CN104641332A - Transparent conductive film, method for manufacturing transparent conductive film, and touch panel - Google Patents
Transparent conductive film, method for manufacturing transparent conductive film, and touch panel Download PDFInfo
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- CN104641332A CN104641332A CN201380048490.6A CN201380048490A CN104641332A CN 104641332 A CN104641332 A CN 104641332A CN 201380048490 A CN201380048490 A CN 201380048490A CN 104641332 A CN104641332 A CN 104641332A
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- nesa coating
- layer
- protective seam
- electrically conducting
- transparent portion
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
Abstract
Provided is a transparent conductive film wherein transparent conductive sections, non-conductive sections, and wiring are appropriately protected, and at the same time, superb optical performance is produced. This transparent conductive film (20) is provided with the following: a transparent substrate (21); optical adjustment layers (22 and 23) provided on both surfaces of said transparent substrate; transparent conductive layers (8 and 9) provided on top of said optical adjustment layers; wiring (10 and 11) connected to said transparent conductive layers (8 and 9); and a protective layer (14) that covers a transparent conductive layer and wiring. Said protective layer (14) is between 1 and 50 [mu]m thick, inclusive. The parts of the transparent conductive film (20) where there is no wiring (10 or 11) have a transmission hue (b*) of 1.5 or less.
Description
Technical field
The present invention relates to the nesa coating being applicable to capacitance-type touch panel, the manufacture being suitable for this nesa coating electrically conducting transparent film manufacturing method and employ the touch panel of this nesa coating.
Background technology
In recent years, use touch panel as input media.Touch panel is the input media can operated machines by the display area touched in display frame.As touch panel, there will be a known the forms such as resistive film mode, capacitance-type.
Resistive film mode is the mode with 2 relative resistive films.Under executing alive state to the resistive film of side, press resistive film, the resistive film meeting be pressed and the resistive film relative with this side connect, and the voltage drop corresponding with the position pressed detected thus.Thus, operating position can be detected.
Capacitance-type is such mode: change by catching the static capacity between electrostatic conductive portion and conducting film such as finger tip, thus the position of detection finger tip etc.By configuring electrically conducting transparent portion and non-conductive portion in display frame, can from finger near electrically conducting transparent portion time static capacity change detect the position of finger tip.In addition, in capacitance-type, join nemaline nesa coating by stacked difference, can multiple spot detection be carried out, thus can realize operating more intuitively.
In touch panel as described above, the requirement etc. from design, requires to make the inconspicuous invisible measure of the shape in electrically conducting transparent portion and non-conductive portion.In addition, the protection of conducting film to touch panel and distribution is also required.In this case, such as total light transmittance or mist degree, optical characteristics through form and aspect b* and so on is required.
Such as, in the touch panel of electrostatic capacity type, propose the nesa coating (with reference to patent documentation 1) being applicable to the touch panel that visuality is improved.
Prior art document
Patent documentation
Patent documentation 1: No. WO2006/126604th, International Publication
Summary of the invention
The problem that invention will solve
Also there is no the touch panel of such capacitance-type: wherein, form electrically conducting transparent portion and non-conductive portion with invisible mode, and there is the double-sided conductive film structure of the conductive part of protection nesa coating, non-conductive portion and wiring part.
Therefore, in order to solve the problem, the object of the present invention is to provide a kind of while suitably protecting electrically conducting transparent portion, non-conductive portion and wiring part, the nesa coating of optical characteristics excellence.
The means of dealing with problems
Nesa coating of the present invention has: transparency carrier; Be arranged on the optical adjustment layer on the two sides of transparency carrier; Be arranged on the transparency conducting layer in each optical adjustment layer; The distribution be connected with transparency conducting layer; And be arranged on nesa coating at least side face on, the protective seam of coated transparency conducting layer and distribution.The thickness of protective seam is more than 1 μm less than 50 μm.Form the first sandwich construction by substrate layer, optical adjustment layer, transparency conducting layer and protective seam, through the first sandwich construction light be less than 1.5 through form and aspect b*.
In addition, touch panel of the present invention has above-mentioned nesa coating.
In the manufacture method of nesa coating of the present invention; the two sides of transparency carrier is formed electrically conducting transparent portion and non-conductive portion; and form the wiring part be connected with electrically conducting transparent portion, the face of at least side of nesa coating is formed the protective seam in coated electrically conducting transparent portion.
Invention effect
According to nesa coating of the present invention, by forming protective seam on the face of its at least side, in for touch panel, can protect by scratching the broken string etc. caused, and can suppress to be prepared through form and aspect b*.Thus, conducting film surface can be provided to obtain the capacitance-type touch panel protected.
Brief Description Of Drawings
[Fig. 1] Fig. 1 is for illustrating the schematic cross-section of an example of the nesa coating described in embodiment 1.
[Fig. 2] Fig. 2 for embodiment 1 is shown variation described in the schematic cross-section of an example of nesa coating.
[Fig. 3] Fig. 3 is the floor map of the nesa coating described in embodiment 1.
[Fig. 4] Fig. 4 is for illustrating the schematic cross-section of an example of the nesa coating described in embodiment 2.
[Fig. 5] Fig. 5 is the floor map of the nesa coating described in embodiment 2.
Embodiment
Below, the nesa coating described in embodiment is described.
(embodiment 1)
Fig. 1 is for illustrating the schematic cross-section of an example of the nesa coating described in embodiment 1.
Nesa coating 20 has: transparency carrier 21; The optical adjustment layer 22,23 that the two sides of transparency carrier 21 is arranged separately; The transparency conducting layer 8,9 that optical adjustment layer 22,23 is arranged separately; The distribution 10,11 be connected respectively with transparency conducting layer 8,9; And arrange on the face of the side of nesa coating 20, the protective seam 14 of coated transparency conducting layer 8 and distribution 10.
In the present embodiment, transparency carrier 21 is made up of base material 1 and the hard conating 2,3 that arranges on the two sides of base material 1.
Base material 1 is formed by the material with visible light permeability.Such as, base material can use: (1) unorganic glass, the transparent resin such as (2) polyolefin (tygon, polypropylene etc.), polyester (polyethylene terephthalate, polybutylene terephthalate, PEN etc.), polyamide (nylon 6, nylon66 fiber etc.), polyimide, polyarylate, polycarbonate, polyacrylate, polyethersulfone, polysulfones.In addition, base material 1 also can be by above-mentioned illustrative transparent resin tensionless winkler foundation/stretching after plastic foil.In addition, base material 1 also can be the stacked composite membrane of multiple material.
In addition, the thickness of base material 1 is preferably more than 10 μm in the scope of about less than 200 μm.But in nesa coating 20 of the present invention, the thickness of base material 1 is not limited within the scope of this.
In addition, also surface treatment can be carried out to the one or two sides of base material 1.By carrying out surface treatment, can bonding layer stacked on the surface of the substrate 1 securely.For surface treatment, the methods such as (such as) easy bonding process, Cement Composite Treated by Plasma, corona treatment, ozone treatment can be used.
Hard conating 2,3 is arranged on the surface of the substrate 1, can improve the physical strength of base material 1, wearing quality etc.As material therefor in hard conating 2,3, the material with visible light permeability can be used.Such as, following material can be used as the material of hard conating 2,3: the transparent resins such as the acrylic resins such as (1) esters of acrylic acid, acrylic amide, methyl acrylic ester, methacryl amine, (2) silicone based resin, (3) thermohardening type polyorganosiloxane resin.
As the formation method of hard conating 2,3, undertaken by the film forming method corresponding with the formation material of hard conating 2,3.Such as, hard conating 2,3 can be formed like this: using as major component above-mentioned resin and absorb ultraviolet material dissolves in a solvent thus prepare coating fluid, with die applicator, curtain coater, roll coater, reverse coater, gravure coater, knife type coater, bar coater, spin coater, micro-gravure coater etc. by this coating solution on base material, and make curing of coating by Ultraviolet radiation etc.
In addition, preferably, hard conating is arranged on the two sides of base material 1.In this case, by regulating the thickness of the hard conating of inside and outside both sides, the stress of both sides inside and outside nesa coating 20 can be adjusted to as best one can symmetrical.By adjusting the stress of inside and outside both sides, the generation etc. of distortion can be suppressed, and ELD 20 can be installed in touch panel well.But, also can form transparency carrier 21 by the base material 1 only arranging hard conating in one side, or by not arranging the base material 1 of hard conating to form transparency carrier 21.
In addition, the thickness of hard conating 2,3 is preferably more than 1 μm in the scope of about less than 10 μm.But the thickness of hard conating 2,3 is not limited to above-mentioned scope.
Transparency conducting layer 8,9 can by having visible light permeability and the material with electric conductivity is formed.As the material of transparency conducting layer 8,9, (such as) tin indium oxide (ITO:Indium Tin Oxide), zinc paste, carbon nano-tube, Graphene, Nano Silver, electroconductive polymer resin (resin containing having the quaternary ammonium salt electric conductivity monomer of mechanism of ionic conduction, the electrically conductive microparticle with electronic conduction mechanism, pi-conjugated class electroconductive polymer etc.) etc. can be used.
In addition, when ITO is used as the material of transparency conducting layer 8,9, the blooming of transparency conducting layer 8,9 is preferably in the scope of more than 30nm below 80nm.When the blooming of transparent electrode layer 8 is less than 30nm, film is thin, fully can not obtain electric conductivity.In addition, when the blooming of transparency conducting layer 8,9 is greater than 80nm, the transmitance of gained film is low, and optical characteristics reduces.But in the nesa coating 20 described in the present embodiment, when the film of ITO being formed pattern as aftermentioned thus form transparency conducting layer 8,9, the blooming of transparency conducting layer 8,9 is not limited to above-mentioned scope.
In the present embodiment, transparency conducting layer 8,9, after using transparent conductive material formation film, is formed by formed film is formed pattern with given shape.By forming pattern, in transparency conducting layer 8,9, form electrically conducting transparent portion 12 and do not have the non-conductive portion 13 of electric conductivity, wherein this non-conductive portion 13 is arranged between adjacent electrically conducting transparent portion 12.Electrically conducting transparent portion 12 forms the part that transparent conductive material is remaining after pattern, and non-conductive portion 13 is for eliminating the part after transparent conductive material by forming pattern.Such as, when nesa coating 20 is for touch panel, transparency conducting layer 8,9 becomes the transparency electrode of touch panel.Now, transparency conducting layer 8 arranges the striated electrically conducting transparent portion 12 extended along predetermined direction, and the striated electrically conducting transparent portion 12 extended along the direction vertical with this predetermined direction is set on transparency conducting layer 9.
In addition, optical adjustment layer 22,23 stacks gradually high refractive index layer 4,5 and low-index layer 6,7 from transparency carrier 21 side.By the layer that stacked refractive index is different, the reflected light making the interface of different layers phase reversal each other thus offset, can alleviate reflected light thus.Therefore, the reflected light sent from transparency carrier 21 side can be alleviated, and the transparent conductive patterns electrode (the electrically conducting transparent portion 12 of transparency conducting layer 8) near sightingpiston side can be made to be difficult to see.As an example, in the present embodiment, high refractive index layer 4,5 is burning compound layer, and low-index layer 6,7 is silicon oxide layer.It should be noted that, the high index of refraction in " high refractive index layer and low-index layer " and low-refraction are distinguished by the relative size of the refractive index of one deck and the refractive index of another layer.That is, comparatively speaking, the refractive index of the refractive index ratio low-index layer of high refractive index layer is high.In addition, because the bandwidth of the reflected light alleviated can be controlled by the refractive index of each layer and blooming, therefore, the physical film thickness of each layer bandwidth that can desirably block is to carry out suitable optical design and to determine.In addition, optical adjustment layer 22,23 also can be consisted of the layer of more than 3 layers.
Such as, when the refractive index of transparent base 1 and hard conating 2,3 more than 1.5 less than 1.7 scope in, use indium tin oxide films (blooming: more than 30nm below 80nm) as transparency conducting layer 8,9, by stacked high refractive index layer (refractive index: less than more than 1.7 2.6, blooming: more than 5nm below 25nm) and low-index layer (refractive index: less than more than 1.3 1.5, blooming: more than 50nm below 100nm), tin indium oxide distinctive yellow tone under visible light can be alleviated.As the combination of the material of the high refractive index layer and low-index layer that meet above-mentioned scope, include, for example high refractive index layer: niobium oxide (Nb
2o
5), low-index layer: monox (SiO
x" X is oxygen atomicity ") combination etc.As the material that can be used for high refractive index layer 4,5, except Nb
2o
5in addition, also ZnO, TiO can be enumerated
2, CeO
2, Sb
2o
5, SnO
2, Y
2o
3, La
2o
3, ZrO
2, Al
2o
3.
As the formation method of high refractive index layer 4,5 and low-index layer 6,7, can carry out according to the film forming method corresponding with the formation material of high refractive index layer and low-index layer.Such as, can use: (1) rubbing method such as serigraphy, ink jet printing; (2) magnetron sputtering method, irradiate the physical vacuum vapour deposition method (PVD) such as EB vapour deposition method of accelerated electron beam; The gas phase membrane formation process such as chemical vapour deposition technique (CVD), etc.Especially, because gas phase membrane formation process can be carried out tight control to thickness and can be adjusted to desired blooming, therefore preferably use gas phase membrane formation process.
Distribution 10,11 is connected with transparency conducting layer 8,9 at the edge part of nesa coating 20.Distribution 10,11 is configured on nesa coating 20 in not overlapping with the image display area of image display device mode, and wherein said image display device and nesa coating 20 combine.In the nesa coating 20 of the present embodiment, the material of distribution 10,11 can from having electric conductivity and suitably selecting the material of excellent in workability.Such as, the metals such as copper, silver, gold can be used as the material of distribution 10,11.
In addition, the thickness of distribution 10,11 is preferably more than 0.1 μm in the scope of about less than 2 μm.But the thickness of distribution 10,11 is not limited to this scope.
Protective seam 14 on the face of the side of ELD 20 to cover electrically conducting transparent portion 12, the mode of non-conductive portion 13 and distribution 10 arranges.Protective seam 14 is for the protection of electrically conducting transparent portion 12, non-conductive portion 13 and distribution 10.In the present embodiment, only protective seam 14 is set on the face of the side of nesa coating 20, but also protective seam 14 can be set on the two sides of ELD 20.In addition, by arranging protective seam 14, the difference of the optical characteristics in electrically conducting transparent portion 12 and non-conductive portion 13 can be reduced, electrically conducting transparent portion 12 and non-conductive portion 13 therefore can be made to be difficult to see.
Protective seam 14 can use has insulativity and the formation of the material of film-forming excellence.For the material of protective seam 14; such as can use: the acrylic resins such as (1) esters of acrylic acid, acrylic amide, methyl acrylic ester, methacryl amine; (2) silicone based resin; (3) thermohardening type polyorganosiloxane resin; (4) monox, etc.
The thickness of protective seam 14 preferably more than 1 μm about less than 50 μm.In addition, protective seam 14 through form and aspect b* preferably more than-1.0 about less than 0.5 scope in.For the ELD not having protective seam 14, because the material forming transparency conducting layer 8 causes overall with yellow hue, therefore become large through form and aspect b*.Therefore; by arranging through the protective seam 14 with slightly cyan adjusted of form and aspect b* within the scope of more than-1.0 less than 0.5 left and right; can suppressing nesa coating 20 entirety below 1.5 through form and aspect b* (do not have the part of distribution 10,11 through form and aspect b*), can yellow tone be suppressed.It should be noted that, refer to b* when representing through light color with L*a*b* color specification system (D65 light source, 2 ° of visuals field) through form and aspect b*.But the thickness of protective seam 14 is not limited to this scope.In addition, protective seam 14 to be more preferably more than-0.5 less than 0 through form and aspect b*.
As the formation method of protective seam 14, can carry out by the film forming method corresponding by the formation material with protective seam 14.Protective seam 14 can be formed like this: such as; using as major component above-mentioned resin and absorb ultraviolet material dissolves in a solvent thus prepare coating fluid; what this coating fluid was applied to protective seam 14 by die applicator, curtain coater, roll coater, reverse coater, gravure coater, knife type coater, bar coater, spin coater, micro-gravure coater etc. is formed on face, then makes curing of coating by Ultraviolet radiation etc. thus is formed.Or, also can adopt the mode of layered product, film formed in addition etc. is bonded on conducting surface as protective seam 14 and use.
Fig. 2 is for illustrating the schematic cross-section of the variation of the nesa coating described in embodiment 1.
Nesa coating 20 described in variation transparency carrier 21 base material 24 for duplexer this respect different from the example shown in Fig. 1.The duplexer that base material 24 described in variation is film substrate 15, optics adhesive linkage 17, film substrate 16 stack gradually.As film substrate 15,16, the film formed by the material identical with above-mentioned base material 1 can be used.In optics adhesive linkage 17, acrylic resin, silicone based resin, rubber resin can be used.In addition, the cementing agent of cementing agent or film-form or the liquid state with UV absorptive character can be used in optics adhesive linkage 17.The thickness of optics adhesive linkage 17 is preferably more than 1 μm in the scope of about less than 150 μm.By hard conating 2,3 stacked on the two sides of this base material 24, thus form transparency carrier 21.It should be noted that; owing to being layered in optical adjustment layer on transparency carrier 21 22,23 (high refractive index layer 4,5, low-index layer 6,7), transparency conducting layer 8,9 (electrically conducting transparent portion 12, non-conductive portion 13), distribution 10 and 11, protective seam 14 are the same with illustrated in fig. 1, and therefore the repetitive description thereof will be omitted.
The floor map of the nesa coating shown in Fig. 1 and 2 has been shown in Fig. 3.
Electrically conducting transparent portion 12, non-conductive portion 13 and wiring part 10,11 protected seam 14 cut off with outside, are therefore represented by dotted lines in fig. 2.Protective seam 14 with cover electrically conducting transparent portion 12, non-conductive portion 13, wiring part 10,11 mode formed.
Here, in the nesa coating 20 shown in Fig. 1 and Fig. 2, through by transparency carrier 21, optical adjustment layer 22,23, transparency conducting layer 8,9, the light of first cascade structure that forms of protective seam 14 be less than 1.5 through form and aspect b*.It should be noted that, refer to b* when representing through light color with L*a*b* color specification system (D65 light source, 2 ° of visuals field) through form and aspect b*.When nesa coating first cascade structure division (not having the part of distribution 10,11) be greater than 1.5 through form and aspect b*, the entirety of nesa coating is with yellow hue.If the nesa coating being greater than 1.5 through form and aspect b* is used for touch panel, then picture is with yellow hue, image quality deterioration.In order to suppress ELD 20 with tone, preferably, through first cascade structure light be more than-3.0 through form and aspect b*.In addition, first cascade structure be more preferably less than more than 0 1.0 through form and aspect b*.In this case, ELD 20 can be suppressed further with tone.
It should be noted that, in order to make nesa coating through form and aspect b* below 1.5, such as, also can adopt protective seam 14 be more than 2 layers duplexer and through interference with the formation that cyan is such.In addition, also can by forming protective seam 14 containing the material making protective seam 14 entirety with the material of cyan.
As mentioned above; nesa coating 20 described in the present embodiment is provided with the protective seam 14 for the protection of electrically conducting transparent portion 12, non-conductive portion 13 and distribution 10; and first cascade structure (that is, the part of distribution 10,11 is not set) be suppressed in less than 1.5 through form and aspect b*.Thus, according to the present embodiment, can be implemented in electrically conducting transparent portion 12, non-conductive portion 13 and distribution 10 obtain protection while, the ELD of optical characteristics excellence.
Nesa coating 20 shown in Fig. 1 and Fig. 2 can be used as the component parts of touch panel.By using nesa coating 20, can realize being improved by protective seam 14 mar resistance, the optical characteristics touch panel that is excellent, the inconspicuous capacitance-type in electrically conducting transparent portion 8,9 in addition such as high permeability/high transparent.
Below, the manufacture method of nesa coating of the present invention is described.
< transparency conducting layer forming step >
First, transparency carrier 21 forming the film of the formation material of transparency conducting layer 8,9, by forming pattern in this film, thus forming electrically conducting transparent portion 12 and non-conductive portion 13.
For the formation of film of formation material employing transparency conducting layer 8,9, according to the formation material of transparency conducting layer 8,9, corresponding film forming method can be used.Such as, can use: (1) rubbing method such as serigraphy, ink jet printing; (2) magnetron sputtering method, irradiate the physical vacuum vapour deposition method (PVD) such as EB vapour deposition method of accelerated electron beam; The gas phase membrane formation process such as chemical vapour deposition technique (CVD), etc.Especially, when using ITO in the material in electrically conducting transparent portion, because the words being formed ito thin film by gas phase membrane formation process are improved the tendency of electric density and electric conductivity, therefore preferably use gas phase membrane formation process.
Formed about the pattern in the film of the formation material of transparency conducting layer 8,9, according to the formation material of transparency conducting layer 8,9, corresponding pattern formation method can be used.Such as, the etching mask corresponding with desired pattern can be formed on film, by flooding in etching solution thus form pattern on film.As other pattern formation method, such as, can use serigraphy, photoetching process, nano impression, beamwriter lithography etc.In addition, as etching solution, such as, can use ferric chloride solution, chloroazotic acid, hydrochloric acid, oxalic acid etc.
< distribution forming step >
Then, form the film of the formation material of distribution 10,11, and form the distribution 10,11 be connected with electrically conducting transparent portion.
About the formation of film of formation material employing distribution 10,11, film forming method that can be suitable according to the formation materials'use of distribution 10,11.Such as, can use: (1) rubbing method such as serigraphy, ink jet printing; (2) magnetron sputtering method, irradiate the physical vacuum vapour deposition method (PVD) such as EB vapour deposition method of accelerated electron beam; The gas phase membrane formation process such as chemical vapour deposition technique (CVD), etc.In addition, also can form pattern on the film that distribution forms material, thus in one deck, form many distributions.
Formed about the pattern on the film of the formation material of distribution 10,11, can material selected by distribution 10,11, use suitable pattern formation method.Such as, the etching mask corresponding to desired pattern can be formed on film, and flood in etching solution thus form pattern on film.As other formation patterning method, (such as) serigraphy, photoetching process, nano impression, beamwriter lithography etc. can be used.In addition, as etching solution, (such as) ferric chloride solution, chloroazotic acid, hydrochloric acid, oxalic acid etc. can be used.
< protective seam forming step >
Then, form the film of formation material of protective seam 14, and to cover electrically conducting transparent portion 12, the mode of non-conductive portion 13 and distribution 10 forms protective seam 14.
Film about the formation material employing protective seam 14 is formed, can material selected by protective seam 14, uses suitable film forming method.Such as, the Method for bonding such as (1) rubbing method such as serigraphy, ink jet printing, (2) stacked processing can be used, etc.
It should be noted that, because transparency conducting layer and distribution need to be formed on the two sides of transparency carrier 21, therefore respectively in above-mentioned transparency conducting layer forming step and distribution forming step, transparency conducting layer and distribution are formed to the two sides of transparency carrier 21.In this case, the order that the film in each step is formed and pattern is formed can be determined aptly according to adopted film forming method and pattern formation method.
In addition, optical adjustment layer 22,23 can be formed like this: by known multilayer film formation method, from transparency carrier 21 side, carry out the film forming of the film of high refractive index layer 4,5 and the film of low-index layer 6,7 successively.
In addition, as the nesa coating 20 of Fig. 2, when the duplexer be bonded by 2 film substrates 15,16 is as base material, after can forming hard conating, optical adjustment layer, transparency conducting layer, distribution on each film substrate 15 and 16, through optics adhesive linkage 17, film substrate 15 and 16 is bonded.In this case, protective seam 14 both can be formed, also can be formed after bonding before the bonding of film substrate 15 and 16.
(embodiment 2)
Fig. 4 is for showing the schematic cross-section of an example of the nesa coating described in embodiment 2.
Nesa coating 30 described in the present embodiment is on the opposing face being provided with the face of protective seam 14 of the nesa coating 20 described in embodiment 1, further stacked optics adhesive linkage 31 and cover-plate glass 32.Optics adhesive linkage 31 can use acrylic resin, silicone based resin, rubber resin.In addition, optics adhesive linkage 31 also can use the cementing agent of cementing agent or film-form or the liquid state with UV absorptive character.It should be noted that; because the transparency carrier 21 that nesa coating 30 has, optical adjustment layer 22 and 23 (high refractive index layer 4,5; low-index layer 6,7), transparency conducting layer 8,9 (electrically conducting transparent portion 12, non-conductive portion 13), distribution 10 and 11 and identical with illustrated by embodiment 1 (Fig. 1) of protective seam 14, therefore the repetitive description thereof will be omitted.
Fig. 5 is for illustrating the schematic cross-section of the variation of the nesa coating described in embodiment 2.
Owing to employing the base material of the base material 24 identical with base material illustrated in fig. 3 as transparency carrier 21, the nesa coating 30 therefore described in variation is different from the example shown in Fig. 4.Owing to illustrating in the variation of embodiment 1, therefore omitted the explanation about this base material 24.
Here; in the nesa coating 30 shown in Fig. 4 and Fig. 5; by transparency carrier 21, optical adjustment layer 22,23, transparency conducting layer 8,9, the part that is laminated of protective seam 14 is called first cascade structure, and the part that optics adhesive linkage 31 and cover-plate glass 32 are laminated is called second layer stack structure.In the formation of Fig. 4 and Fig. 5, through first cascade structure and second layer stack structure light be less than 2.5 through form and aspect b*.It should be noted that, refer to b* when representing through light color with L*a*b* color specification system (D65 light source, 2 ° of visuals field) through form and aspect b*.First cascade structure and second layer stack structure overlap part (that is, not having the part of distribution 10,11) be greater than 2.5 through form and aspect b* when, the entirety of nesa coating is with yellow hue.If the nesa coating being greater than 2.5 through form and aspect b* is used for touch panel, then picture is with yellow hue, image quality deterioration.It should be noted that, in order to make nesa coating through form and aspect b* below 2.5, such as, also can adopt protective seam 14 be more than 2 layers duplexer and through interference with the formation that cyan is such.In addition, also can by containing making protective seam 14 entirety with the material of the such material of cyan to form protective seam 14.In order to suppress ELD 20 with tone, preferably, through first cascade structure and second layer stack structure light through form and aspect b* more than-3.0.In addition, first cascade structure through form and aspect b* more preferably more than 0 less than 2.0.In this case, ELD 20 can be suppressed further with tone.
It should be noted that; nesa coating 30 described in embodiment 2 can manufacture like this: according to the manufacture method illustrated by embodiment 1; transparency carrier 21 is formed optical adjustment layer 22 and 23, transparency conducting layer 8 and 9, distribution 10 and 11, protective seam 14; then with on the face of protective seam 14 opposite side, the adhesive cover glass sheet 32 through optics adhesive linkage 31.
As mentioned above, the face of the side of the nesa coating 30 described in the present embodiment is provided with the protective seam 14 for the protection of electrically conducting transparent portion 12, non-conductive portion 13 and distribution 10, and on the face of opposite side through optics adhesive linkage 31 adhesive cover glass sheet 32.But, the laminated portions (that is, the part of distribution 10,11 is not set) of above-mentioned first cascade structure and second layer stack structure be suppressed in less than 2.5 through form and aspect b*.Thus, according to the present embodiment, while protection electrically conducting transparent portion 12, non-conductive portion 13 and distribution 10, the ELD of optical characteristics excellence can be obtained.
Nesa coating 30 shown in Fig. 4 and Fig. 5 can be used as the component parts of touch panel.By using nesa coating 30, the optical characteristics such as the mar resistance because of protective seam 14 is improved, high permeability/high transparent touch panel that is excellent, the inconspicuous capacitance-type in electrically conducting transparent portion 8,9 in addition can be obtained.
Embodiment
< embodiment 1>
First, coating resin on the two sides of base material, forms bottom hard conating and top hard conating.
Base material employs the pet film (PET) that thickness is 50 μm.In addition, the thickness of bottom hard conating is 1.5 μm.In addition, the thickness of above-mentioned hard conating is 1.5 μm.
Then, top hard conating forms high refractive index layer.High refractive index layer material used is niobium oxide (Nb
2o
5).In addition, in the formation of high refractive index layer, magnetron sputtering method is employed.
Then, high refractive index layer forms low-index layer.Monox is employed in the material of low-index layer.In addition, in the formation of low-index layer, magnetron sputtering method is employed.
Then, low-index layer forms transparent conductive patterns electrode.Transparent conductive patterns electrode material used is the tin indium oxide (ITO) containing 5wt% tin oxide.In addition, form ito thin film by magnetron sputtering method, by the etching mask that serigraphy formation is corresponding with pattern, and by flooding in etching solution thus forming transparent conductive patterns electrode.Now, the pattern width in electrically conducting transparent portion is 5mm, and the pattern width in non-conductive portion is 70 μm.In addition, etching solution employs ferric chloride solution.
Then, the distribution be connected with electrically conducting transparent portion is formed.Distribution material used is copper.In addition, formed the film of copper by magnetron sputtering method, by the etching mask that serigraphy formation is corresponding with pattern, and by flooding in etching solution thus the distribution of formation lower floor.Now, etching solution employs sodium persulfate aqueous solution.In addition, the Wiring pattern of lower floor's distribution is set to the Wiring pattern be connected with electrically conducting transparent portion pattern and linear pattern.
Then, with cover electrically conducting transparent portion, non-conductive portion, distribution mode form protective seam.Protective seam material used is acrylic resin.In addition, in the formation of protective seam, employ micro-gravure coater, and the thickness of protective seam is 1.0 μm.
Through above step, manufacture the nesa coating described in embodiment 1.The blooming of high index layer/low index layer/each layer in electrically conducting transparent portion that manufactured nesa coating has is as described below:
High refractive index layer: 12nm, low-index layer: 74nm, electrically conducting transparent portion: 40nm.
< comparative example 1>
By the condition identical with embodiment 1, base material defines hard conating, high refractive index layer, low-index layer, electrically conducting transparent portion, non-conductive portion and distribution, it can be used as the nesa coating described in comparative example 1.In the nesa coating of comparative example 1, protective seam is not set.
The evaluation > of < embodiment 1 and comparative example 1
Total light transmittance (JIS-K7105) is carried out to embodiment 1 and comparative example 1, when representing with L*a*b* color specification system (D65 light source, 2 °, the visual field) through form and aspect b*, scoring test, pencil hardness test (JIS-K5600).
The total light transmittance (JIS-K7105) in the conductive pattern region (not having the region of distribution) of the nesa coating of embodiment 1 is 90.6%, be 1.5 through form and aspect b*, can obtain that yellow hue is few, high permeability/high transparent and the inconspicuous nesa coating of pattern in electrically conducting transparent portion.Further, in the nesa coating of embodiment 1, even if also do not confirm cut in pencil hardness test (pencil hardness H, 500g loading).On the other hand, the total light transmittance (JIS-K7105) in the conductive pattern region (not having the region of distribution) of the nesa coating of comparative example 1 is 90.0%, be 1.8 through form and aspect b*, with yellow hue.In addition, the nesa coating of comparative example has confirmed cut in pencil hardness test (pencil hardness H, 500g loading).
< embodiment 2>
Under the same conditions as example 1; base material is formed hard conating, high refractive index layer, low-index layer, electrically conducting transparent portion, non-conductive portion, distribution and protective seam; then with on the face of protective seam opposite side; through the optics adhesive linkage that thickness is 100 μm; bond thickness is the cover-plate glass of 500 μm, and using this as the nesa coating described in embodiment 2.
< comparative example 2>
Under the same conditions as example 1, base material is formed hard conating, high refractive index layer, low-index layer, electrically conducting transparent portion, non-conductive portion, distribution, then be the optics adhesive linkage of 100 μm through thickness, bond thickness is the cover-plate glass of 500 μm, and using this as the nesa coating described in comparative example 2.In the nesa coating of comparative example 2, protective seam is not set.
The evaluation > of < embodiment 2 and comparative example 2
Total light transmittance (JIS-K7105) is carried out to embodiment 2 and comparative example 2, when representing with L*a*b* color specification system (D65 light source, 2 °, the visual field) through form and aspect b*, scoring test, pencil hardness test (JIS-K5600).
The total light transmittance (JIS-K7105) in the conductive pattern region (not having the region of distribution) of the nesa coating of embodiment 2 is 90.6%, be 2.5 through form and aspect b*, can obtain that yellow hue is few, high permeability/high transparent and the inconspicuous nesa coating of pattern in electrically conducting transparent portion.Further, even if the nesa coating of embodiment 1 does not also confirm cut in pencil hardness test (pencil hardness H, 500g loading).On the other hand, the total light transmittance (JIS-K7105) in the conductive pattern region (not having the region of distribution) of the nesa coating of comparative example 1 is 90.0%, be 3.0 through form and aspect b*, with yellow hue.In addition, the nesa coating of comparative example has confirmed cut in pencil hardness test (pencil hardness H, 500g loading).
Industrial applicibility
Nesa coating of the present invention may be used for using in the wide spectrum of capacitance-type touch panel.Such as, can be used for forming the touch panel of guidance panel of the ATM of financial institution, electronic equipment (duplicating machine, facsimile recorder, auto-navigation system, other household electrical appliances etc.), portable data assistance (mobile phone, smart mobile phone, dull and stereotyped PC etc.), the trip of e-book terminal, hand terminal, portable music player, vending machine etc.
Symbol description
1 base material
2,3 hard conatings
4,5 high refractive index layers
6,7 low-index layers
8,9 transparency conducting layers
10,11 distributions
12 electrically conducting transparent portions
13 non-conductive portions
14 protective seams
20 nesa coatings
21 transparency carriers
22,23 optical adjustment layer
24 base materials
Claims (10)
1. a nesa coating, has:
Transparency carrier;
Be arranged on the optical adjustment layer on the two sides of described transparency carrier;
Be arranged on the transparency conducting layer in optical adjustment layer described in each;
The distribution be connected with described transparency conducting layer; And
Be arranged on the protective seam of on the face of at least side of described nesa coating, coated described transparency conducting layer and described distribution,
The thickness of described protective seam is more than 1 μm less than 50 μm,
The first sandwich construction is formed by described substrate layer, described optical adjustment layer, described transparency conducting layer, described protective seam,
Through described first sandwich construction light be less than 1.5 through form and aspect b*.
2. nesa coating according to claim 1, also has the second sandwich construction, described second sandwich construction by be arranged on described nesa coating at least side face on optics adhesive linkage and the cover-plate glass be arranged on described optics adhesive linkage form,
Through described first sandwich construction and described second sandwich construction light be less than 2.5 through form and aspect b*.
3. nesa coating according to claim 1, is characterized in that, by being arranged on the pattern of the described transparency conducting layer on the two sides of described transparency carrier, defines electrically conducting transparent portion and non-conductive portion.
4. nesa coating according to claim 3, is characterized in that, the described protective seam of described nesa coating is formed to cover described electrically conducting transparent portion, described non-conductive portion and described electrode wiring.
5. nesa coating according to claim 1, is characterized in that, from described transparency carrier side, stacks gradually burning compound layer and silicon oxide layer thus forms described optical adjustment layer.
6. nesa coating according to claim 1, is characterized in that, stacks gradually film substrate, optics adhesive linkage and optical thin film thus forms described transparency carrier.
7. nesa coating according to claim 1, is characterized in that, the wiring width of described electrode wiring is more than 10 μm less than 40 μm.
8. a touch panel, has nesa coating according to claim 1.
9. a manufacture method for nesa coating, its be have on the two sides of transparency carrier electrically conducting transparent portion and the manufacture method of nesa coating with electrode wiring, wherein,
The two sides of described transparency carrier is formed described electrically conducting transparent portion and non-conductive portion,
Form the wiring part be connected with described electrically conducting transparent portion,
The face of at least side of described nesa coating is formed the protective seam in coated described electrically conducting transparent portion.
10. the manufacture method of nesa coating according to claim 9, wherein, the face of the side of described nesa coating bonds optics adhesive linkage and cover-plate glass further.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012210049 | 2012-09-24 | ||
| JP2012-210048 | 2012-09-24 | ||
| JP2012210048 | 2012-09-24 | ||
| JP2012-210049 | 2012-09-24 | ||
| JP2013-066164 | 2013-03-27 | ||
| JP2013066164 | 2013-03-27 | ||
| PCT/JP2013/005588 WO2014045595A1 (en) | 2012-09-24 | 2013-09-20 | Transparent conductive film, method for manufacturing transparent conductive film, and touch panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104641332A true CN104641332A (en) | 2015-05-20 |
Family
ID=50340930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380048490.6A Pending CN104641332A (en) | 2012-09-24 | 2013-09-20 | Transparent conductive film, method for manufacturing transparent conductive film, and touch panel |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2014045595A1 (en) |
| CN (1) | CN104641332A (en) |
| TW (1) | TWI581162B (en) |
| WO (1) | WO2014045595A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104966551A (en) * | 2015-05-30 | 2015-10-07 | 汕头万顺包装材料股份有限公司 | ITO conductive film with copper-plated surface |
| CN106775073A (en) * | 2016-12-02 | 2017-05-31 | 东莞市平波电子有限公司 | A kind of sensor glass adds safety glass structure touch-screen and preparation method thereof |
| TWI643114B (en) * | 2018-01-08 | 2018-12-01 | 友達光電股份有限公司 | A touch display panel and a method of mending thereof |
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| TWI570608B (en) * | 2015-03-20 | 2017-02-11 | 禾瑞亞科技股份有限公司 | Pressure sensing and touch sensitive panel, pressure sensing method, pressure sensing electronic device and control unit thereof |
| JP6626759B2 (en) * | 2016-03-29 | 2019-12-25 | 富士フイルム株式会社 | Conductive film, touch panel and electronic device |
| US10705268B2 (en) | 2018-06-29 | 2020-07-07 | Applied Materials, Inc. | Gap fill of imprinted structure with spin coated high refractive index material for optical components |
| TWI767296B (en) * | 2020-08-13 | 2022-06-11 | 大陸商天材創新材料科技（廈門）有限公司 | Transparent conductive film and manufacturing method thereof |
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| TWI643114B (en) * | 2018-01-08 | 2018-12-01 | 友達光電股份有限公司 | A touch display panel and a method of mending thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014045595A1 (en) | 2014-03-27 |
| JPWO2014045595A1 (en) | 2016-08-18 |
| TW201413556A (en) | 2014-04-01 |
| TWI581162B (en) | 2017-05-01 |
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