~40%, organic solvent 10~ 20% and liquid refractory agent 10~20%, liquid refractory agent is used to increase the continuous temperature tolerance that finished product is made, and is provided with adhesion coating Heat conduction silicone, the heat conduction silicone is by heat conductive silica gel of the mass fraction for 100%, 0.2~3% A/B platinum vulcanizing agents Or 1~5% double 24 or 1~5% double 25,5~30% conducting resinl or 5~30% conductive powders, 2~5% receive Rice carbon pipe, nano-titanium oxide and silica gel wetting agent, which are kneaded, to be made.
A kind of preparation method of hot pressing buffer substrate tablet, it is characterised in that：Comprise the following steps that：
(1) Teflon glass-fiber-fabric is subjected to Surface Treatment with Plasma：Teflon glass-fiber-fabric is placed at plasma surface In reason machine, Surface Treatment with Plasma machine carries out certain physical and chemical modified to Teflon glass-fiber-fabric, removes Teflon glass-fiber-fabric The poly- four ethene release layer in surface, Teflon glass-fiber-fabric surface adhesion force is improved, be easier sticker be bonded with its, solved follow-up It is to be not easy delamination to meet high temperature, and enters drying tunnel and carry out drying and processing 2-15 minutes, treats that Teflon glass-fiber-fabric surface black occurs and showed During as producing, drying tunnel temperature is 30~150 DEG C；
(2) the Teflon glass-fiber-fabric after Surface Treatment with Plasma is subjected to sticker coating processing：Sticker is applied to spy The surface that fluorine dragon glass-fiber-fabric plasma treatment is crossed, sticker is placed into sticker groove, is upper and lower two above sticker groove Roller, the roller portion of lower section are immersed in sticker, and the Teflon glass after Surface Treatment with Plasma is laid on coating machine simultaneously Through the gap location of upper and lower two rollers, processing is dried subsequently into drying tunnel progress 3-15 minutes, drying tunnel temperature is 30~150 ℃；
(3) it is 100% heat conductive silica gel by mass fraction, 0.2~3% A/B platinums vulcanizing agent or double the two of 1~5% Four or 1~5% double 25,5~30% conducting resinl or 5~30% conductive powders, 2~5% CNT, nano oxidized Titanium and silica gel wetting agent, which are kneaded, is made heat conduction silicone, and CNT is used for the static value for improving product surface and reduction is led The charging quantity of electric glue, nano-titanium oxide are used for increasing intensity, prevent that product has dust releasing after being fabricated to finished product, heat conductive silica gel fills Fill out thing to be not easy that processing is made, silica gel wetting agent makes its softening, facilitates subsequent production to reduce bad generation more；
(4) the Teflon glass that the heat conduction silicone that step (3) is obtained treats with step (2) is arranged in into drying to prolong Carry out prolonging pressure, drying Combined Processing in pressure equipment.
Compared with prior art, the beneficial effects of the invention are as follows：With good heat resistance, wire-conducting performance and release, no Easy delamination, service life length.
Brief description of the drawings
Fig. 1 is a kind of structural representation of hot pressing buffer substrate tablet.
In figure：1st, heat conduction silicone；2nd, Teflon glass-fiber-fabric；3 adhering agent layers
Embodiment
Present pre-ferred embodiments are described in detail below in conjunction with the accompanying drawings, so as to can be more easy to feature the advantages of invention In being readily appreciated by one skilled in the art, apparent clearly defined so as to be made to protection scope of the present invention.
Referring to Fig. 1, the embodiment of the present invention includes：
Specific embodiment one:
A kind of hot pressing buffer substrate tablet, hot pressing buffering include Teflon glass-fiber-fabric, sticker and heat conduction silicone, the Teflon The thickness of imperial glass-fiber-fabric is 0.5mm, width 10mm, and Teflon glass-fiber-fabric surface scribbles sticker, and sticker forms adhesion coating, The sticker is made up of the material of following mass fraction：Organic-silicon-modified silicon resin 40%, silane coupler 40%, You Jirong Agent 10% and liquid refractory agent 10%, liquid refractory agent are used to increase the continuous temperature tolerance that finished product is made, are provided with and lead on adhesion coating Hot layer of silica gel, the heat conduction silicone are 100% heat conductive silica gel, 0.2% A/B platinums vulcanizing agent, 20% by mass fraction Conducting resinl, 5% CNT, nano-titanium oxide and silica gel wetting agent be kneaded and be made.
A kind of preparation method of hot pressing buffer substrate tablet, it is characterised in that：Comprise the following steps that：
(1) Teflon glass-fiber-fabric is subjected to Surface Treatment with Plasma：Teflon glass-fiber-fabric is placed at plasma surface In reason machine, Surface Treatment with Plasma machine carries out certain physical and chemical modified to Teflon glass-fiber-fabric, removes Teflon glass-fiber-fabric The poly- four ethene release layer in surface, Teflon glass-fiber-fabric surface adhesion force is improved, be easier sticker be bonded with its, solved follow-up It is to be not easy delamination to meet high temperature, and enters drying tunnel and carry out drying and processing 2-15 minutes, treats that Teflon glass-fiber-fabric surface black occurs and showed During as producing, drying tunnel temperature is 100 DEG C；
(2) the Teflon glass-fiber-fabric after Surface Treatment with Plasma is subjected to sticker coating processing：Sticker is applied to spy The surface that fluorine dragon glass-fiber-fabric plasma treatment is crossed, carry out drying within 10 minutes processing subsequently into drying tunnel, drying tunnel temperature is 100 DEG C；
(3) it is 100% heat conductive silica gel, 0.2% A/B platinums vulcanizing agent, 20% conducting resinl, 5% by mass fraction CNT, nano-titanium oxide and silica gel wetting agent be kneaded and be made；
(4) the Teflon glass that the heat conduction silicone that step (3) is obtained treats with step (2) is arranged in into drying to prolong Carry out prolonging pressure, drying Combined Processing in pressure equipment.
Specific embodiment two:
A kind of hot pressing buffer substrate tablet, hot pressing buffering include Teflon glass-fiber-fabric, sticker and heat conduction silicone, the Teflon The thickness of imperial glass-fiber-fabric is 0.15~2.0mm, and width is 2~1350mm, and Teflon glass-fiber-fabric surface scribbles sticker, sticker Adhesion coating is formed, the sticker is made up of the material of following mass fraction：Organic-silicon-modified silicon resin 35%, silane coupler 35%th, organic solvent 20% and liquid refractory agent 10%, liquid refractory agent are used to increase the continuous temperature tolerance that finished product is made, adhesion coating On be provided with heat conduction silicone, the heat conduction silicone is by heat conductive silica gel that mass fraction is 100%, double 24, the 15% of 5% Conductive powder, 2% CNT, nano-titanium oxide and silica gel wetting agent are kneaded and are made.
A kind of preparation method of hot pressing buffer substrate tablet, it is characterised in that：Comprise the following steps that：
(1) Teflon glass-fiber-fabric is subjected to Surface Treatment with Plasma：Teflon glass-fiber-fabric is placed at plasma surface In reason machine, Surface Treatment with Plasma machine carries out certain physical and chemical modified to Teflon glass-fiber-fabric, removes Teflon glass-fiber-fabric The poly- four ethene release layer in surface, Teflon glass-fiber-fabric surface adhesion force is improved, be easier sticker be bonded with its, solved follow-up It is to be not easy delamination to meet high temperature, and enters drying tunnel and carry out drying and processing 2-15 minutes, treats that Teflon glass-fiber-fabric surface black occurs and showed During as producing, drying tunnel temperature is 130 DEG C；
(2) the Teflon glass-fiber-fabric after Surface Treatment with Plasma is subjected to sticker coating processing：Sticker is applied to spy The surface that fluorine dragon glass-fiber-fabric plasma treatment is crossed, carry out drying within 10 minutes processing subsequently into drying tunnel, drying tunnel temperature is 130 DEG C；
(3) by heat conductive silica gel, double 24, the 15% of 5% conductive powder, 2% nanometer that mass fraction is 100% Carbon pipe, nano-titanium oxide and silica gel wetting agent are kneaded and heat conduction silicone are made；
(4) the Teflon glass that the heat conduction silicone that step (3) is obtained treats with step (2) is arranged in into drying to prolong Carry out prolonging pressure, drying Combined Processing in pressure equipment.
Specific embodiment three:
A kind of hot pressing buffer substrate tablet, hot pressing buffering include Teflon glass-fiber-fabric, sticker and heat conduction silicone, the Teflon The thickness of imperial glass-fiber-fabric is 2.0mm, and width 500mm, Teflon glass-fiber-fabric surface scribbles sticker, sticker formation adhesion Layer, the sticker are made up of the material of following mass fraction：Organic-silicon-modified silicon resin 35%, silane coupler 35%, have Solvent 20% and liquid refractory agent 10%, liquid refractory agent are used to increase the continuous temperature tolerance that finished product is made, set on adhesion coating There is heat conduction silicone, the heat conduction silicone is by heat conductive silica gel of the mass fraction for 100%, 3% double 25,30% conducting powders Grain, 5% CNT, nano-titanium oxide and silica gel wetting agent, which are kneaded, to be made.
A kind of preparation method of hot pressing buffer substrate tablet, it is characterised in that：Comprise the following steps that：
(1) Teflon glass-fiber-fabric is subjected to Surface Treatment with Plasma：Teflon glass-fiber-fabric is placed at plasma surface In reason machine, Surface Treatment with Plasma machine carries out certain physical and chemical modified to Teflon glass-fiber-fabric, removes Teflon glass-fiber-fabric The poly- four ethene release layer in surface, Teflon glass-fiber-fabric surface adhesion force is improved, be easier sticker be bonded with its, solved follow-up It is to be not easy delamination to meet high temperature, and enters drying tunnel and carry out drying and processing 2-15 minutes, treats that Teflon glass-fiber-fabric surface black occurs and showed During as producing, drying tunnel temperature is 80 DEG C；
(2) the Teflon glass-fiber-fabric after Surface Treatment with Plasma is subjected to sticker coating processing：Sticker is applied to spy The surface that fluorine dragon glass-fiber-fabric plasma treatment is crossed, carry out drying within 10 minutes processing subsequently into drying tunnel, drying tunnel temperature is 80 DEG C；
(3) by heat conductive silica gel of the mass fraction for 100%, 3% double 25,30% conductive powder, 5% nano-sized carbons Pipe, nano-titanium oxide and silica gel wetting agent are kneaded and heat conduction silicone are made；
(4) the Teflon glass that the heat conduction silicone that step (3) is obtained treats with step (2) is arranged in into drying to prolong Carry out prolonging pressure, drying Combined Processing in pressure equipment.
A kind of hot pressing buffer substrate tablet of the present invention and preparation method thereof, has good heat resistance, wire-conducting performance and release, is not easy Delamination, service life length.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills Art field, is included within the scope of the present invention.

Claims (2)

1. a kind of hot pressing buffer substrate tablet, hot pressing buffering includes Teflon glass-fiber-fabric, sticker and heat conduction silicone, the Teflon The thickness of glass-fiber-fabric is 0.1~3.0mm, and width is 1.5~4.0mm, and Teflon glass-fiber-fabric surface scribbles sticker, dosage form of adhering Into adhesion coating, the sticker is made up of the material of following mass fraction：It is organic-silicon-modified silicon resin 30~40%, silane coupled Agent 30~40%, organic solvent 10~20% and liquid refractory agent 10~20%, heat conduction silicone is provided with adhesion coating, it is described Heat conduction silicone is by heat conductive silica gel that mass fraction is 100%, 0.2~3% A/B platinums vulcanizing agent or double the 24 of 1~5% Or 1~5% double 25,5~30% conducting resinl or 5~30% conductive powders, 2~5% CNT, nano-titanium oxide It is kneaded and is made with silica gel wetting agent.
A kind of 2. preparation method of hot pressing buffer substrate tablet, it is characterised in that：Comprise the following steps that：
(1) Teflon glass-fiber-fabric is subjected to Surface Treatment with Plasma：Teflon glass-fiber-fabric is placed into Surface Treatment with Plasma machine In, Surface Treatment with Plasma machine carries out certain physical and chemical modified to Teflon glass-fiber-fabric, removes Teflon glass-fiber-fabric surface Poly- four ethene release layer, Teflon glass-fiber-fabric surface adhesion force is improved, and enter drying tunnel and carry out drying and processing 2-15 minutes, treat spy When corrupted phenomena generation occurs in fluorine dragon glass-fiber-fabric surface, drying tunnel temperature is 30~150 DEG C；
(2) the Teflon glass-fiber-fabric after Surface Treatment with Plasma is subjected to sticker coating processing：Sticker is applied to Teflon The surface that glass-fiber-fabric plasma treatment is crossed, sticker is placed into sticker groove, is upper and lower two rollers above sticker groove, The roller portion of lower section is immersed in sticker, and the Teflon glass after Surface Treatment with Plasma is laid on coating machine and passed through upper The gap location of lower two rollers, processing is dried subsequently into drying tunnel progress 3-15 minutes, drying tunnel temperature is 30~150 DEG C；
(3) it is 100% heat conductive silica gel by mass fraction, 0.2~3% A/B platinums vulcanizing agent or double the 24 or 1 of 1~5% ~5% double 25,5~30% conducting resinl or 5~30% conductive powders, 2~5% CNT, nano-titanium oxide and Silica gel wetting agent is kneaded and heat conduction silicone is made；
(4) the Teflon glass that the heat conduction silicone that step (3) is obtained and step (2) treat is arranged in drying prolongs pressure and set Carry out prolonging pressure, drying Combined Processing on standby.
CN201710610621.5A 2017-07-25 2017-07-25 A kind of hot pressing buffer substrate tablet and preparation method thereof Withdrawn CN107471783A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110001164A (en) * 2019-04-14 2019-07-12 广州恒荣电子科技有限公司 A kind of high temperature resistant hot pressing padded coaming
CN112622370A (en) * 2020-12-25 2021-04-09 镇江中垒新材料科技有限公司 Silica gel glass fiber cloth hot-pressing buffer material and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110001164A (en) * 2019-04-14 2019-07-12 广州恒荣电子科技有限公司 A kind of high temperature resistant hot pressing padded coaming
CN112622370A (en) * 2020-12-25 2021-04-09 镇江中垒新材料科技有限公司 Silica gel glass fiber cloth hot-pressing buffer material and preparation method thereof

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Application publication date: 20171215