CN104681547B - The method for packing of LED light source - Google Patents
The method for packing of LED light source Download PDFInfo
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- CN104681547B CN104681547B CN201310641862.8A CN201310641862A CN104681547B CN 104681547 B CN104681547 B CN 104681547B CN 201310641862 A CN201310641862 A CN 201310641862A CN 104681547 B CN104681547 B CN 104681547B
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- electric connection
- led chip
- connection board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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Abstract
The present invention relates to a kind of method for packing of multiple LED chip integrated encapsulation LED light sources.The method for packing of the LED light source of the present invention, it includes：Step S1, there is provided at least two LED chips LED base consistent with LED chip number and LED substrate, which is fixed in LED substrate by a LED bases respectively, the LED bases both sides of the positive and negative anodes electric connection of the LED chip；Step S2, fixes an electric connection board between each two LED chip, which is electrically connected on the electrode of LED chip, and electric connection board is in strip；Step S3, a conductive path is formed with conducting wire by all LED chips, LED bases and electric connection board；And step S4, injecting glue encapsulates the LED chip, LED bases and electric connection board in LED substrate.
Description
【Technical field】
The present invention relates to technical field of LED illumination, more particularly to a kind of and LED light source method for packing.
【Background technology】
Nowadays as the development process of modernization China, the emerging product of all trades and professions also gradually modernize.Just take illumination
For industry, bulb before, incandescent lamp, fluorescent lamp gradually updated as the energy-saving lamp of modernization, and LED light etc. is more
Energy saving more environmentally-friendly illuminator.With the development of science and technology and further going deep into for application practice, LED lighting technology is
As most popular, most promising, the highest lighting engineering of acceptance level.
But since LED illumination is the technical field just gradually risen in recent years, its application under circumstances, which also has, is permitted
The technical barriers for needing to assault fortified position more.For example how LED light source encapsulates and just can guarantee that it is imitated with preferable illumination effect and heat dissipation
Fruit is exactly a difficulty that need be captured.Single chip encapsulation and more cores can be divided into by commonly using LED light source packaged type now
Piece integration packaging, multiple chips integration packaging point small-power multiple chips integration packaging (refer mainly to LED light source power to be less than
0.5W) and high-power multiple chips (refer mainly to LED light source power and are more than 0.5W) integration packaging, since LED illumination lamp illuminates
It is required that luminous flux of light source need to reach hundreds of or thousands of or even lumen up to ten thousand, while inside dimension is limited to, therefore frequently with plurality of LEDs
Integrated chip is packaged into modularized limit emitting diode (LED) to meet the requirement of high light flux and small size.But existing multiple LED chips integrate envelope
When dressing up a Modular LED lamp bead, since heat-dissipating space is small, power density is big, and plurality of LEDs chip distance is too near so that
The heat that LED chip is sent excessively is concentrated, so that most heat is difficult to shed in time, causes whole LED lamp bead heat dissipation not
It is good, reduce its service life.Simultaneously as distance is too near between LED chip, so that the light that LED chip side is sent is mutual
Absorb, reduce the light-out effect of LED chip.
Most of all, now on multiple LED chip integrated encapsulation structures, use directly adopts the plurality of LED chip more
Conducting connection is carried out with gold thread, although this connection mode saves the technological process of LED encapsulation, but there are many problems.
Such as, since the LED lamp bead of multiple LED chip integration packagings could just after needing to carry out many tests after completing
Often use, as voltage tester, testing current etc., if using the structure of direct interconnection between LED chip, these tests can only
Integrated testability is carried out for whole LED lamp bead, its result tested only is an average magnitude, can not correctly reflect each LED core
Piece is qualified or not.Further, if direct interconnection between LED chip, will be unable to determine gold thread and ohm of LED chip
Whether contact situation, LED chip are damaged in welding process, and whether LED chip is subject to ESD (English full name：Electro-
Static discharge, static discharge) impact is impaired, and whether LED chip effectively contacts and connects with pedestal, and LED chip is hot
Amount conduction it is whether effective, these test events as can not in encapsulation process science accurately test if, LED lamp bead will be immediately
Initial failure is failed using mid-term after a period of time, can not ensure the distinctive long-life 50000H of LED at all.Moreover, such as
If fruit test failure, whole LED chips need to all be pulled down and carry out single test again, thus not only in test process
It is middle to expend more time and manpower, it can also substantially reduce the overall yield of LED lamp bead.
In addition, it is electrically connected between multiple LED chips in the LED lamp bead of integration packaging using gold thread.Work as LED chip
After being encapsulated in LED substrate, the gold thread length between each two LED chip is very limited, and with usage time increasingly
Long, the deformation of gold thread is increasing so that gold thread becomes further loose between LED chip, influences the normal hair of whole LED lamp bead
Light.Further, since thermal coefficient of expansion mismatches between different materials so that the internal stress of LED chip changes variation and breaks
Gold thread.
The LED lamp bead that existing frequently-used multiple LED chip integration packagings are formed on the arrangement mode of LED chip, more with
The rectangular array arrangement mode of rule is configured, and LED chip can be facilitated to be encapsulated in LED substrate though array is set, subtracted
The size of small LED substrate and whole LED lamp bead.But since the rectangular array arrangement using rule, multiple LED chips are horizontal
And longitudinal midline overlaps, and causes the distance of two adjacent LEDs chip too near so that the heat that LED chip is sent excessively concentrates difficulty
To shed.Meanwhile the light that the LED chip of regular rectangular shape array arrangement is sent also intermeshes, make the hot spot that sends locally bright
Spend it is uneven so that the illumination effect of LED lamp bead is had a greatly reduced quality.
In conclusion in order to make the LED lamp bead using effect of integrated packaging reach optimal, the heat dissipation of multiple LED chips
Problem, the test problem of single led chip, LED chip gold thread welding technique problem, the spread configuration problem of multiple LED chips
It is required for pre- to overcome, long lifespan, low energy consumption, pollution-free LED lighting technology could promotes to be promoted to a new application high
Degree.
【The content of the invention】
To overcome, heat dissipation effect is bad in existing integrated packaging LED lighting technology, can not individually test one chip
Can, gold thread failure welding, the technical barrier of light-out effect inequality, can accurate science the present invention provides a kind of good heat dissipation effect
Each LED core piece performance is tested, gold thread welding is firm, the method for packing of the more uniform rational LED light source of light-out effect.
The present invention also provides a kind of method for packing of LED light source, it includes：Step S1, there is provided at least two LED chips,
The LED base consistent with LED chip number and LED substrate, which is fixed by a LED bases respectively
In LED substrate, the positive and negative anodes of the LED chip are electrically connected the both sides of LED bases；Step S2, each two LED chip it
Between fix an electric connection board, which is electrically connected on the electrode of LED chip, and electric connection board is in strip；Step S3, is used
All LED chips, LED bases and electric connection board are formed a conductive path by conducting wire；And step S4, injecting glue seals in LED substrate
Fill the LED chip, LED bases and electric connection board.
Preferably, the conductor length is 1.1-2 times of LED bases and electric connection board connecting portion length.
Preferably, the length of the electric connection board and the length of LED bases are roughly equal, and the width of the electric connection board is small
In the half of the width of LED bases.
Preferably, electrical testing point is provided with the electric connection board.
Preferably, in step sl, the position of the LED chip set in LED substrate mutually deviates.
Preferably, in step s3, the circuit connecting mode of the conductive path is according to conductive connection plates and external circuit
The internal structure of link position and conductive connection plates and change.
Compared with prior art, LED light source of the invention increases on the both sides of each LED chip and is electrically connected, by being electrically connected
All LED chips are turned on connection by fishplate bar.So that this integrated package into the distance between LED chip increase, increase
Effective heat dissipation area of each LED chip, so as to ensure the good heat-radiating effect of whole LED light source.Simultaneously as LED chip
The distance between increase so that the mutual uptake of LED chip lateral emitting is reduced, and improves light extraction efficiency.
The electrical testing point of LED chip is equipped with each electric connection board, test probe is placed on electrical testing point
After upper, the electrical performance of each LED chip can be individually tested, is avoided since the damage of single LED chip causes whole LED light source
Disabled drawback, improves product yield when mass production produces the LED light source.
During using electric connection board to be conductively connected LED chip, one end of conducting wire is connected into LED chip, one end is connected to electricity
On connecting plate, rather than the connection mode that all LED chips are directly electrically connected by conducting wire of the prior art.Consequently, it is possible to conducting wire
Radian and shape can remain at optimal shape, avoid between different LED bases and electric connection board due to thermal expansion
The unmatched internal stress of coefficient breaks conducting wire.Conducting wire reserves certain free elongation in welding at the same time, prevents due to LED bottoms
Seat or electric connection board position change, malformation and the risk that causes conducting wire to be pulled off.
Finally, the present invention also provides a kind of method for packing of LED light source, in encapsulation step, using friendship between LED chip
The package position of wrong die bond so that effective heat dissipation area increase of each LED chip, improves heat dissipation effect.Also make at the same time each
The light interference that LED chip is sent substantially reduces, and improves the uniformity of LED light source lighting., can when whole conducting channel connects
With the link position by varying extemal plate and electric connection board, to change the circuit side connector of whole integrated packaging LED chip
Formula, the circuit connecting mode that can such as change 12 strings all the way are the circuit connecting mode of two tunnels three string, or are changed to four tunnels six string
Circuit connecting mode.Make the back panel wiring mode flexibility and changeability of whole LED light source, meet the use demand under various environment.And
Without as now, circuit connecting mode could be changed by needing to change whole LED light source.
【Brief description of the drawings】
Fig. 1 is the dimensional structure diagram of LED light source first embodiment of the present invention.
Fig. 2 is the floor map of LED light source first embodiment of the present invention.
Fig. 3 is the floor map of LED light source second embodiment of the present invention.
Fig. 4 is the packaging technology flow figure of LED light source of the present invention.
【Embodiment】
In order to make the purpose of the present invention, technical solution and advantage are more clearly understood, below in conjunction with attached drawing and embodiment,
The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention,
It is not intended to limit the present invention.
Referring to Fig. 1, the LED light source 100 of the present invention includes a LED substrate 103,12 are packaged with LED substrate 103
A LED chip 105,12 105 integration packagings of LED chip are in LED substrate 103.It is use LED chip during encapsulation more
105 are encapsulated on one of surface of LED substrate 103, naturally it is also possible to are encapsulated on two faces of LED substrate 103 and are formed
Dual surface LED substrate 103.There are a lens 101 in LED chip 105, which is covered in all sealings of LED chip 105
In LED substrate 103, while sealing is remained between lens 101 and LED substrate 103, make LED chip 105 and the external world of inside
Air exclusion.Lens 101 generally use hemispheric shape design, its main function be on the one hand can seal it is luminous multiple
LED chip 105, is on the other hand that the light to shine to LED chip 105 carries out matching somebody with somebody light processing.The lens more than 101 are used with silica gel material
The mode molded package of injection is in LED substrate 103.
Referring to Fig. 2, four plant-grid connection points 1031, four extemal plates are provided with the LED substrate 103 of LED light source 100
1033,14 electric connection boards 1035 and 12 LED bases 1039.One end of extemal plate 1033 is connected to plant-grid connection point
1031, the other end is connected on electric connection board 1035, and electric connection board 1035 and LED bases 1039 pass through 1037 electrical phase of conducting wire
Even.12 LED chips 105 are fixed on 12 LED bases 1039, and the positive and negative electrode of LED chip 105 can turn on connection
To the both sides of LED bases 1039.
From the point of view of position relationship, plant-grid connection point 1031 is located at the outside of lens 101, it will not be hermetically sealed, power supply
The actually electrical solder joint of access point 1031, the positive and negative anodes of external power supply are connected to for turning on.In this embodiment, two are provided with
Cathode access point and two anode access points.
With 3 × 4 regular rectangular shape array arrangement, 12 LED chips 105 correspond to be occupied 12 LED bases 1039
In be installed on LED bases 1039 on.The positive and negative electrode of each LED chip 105 is both turned on being connected to corresponding LED bases
Specify in bond pad locations 1039 both sides.
An electric connection board 1035 is both provided with the both sides of each LED chip 105 of every row, between two LED chips 105
Electric connection board 1035 can be connected to two LED chip 105 at the same time.With 105 row of LED chip of 3 × 4 regular rectangular shape array
From the point of view of mode for cloth, amount to and have 4 × 4 regular rectangular shape array electric connection board 1035 corresponding thereto.4 × 4 regular rectangular shape
Array electric connection board 1035 is sealed in lens 101.Row are ranked fourth in the first electric connection board 1035 that ranked fourth row and second
Electric connection board 1035 be connected as one, the LED chip 101 of first row and second row is linked as path.Similarly, the 3rd is arranged
The electric connection board 1035 of one row is connected 1035 with the 4th electric connection board that ranked first row and is integrated, and makes the 3rd row and the 4th row's
LED chip 105 is linked as path.
One end of four extemal plates 1033 is connected respectively in four plant-grid connection points 1031, and the other end connects respectively
Row are ranked fourth in first row first row, second row first row, the 3rd, on the 4th electric connection board 1035 that ranked fourth row.In correspondence
Need to ensure in relation, the plant-grid connection point 1031 of a cathode is connected to the electrical connection of first row first row by extemal plate 1033
On plate 1035, the plant-grid connection point 1031 of an anode is connected to the electric connection board of second row first row by extemal plate 1033
On 1035；Another cathode power supply access point 1031 is connected to the 3rd electric connection board 1035 that ranked fourth row by extemal plate 1033
On, another negative power supply access point 1031 is connected to the 4th by extemal plate 1033 and ranked fourth on the electric connection board 1035 of row.
Consequently, it is possible to it just can guarantee that to form a kind of correct conductivity pathway.
In shape and size, the shape and size of plant-grid connection point 1031 do not limit, and can be circular or side
The electrical node of shape or strip, its size need rationally to set according to the coupled size of power supply.
LED bases 1039 make in a rectangular shape, and LED chip 105 is centrally positioned on the LED bases 1039 of rectangle.Its
Surface area is 2 times or so of 105 surface area of LED chip, so sets the electrode that on the one hand can take into account LED chip 105
Convenient conducting is connected to 1039 both sides of LED bases, on the other hand can give LED chip 105 larger heat dissipation area.
Electric connection board 1035 is fabricated to strip, its length is approximately equal to the length of LED bases 1039, its width is less than LED
The half of 1039 width of base, on the one hand being electrically connected for electric connection board 1035 and LED bases 1039 can be facilitated by being arranged such, separately
On the one hand the overall dimensions of LED light source 100 can maximumlly be reduced.
In addition, it is more than the 1/4 of 1039 length of LED bases per the distance between two rows LED bases 1039, due to every two row
Electric connection board 1035 is provided between LED bases 1039, the distance between every two row LED bases 1039 is more than LED bases
The 1/2 of 1039 width.It is each in the case that if LED chip 105, electric connection board 1035 and LED bases 1039 are all uniformly arranged
The average heat dissipation area of LED chip 105 will be more than 2.8 times of 105 area of LED chip.But, according to actual needs, pass through
The distance between reasonable arrangement LED bases 1039, optimal value result should be set to：The average effective heat dissipation of each LED chip 105
Area is more than 105 surface area of LED chip, preferably 2-5 times.
Extemal plate 1033 can be the connecting plate of strip, or even say to be a conducting wire, as long as it can be by electric connection board
1035 connect with the conducting of plant-grid connection point 1031, since plant-grid connection point 1031 is located at outside lens 101, extemal plate
1033, which have part, is sealed in lens 101, is partly arranged on outside lens 101.
It is to be interconnected by conducting wire 1037 between electric connection board 1035 and LED bases 1039, the LED bases of the present embodiment
1039 either sides are connected on electric connection board 1035 with two conducting wires 1037, and the length of conducting wire 1037 is two corresponding tie points
Between 1.1-2 times of distance, that is to say, that conducting wire 1037 between 0.1-1 times of tie point can be also kept after connecting distance from
By stretch amount, if with ensure after prolonged use the position or alteration of form of LED bases 1039 or electric connection board 1035 when
Conducting wire 1037 will not be broken, moreover it is possible to reduce since 1037 pulling force of conducting wire is excessive to damaged caused by LED chip 105.
Electrical testing point 1036 is both provided with each electric connection board 1035, for individually testing the electricity of LED chip 105
Property performance.When needing to test the electrical performance of a certain LED chip 105, the both ends of test probe are directly placed on the LED chip
At electrical testing point 1036 on 105 both sides electric connection boards 1035 can accurate science test this LED chip 105 performance
Parameter.
During 100 use of LED light source, power supply can arrive LED substrate 103 by four power supplies of plant-grid connection point 1031
On.One end of extemal plate 1033 is connected to plant-grid connection point 1031, and the other end is optionally connected on electric connection board 1035, will
Electric connection board 1035 is turned on external power supply.Electric connection board 1035 is turned on by conducting wire 1037 with LED bases 1039 and connected, LED
The electrode of chip 105 is welded on LED bases 1039 again, thus all LED chips 105 by electric connection board 1035 with it is external
Plate 1033 is formed a turning circuit.In the present embodiment, using four plant-grid connection points 1031, per a pair of plant-grid connection
Series winding conducting six LED chips 105 of connection of point 1031, therefore may eventually form the circuit structure of two and six strings.Per six all the way
Six LED chips 105 of a LED chip 105 and another way are due to being connected in parallel, so the mutual not shadow of connecting and disconnecting of the circuit and luminosity
Ring.
Referring to Fig. 3, second embodiment of the invention LED light source 300 includes a LED substrate 303, sealed in LED substrate 303
Equipped with 12 LED chips 305,12 305 integration packagings of LED chip are in LED substrate 303.Have in LED chip 305
One lens 301, which is covered in all sealings of LED chip 305 in LED substrate 303, while lens 301 and LED
Sealing is remained between substrate 303, the LED chip 305 and outside air for making inside completely cut off.
Two plant-grid connection points 3031, two extemal plates 3033,13 are provided with the LED substrate 303 of LED light source 300
A electric connection board 3035 and 12 LED bases 3039.One end of extemal plate 3033 is connected to plant-grid connection point 3031, the other end
It is connected on electric connection board 3035, electric connection board 3035 and LED bases 3039 are electrical connected by conducting wire 3037.12 LED
Chip 305 is fixed on 12 LED bases 3039, and the positive and negative electrode of LED chip 305, which can turn on, is connected to LED bases
3039 both sides.
From the point of view of position relationship, plant-grid connection point 3031 is located at the outside of lens 301, it will not be hermetically sealed, power supply
The actually electrical solder joint of access point 3031, the positive and negative anodes of external power supply are connected to for turning on.In this embodiment, it is provided with one
Cathode access point and an anode access point.
12 LED bases 3039 arrange the arrangement that is staggered with four rows three, and 12 LED chips 305 correspond between two parties
On LED bases 3039.The positive and negative electrode of each LED chip 305 is both turned on being connected to corresponding LED bases 3039
Both sides specify in bond pad locations.
An electric connection board 3035 is both provided with the both sides of each LED chip 305 of every row, between two LED chips 305
Electric connection board 3035 can be connected to two LED chip 305 at the same time.Staggered LED chip 305 is arranged with four row three
See, total has the electric connection board 3035 of four rows and four columns corresponding thereto.The electric connection board 3035 of the four rows and four columns is sealed in
In lens 301.The electric connection board 3035 of row is ranked fourth first and the second electric connection board 3035 that ranked fourth row is connected as one,
The LED chip 305 of first row and second row is set to be linked as path.Similarly, the electric connection board 3035 and the 3rd of second row first row
The electric connection board 3035 that ranked first row is connected as one, and second row and the LED chip 305 of the 3rd row is linked as path；3rd row
The electric connection board 3035 that the electric connection board 3035 of 4th row ranked fourth row with the 4th is connected as one, and makes the 3rd row and the 4th row's
LED chip 305 is linked as path.
One end of two extemal plates 3033 be connected respectively with two plant-grid connection points 3031, the other end connects respectively
In on first row first row, the 4th electric connection board 3035 that ranked first row.
In shape and size, the shape and size of plant-grid connection point 3031 do not limit, and can be circular or side
The electrical node of shape or strip, its size need rationally to set according to the coupled size of power supply.
LED bases 3039 make in a rectangular shape, and LED chip 305 is centrally positioned on the LED bases 3039 of rectangle.Its
Surface area is 2 times or so of 305 surface area of LED chip, so sets the electrode that on the one hand can take into account LED chip 305
Convenient conducting is connected to 3039 both sides of LED bases, on the other hand can give LED chip 305 larger heat dissipation area.
Electric connection board 3035 is fabricated to strip, its length is approximately equal to the length of LED bases 3039, its width is less than LED
The half of 3039 width of base, on the one hand being electrically connected for electric connection board 3035 and LED bases 3039 can be facilitated by being arranged such, separately
On the one hand the overall dimensions of LED light source 300 can maximumlly be reduced.
In addition, it is more than the 1/4 of 3039 length of LED bases per the distance between two rows LED bases 3039.At each column LED bottoms
In the distance of seat 3039, due to being provided with electric connection board 3035 between each two LED bases 3039, make each two LED bases
The distance between 3039 are more than the 1/2 of 3039 width of LED bases.If LED chip 305, electric connection board 3035 and LED bases
In the case that 3039 are all uniformly arranged, the average heat dissipation area of each LED chip 305 will be more than 305 area of LED chip
2.8 again.But, according to actual needs, by the distance between reasonable arrangement LED bases 3039, optimal value result should be set to：
The average heat dissipation area of each LED chip 305 is more than 2-5 times of 305 area of LED chip.
It is interlaced arrangement between each column LED chip 305, it is described herein staggeredly to refer to any LED chip of first row and the
The horizontal middle separated time of any LED chip either two LED chip of two row or longitudinal middle separated time are misaligned.First row
The LED chip 305 and the LED chip 305 of its second row first row of one row are staggered, if the horizontal ruler of LED bases 3039
Very little is L, then the distance between the center line of first row first row LED chip 305 and 305 center line of second row first row LED chip are
S, and S >=L.Since LED chip 305, electric connection board 3035 and LED bases 3039 are all uniformly arranged, first row it is each
There are deviation distance S for LED chip 305 and each LED chip 305 of second row；Each LED chip 305 of second row and
There are deviation distance S for each LED chip 305 of three rows；Each LED core of 305 and the 4th row of each LED chip of 3rd row
There are deviation distance S for piece 305.It is arranged such so that either laterally or vertical between 12 LED chips 305
Distance between all having widened, makes effective heat dissipation area of each LED chip 305 increase to 3-7 times of LED chip 305
Area, while the light interference that LED chip 305 is sent also greatly reduces, and improves the light-out effect of LED light source 300.
Extemal plate 3033 can be the connecting plate of strip, or even say to be a conducting wire, as long as it can be by electric connection board
3035 connect with the conducting of plant-grid connection point 3031, since plant-grid connection point 3031 is located at outside lens 301, extemal plate
3033, which have part, is sealed in lens 301, is partly arranged on outside lens 301.
It is to be interconnected by conducting wire 3037 between electric connection board 3035 and LED bases 3039, the LED bases of the present embodiment
3039 either sides are connected on electric connection board 3035 with two conducting wires 3037, and the length of conducting wire 3037 is two corresponding tie points
Between 1.1-2 times of distance, that is to say, that conducting wire 3037 between 0.1-1 times of tie point can be also kept after connecting distance from
By stretch amount, if with ensure after prolonged use the position or alteration of form of LED bases 3039 or electric connection board 3035 when
Conducting wire 3037 will not be broken, moreover it is possible to reduce since 3037 pulling force of conducting wire is excessive to damaged caused by LED chip 305.
Electrical testing point 3036 is both provided with each electric connection board 3035, for individually testing the electricity of LED chip 305
Property performance.When needing to test the electrical performance of a certain LED chip 305, the both ends of test probe are directly placed on the LED chip
At electrical testing point 3036 on 305 both sides electric connection boards 3035 can accurate science test this LED chip 305 performance
Parameter.
During 300 use of LED light source, power supply can arrive LED substrate 303 by two power supplies of plant-grid connection point 3031
On.One end of extemal plate 3033 is connected to plant-grid connection point 3031, and the other end is optionally connected on electric connection board 3035, will
Electric connection board 3035 is turned on external power supply.Electric connection board 3035 is turned on by conducting wire 3037 with LED bases 3039 and connected, LED
The electrode of chip 305 is welded on LED bases 3039 again, thus all LED chips 305 by electric connection board 3035 with it is external
Plate 3033 is formed a turning circuit.In the present embodiment, using two plant-grid connection points 3031, two plant-grid connections
12 LED chips 305 are connected in series as a conductive path by point 3031.Due to being connected in series, the confession of each LED chip 305
Electric current is identical, so the luminosity of 12 LED chips 305 keeps unified.
Connection mode in the connection mode of circuit, being also change to four and three strings, needs to provide eight at this time
Extemal plate 3033, one end of four extemal plates 3033 are connected to the plant-grid connection point 3031 of cathode, and the other end is connected to every row's
On first electric connection board 3035；One end of four additional extemal plate 3033 is connected to the plant-grid connection point 3031 of anode, another
End is connected on the 4th electric connection board 3035 of every row.After so connecting, form four three LED chips 305 of route and form
Turned in parallel circuit.Same mode, need to only change the quantity and extemal plate 3033 and electric connection board 3035 of extemal plate 3033
On-position, in special circumstances, also need to change the arrangement mode of LED bases 3039 and electric connection board 3035, can be fabricated to
Six and two strings, the circuit connecting mode of three and four strings.
Referring to Fig. 4, present invention also offers the method for packing of LED light source 300, it includes following steps：
Step S1, there is provided multiple LED chips 305 and LED substrate 303.Before packaging, according to the needs of lighting power, really
Determine the quantity and arrangement mode of LED chip 305, determine to need to select in the size occupied according to multiple LED chips 305 afterwards
The LED substrate 303 of which kind of size.The LED substrate 303 of individual layer or the LED substrate 303 of bilayer can be selected herein.
Step S2, the plurality of LED chip 305 is fixed in LED substrate 303.Choose LED chip 305 quantity and
After the size of LED substrate 303, the relevant position of LED substrate 303 marks the position line for needing to place LED chip 305, afterwards
LED bases 3039 are fixed at the position line of the mark.The LED chip 305 and LED bases 3039 of the present embodiment are with four rows three
Row interlaced arrangement, 12 LED bases 3039 are evenly arranged in the center of LED substrate 303 between two parties, and each LED chip 305 occupies
In be arranged on corresponding LED bases 3039.The positive and negative electrode of LED chip 305 is electrically connected to the both sides of LED bases 3039.
It is more than the 1/4 of 3039 length of LED bases per the distance between two rows LED bases 3039, is staggeredly between each column LED chip 305
Arrangement, the LED chip 305 of first row first row is staggered with the LED chip 305 of its second row first row, if LED bases
3039 lateral dimension is L, then the center line of first row first row LED chip 305 and 305 center line of second row first row LED chip
The distance between be S, and S >=L.Similarly, each LED chip 305 LED corresponding with its next column of each row afterwards
The lateral dimension that the distance between chip 305 is all higher than LED bases is L.
Step S3, there is provided multiple electric connection boards 3035 are simultaneously fixed in LED substrate 303.The cloth that interlocks is arranged for four row three
The LED chip 305 put, need to provide 16 electric connection boards 3035, and the both sides of each LED chip 305 are equipped with the electric connection board
3035, the electric connection board 3035 between two adjacent LED chips 305 can share.According to electric connection board 3035 and LED chip 305
After spaced mode is fixed in LED substrate 303, which forms the arrangement side of four rows and four columns
Formula.After arranging electric connection board 3035, using conducting wire 3037 by electric connection board 3035 and 3039 company of electrically conducting of LED bases
Connect, the both sides of every LED bases 3039 are connected on different electric connection boards 3035.
Step S4, is linked to be conductivity pathway by LED light source 300.In addition, provide again outside four plant-grid connection points 3031 and four
Fishplate bar 3033.Two plant-grid connection points 3031 are connected to the cathode of power supply, and two plant-grid connection points 3031 are connected to the negative of power supply
Pole, one end of extemal plate 3033 are connected to plant-grid connection point 3031, and the other end is connected on the electric connection board 3035 of most edge.This
In embodiment, an extemal plate 3033 is connected on the electric connection board 3035 of first row first row, and an extemal plate 3033 connects
Onto the electric connection board 3035 of second row first row, an extemal plate 3033 is connected to the 3rd electric connection board 3035 that ranked fourth row
On, an extemal plate 3033 is connected to the 4th and ranked fourth on the electric connection board 3035 of row.Due to the first electrical connection that ranked fourth row
The electric connection board 3035 that plate 3035 ranked fourth row with second is connected as one, so the electric connection board 3035 of first row and second row
Contact as a turning circuit；It is a turning circuit that the electric connection board 3035 of the 3rd similar row and the 4th row, which are also contacted,.Most
Eventually, after connecting extemal plate 3033, the LED chip 305 of first row and second row forms a series circuit path, six LED cores
Piece 305 is connected in series；The LED chip 305 of 3rd row and the 4th row form a series circuit path, and two series circuit paths are in parallel even
Connect.Deformed as one kind, using two plant-grid connection points 3031 and two extemal plates 3033,3033 first row of extemal plate the
On the electric connection board 3035 of one row, another extemal plate 3033 is connected to the 4th and ranked fourth on the electric connection board 3035 of row, internal
12 LED chips 305 by electric connection board 3035 be connected in series after, ultimately form it is a kind of all the way 12 string circuits connection
Mode.Similarly, by varying the quantity and extemal plate 3033 and the on-position of electric connection board 3035 of extemal plate 3033, may be used also
To be fabricated to the circuit connecting mode of four and three strings.
Step S5, electrical testing.Electrical testing point 3036 is both provided with each electric connection board 3035, for individually surveying
Try the electrical performance of LED chip 305.When needing to test the electrical performance of a certain LED chip 305, directly by test probe
Both ends be placed at the electrical testing point 3036 on the 305 both sides electric connection board 3035 of LED chip can accurate science test this
The performance parameter of a LED chip 305.Herein, test the main contents include the test of positive low current, forward voltage change test,
Forward voltage is tested, reverse current leakage test, backward voltage test etc..
Step S6, injecting glue encapsulation.Silica gel is injected in LED substrate 303, hemispheric lens 301 are formed on, by ten
Two LED chips 305 and electric connection board 3035 are sealed in lens 301, and the light sent to LED chip 305 carries out light distribution
Processing.
Compared with prior art, LED light source 100,300 of the invention increases electricity on the both sides of each LED chip 105,305
Connecting plate 1035,3035, connection is turned on by electric connection board 1035,3035 by all LED chips 105,305.It is so that this
Integrated package into LED chip 105, the distance between 305 increase, increase effective radiating surface of each LED chip 105,305
Product, so as to ensure the good heat-radiating effect of whole LED light source 100,300.Simultaneously as LED chip 105, the distance between 305
Increase so that the mutual uptake of 105,305 lateral emitting of LED chip is reduced, and improves light extraction efficiency.
The electrical testing point 1036,3036 of LED chip 105,305 is equipped with each electric connection board 1035,3035, will
After test probe is placed on electrical testing point 1036,3036, the electrical performance of each LED chip 105,305 can be individually tested,
Avoid since the damage of single LED chip 105,305 causes whole LED light source 100,300 disabled drawbacks, improve mass production
Produce product yield during LED light source 100,300.
During using electric connection board 1035,3035 to be conductively connected LED chip 105,305, by one end of conducting wire 1037,3037
Connect LED chip 105,305, one end is connected on electric connection board 1035,3035, rather than the prior art by conducting wire 1037,
3037 are directly electrically connected the connection mode of all LED chips 105,305.Consequently, it is possible to the radian and shape of conducting wire 1037,3037
Optimal shape can be remained at, avoid between different LED bases 1039,3039 and electric connection board 1035,3035 due to
The unmatched internal stress of thermal coefficient of expansion breaks conducting wire 1037,3037.Conducting wire 1037,3037 is reserved certain in welding at the same time
Free elongation, prevent due to LED bases 1039,3039 or 1035,3035 position of electric connection board change, malformation and cause
The risk that conducting wire 1037,3037 is pulled off.
Finally, the present invention also provides a kind of method for packing of LED light source 300, in encapsulation step, between LED chip 305
Using the package position of staggeredly die bond so that effective heat dissipation area increase of each LED chip 305, improves heat dissipation effect.At the same time
Also substantially reduce the light interference that each LED chip 305 is sent, improve the uniformity that LED light source 300 illuminates.Entirely leading
, can be by varying extemal plate 3033 and the link position of electric connection board 3035, to change whole integrated envelope when circuit connects
The circuit connecting mode of dress formula LED chip 305, the circuit connecting mode that can such as change 12 strings all the way is the circuit of two tunnels six string
Connection mode, or it is changed to the circuit connecting mode of four tunnels three string.Make the back panel wiring mode flexibility and changeability of whole LED light source 300,
Meet the use demand under various environment.Without as now, circuit side connector could be changed by needing to change whole LED light source 300
Formula.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all originals in the present invention
Any modification made within then, equivalent substitution and improvement etc. should all be included within protection scope of the present invention.
Claims (6)
1. a kind of method for packing of LED light source, it includes：
Step S1, there is provided at least two LED chips LED base consistent with LED chip number and LED substrate, by this at least two
A LED chip is fixed in LED substrate by a LED bases respectively, and the positive and negative anodes of the LED chip are electrically connected LED bases
Both sides；
Step S2, fixes an electric connection board between each two LED chip, which is electrically connected to the electrode of LED chip
On, electric connection board is in strip；
Step S3, a conductive path is formed with conducting wire by all LED chips, LED bases and electric connection board；And
Step S4, injecting glue encapsulates the LED chip, LED bases and electric connection board in LED substrate.
2. LED light source method for packing as claimed in claim 1, it is characterised in that：The conductor length is LED base and is electrically connected
1.1-2 times of fishplate bar connecting portion length.
3. LED light source method for packing as claimed in claim 1, it is characterised in that：The length of the electric connection board and LED bases
Length it is roughly equal, the width of the electric connection board is less than the half of the width of LED bases.
4. LED light source method for packing as claimed in claim 1, it is characterised in that：Electrical survey is provided with the electric connection board
Pilot.
5. LED light source method for packing as claimed in claim 1, it is characterised in that：In step sl, set in LED substrate
The position of LED chip mutually deviates.
6. LED light source method for packing as claimed in claim 1, it is characterised in that：In step s3, the circuit of the conductive path
Connection mode changes according to the internal structure of the link position and conductive connection plates of conductive connection plates and external circuit.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403421A (en) * | 2011-11-16 | 2012-04-04 | 广东粤兴照明科技有限公司 | Method for coating LED module fluorescent powder mixture |
| CN103050608A (en) * | 2013-01-16 | 2013-04-17 | 复旦大学 | LED (light emitting diode) packaged based on zinc oxide-bismuth oxide composite ceramic substrate and preparation method thereof |
| CN203607458U (en) * | 2013-12-02 | 2014-05-21 | 深圳市邦贝尔电子有限公司 | Led lamp bead |
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| US7821023B2 (en) * | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403421A (en) * | 2011-11-16 | 2012-04-04 | 广东粤兴照明科技有限公司 | Method for coating LED module fluorescent powder mixture |
| CN103050608A (en) * | 2013-01-16 | 2013-04-17 | 复旦大学 | LED (light emitting diode) packaged based on zinc oxide-bismuth oxide composite ceramic substrate and preparation method thereof |
| CN203607458U (en) * | 2013-12-02 | 2014-05-21 | 深圳市邦贝尔电子有限公司 | Led lamp bead |
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