CN104704931B - The method and system of electric component and manufacture electric component - Google Patents
The method and system of electric component and manufacture electric component Download PDFInfo
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- CN104704931B CN104704931B CN201380052333.2A CN201380052333A CN104704931B CN 104704931 B CN104704931 B CN 104704931B CN 201380052333 A CN201380052333 A CN 201380052333A CN 104704931 B CN104704931 B CN 104704931B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0006—Electron-beam welding or cutting specially adapted for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of method manufacturing electric component (100) includes providing substrate (104), applying insulating layer (110) on substrate, apply circuit layer (112) on the insulating layer, with electron beam (114) irradiate insulating layer to convert insulating layer, and with electron beam irradiation circuit layer with conversion circuit layer.Substrate can be the metal substrate of high-termal conductivity.Insulating layer provides electrical isolation and effectively heat transfer between circuit layer and substrate.The method may include by light-emitting diode (LED) module (102) or need other active circuits of heat management to be connected to the circuit layer on electrical isolation/heat-conducting layer.
Description
Technical field
The theme of this paper relates in general to electric component and manufactures the method and system of electric component.
Background technique
Active electronic high-performance components, such as high-performance light emitting diode (LED) generate big calorimetric, and the heat must be sufficiently
It dissipates to operate normally on ground.In the case where LED, heat dissipation occurs on the rear side of the component, because of generated light
Emit from front side.
Conventional system provides heat dissipation using the radiator (for example, aluminium) for being deposited with organic insulator.Have for driving
The circuit of source electronic component is applied to the organic insulator.Organic insulator is (for example, added with particle to increase heat transfer
The epoxy resin of rate) radiator must be transferred heat to.Conventional insulation layer is problematic.For example, insulating layer needs to have foot
Enough breakdown voltages, sufficiently absolutely from voltage bearer circuit (in some instances, until the high pressure of 1000V size) by radiator
Edge.Compared with Conventional insulation device, small breakdown voltage is typically presented in organic insulator.Need thicker organic insulator with reality
So as to cause lower thermal conductivity and therefore existing breakdown voltage leads to the bad thermal coupling of radiator.
The circuit is applied to the conductive metal structure of insulating layer.The application of this layer is typically via deposition conductive gold
Belong to structure to complete, the deposition of conductive metal structure by using mask (for example, vacuum evaporation, sputtering, chemical vapour deposition,
Coating) either carried out by the way that metal paste or ink print are carried out subsequent heat treatment on substrate and then.These are often
Advising application process, there are problems.For example, the structure size (usually millimeter or bigger magnitude) of mask used is limited by gas
The minimum of the conductor metal structure for the deposition mutually realized can produce characteristic size, and the major part in material therefor will not be used
In actual coating, therefore must be recycled highly.In addition, the printing and structure that is routinely heat-treated is (for example, in baking oven
In) there is the undesirable feature of electrical property compared with pure metal because print request adds non-metallic additive, such as glue, it is viscous and
Agent (binder) adjusts the additive for printing required mobility.In hot subsequent processing (post-treatment), these
Additive is only partly removed from layer, causes coating with the coating with more high metal content (such as, close to pure metal
Those) are compared to bad electrical property.In addition, the thermal stress during deposition or during heat treatment is problematic.Certain methods,
Such as MID (molded-interconnect-device) and LDS (laser direct organization), uses the specialty polymer comprising metallic catalyst.?
This is expensive using proprietary material in the process, and the chemical coating processing can take a very long time.
Summary of the invention
Solution is provided by manufacturing the method for electric component as described herein.The method includes providing lining
Bottom applies insulating layer on substrate, by circuit layer application on the insulating layer, with electron beam irradiation insulating layer to convert insulation
Layer, and with electron beam irradiation circuit layer with conversion circuit layer.Substrate can be the metal substrate of high-termal conductivity.Insulating layer provides
Electrical isolation and effectively heat transfer between circuit layer and substrate.The method may include light-emitting diode (LED) module is connected to electricity
Road floor.
Detailed description of the invention
The citing description present invention with reference to the drawings, in figure:
Fig. 1 shows electric component, which is made to include the electronic module on substrate.
Fig. 2 shows the electric components electron beam to be radiated on electric component accoding to exemplary embodiment to be formed
System.
Fig. 3 shows the interaction of electron beam Yu electric component coating.
Fig. 4 shows the processing for being used to form electric component.
Fig. 5 shows the processing for being used to form electric component.
Fig. 6 shows the method for manufacture electric component.
Specific embodiment
Embodiment described herein includes the method for manufacturing electric component comprising: insulating layer and circuit are irradiated with electron beam
Layer is to convert the layer.Embodiment described herein includes irradiating the circuit layer on insulating layer and insulating layer using electron beam to convert
System of the layer to improve the one or more performances of the layer.Embodiment described herein includes having insulating layer and electricity
The electric component of road floor, the insulating layer and circuit layer are improved the property of the layer by the energy from electron beam by converting
Energy.Insulating layer deposition on substrate, and circuit layer deposition on the insulating layer.
Embodiment described herein may include the electric component of clad (metal clad) circuit board form, wherein electricity
Conductor forms circuit on circuit boards, and electric conductor passes through electron beam treatment.The circuit of clad circuit board is arranged in insulating layer
Between metal substrate.Insulating layer and electric conductor are irradiated with electron beam to convert the layer.
Embodiment described herein can form high-termal conductivity but the insulation of electrical isolation by using electron beam treatment technique
Layer.For example, heat can promptly (for example, in several microseconds) generate inside insulating layer, this can convert insulating layer, with solidification
The insulating layer.The heat can be used to melt or melt again the compound or material of some or all of insulating layer.At it
In its embodiment, the electronics of electron beam can be reacted with the material of insulating layer, to convert insulating layer.Some insulating layer materials can be with
It isolates and/or evaporates by electron beam during processing, formed with converting insulating layer.Material for insulating layer can choose for
It works together with electron beam treatment well.For example, glass or ceramic forming material may be used as insulation layer structure.Fine and close height
Thermal conductivity nanometer materials can be by being realized with electron beam treatment insulating layer.
Embodiment described herein can realize the electric conductor of high quality by using electron beam treatment technique.For example, heat can
Promptly to generate (for example, in microsecond) in circuit layer, this can improve the electrical property of circuit layer with conversion circuit layer.Institute
State some or all of compound or material that heat can be used to melt or melt circuit layer again.In other embodiments, electric
Electronics in beamlet can be reacted with circuit layer material, with conversion circuit layer.Some materials in circuit layer material can located
It is isolated and/or evaporates during reason, with conversion circuit composition of layer.Material for circuit layer can choose as well for electricity
Beamlet processing.For example, non-alloyed combine the metal structure that may be used as circuit layer.Hard high conductivity nano material can pass through
It is realized with electron beam processing circuit layer.
Embodiment described herein can provide circuit layer and electric conductor, wherein from paste or ink (to by circuit layer
Be applied on insulating layer) nonmetallic (for example, organic matter) material of substantially all remnants circuit layer the electron beam treatment phase
Between be removed.Treated (post-processed), and electric conductor can be close, non-porous metal coating.The circuit layer can
Initial concentration with nonmetallic materials (for example, bonding agent), the initial concentration are lower than, are even much lower than conventional paste (example
Such as, the paste handled in oven heat).The circuit layer can have the ultimate density of nonmetallic materials (for example, bonding agent), should
Ultimate density is lower than, even much lower than uses component made of conventional paste (for example, processing in oven heat).
Embodiment described herein can be improved or select control parameter, to realize the electric conductor of high quality.Electron beam with
The interaction of the coating and substrate of application can take in.Such as, it is contemplated that peace weighing apparatus includes ink or paste composition, print
Brush technology (for example, differential is matched, silk-screen printing, pad printing, ink jet printing, aerosol jet printing etc.) and/or electron beam water
The interaction of flat parameter.
The electric conductor that embodiment described herein produces, which can have to provide in the entire validity period of electric component, stablizes electromechanics
Characteristic needed for performance.For example, electric conductor can have low and stable contact resistance, good welding characteristic, excellent abrasive resistance
And/or the good tolerability for environmental degradation factor such as corrosive gas or high temperature exposure.Electron beam can be accurate
Control, to allow the high spatial resolution of electric conductor.The surface smoothness of electric conductor can pass through electron beam treatment and circuit layer
Material controls, to realize required characteristic.For example, electric conductor can have a coating quality appropriate, such as layer composition, film thickness,
Roughness, pattern, structure etc..
The electric conductor that embodiment described herein generates, which can have, to be provided the metal substrate that dissipates the heat into from circuit layer
Characteristic necessary to good thermal characteristic.Insulating layer can provide good insulation characteristic to provide enough breakdown voltages, to fill
Divide ground that metal substrate insulate from voltage bearer circuit layer.
Fig. 1 shows electric component 100, and electric component 100 is fabricated to the electronic module 102 including being located on substrate 104.
In the exemplary embodiment, electronic module 102 is light emitting diode (LED) module, and is hereinafter properly termed as LED module
102, still, other types of electronic module 102 or require other active circuits of heat management that can be installed to substrate 104.
In the exemplary embodiment, electronic module 102 is high-power component, such as high-capacity LED.The high power tends to generate
Heat, the heat need to be dissipated to protection electric component 100.In the exemplary embodiment, substrate 104 is metal substrate or dissipates
Hot device, with the heat from LED module 102 that dissipates.Electric component 100 is properly termed as clad circuit board, but other types
Electric component 100 method described herein and system can be used also to be made.
During processing, coating 106 is applied to the outer surface 108 of substrate 104.Any number of coating 106 can be applied
It is added to substrate 104.In an illustrated embodiment, coating 106 includes being applied to the insulating layer 110 of substrate 104 and being applied to insulation
The circuit layer 112 of layer 110.LED module 102 is installed to circuit layer 112.For example, LED module 102 can be soldered to circuit layer
112.Insulating layer 110 provides the electrical isolation between circuit layer 112 and substrate 104.In the exemplary embodiment, insulating layer
110 can be high-termal conductivity, to dissipate from circuit layer 112 and the corresponding LED module 102 for being installed to circuit layer 112
Heat.
In the exemplary embodiment, the electron beam 114 that coating 106 is generated by irradiation bomb 116 is handled.Optionally, two paintings
Layer 106 can be irradiated simultaneously by electron beam 114.For example, insulating layer 110 can be applied to substrate 104, then circuit layer 112 can
To be applied to insulating layer 110, latter two right layer 110,112 is illuminated.Alternatively, insulating layer 110 can be applied to substrate 104,
Then it is irradiated with electron beam 114.Circuit layer 112 is then applied to that treated insulating layer 110, is then irradiated with electron beam 114.
Optionally, electron beam can be used in nonadiabatic electron beam treatment technique.
Fig. 1 shows the electric component 100 of different phase or state in processing.For example, at 120, electrical part
The coating 106 of part 100 is illustrated at (pre-processing) state before processing.At 122, the coating of electric component 100
106 are illustrated at state in processing, and electron beam 114 is directed to coating 106 at this time.Electron beam 114 is at least partially through painting
Layer 106.For example, some electron beams 114 can be directed to across insulating layer 110, and other electron beams 114 can be directed to across
Circuit layer 112.Optionally, the electron beam 114 of guiding insulating layer 110 can have different from the electron beam for being oriented to circuit layer 112
Characteristic.The illuminated one or more characteristics to convert the material of these coatings 106 of coating 106.At 124, electric component 100
Coating 106 be illustrated at electron beam 114 irradiation after processing after (post-processing) state.LED module
102 are shown as being coupled to circuit layer 112 after electron beam 114 irradiates.
Substrate 104 is used to form circuit board, such as clad circuit board.Circuit layer 112, which is formed, limits circuit board electricity
The conductive trace on road.Substrate 104 is metal substrate, such as aluminium radiator.
Insulating layer 110 is high-termal conductivity layer.Optionally, insulating layer 110 can be with hard anodized layer.Insulating layer 110 can lead to
It crosses and ink or paste is printed on outer surface 108 and is applied.Optionally, insulating layer 110 can be applied directly to outer surface 108.
Alternatively, one or more layers can be provided between substrate 104 and insulating layer 110.Insulating layer 110 is being printed on outer surface
Before on 108, substrate 104 can be cleaned and deoxidation.
In the exemplary embodiment, insulating layer 110 includes metal oxide, the oxide etc. of such as aluminium, silicon, titanium, magnesium.
Insulating layer 110 may include other particles, such as enamel, glass, ceramics, porcelain etc..Insulating layer 110 may include boric acid
Salt, silicate, fluoride, alkali metal, lead, aluminium etc..Insulating layer may include organic material, and such as epoxy resin, glues resin
With agent etc., which may include metallic or thin slice to improve the heat transfer of insulating layer 110.For example, organic
Carrier can be sufficiently filled with high-termal conductivity particle, metal oxide, aluminium oxide, silica, aluminium nitride, diamond etc.
Deng.The particle of various shape and size can be used.Insulating layer 110 may include bonding agent to promote (the as- under printing state
Printed) adhere to, and/or including surfactant to prevent tablet bonding.Insulating layer 110 may include required solvent and/or
Other additives, to adjust ink/paste viscosity needed for printing treatment.110 material of insulating layer may include metal precursor object
Or the other materials that can be chemically reduced during being irradiated with electron beam 114.
In the exemplary embodiment, insulating layer 110 can be the micro-structure of micro particle and/or nanoparticle.Insulating layer
110 particle electron beam 114 is melted to generate the solution that wherein material is mixed with atomic level.Optionally, insulating layer 110 can
To be quickly cooled down with rapid curing solution, to prevent from mutually separating, grain growth and/or passed to the excessive heat of metal heat sink 104
It leads.The metal heat sink for limiting substrate 104 facilitates heat of the rapid dispersion from insulating layer 110 during and after irradiation.Make
Material, which well mixes and is allowed to rapid curing, produces fine material micro-structure.
Insulating layer 110 can be applied by one of various different printing technologies, such as silk-screen printing, pad printing, spray
Ink print, aerosol jet printing, differential match, spin coating, wiping apply etc..In alternative embodiments, it can be used except printing
Insulating layer 110 is applied to substrate 104 by other application technologies.For example, insulating layer 110 can by powder coating, spray, dip in
Dipping or other processing are applied to apply.Insulating layer 110 is optionally applied to substrate 104 by the application technology, such as
Along scheduled circuit trace path.The printing technology can permit the printing standardization pattern on substrate 104, and described
Printing discontinuously can such as be applied with batch prints or continuously such as be printed with reel and applied to complete.The printing
Technology can be selected according to the minimum compact mechanism of paste or ink, the thickness degree of application, insulating layer material composition etc..
Circuit layer 112 can be by the way that conductive or metallization ink or paste to be printed on insulating layer 110 and apply.Insulation
Layer 110 is between circuit layer 112 and substrate 104, to provide electrical isolation between the two.Optionally, circuit layer 112 can be direct
It is applied to insulating layer 110.Alternatively, one or more layers can be provided between insulating layer 110 and circuit layer 112.
In the exemplary embodiment, circuit layer 112 includes the metallic of various shape and size.Circuit layer 112 can be with
Including bonding agent to promote printing to adhere to and/or prevent metallic from bonding (for example, 1-2wt%) including surfactant.
Circuit layer 112 may include the solvent and/or other additives that printing treatment needs.Optionally, circuit layer 112 may include volume
Outer solder flux additive (for example, commercially available soldering flux, borax and potassium-tetraborate), the water between all for example 1-10wt%
It is flat.During the post-processing (post processing) with electron beam 114, the brazing flux can be added to adjust circuit layer
112 wetting state.In the exemplary embodiment, circuit layer 112 can have high metal concentration (for example, being greater than 50wt%).
In one exemplary embodiment, metallic can be 100% silver particles.In a further exemplary embodiment, metallic
Can for 100% copper particle or another high-conductivity metal.In alternative embodiments, other types of metal can be used,
Such as gold, aluminium, nickel, silver, molybdenum, tin, zinc, titanium, palladium, platinum etc. and/or their alloy.112 material of circuit layer may include energy
Electronation is reached into the metal precursor object of metal.It is, for example, possible to use metal salt, metal oxide and other metallic compounds,
Such as silver chlorate, stannic chloride and silver nitrate.The precursor may include the metal with low melting point, such as tin, zinc, copper, silver
Etc..When using the mixture of metal mixture or alloy, intermetallic knot can be formed during electron beam treatment
Structure, to realize the characteristic or performance of desired coating 106.
In the exemplary embodiment, circuit layer 112 can be the micro-structure of micro particle and/or nanoparticle.Optionally,
Circuit layer 112 may include the mixed powder of solid metal particles (such as Ag particle) and bonding agent, solvent and/or flux mixture
End.Metallic electron beam 114 is melted to generate the solution that wherein material is mixed with atomic level.Optionally, circuit layer 112
It can be quickly cooled down with solution described in rapid curing, to prevent from mutually separating and grain growth.For example, limiting the metal of substrate 104
Radiator can be used for dissipating the heat from circuit layer 112, wherein heat also passes through high thermal conductivity insulating layer 110.Mix material well
It closes and quickly solidifies, lead to fine material microstructure.It is alternatively possible to use the metallic of different sizes and shapes.It can
So as to be reduced into the precursor (for example, metal salt, metal oxide) of metallic during being used in irradiation and melt processed.It is optional
Ground, diffusion barrier layer can be set between insulating layer 110 and circuit layer 112, to reduce 110 material of insulating layer and circuit layer
Diffusion between 112 materials.
Bonding agent concentration can lower (for example, be less than 5wt%), be such as lower compared with the concentration of metallic.
Bonding agent concentration can be lower compared with routine paste used in the post-processing application of conventional oven heat.Bonding agent concentration can
Between approximate 25wt% and 5wt%.Alternatively, bonding agent concentration can be very low (for example, being less than 1wt%).Bonding agent
Example include dextrin, polyvinyl butyral (for example, butvar), hydroxypropylcellulose (for example,), but
In alternate embodiment, other types of bonding agent can be used.Bonding agent may include glue or other additives, be applied with changing
Expect viscosity consequently facilitating being applied to insulating layer 110.
Circuit layer 112 can be applied by one of various different printing technologies, such as silk-screen printing, pad printing, spray
Ink print, aerosol jet printing, differential match, spin coating, wiping apply etc..In alternative embodiments, it can be used except printing
Circuit layer 112 is applied to insulating layer 110 by other application technologies.For example, circuit layer 112 can by powder coating, sprinkling,
Dipping dipping or other processing are to apply.Circuit layer 112 is optionally applied to insulating layer 110 by the application technology,
Such as along scheduled circuit trace path.The printing technology can permit the printing standardization pattern on substrate 104, and
The printing discontinuously can such as be applied with batch prints or continuously such as be printed with reel and applied to complete.It is described
Printing technology can be selected according to the minimum compact mechanism of paste or ink, the thickness degree of application, coating material composition etc..
Referring again to Fig. 2, Fig. 2 shows accoding to exemplary embodiment electron beam 114 is radiated at electric component 100
On electric component formed system 140.System 140 can be the electron beam microminiature welder that can generate electron beam 114.The place
Reason can execute in vacuum chamber 142.The power of irradiation bomb 116 can be controlled during processing.The energy density of electron beam 114
It during processing can be controlled.The deflection speed (deflection speed) of electronics during processing can be controlled.Most greatly
Fast voltage during processing can be controlled.Maximum electron beam electric current during processing can be controlled.Act on the beam in target
Focal spot size and depth can be controlled during processing.System 140 can control electron beam 114 to focus on more than one beam
In focus, insulating layer 110 and circuit layer 112 are such as irradiated simultaneously.Electron beam 114 can be based on the performance (example of depositing coating 106
Such as, thickness degree, layer composition) and the material properties (for example, density, thermal conductivity, chemical composition) of coating 106 it is controlled.
System 140 can be equipped with back scattered electron and secondary electron detector, with scanning electron microscope (SEM) class
Seemingly, the detector can be used to generate the electron beam image of workpiece.Described image can watch in real time on the screen, or use tricks
The storage of calculation machine.System 140 may include software to control the function of irradiation bomb 116, such as program electron beam 114 with scanned
Restriction path or illuminating defined pattern on sample.The software can permit the shifting synchronous with irradiating sample of electron beam 110
It is dynamic, the reel of such as continuous moving.Continuous re melting process is possible as a result,.Optionally, system 140 may include heat dissipation
Device such as with high caloic (thermal mass) and is positioned to the thick aluminium sheet radiator well thermally contacted with target.
Fig. 3 shows the interaction of electron beam 114 Yu coating 106.In an illustrated embodiment, insulating layer 110 and electricity
Road floor 112 prints before exposure.During irradiation, some electron beams 114 are focused on inside insulating layer 110, and some electricity
Beamlet 114 focuses on inside circuit layer 112.Electron beam 114 is at least partially through respective coatings 106.In exemplary embodiment
In, beam focus 150 is in insulating layer 106, and beam focus 152 is in circuit layer 112.Electron beam 114 is not to focus on substrate
In 104, the heat from coating 106 but substrate dissipates.Irradiation or heating for substrate 104 is due to the focusing of electron beam 114
It is limited on coating 106.Due to the material scattering of the impacting electron coated 106 of electron beam 114, the kinetic energy of electronics is converted
For thermal energy, it is burnt that the probability of scattering may rely on the energy of electronics, the density of the illuminated material of respective coatings 106, beam
Point depth etc..Optionally, the penetration depth of electron beam can be between 0.5 μm and 20 μm.In the exemplary embodiment, it scatters
The energy dependence of probability is characterized in that the maximum value of generated heat density is not located on the surface of the material, and is penetrating depth
At about the 1/3 of degree.Heat not only generates on the surface of coating 106, but also generates in the material internal of coating 106.Electronics
A part is reflected from coating 106 or is emitted again.This electronics can be used to generate SEM image in situ during irradiation, with warp
Treatment with irradiation is controlled by feedback control system.
For fixed acceleration voltage, the power of generated heat depends on electron stream.Acceleration voltage and beam current multiply
Product generates beam power.The power can be adjusted by control electronic current and/or acceleration voltage.It is adjustable with control described in
Another parameter for the treatment of with irradiation is the irradiation duration at or near the point of coating 106.If the heat generated is more than by material
Material is heated to the thermal energy of its fusing point needs and the latent heat of fusion of material, the then material molten of the coating 106 printed.Make thermal energy focus
On coating 106 rather than on substrate 104, this generates heat and makes 106 Flashmelt of coating.By make material react and/or
It is sintered the layer, coating 106 and/or substrate layer 104 can be heated to fusing point temperature below, to change the spy of the layer
Property.Optionally, substrate 104 can act on as radiator, with the heat after illumination from coating 106 that promptly dissipates, thus
Allow the high cooldown rate of melt film.Quickly heating and cooling rate can influence the characteristic of coating 106.For example, circuit layer 112
Hardness can be higher and quickly heating and cooling down, this slow heating and cooling with circuit layer 112 is on the contrary, as wherein
As heat cure typical case in the oven heat being also heated except the outer-lining bottom 104 of paste.In addition, the paste in heating oven heat needs
More thermal energy are wanted, because the outer-lining bottom in paste is also heated.
Because the size for the mass density that bonding agent typically has exists lower than the metallic in coating 106, bonding agent
Percentage by volume in coating 106 is even higher.For example, in the typical routine wherein in oven heat in cured application
Paste is the 90Ag/10Mo material with the butvar bonding agent of 23wt%, this is high bonding agent concentration and is critical
Very high bonding agent concentration.The routine paste has the bonding agent volume fraction of approximation 75%.The height of conventional paste or
Very high bonding agent concentration be it is required, print structure is fixed firmly on substrate, and bonding agent use it is conventional
Oven heat keeps subsequent heat treatment.
In the exemplary embodiment, for being handled with electron beam 114, coating 106 does not need this high binder content,
Because bonding agent is only needed the coating 106 of printing to be held in place to long enough on substrate 104, to transmit substrate 104
To electron beam 114 for irradiating.For example, binder content can be approximate 1wt%, to be significantly reduced percentage by volume.
After melting, coating 106 is fine and close, and has good attachment.In the exemplary embodiment, bonding agent is directed at irradiation
It is substantially completely removed during processing from coating 106, is such as realized by evaporating or by decomposing.In coating 106
Allow that bonding agent more rapidly and is more thoroughly evaporated or removed during irradiation using low bonding agent concentration.In insulating layer 110
Middle to use fewer adhesive that insulating layer 110 is made to have bigger thermal conductivity, this is desired in some embodiments, such as in gold
Belong in the application of clad circuit plate.Fewer bonding agent is used to make circuit layer 112 that there is bigger electric conductivity in circuit layer 112, this
It is desired in some applications.When selecting bonding agent material, the bonding agent with such characteristic is considered, such as in irradiation
The high paste quality of coating 106, high printing film layer attachment, film quality are (for example, low carbon residue (is burnt after illumination afterwards
Object) concentration).In the exemplary embodiment, whole or substantially all of bonding agent is irradiated by electron beam 114, and is kept
Low carbon residue amount, this can be removed by scraping or another treatment process.
During processing, electron beam 114 operation can the material type based on specific coating 106 and change.For example,
The operation can when using pure metal material different from the use of metal precursor object when operation.Electron beam 114 is for insulation
The operation of layer 110 can be different from the operation for circuit layer 112.In the exemplary embodiment, the pure metal composition the case where
Under, the post-processing and irradiation of circuit layer 112 can be controlled by adjusting energy density and time for exposure, so as to metallic burning
Tying object or at least one metal ingredient becomes melting behaviors, and circuit layer 112 is molten into homogeneous metal layer.In some embodiments
In, there is sintering and the processing of double ranks of subsequent melting is possible.Non-metallic components (for example, bonding agent) are isolated or steam
Hair, to leave pure metal layer.In the exemplary embodiment, in the case where metal precursor object, such as in such as insulating layer 110
In metal oxide (still, these metal precursor objects may be used to form circuit layer 112 in some embodiments), insulating layer
110 post-processing and irradiation is controlled by energy density and time for exposure, so that metal precursor object is chemically reduced, this passes through defeated
The heat entered into insulating layer 110 is realized indirectly, or passes through the interaction of the electronics in metal precursor object and electron beam 114
Directly realize.Metal oxide can form non-conductive but high-termal conductivity layer, this is limited for being located at by metal substrate 104
Radiator and circuit layer 112 between insulating layer 110 can be desired.Insulating layer 110 Non-metallic components (for example, it is viscous and
Agent) it can be isolated or be evaporated.When precursor is by 114 chemical modification of electron beam, insulating layer 110 can be transformed into
Matter layer, such as alumina layer.
The thermal energy that electron beam 114 generates inside coating 106 can be controlled by adjusting the parameter of electron beam 114.?
In the case where the irradiation time of low thermal energy and length, coating 106 only partially can be melted and can be not joined to down
Layer structure (underlying structure).In the case where low thermal energy and long irradiation time, the particle of coating 106 can
To be only sintered, and incomplete fusion.In this case, coating 106 may not be bonded to understructure well, and
It may be easy to pass by and shift at any time.In the case where low thermal energy still short irradiation, partial coating 106 can be by electricity
Beamlet 114 removes, and is such as realized by leaving material splatter in irradiation.In the case where high-energy, big drop of drying
It can be remained with three-dimensional island, this is undesirable.In the case where higher energy, such as when energy is excessively high, circuit layer is removed
Except 112, the understructure of such as substrate 104 or insulating layer 110 etc is fusible, this provides worse electric interfaces.
The energy level of electron beam 114 should the controlled melting to realize coating 106, while good covering understructure and not undermining down excessively
Layer structure.
During use, the particle fusing or sputtering of coating 106 may occur under any energy level.Several physical
Explain the effect of metallic blowing: a) transmitting momentum, b) electrostatic effect, c) dynamo-electric effect and d) thermomechanical effect.For
Reduce particle blowing, it is possible to reduce or the amount of minimum Non-metallic components then will because the fill between particle is fewer
There is conductive path " releasing " excess electron between the particle of greater number to ground.To reduce particle blowing, coating 106 or substrate
Other layers can preheat so that desired beam power is lower before actually melting.For example, coating 106 can be preheating to
The fusing point of coating 106 temperature below, is such as preheated in oven heat, is preheated using electron beam, or preheated in other ways.?
During treatment with irradiation, coating 106 is then further heated to the temperature more than fusing point of respective coatings 106.To reduce particle spray
It blows, bigger 106 material of coating of particle size can be used or the particle of irregular (aspherical) shape may be used, with
The effect for reducing particle blowing, because more Mechanical Contacts between particle can be improved the power for being moved relative to each other particle,
And it is likely to form more conductive paths.To reduce particle blowing, scanning or irradiation patterns can choose into be passed via heat
The material for heating coating 106 indirectly is led, the heat transfer of substrate 104 is such as passed through.To reduce particle blowing, the material of coating 106
Material composition can have high metal particle density and/or low porosity, to enhance electric conductivity and thermal conductivity.
To avoid the possible charging during electron beam 114 irradiates to substrate 104, coating 106 can be grounded.To avoid
It charges during electron beam 114 irradiates to the possibility of substrate 104, electron beam 114 can carry out work with low acceleration voltage, to increase
Big electron emission.To avoid charging to the possibility of substrate 104 during electron beam 114 irradiates, can be used light (for example, UV or
Person's laser) enhance the photoconductivity of coating 106.To avoid filling the possible of substrate 104 during electron beam 114 irradiates
Electricity, coating 106 can be handled under the pressure (for example, having partial pressure of ar gas power) of increase.
In the exemplary embodiment, the amount for the control of electron beam 114, such as to the thermal energy generated by electron beam 114
Control, can change along coating 106.For example, by compared with a part of circuit layer 112 change electron beam 114 along
The operation of another part of circuit layer 112 can make the characteristic variations of circuit layer 112.For example, passing through the ginseng of electron beam 114
Number variation, resistor can be integrated into electric conductor path or circuit.The assembling or installation of resistor are not needed as a result,.Separately
Outside, compared with insulating layer 110, the control of electron beam 114 can be changed along circuit layer 112.
Fig. 4 shows another processing for being used to form electric component 100 (see Fig. 1).In an illustrated embodiment, insulating layer
110 and circuit layer 112 with electron beam 114 handle before deposit.114 first processing insulating layer 110 of electron beam.Then dividing
ETAD expected time of arrival and departure processing circuit layer 112.Electron beam can be controlled particularly to aim at a layer as a result, and then aims at another layer,
Such as using different running parameters (for example, different power levels, different rates etc.).
Fig. 5 shows another processing for being used to form electric component 100 (see Fig. 1).In an illustrated embodiment, insulating layer
110 are deposited first on substrate 104, are then irradiated with electron beam 114.Then circuit layer 112 is deposited over that treated absolutely
In edge layer.Then circuit layer 112 is irradiated with electron beam 114.
Fig. 6 shows the method 200 of manufacture electric component such as clad circuit board.Method 200 includes providing 202 tools
There is the substrate of outer surface.In the exemplary embodiment, substrate is metal substrate, such as the radiator for electric component
Aluminium substrate.
The method 200 includes that insulating layer is applied to 204 on the outer surfaces of the substrates.The insulating layer can be paste or
Person's ink.Insulating layer can be powder or can have other forms.The insulating layer may include that glass or ceramics form material
Material, the glass or ceramic forming material are after the treatment by conversion glass or ceramics.Insulating layer may include precursor, all
Such as metal oxide or metal salt, the precursor is processed in later step.Optionally, insulating layer may include it is viscous and
Agent is to be fixed to substrate for insulating layer.Bonding agent concentration can be lower, to remove substantially the entirety of bonding agent during processing.
Insulating layer can apply 204 by the way that insulating layer to be printed on substrate.For example, insulating layer can be by screen printing
Brush, pad printing, ink jet printing, aerosol jet printing.Insulating layer can be matched by differential, spin coating, wiping applies, powder applies
It applies, sprinkling, dipping impregnates or other processing are to apply.Insulating layer can be applied directly to outer substrate surface.Alternatively, at it
Between other layers can be set.
Method 200 includes that circuit layer is applied to 206 on the insulating layer.Circuit layer can be paste or ink.Circuit layer can
By be powder or can have it is other in the form of.Circuit layer may include high metal particle concentrations.Circuit layer may include precursor
Object, such as metal oxide or metal salt, the precursor are processed in later step.Optionally, circuit layer can wrap
Bonding agent is included so that circuit layer is fixed to insulating layer.Bonding agent concentration can be lower, substantially the entirety of to remove during processing
Bonding agent.
Circuit layer can apply 206 by the way that circuit layer to be printed on insulating layer.For example, circuit layer can be by screen printing
Brush, pad printing, ink jet printing, aerosol jet printing.Circuit layer can be matched by differential, spin coating, wiping applies, powder applies
It applies, sprinkling, dipping impregnates or other processing are to apply.Circuit layer can be applied directly to outer substrate surface.Alternatively, at it
Between other layers can be set.
Optionally, the insulating layer and circuit layer for defining coating can be such as with other processing of electron beam treatment coating
It is preheated before step.Before other processing steps, coating can be preheated to coating fusing point temperature below, other
In processing step, the temperature be can be improved to temperature more than coating fusing point.
Optionally, coating can be electrically grounded before other processing steps such as with electron beam treatment coating.This connects
Ground can be sputtered with reduction coating between electron beam process phase.
Method 200 includes irradiating 208 insulating layers with electron beam to convert insulating layer.Electron beam can focus in insulating layer
It is interior.Insulating layer can be heated to melt insulating layer with electron beam irradiation, to form non-lead between metal substrate and circuit layer
Electric but thermally conductive layer.Optionally, the irradiation 208 can occur after circuit layer is applied to insulating layer.Alternatively, described
Irradiation 208 can be applied 206 to occurring before insulating layer in circuit layer.
The irradiation 208 can evaporate substantially the whole of bonding agent or nonmetallic materials in insulating layer.Insulating layer can
With illuminated until fully removing the nonmetallic materials in insulating layer.The treatment with irradiation can be controlled based on insulating layer characteristic
System is such as controlled by controlling the running parameter of electron beam, and all thickness in this way of the insulating layer characteristic, ingredient, bonding agent are dense
Degree etc..Optionally, the different piece of insulating layer can differently be irradiated.
Method 200 includes irradiating 210 circuit layers with electron beam, to form the electric conductor of electric component.Electron beam can gather
Point of the coke in circuit layer.Optionally, irradiation 210 synchronous with the irradiation of insulating layer can occur, such as by controlling irradiation bomb
It is realized so that electron beam to be emitted in two coatings.Two layers can be irradiated with identical electronic beam.It can be with electron beam irradiation
Heating circuit layer, to melt circuit layer to form electric conductor.Optionally, such as when metal precursor object is used in circuit layer,
Metal precursor object can be with the electron interaction of electron beam with conversion circuit layer during irradiation.Electron beam can will be before metal
Body object chemistry is reduced to metal, to form electric conductor.
Irradiation 210 can be left basic with the substantially all of bonding agent or nonmetallic materials in evaporation circuit layer
Upper pure metal layer, to form electric conductor.Circuit layer can be illuminated, until the nonmetallic materials of circuit layer are fully removed
It goes.The treatment with irradiation can based on circuit layer characteristic (such as, thickness, composition, bonding agent concentration etc.) be it is controlled, such as
It is controlled by controlling the running parameter of electron beam.Optionally, the different piece of circuit layer can differently irradiate, such as
Resistor is formed in electric conductor.Electric component can be structuring electric component.For example, the layer of electric component can pass through knot
Structure mode is printed and is irradiated via electron beam, to obtain predetermined properties in one or more layers.Electric component can be with tegillum
Pressure or printing, or planar structure is limited in some way.Electron beam can irradiate layered structure whole or selected portion
Point, it then can remove excessive lamination/printing material.
The method includes circuit layer is arrived in LED module connection 212.LED module can be soldered to circuit layer.From LED
The heat of module is dissipated by substrate.Insulating layer is high-termal conductivity, is passed to substrate to allow heat to pass therethrough.
Method and system as described herein with 114 processing circuit layer 110,112 of electron beam realizes on the metallic substrate
High quality layered structure.Insulating layer 110 is non-conductive and high-termal conductivity, will the dissipation of heat from circuit layer to substrate
In 104 radiator.The processing can not utilize wet chemistry to execute, and reduce effect on environment.With other manufacturing process
It compares, it is possible to reduce for manufacturing the metal consumption of electric component.The processing realizes the highly selective and accurate cloth of coating 106
It sets.Coating 106 and electric component can be rendered adequately treated quite quickly, and can be used as continuous reel system or discontinuous batch system
A part handle.Compared with standard processing, by treated, electric conductor that circuit layer 112 limits provides improved spy
Property.For example, conductor can have the conductivity of raising, the thermal conductivity of raising, better wearability, better corrosion resistance, raising
Hardness etc..Compared with standard processing, by treated, insulating layer that insulating layer 110 limits provides improved characteristic.Example
Such as, insulating layer can have low bonding agent concentration, and the heat transfer of insulating layer can be improved in this.
It should be understood that it is described above be intended to it is illustrative, rather than it is restrictive.For example, above-described embodiment (and/or its
Aspect) it can be used to be combined with each other.In addition, can carry out it is many modify so that especially situation or material are suitable for the teachings of the present invention,
Without departing from the scope of the invention.The size of each component described herein, material type, the number and location purport of orientation and each component
In the parameter for limiting some embodiments, but it is restrictive by no means, and be only exemplary embodiment.It is described above by reading
Book, many other embodiments and modification in the spirit and scope of claims will be for those of ordinary skill in the art
Significantly.
Claims (10)
1. a kind of method for manufacturing electric component, which comprises
Substrate is provided；
Insulating layer is applied over the substrate；
Circuit layer is applied on the insulating layer；
The insulating layer is irradiated with electron beam to convert the insulating layer；And
With the electron beam irradiation circuit layer to convert the circuit layer,
Wherein, the irradiation insulating layer and the irradiation circuit layer occur simultaneously, and some Electron Beam Focusings are insulating
Layer is internal, and other Electron Beam Focusings are inside circuit layer, and some electron beams and other described electron beams have not
Same beam characteristics；
Wherein, the irradiation circuit layer includes heating a part of the circuit layer to melt the circuit layer to be formed
Electric conductor, and another part of heating circuit layer is to forming resistor, and wherein, by institute during the treatment with irradiation
State circuit layer electrical ground.
2. according to the method described in claim 1, wherein, the substrate that provides includes providing the metal substrate of high-termal conductivity, institute
It states insulating layer and electrical isolation between the circuit layer and the substrate is provided.
3. according to the method described in claim 1, further comprising: before irradiating the circuit layer, the circuit layer is pre-
It is heated to its fusing point temperature below, the irradiation circuit layer includes that the circuit layer is heated to melting for the circuit layer
Or more temperature.
4. according to the method described in claim 1, wherein, the application circuit layer includes applying to have bonding agent concentration and metal
The combined circuit layer of concentration, the irradiation circuit layer includes evaporating the substantially all bonding agent, is left substantially
Metal layer is to form the electric conductor.
5. according to the method described in claim 1, wherein, applying insulating layer includes applying to have glass or ceramic forming material
Insulating layer, the irradiation insulating layer includes irradiating the insulating layer with by the glass or ceramic forming material conversion
As glass or ceramics.
6. according to the method described in claim 1, wherein, the application insulating layer includes that the insulating layer is directly printed on institute
It states on the outer surface of substrate, wherein the application circuit layer includes that the circuit layer is directly printed on the insulating layer.
7. according to the method described in claim 1, further comprising: light-emitting diode (LED) module is connected to the circuit layer.
8. a kind of electric component, comprising:
Substrate with outer surface；
It is applied selectively to the insulating layer of the outer surface, the insulating layer conformation is in the preceding state of processing and in electricity consumption
After beamlet irradiation after processing state, the insulating layer from state after state transformation to the processing before the processing,
Middle electron beam at least partially penetrates into the insulating layer during treatment with irradiation to convert the insulating layer；With
It is applied selectively to the circuit layer of the insulating layer, the circuit layer is configured in the preceding state of processing and in electricity consumption
After beamlet irradiation after processing state, the circuit layer from state after state transformation to the processing before the processing,
Middle electron beam at least partially penetrates into the circuit layer during treatment with irradiation to convert the circuit layer；
Wherein, the electron beam simultaneously irradiate the insulating layer and the circuit layer, some Electron Beam Focusings inside insulating layer,
And other Electron Beam Focusings are inside circuit layer, some electron beams and other described electron beams have different electronics
Beam characteristic；
Wherein, the irradiation circuit layer includes heating a part of the circuit layer to melt the circuit layer to be formed
Electric conductor, and another part of heating circuit layer is to forming resistor, and wherein, by institute during the treatment with irradiation
State circuit layer electrical ground.
9. electric component according to claim 8, wherein the substrate is manufactured with metal material, and the insulating layer provides
The circuit layer is electrically insulated with the substrate.
10. electric component according to claim 8, wherein the content of the nonmetallic materials of the circuit layer is at the place
State is higher than state after the treatment before managing, and the nonmetallic materials are removed during through the treatment with irradiation of the electron beam
It goes.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261710395P | 2012-10-05 | 2012-10-05 | |
| US61/710,395 | 2012-10-05 | ||
| US13/838,008 US20140097003A1 (en) | 2012-10-05 | 2013-03-15 | Electrical components and methods and systems of manufacturing electrical components |
| US13/838,008 | 2013-03-15 | ||
| PCT/US2013/061102 WO2014055270A1 (en) | 2012-10-05 | 2013-09-23 | Electrical components and methods and systems of manufacturing electrical components |
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| Publication Number | Publication Date |
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| CN104704931A CN104704931A (en) | 2015-06-10 |
| CN104704931B true CN104704931B (en) | 2019-01-08 |
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| CN201380052333.2A Expired - Fee Related CN104704931B (en) | 2012-10-05 | 2013-09-23 | The method and system of electric component and manufacture electric component |
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| Country | Link |
|---|---|
| US (2) | US20140097003A1 (en) |
| EP (1) | EP2904882A1 (en) |
| JP (1) | JP2015532533A (en) |
| KR (1) | KR20150052280A (en) |
| CN (1) | CN104704931B (en) |
| BR (1) | BR112015006787A2 (en) |
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| WO (1) | WO2014055270A1 (en) |
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| CN108031836B (en) * | 2018-01-22 | 2019-12-03 | 北京大学 | A kind of preparation method of metal-metallic oxide nanocomposite |
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- 2013-09-23 EP EP13771340.0A patent/EP2904882A1/en not_active Withdrawn
- 2013-09-23 KR KR1020157008712A patent/KR20150052280A/en active Search and Examination
- 2013-09-23 MX MX2015004040A patent/MX346728B/en active IP Right Grant
- 2013-09-23 BR BR112015006787A patent/BR112015006787A2/en not_active Application Discontinuation
- 2013-09-23 WO PCT/US2013/061102 patent/WO2014055270A1/en active Application Filing
- 2013-09-23 CN CN201380052333.2A patent/CN104704931B/en not_active Expired - Fee Related
- 2013-09-23 JP JP2015535690A patent/JP2015532533A/en active Pending
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2015
- 2015-01-05 US US14/589,748 patent/US20150126026A1/en not_active Abandoned
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Also Published As
| Publication number | Publication date |
|---|---|
| MX346728B (en) | 2017-03-30 |
| US20140097003A1 (en) | 2014-04-10 |
| WO2014055270A1 (en) | 2014-04-10 |
| MX2015004040A (en) | 2015-07-06 |
| EP2904882A1 (en) | 2015-08-12 |
| CN104704931A (en) | 2015-06-10 |
| BR112015006787A2 (en) | 2017-07-04 |
| KR20150052280A (en) | 2015-05-13 |
| JP2015532533A (en) | 2015-11-09 |
| US20150126026A1 (en) | 2015-05-07 |
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