CN104668810A - Novel lead-free welding material and scaling powder preparation method thereof - Google Patents
Novel lead-free welding material and scaling powder preparation method thereof Download PDFInfo
- Publication number
- CN104668810A CN104668810A CN201510046766.8A CN201510046766A CN104668810A CN 104668810 A CN104668810 A CN 104668810A CN 201510046766 A CN201510046766 A CN 201510046766A CN 104668810 A CN104668810 A CN 104668810A
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- China
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- scaling powder
- main part
- mass percent
- novel lead
- welding material
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention discloses a novel lead-free welding material and a scaling powder preparation method thereof. The novel lead-free welding material comprises a main material and scaling powder, and the main material comprises, by weight percentage, 8-12% of zinc, 0.5-2% of manganese and the balance of tin; the scaling powder comprises, by weight percentage, 2% of organic components and 98% of powdered main materials, namely metal powder, subjected to gas atomization technology treatment; the main materials and the scaling powder are in the weight percentage proportion of 80%:20%. Raw materials adopted are low in cost and equipment requirement, so that production cost can be lowered; technical problems about grain fitness size, distribution, size, oxidation level, uniformity and the like existing in the production process of tin-zinc-manganese lead-free alloy materials are solved, and the problem about performance index of electronic industry products is solved.
Description
Technical field
The invention belongs to technical field of nonferrous metal processing, be specifically related to a kind of stanniferous and the kamash alloy leadless welding material of zinc and the preparation method of scaling powder thereof.
Background technology
Along with the formal enforcement of the plumbous instruction of ROHS taboo in the electronics industry, the main lead-free that can substitute lead alloy material is exactly SAC.But the application difficult point of SAC material is not only that requirement reflow oven temperature is higher than original metal 25 DEG C, and its cost is also high than leypewter by 20%, the more important thing is that the raising of this temperature can reduce the stability exposing components and parts greatly.The fusing point of red brass eutectic alloy and the fusing point (183) of SnPb eutectic the most close, and soldering can be carried out when substantially not changing existing welding equipment and technique, paying attention to so Sn-Zn series lead-free solder receives people.But due to the activity of zinc large, easily to be oxidized, therefore the oxidation of zinc hinders the application of this alloy, Israel's leadless welding material researches and develops company's innovation and application micro-alloying technology, by adding the third element manganese to achieve the goal, can improve the oxidation resistance of zinc by adding manganese, but adding of manganese must be sought a kind of chemistry completely newly and assist to ensure its superperformance.
Summary of the invention
The object of the invention is, for above-mentioned the deficiencies in the prior art, to provide novel lead-free welding material, this welding material effectively can suppress the oxidation of zinc under the prerequisite keeping its eutectic temperature.
For achieving the above object, the technical solution used in the present invention is as follows:
A kind of novel lead-free welding material, comprises material of main part and scaling powder, wherein:
The mass percent of material of main part consists of the tin of the zinc of 8-12%, the manganese of 0.5-2% and surplus;
Scaling powder comprises the material of main part of organic principle and the powdered through Gas atomization techniques process, and its mass percent consists of the organic principle of 2% and the metal dust of 98%.
Further, main part also comprises antimony that mass percent is 0.05-0.8% and mass percent is the copper of 0.05-0.5%.
Further, the mass percent of material of main part consist of 10% zinc, 1.5% manganese, the antimony of 0.4%, the copper of 0.25% and surplus tin; The mass percent of scaling powder consists of the material of main part of the organic principle of 2% and the powdered process of 98%, and material of main part and scaling powder mass ratio are 80%:20%.
Further, described organic principle is rosin.
Further, described Gas atomization techniques adopts inert gas, and described gas pressure is 1.9-2.2MPa, and gas spray angle is 40-45 degree.
Further, the granularity of described powdered material is less than 100 μm.
Invention further provides a kind of preparation method of above-mentioned scaling powder, comprise the following steps:
1) according to the metal material composition that proportioning preparation is identical with material of main part composition and proportioning;
2) metal alloy being placed in gas atomization equipment adopts gas pressure to be 1.9-2.2MPa, and angle is be atomized under the condition of 40-45 degree;
3) by the metal material of powdered when 50-70 DEG C by ultrasonic disperse, with obtained metal dust;
4) metal dust is mixed by proportioning with organic principle, obtained scaling powder.
Further, step 1) and step 4) in mixing carry out all at normal temperatures.
The invention has the beneficial effects as follows: the cost of raw material of the present invention is cheap, low for equipment requirements, production cost can be reduced, the leadless welding material utilizing the solution of the present invention to produce solves the technical bottlenecks such as grain size size, branch's size, shape, oxidation level and the uniformity existed in tin zinc-manganese lead-free alloy Material Manufacturing Process, thus solves the performance indications problem of electronics industry series products.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is described in further detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
(1) embodiment 1
A kind of novel lead-free welding material, comprises material of main part and scaling powder, wherein: the mass percent of material of main part consist of the zinc of 8%, the manganese of 0.5% and 91.5% tin; Scaling powder comprises the material of main part of organic principle and the powdered through Gas atomization techniques process, its mass percent composition organic principle of 2% and the metal dust of 98%; The mass percent of material of main part and scaling powder is 80%:20%.
The preparation method of the scaling powder of embodiment 1, comprises the steps:
1) mass percent is consisted of the zinc of 8%, the manganese of 0.5% and 91.5% tin make alloy;
2) above-mentioned metal alloy is placed in gas atomization equipment to be atomized, by metal pulverization, wherein gas pressure is 1.9MPa, and angle is 40 degree;
3) by the metal of powdered at 50 DEG C of ultrasonic disperse, obtained metal dust;
4) ratio being 2%:98% in mass ratio by metal dust and rosin mixes, obtained scaling powder of the present invention.
(2) embodiment 2
A kind of novel lead-free welding material, comprises material of main part and scaling powder, wherein: the mass percent of material of main part consist of 10% zinc, 1.5% manganese, the antimony of 0.4%, the copper of 0.25% and 87.85% tin; Scaling powder comprises the material of main part of organic principle and the powdered through Gas atomization techniques process, its mass percent composition organic principle of 2% and the metal dust of 98%, organic principle is the ethanolic solution of the rosin being 30% containing mass fraction, and adds the ethylenediamine that mass fraction is 5%; The mass percent of material of main part and scaling powder is 80%:20%.
The preparation method of the scaling powder of embodiment 2, comprises the steps:
1) mass percent is consisted of the zinc of 10%, 1.5% manganese, the antimony of 0.4%, the copper of 0.25% and 87.85% tin make alloy;
2) above-mentioned metal alloy is placed in gas atomization equipment to be atomized, by metal pulverization, wherein gas pressure is 2.1MPa, and angle is 42 degree;
3) by the metal of powdered at 60 DEG C of ultrasonic disperse, obtained metal dust;
4) ratio being 2%:98% in mass ratio by metal dust and rosin mixes, obtained scaling powder of the present invention.
Copper can with rich zinc in solder mutually in the zinc atom of free state generates Cu-Zn compound, when fusing, because fusion temperature is lower, in alloy, there is Cu-Zn compound in a large number, decrease the oxidation of zinc atom on welding material surface.
Rosin flux has obvious corrosivity to red brass, and adding ethylenediamine can significantly fall low-alloyed corrosion rate.
Antimony contributes to brazing filler metal alloy and sprawls on masterbatch, adds the melting range of alloy, and antimony also contributes to the secondary oxidation and the scaling loss that form fine and close oxide-film stop solder on brazing filler metal alloy surface simultaneously.
(3) embodiment 3
A kind of novel lead-free welding material, comprises material of main part and scaling powder, wherein: the mass percent of material of main part consist of 12% zinc, 2% manganese, the antimony of 0.8%, the copper of 0.5% and 84.7% tin; Scaling powder comprises the material of main part of organic principle and the powdered through Gas atomization techniques process, its mass percent composition organic principle of 2% and the metal dust of 98%; The mass percent of material of main part and scaling powder is 80%:20%.
The preparation method of the scaling powder of embodiment 3, comprises the steps:
1) mass percent is consisted of the zinc of 12%, 2% manganese, the antimony of 0.8%, the copper of 0.5% and 84.7% tin make alloy;
2) above-mentioned metal alloy is placed in gas atomization equipment to be atomized, by metal pulverization, wherein gas pressure is 2.2MPa, and angle is 45 degree;
3) by the metal of powdered at 70 DEG C of ultrasonic disperse, obtained metal dust;
4) ratio being 2%:98% in mass ratio by metal dust and rosin mixes, obtained scaling powder of the present invention.
The performance of novel lead-free welding material provided by the invention and traditional welding material is as shown in table 1.
The performance comparison of table 1 novel lead-free welding material and traditional welding material
The foregoing is only preferred embodiment of the present invention, be not used for limiting practical range of the present invention; If do not depart from the spirit and scope of the present invention, the present invention is modified or equivalent to replace, in the middle of the protection domain that all should be encompassed in the claims in the present invention.
Claims (8)
1. a novel lead-free welding material, is characterized in that, comprises material of main part and scaling powder, wherein:
The mass percent of material of main part consists of the tin of the zinc of 8-12%, the manganese of 0.5-2% and surplus;
Scaling powder comprises the material of main part of organic principle and the powdered through Gas atomization techniques process, and its mass percent consists of the organic principle of 2% and the metal dust of 98%;
The mass percent of material of main part and scaling powder is 80%:20%.
2. novel lead-free welding material according to claim 1, is characterized in that, material of main part also comprises antimony that mass percent is 0.05-0.8% and mass percent is the copper of 0.05-0.5%.
3. novel lead-free welding material according to claim 1, is characterized in that, the mass percent of material of main part consist of 10% zinc, 1.5% manganese, the antimony of 0.4%, the copper of 0.25% and surplus tin; The mass percent of scaling powder consists of the material of main part of the organic principle of 2% and the powdered process of 98%, and material of main part and scaling powder mass ratio are 80%:20%.
4. novel lead-free welding material according to claim 1, is characterized in that, described organic principle is rosin.
5. novel lead-free welding material according to claim 1, is characterized in that, described Gas atomization techniques adopts inert gas, and gas pressure is 1.9-2.2MPa, and gas spray angle is 40-45 degree.
6. novel lead-free welding material according to claim 5, is characterized in that, the granularity of described powdered material is less than 100 μm.
7. a preparation method for the scaling powder according to any one of claim 1-6, is characterized in that, comprises the following steps:
1) according to the metal alloy that proportioning preparation is identical with material of main part composition and proportioning;
2) metal alloy being placed in gas atomization equipment adopts gas pressure to be 1.9-2.2MPa, and angle is be atomized under the condition of 40-45 degree;
3) by the metal material of powdered when 50-70 DEG C by ultrasonic disperse, with obtained metal dust;
4) metal dust is mixed by proportioning with organic principle, obtained scaling powder.
8., according to the preparation method of the scaling powder described in claim 7, it is characterized in that, step 1) and step 4) in mixing carry out all at normal temperatures.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510046766.8A CN104668810B (en) | 2015-01-29 | 2015-01-29 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
| PCT/CN2015/000867 WO2016119096A1 (en) | 2015-01-29 | 2015-12-04 | Lead-free welding material and method for preparing scaling powder thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510046766.8A CN104668810B (en) | 2015-01-29 | 2015-01-29 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN104668810A true CN104668810A (en) | 2015-06-03 |
| CN104668810B CN104668810B (en) | 2016-09-07 |
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| CN (1) | CN104668810B (en) |
| WO (1) | WO2016119096A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016119096A1 (en) * | 2015-01-29 | 2016-08-04 | 苏州天兼新材料科技有限公司 | Lead-free welding material and method for preparing scaling powder thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113199170B (en) * | 2021-04-25 | 2022-10-25 | 江苏海瑞电源有限公司 | Gel type storage battery soldering flux and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198117A (en) * | 1995-09-29 | 1998-11-04 | 松下电器产业株式会社 | Lead-free solder |
| CN1337293A (en) * | 2001-09-05 | 2002-02-27 | 北京工业大学 | Rare earth-containing tin-base lead-less brazing alloy and its prepn |
| US20040208779A1 (en) * | 2001-07-05 | 2004-10-21 | Ika Consulting Ltd. | Lead-free alloy |
| CN1651180A (en) * | 2005-02-03 | 2005-08-10 | 复旦大学 | Sn-zn or Sn-AgBi series leadless parent metal containing trace doped metal and its preparation method |
| CN1764515A (en) * | 2003-04-01 | 2006-04-26 | 千住金属工业株式会社 | Solder paste and printed board |
| CN102787256A (en) * | 2012-08-28 | 2012-11-21 | 苏州金仓合金新材料有限公司 | Environment-friendly tin-zinc-manganese alloy rod for welding and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
| JP2011156558A (en) * | 2010-01-30 | 2011-08-18 | Nihon Superior Co Ltd | Lead-free solder alloy |
| US9017446B2 (en) * | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| US10329642B2 (en) * | 2013-03-13 | 2019-06-25 | Nihon Superior Co., Ltd. | Solder alloy and joint thereof |
| CN104668810B (en) * | 2015-01-29 | 2016-09-07 | 苏州天兼新材料科技有限公司 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
-
2015
- 2015-01-29 CN CN201510046766.8A patent/CN104668810B/en active Active
- 2015-12-04 WO PCT/CN2015/000867 patent/WO2016119096A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198117A (en) * | 1995-09-29 | 1998-11-04 | 松下电器产业株式会社 | Lead-free solder |
| US20040208779A1 (en) * | 2001-07-05 | 2004-10-21 | Ika Consulting Ltd. | Lead-free alloy |
| CN1337293A (en) * | 2001-09-05 | 2002-02-27 | 北京工业大学 | Rare earth-containing tin-base lead-less brazing alloy and its prepn |
| CN1764515A (en) * | 2003-04-01 | 2006-04-26 | 千住金属工业株式会社 | Solder paste and printed board |
| CN1651180A (en) * | 2005-02-03 | 2005-08-10 | 复旦大学 | Sn-zn or Sn-AgBi series leadless parent metal containing trace doped metal and its preparation method |
| CN102787256A (en) * | 2012-08-28 | 2012-11-21 | 苏州金仓合金新材料有限公司 | Environment-friendly tin-zinc-manganese alloy rod for welding and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016119096A1 (en) * | 2015-01-29 | 2016-08-04 | 苏州天兼新材料科技有限公司 | Lead-free welding material and method for preparing scaling powder thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016119096A1 (en) | 2016-08-04 |
| CN104668810B (en) | 2016-09-07 |
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Effective date of registration: 20221026 Address after: No. 88, Zhenghe Middle Road, Ludu Town, Taicang City, Suzhou City, Jiangsu Province, 215400 Patentee after: SUZHOU JINCANG ALLOY NEW-MATERIAL Co.,Ltd. Address before: 215412 Changsheng formation, Ludong village, Ludu Town, Taicang City, Suzhou City, Jiangsu Province Patentee before: SUZHOU TIANQIAN NEW MATERIAL SCIENCE & TECHNOLOGY Co.,Ltd. |
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