CN203690301U - LED light - Google Patents
LED light Download PDFInfo
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- CN203690301U CN203690301U CN201320787478.4U CN201320787478U CN203690301U CN 203690301 U CN203690301 U CN 203690301U CN 201320787478 U CN201320787478 U CN 201320787478U CN 203690301 U CN203690301 U CN 203690301U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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Abstract
The utility model relates to a LED light integrated and packaged by a plurality of LED chip. The LED light provided by the utility model includes at least two LED chips encapsulated on a LED substrate, and each electrode of the LED chips is connected with an electrical connection plate between the LED chips. The LED light provided by the utility model has the advantages of good heat dissipation effect, exactly and scientifically testing the performance of each LED chips, stable gold wire welding, more even and reasonable effect of light, high yield, and low production cost.
Description
[technical field]
The utility model relates to LED lighting technical field, particularly a kind of LED light source of multiple LED chip integration packagings.
[background technology]
Nowadays along with the development process of modernization China, the also modernization gradually of the emerging product of all trades and professions.With regard to by illuminating industry, bulb before, incandescent lamp, sight lamp updates gradually as modern electricity-saving lamp, the lighting of the more energy-conservation environmental protection more such as LED lamp.Follow further going deep into of scientific and technical development and application practice, LED lighting technology has become the lighting technology most popular, the most promising, acceptance level is the highest.
But, due to the technical field of LED illumination in recent years just rising gradually, the technical barrier that its application under various environment also has many needs to assault fortified position.Such as how, LED light source encapsulates guarantee, it has good illumination effect and radiating effect is exactly the difficulty that need capture.Conventional LED light source packaged type can be divided into single chips encapsulation and multiple chips integration packaging now, multiple chips integration packaging point small-power multiple chips integration packaging (mainly referring to that LED light source power is less than 0.5W) and high-power multiple chips (mainly referring to that LED light source power is greater than 0.5W) integration packaging, because LED lighting lighting requirement luminous flux of light source need reach hundreds of or several thousand lumens even up to ten thousand, be limited to inside dimension simultaneously, meet high light flux and undersized requirement therefore often adopt plurality of LEDs integrated chip to be packaged into modularized limit emitting diode (LED).When but existing multiple LED chip integration packaging becomes a Modular LED lamp pearl, because heat-dissipating space is little, power density is large, plurality of LEDs chip distance is too near, the heat that LED chip is sent is too concentrated, so that most heat is difficult to shed in time, cause whole LED lamp pearl heat radiation bad, reduce its useful life.Meanwhile, because distance between LED chip is too near, so that the light that send LED chip side absorbs mutually, reduces the light effect that of LED chip.
The most important thing is, on multiple LED chip integrated encapsulation structures, adopt directly adopts gold thread to carry out conducting connection the plurality of LED chip more now, although this connected mode has been saved the technological process of LED encapsulation, has a lot of problems.As, because the LED lamp pearl of multiple LED chip integration packagings needs to carry out could normally to use after many-sided test after completing, picture voltage tester, testing current etc., if the structure of direct interconnection between employing LED chip, these tests can only be carried out integrated testability for whole LED lamp pearl, and the result of its test is only an average magnitude, cannot correctly reflect that whether qualified each LED chip is.Further, if direct interconnection between LED chip, cannot determine the ohmic contact situation of gold thread and LED chip, whether LED chip is impaired in welding process, whether LED chip is subject to ESD (English full name: Electro-Static discharge, static discharge) impact impaired, whether LED chip effectively contacts and is connected with pedestal, whether the conduction of LED chip heat is effective, these test events as cannot be science accurately tested in encapsulation process, LED lamp pearl is early failure or inefficacy in mid-term after use a period of time immediately, cannot guarantee the distinctive long-life 50000H of LED at all.And, if test failure need all be pulled down whole LED chips and carry out single test again, not only in test process, can expend more time and manpower thus, also can greatly reduce the overall yield of LED lamp pearl.
In addition, between the multiple LED chips on the LED lamp pearl of integration packaging, adopt gold thread to be electrically connected.After LED chip is encapsulated on LED substrate, gold thread length between every two LED chips is very limited, and along with service time is more and more longer, the distortion of gold thread is increasing, make gold thread between LED chip become further lax, affect the normally luminous of whole LED lamp pearl.In addition, because thermal coefficient of expansion between different materials does not mate, make the internal stress of LED chip change variation and break gold thread.
The LED lamp pearl that conventional multiple LED chip integration packagings form is now on the arrangement mode of LED chip, arrange mainly with regular rectangular array arrangement mode, though array setting can facilitate LED chip to be encapsulated on LED substrate, reduce the size of LED substrate and whole LED lamp pearl.But, owing to adopting regular rectangular array to arrange, multiple LED chips laterally and longitudinal midline overlap, cause the distance of two adjacent LEDs chip too near, make the heat that LED chip sends too concentrate and be difficult to shed.Meanwhile, the light that the LED chip of regular rectangular shape array arrangement sends also intermeshes, and make the hot spot local luminance sent inhomogeneous, so that the illumination effect of LED lamp pearl is had a greatly reduced quality.
In sum, in order to make the LED lamp pearl result of use of integrated packaging reach best, the heat dissipation problem of multiple LED chips, the test problem of single led chip, LED chip gold thread solder technology problem, the spread configuration problem of multiple LED chips all needs in advance to overcome, and life-span length, low energy consumption, pollution-free LED lighting technology could be promoted and be promoted to a new application height.
[utility model content]
Bad for overcoming in existing integrated packaging LED lighting technology radiating effect, cannot test separately one chip performance, gold thread failure welding, go out the technical barrier of light effect inequality, the utility model provides a kind of good heat dissipation effect, can test each LED chip performance by accurate science, gold thread welding is firm, goes out more evenly rational LED light source of light effect.
The scheme of the utility model technical solution problem is to provide a kind of LED light source, and it comprises at least two LED chips that are packaged on LED substrate, and the electrode of described each LED chip is connected on the electric connection board between LED chip.
Preferably, the electrode of LED chip is drawn separately from both sides respectively.
Preferably, the join domain of LED chip and electric connection board arranges the testing electrical property point of this LED chip.
Preferably, between LED chip and electric connection board, be connected by least one wire.
Preferably, the distance between the tie point that the tie point that LED chip is connected with wire to electric connection board and wire is connected is less than the length of wire.
Preferably, the rectangular array arrangement of LED chip on these at least two encapsulation and LED substrate.
Preferably, described LED chip is fixed on a kind of LED base, and this LED base and described electric connection board electrically conduct.
Preferably, the distance between every two adjacent LED bases is greater than 1/2 of LED base size.
Preferably, it further comprises at least one group of boards being connected with external power source, and described electric connection board forms at least one circuit that is electrically connected with described LED chip, and described boards selectivity is connected to this at least one electrical connection circuit.
Preferably, at least two LED chips are in column for this while arranging, arbitrary LED chip of first row and arbitrary LED chip of secondary series laterally in separated time and longitudinally in separated time all do not overlap.
Compared with prior art, LED light source of the present utility model increases electrical connection on the both sides of each LED chip, by electric connection board, all LED chip conductings is connected.Distance between LED chip that this integrated package becomes is strengthened, increase the efficiently radiates heat area of each LED chip, thereby guarantee the good heat-radiating effect of whole LED light source.Meanwhile, because the distance between LED chip strengthens, the mutual uptake of LED chip lateral emitting is reduced, improve light extraction efficiency.
On each electric connection board, be equipped with the testing electrical property point of LED chip, after test probe is placed on testing electrical property point, can test separately the electrical performance of each LED chip, avoid because the damage of single LED chip causes the disabled drawback of whole LED light source product yield when this LED light source is produced in raising mass production.
Adopt electric connection board to conduct electricity while connecting LED chip, one end of wire is connected to LED chip, one end is connected on electric connection board, but not the connected mode of passing through all LED chips of the direct electrical connection of wire of prior art.Thus, the radian of wire and shape can remain at best shape, avoid between different LED base and electric connection board because the unmatched internal stress of thermal coefficient of expansion is broken wire.Simultaneously wire reserved certain free elongation in the time of welding, prevents from changing due to LED base or electric connection board position, malformation and the risk that causes wire to be pulled off.
Between LED chip, adopt the package position of staggered die bond, the efficiently radiates heat area of each LED chip is increased, improve radiating effect.Also make the light that each LED chip sends interfere reduction greatly simultaneously, improve the uniformity of LED light source illumination.In the time that whole conducting channel connects, can be by changing the link position of boards and electric connection board, change the circuit connecting mode of whole integrated packaging LED chip, as can Gai Yi road the circuit connecting mode Wei Er road six of the 12 strings circuit connecting mode of going here and there, or change the circuit connecting mode that go here and there on four tunnels three into.The back panel wiring mode flexibility and changeability that makes whole LED light source, meets the user demand under various environment.And without picture now, need to change whole LED light source and could change circuit connecting mode.
[accompanying drawing explanation]
Fig. 1 is the perspective view of the utility model LED light source the first embodiment.
Fig. 2 is the floor map of the utility model LED light source the first embodiment.
Fig. 3 is the floor map of the utility model LED light source the second embodiment.
[embodiment]
In order to make the purpose of this utility model, technical scheme and advantage are clearer, below in conjunction with accompanying drawing and embodiment, the utility model are further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, LED light source 100 of the present utility model comprises a LED substrate 103, is packaged with 12 LED chips 105 on LED substrate 103, and these 12 LED chip 105 integration packagings are on LED substrate 103.When encapsulation, adopt that LED chip 105 is encapsulated in to one of them surface of LED substrate 103 is upper more, can certainly be encapsulated on two faces of LED substrate 103 and form dual surface LED substrate 103.On LED chip 105, have lens 101, these lens 101 cover 105 sealings of all LED chips on LED substrate 103, remain sealing between lens 101 and LED substrate 103 simultaneously, make inner LED chip 105 and isolate from outer air.Lens 101 are general adopt hemispheric shape structure, its Main Function be on the one hand can sealed light emitting multiple LED chips 105, be that the luminous light of LED chip 105 is carried out to luminous intensity distribution processing on the other hand.These lens 101 are encapsulated on LED substrate 103 with the mode moulding of injection mainly with silica gel material.
Refer to Fig. 2, on the LED substrate 103 of LED light source 100, be provided with 1035 and 12 LED bases 1039 of 1033, ten four electric connection boards of 1031, four boards of four power supply access points.One end of boards 1033 is connected to power supply access point 1031, and the other end is connected on electric connection board 1035, and electric connection board 1035 is electrical connected by wire 1037 with LED base 1039.12 LED chips 105 are fixed on these 12 LED bases 1039, and the positive and negative electrode meeting conducting of LED chip 105 is connected to the both sides of LED base 1039.
From position relationship, power supply access point 1031 is positioned at the outside of lens 101, and it can sealedly not encapsulate, and power supply access point 1031 is real is electrical solder joint, is connected to the both positive and negative polarity of external power source for conducting.In this embodiment, be provided with two anodal access points and two negative pole access points.
12 LED bases 1039 are with 3 × 4 regular rectangular shape array arrangement, and 12 LED chips 105 one by one correspondence are arranged on LED base 1039 between two parties.The equal conducting of positive and negative electrode of each LED chip 105 is connected to the both sides of the LED base 1039 corresponding with it and specifies in bond pad locations.
The electric connection board 1035 being provided with between 1035, two LED chips 105 of an electric connection board in the both sides of each LED chip 105 of every row can be connected to this two LED chip 105 simultaneously.LED chip 105 arrangement modes of the regular rectangular shape array with 3 × 4, amount to and have 4 × 4 regular rectangular shape array electric connecting plate 1035 corresponding thereto.This regular rectangular shape array electric connecting plate 1035 of 4 × 4 is all sealed in lens 101.The electric connection board 1035 that ranked fourth row at the first electric connection board 1035 and second that ranked fourth row connects as one, and makes the LED chip 101 of first row and second row be linked as path.Similarly, the 3rd electric connection board 1035 that ranked first row is connected 1035 with the 4th electric connection board that ranked first row and is integrated, and makes the 3rd row and the 4th row's LED chip 105 be linked as path.
One end of these four boards 1033 is connected respectively in four power supply access points 1031, and the other end is connected to first row first row, second row first row, the 3rd and ranked fourth on the electric connection board 1035 that row, the 4th ranked fourth row.On corresponding relation, need to guarantee, an anodal power supply access point 1031 is connected to by boards 1033 on the electric connection board 1035 of first row first row, and the power supply access point 1031 of a negative pole is connected to by boards 1033 on the electric connection board 1035 of second row first row; Another cathode power supply access point 1031 is connected to the 3rd by boards 1033 and ranked fourth on the electric connection board 1035 of row, and another negative power supply access point 1031 is connected to the 4th by boards 1033 and ranked fourth on the electric connection board 1035 of row.Thus, guarantee forms a kind of correct electrical path.
In shape and size, shape and the size of power supply access point 1031 do not limit, and can be the electrical node of circular or square or strip, and its size needs rationally to arrange according to the coupled size of power supply.
In addition, the distance between every two row LED bases 1039 is greater than 1/4 of LED base 1039 length, owing to being provided with electric connection board 1035 between every two row LED bases 1039, makes the distance between every two row LED bases 1039 be greater than 1/2 of LED base 1039 width.If in the situation that LED chip 105, electric connection board 1035 and LED base 1039 all evenly arrange, the average area of dissipation of each LED chip 105 will be greater than 2.8 times of LED chip 105 areas.But, according to actual needs, by the distance between reasonable arrangement LED base 1039, best value result should be made as: the average effective area of dissipation of each LED chip 105 is greater than LED chip 105 surface areas, and preferably 2-5 doubly.
Between electric connection board 1035 and LED base 1039, be to be undertaken interconnected by wire 1037, LED base 1039 either sides of the present embodiment are all connected on electric connection board 1035 with two wires 1037, the length of wire 1037 is 1.1-2 times of distance between two corresponding tie points, that is to say that wire 1037 also can keep the free stretch amount of distance between 0.1-1 times of tie point after connecting, if wire 1037 can not broken when guaranteeing the position of after long-time use LED base 1039 or electric connection board 1035 or alteration of form, can also reduce due to the excessive breakage that LED chip 105 is caused of wire 1037 pulling force.
On each electric connection board 1035, be provided with testing electrical property point 1036, for testing separately the electrical performance of LED chip 105.In the time need to testing the electrical performance of a certain LED chip 105, directly the two ends of test probe are placed on to testing electrical property on these LED chip 105 both sides electric connection boards 1035 and put the performance parameter of this LED chip 105 of test that 1036 places can accurate science.
In these LED light source 100 use procedures, power supply can supply power on LED substrate 103 by four power supply access points 1031.One end of boards 1033 is connected to power supply access point 1031, and the other end is optionally connected on electric connection board 1035, by electric connection board 1035 and external power source conducting.Electric connection board 1035 is connected by wire 1037 conductings with LED base 1039, and the electrode of LED chip 105 is welded on again on LED base 1039, and therefore all LED chips 105 have just formed a turning circuit by electric connection board 1035 and boards 1033.In the present embodiment, adopt four power supply access points 1031, every a pair of power supply access point 1031 contact conducting connect six LED chips 105, therefore finally can form two and six string circuit structures.Six LED chips 105 on each road and six LED chips 105 on another road are owing to being connected in parallel, so connecting and disconnecting of the circuit and luminosity are independent of each other.
Refer to Fig. 3, the utility model the second embodiment LED light source 300 comprises a LED substrate 303, is packaged with 12 LED chips 305 on LED substrate 303, and these 12 LED chip 305 integration packagings are on LED substrate 303.On LED chip 305, have lens 301, these lens 301 cover 305 sealings of all LED chips on LED substrate 303, remain sealing between lens 301 and LED substrate 303 simultaneously, make inner LED chip 305 and isolate from outer air.
On the LED substrate 303 of LED light source 300, be provided with 3035 and 12 LED bases 3039 of 3033, ten three electric connection boards of 3031, two boards of two power supply access points.One end of boards 3033 is connected to power supply access point 3031, and the other end is connected on electric connection board 3035, and electric connection board 3035 is electrical connected by wire 3037 with LED base 3039.12 LED chips 305 are fixed on these 12 LED bases 3039, and the positive and negative electrode meeting conducting of LED chip 305 is connected to the both sides of LED base 3039.
From position relationship, power supply access point 3031 is positioned at the outside of lens 301, and it can sealedly not encapsulate, and power supply access point 3031 is real is electrical solder joint, is connected to the both positive and negative polarity of external power source for conducting.In this embodiment, be provided with an anodal access point and a negative pole access point.
12 LED bases 3039 are with four rows' three row layout that is staggered, and 12 LED chips 305 one by one correspondence are arranged on LED base 3039 between two parties.The equal conducting of positive and negative electrode of each LED chip 305 is connected to the both sides of the LED base 3039 corresponding with it and specifies in bond pad locations.
The electric connection board 3035 being provided with between 3035, two LED chips 305 of an electric connection board in the both sides of each LED chip 305 of every row can be connected to this two LED chip 305 simultaneously.With the staggered LED chip 305 of these four rows, three row, amount to have four rows and four columns electric connection board 3035 corresponding thereto.The electric connection board 3035 of these four rows and four columns is all sealed in lens 301.The electric connection board 3035 that ranked fourth row at the first electric connection board 3035 and second that ranked fourth row connects as one, and makes the LED chip 305 of first row and second row be linked as path.Similarly, the electric connection board 3035 that the electric connection board 3035 of second row first row and the 3rd ranked first row connects as one, and makes second row and the 3rd row's LED chip 305 be linked as path; The electric connection board 3035 that the 3rd electric connection board 3035 and the 4th that ranked fourth row ranked fourth row connects as one, and makes the 3rd row and the 4th row's LED chip 305 be linked as path.
One end of these two boards 3033 is connected respectively and two power supply access points 3031, and the other end is connected on the electric connection board 3035 that first row first row, the 4th ranked first row.
In shape and size, shape and the size of power supply access point 3031 do not limit, and can be the electrical node of circular or square or strip, and its size needs rationally to arrange according to the coupled size of power supply.
In addition, the distance between every two row LED bases 3039 is greater than 1/4 of LED base 3039 length.In the distance of every row LED base 3039, owing to being provided with electric connection board 3035 between every two LED bases 3039, make the distance between every two LED bases 3039 be greater than 1/2 of LED base 3039 width.If LED chip 305, electric connection board 3035 and LED base 3039 are all in the situation of uniform setting, the average area of dissipation of each LED chip 305 will be greater than 2.8 times of LED chip 305 areas.But, according to actual needs, by the distance between reasonable arrangement LED base 3039, best value result should be made as: the average area of dissipation of each LED chip 305 is greater than 2-5 times of LED chip 305 areas.
Between every row LED chip 305, be interlaced arrangement, described herein interlocking refers to that arbitrary LED chip of first row and arbitrary LED chip of secondary series all do not overlap regardless of the laterally middle separated time or the longitudinally middle separated time that are this two LED chip.The LED chip 305 of first row first row is crisscross arranged with the LED chip 305 of its second row first row, if the lateral dimension of LED base 3039 is L, the distance between the center line of first row first row LED chip 305 and second row first row LED chip 305 center lines is S, and S >=L.Because LED chip 305, electric connection board 3035 and LED base 3039 all evenly arrange, all there is deviation distance S with each LED chip 305 of second row in each LED chip 305 of first row therefore; All there is deviation distance S in each LED chip 305 of each LED chip 305 of second row and the 3rd row; All there is deviation distance S in each LED chip 305 of each LED chip 305 of the 3rd row and the 4th row.So arrange, make between these 12 LED chips 305 no matter be laterally or longitudinally all widening distance each other, make the efficiently radiates heat area of each LED chip 305 increase to 3-7 times of LED chip 305 areas, the light interference that LED chip 305 sends simultaneously also reduces greatly, improves the light effect that of LED light source 300.
Between electric connection board 3035 and LED base 3039, be to interconnect by wire 3037, LED base 3039 either sides of the present embodiment are all connected on electric connection board 3035 with two wires 3037, the length of wire 3037 is 1.1-2 times of distance between two corresponding tie points, that is to say that wire 3037 also can keep the free stretch amount of distance between 0.1-1 times of tie point after connecting, if wire 3037 can not broken when guaranteeing the position of after long-time use LED base 3039 or electric connection board 3035 or alteration of form, can also reduce due to the excessive breakage that LED chip 305 is caused of wire 3037 pulling force.
On each electric connection board 3035, be provided with testing electrical property point 3036, for testing separately the electrical performance of LED chip 305.In the time need to testing the electrical performance of a certain LED chip 305, directly the two ends of test probe are placed on to testing electrical property on these LED chip 305 both sides electric connection boards 3035 and put the performance parameter of this LED chip 305 of test that 3036 places can accurate science.
In these LED light source 300 use procedures, power supply can supply power on LED substrate 303 by two power supply access points 3031.One end of boards 3033 is connected to power supply access point 3031, and the other end is optionally connected on electric connection board 3035, by electric connection board 3035 and external power source conducting.Electric connection board 3035 is connected by wire 3037 conductings with LED base 3039, and the electrode of LED chip 305 is welded on again on LED base 3039, and therefore all LED chips 305 have just formed a turning circuit by electric connection board 3035 and boards 3033.In the present embodiment, adopt two power supply access points 3031,12 LED chips 305 are connected to a conductive path by these two power supply access points 3031.Because series winding connects, the supply current of each LED chip 305 is identical, so the luminosity of these 12 LED chips 305 keeps unification.
In connected mode for circuit, can also change into the connected mode of four and three strings, now need to provide one end of 3033, four boards 3033 of eight boards to be connected to anodal power supply access point 3031, the other end is connected on first electric connection board 3035 of every row; One end of other four boards 3033 is connected to the power supply access point 3031 of negative pole, and the other end is connected on every row's the 4th electric connection board 3035.After connecting like this, form the turning circuit in parallel that three LED chips 305 of four routes form.Same mode, only need to change the quantity of boards 3033 and the on-position of boards 3033 and electric connection board 3035, in particular cases, also need to change the arrangement mode of LED base 3039 and electric connection board 3035, can be made into six and two strings, the circuit connecting mode of three and four strings.
Compared with prior art, LED light source 100,300 of the present utility model increases electric connection board 1035,3035 on the both sides of each LED chip 105,305, by electric connection board 1035,3035,105,305 conductings of all LED chips is connected.Distance between LED chip 105,305 that this integrated package becomes is strengthened, increase the efficiently radiates heat area of each LED chip 105,305, thereby guarantee the good heat-radiating effect of whole LED light source 100,300.Meanwhile, because the distance between LED chip 105,305 strengthens, the mutual uptake of LED chip 105,305 lateral emittings is reduced, improve light extraction efficiency.
On each electric connection board 1035,3035, be equipped with the testing electrical property point 1036 of LED chip 105,305,3036, after test probe is placed on testing electrical property point 1036,3036, can test separately each LED chip 105,305 electrical performance, avoid because the damage of single LED chip 105,305 causes the disabled drawback of whole LED light source 100,300, improve mass production and produce this LED light source product yield of 100,300 o'clock.
Adopt electric connection board 1035,3035 conduct electricity connect LED chip 105,, one end of wire 1037,3037 is connected to LED chip 105 at 305 o'clock, 305, one end is connected on electric connection board 1035,3035, but not prior art pass through wire 1037,3037 are directly electrically connected the connected mode of all LED chips 105,305.Thus, the radian of wire 1037,3037 and shape can remain at best shape, avoid between different LED base 1039,3039 and electric connection board 1035,3035 because the unmatched internal stress of thermal coefficient of expansion is broken wire 1037,3037.Simultaneously wire 1037,3037 reserved certain free elongation in the time of welding, prevents from changing due to LED base 1039,3039 or electric connection board 1035,3035 positions, malformation and the risk that causes wire 1037,3037 to be pulled off.
For LED light source 300, between LED chip 305, adopt the package position of staggered die bond, the efficiently radiates heat area of each LED chip 305 is increased, improve radiating effect.Also make the light that each LED chip 305 sends interfere reduction greatly simultaneously, improve the uniformity that LED light source 300 throws light on.In the time that whole conducting channel connects, can be by changing the link position of boards 3033 and electric connection board 3035, change the circuit connecting mode of whole integrated packaging LED chip 305, as can Gai Yi road the circuit connecting mode Wei Er road six of the 12 strings circuit connecting mode of going here and there, or change the circuit connecting mode that go here and there on four tunnels three into.The back panel wiring mode flexibility and changeability that makes whole LED light source 300, meets the user demand under various environment.And without picture now, need to change whole LED light source 300 and could change circuit connecting mode.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all any modifications of doing within principle of the present utility model, are equal to and replace and within improvement etc. all should comprise protection range of the present utility model.
Claims (10)
1. a LED light source, it comprises at least two LED chips that are packaged on LED substrate, it is characterized in that: the electrode of described each LED chip is connected on the electric connection board between LED chip.
2. LED light source as claimed in claim 1, is characterized in that: the electrode of LED chip is drawn separately from both sides respectively.
3. LED light source as claimed in claim 1, is characterized in that: the join domain of LED chip and electric connection board arranges the testing electrical property point of this LED chip.
4. LED light source as claimed in claim 1, is characterized in that: between LED chip and electric connection board, be connected by least one wire.
5. LED light source as claimed in claim 4, is characterized in that: the distance between the tie point that the tie point that LED chip is connected with wire to electric connection board and wire is connected is less than the length of wire.
6. the LED light source as described in claim 1-5 any one, is characterized in that: the rectangular array arrangement of LED chip on these at least two encapsulation and LED substrate.
7. the LED light source as described in claim 1-5 any one, is characterized in that: described LED chip is fixed on a kind of LED base, and this LED base and described electric connection board electrically conduct.
8. LED light source as claimed in claim 7, is characterized in that: the distance between every two adjacent LED bases is greater than 1/2 of LED base size.
9. the LED light source as described in claim 1-5 any one, it is characterized in that: it further comprises at least one group of boards being connected with external power source, described electric connection board forms at least one circuit that is electrically connected with described LED chip, and described boards selectivity is connected to this at least one electrical connection circuit.
10. the LED light source as described in claim 1-5 any one, is characterized in that: at least two LED chips are in column for this while arranging, arbitrary LED chip of first row and arbitrary LED chip of secondary series laterally in separated time and longitudinally in separated time all do not overlap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320787478.4U CN203690301U (en) | 2013-12-03 | 2013-12-03 | LED light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320787478.4U CN203690301U (en) | 2013-12-03 | 2013-12-03 | LED light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203690301U true CN203690301U (en) | 2014-07-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320787478.4U Expired - Fee Related CN203690301U (en) | 2013-12-03 | 2013-12-03 | LED light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203690301U (en) |
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2013
- 2013-12-03 CN CN201320787478.4U patent/CN203690301U/en not_active Expired - Fee Related
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20201203 |