CN104640349A - Improved thick copper foil printing board structure - Google Patents
Improved thick copper foil printing board structure Download PDFInfo
- Publication number
- CN104640349A CN104640349A CN201310556267.4A CN201310556267A CN104640349A CN 104640349 A CN104640349 A CN 104640349A CN 201310556267 A CN201310556267 A CN 201310556267A CN 104640349 A CN104640349 A CN 104640349A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- printing board
- thick copper
- foil printing
- board structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses an improved thick copper foil printing board structure. The improved thick copper foil printing board structure comprises a square thick copper foil printing board circuit graph, and four corners of the square thick copper foil printing board circuit graph are arc-shaped, approximate to circular. In addition, curvature is increased to the greatest extent, edge length of copper sheet is decreased, and the problem of copper sheet peeling during high-temperature tin coating is solved.
Description
Technical field
The present invention relates to a kind of heavy copper cladding printed circuit board structure-improved, be generally used in the thick printed board being greater than 2 ounces of copper.
Background technology
What many printing board surface processing modes adopted is tin spray process, sprays tin or lead-free tin spray than if any lead, but when printed board plate face copper thickness reaches more than 2 ounces, often surperficial copper sheet peeling can occur, thus affect product quality in spray tin process.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of heavy copper cladding printed circuit board structure-improved, effectively can solve copper sheet in high temperature spray tin process and peeling off problem.
The present invention in order to the technical scheme solving its technical problem and adopt is: a kind of heavy copper cladding printed circuit board structure-improved, comprises the circuitous pattern of square heavy copper cladding printed circuit board, and four angles of the circuitous pattern of described square heavy copper cladding printed circuit board are curved.
The invention has the beneficial effects as follows: by changing the edge designs of circuitous pattern square in printed board, making it be approximately circular, and adding deep camber as far as possible, thus decreasing copper sheet edge length, solve the problem that in high temperature spray tin process, copper sheet is peeled off.
Accompanying drawing explanation
Fig. 1 is this existing printed board structural representation;
Fig. 2 is printed board structural representation of the present invention.
Embodiment
By reference to the accompanying drawings, elaborate to the present invention, but protection scope of the present invention is not limited to following embodiment, the simple equivalence namely in every case done with the present patent application the scope of the claims and description changes and modifies, and all still belongs within patent covering scope of the present invention.
A kind of heavy copper cladding printed circuit board structure-improved, as shown in Figure 2, comprise the circuitous pattern of square heavy copper cladding printed circuit board 1, four angles of the circuitous pattern of this square heavy copper cladding printed circuit board 1 are curved, namely be approximately circular, and deep camber can be added as far as possible, thus decrease copper sheet edge length, solve the problem that in high temperature spray tin process, copper sheet is peeled off.
Claims (1)
1. a heavy copper cladding printed circuit board structure-improved, comprises the circuitous pattern of square heavy copper cladding printed circuit board, it is characterized in that: four angles of the circuitous pattern of described square heavy copper cladding printed circuit board (1) are curved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310556267.4A CN104640349A (en) | 2013-11-11 | 2013-11-11 | Improved thick copper foil printing board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310556267.4A CN104640349A (en) | 2013-11-11 | 2013-11-11 | Improved thick copper foil printing board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640349A true CN104640349A (en) | 2015-05-20 |
Family
ID=53218518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310556267.4A Pending CN104640349A (en) | 2013-11-11 | 2013-11-11 | Improved thick copper foil printing board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104640349A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201201562Y (en) * | 2008-04-03 | 2009-03-04 | 郭锡钦 | Automobile voltage-stabilizing apparatus |
| CN201213328Y (en) * | 2008-07-08 | 2009-03-25 | 常州澳弘电子有限公司 | PCB board having round corner |
| CN201657502U (en) * | 2010-03-01 | 2010-11-24 | 番禺得意精密电子工业有限公司 | Printed circuit board |
| CN202143296U (en) * | 2011-07-13 | 2012-02-08 | 龚晓刚 | PCB with round chamfers |
| CN203387776U (en) * | 2013-07-12 | 2014-01-08 | 广东生益科技股份有限公司 | Printed circuit board |
-
2013
- 2013-11-11 CN CN201310556267.4A patent/CN104640349A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201201562Y (en) * | 2008-04-03 | 2009-03-04 | 郭锡钦 | Automobile voltage-stabilizing apparatus |
| CN201213328Y (en) * | 2008-07-08 | 2009-03-25 | 常州澳弘电子有限公司 | PCB board having round corner |
| CN201657502U (en) * | 2010-03-01 | 2010-11-24 | 番禺得意精密电子工业有限公司 | Printed circuit board |
| CN202143296U (en) * | 2011-07-13 | 2012-02-08 | 龚晓刚 | PCB with round chamfers |
| CN203387776U (en) * | 2013-07-12 | 2014-01-08 | 广东生益科技股份有限公司 | Printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150520 |
|
| RJ01 | Rejection of invention patent application after publication |