CN104637857B - Work treatment installation - Google Patents
Work treatment installation Download PDFInfo
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- CN104637857B CN104637857B CN201310553944.7A CN201310553944A CN104637857B CN 104637857 B CN104637857 B CN 104637857B CN 201310553944 A CN201310553944 A CN 201310553944A CN 104637857 B CN104637857 B CN 104637857B
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- 238000009434 installation Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 113
- 230000004308 accommodation Effects 0.000 claims abstract description 11
- 238000012545 processing Methods 0.000 abstract description 12
- 239000007789 gas Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 8
- 239000007921 spray Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Present invention discloses a kind of Work treatment installations, comprising: process cavity and Workpiece carrier mechanism, wherein Workpiece carrier mechanism includes support shaft, big chuck, several small chucks, supporting plate, one group of pillar, first driving device and third driving device.Big chuck is contained in process cavity, and bottom and side wall surround accommodation space.Several small chucks are contained in the accommodation space of big chuck, and each small chuck has chuck main body, and top offers accommodating chamber downwards to accommodate workpiece.By configuring several small chucks, when needing while processing has the workpiece of identical or different size and shape, the small chuck of the accommodating chamber with corresponding size and shape need to be only selected, and small chuck is placed in the accommodation space of big chuck, without replacing entire big chuck, therefore, Work treatment installation of the present invention using it is upper it is more convenient flexibly, structure is simple, can handle multi-disc workpiece simultaneously, work pieces process efficiency is improved, work pieces process cost is reduced.
Description
Technical field
The present invention relates to Work treatment installation more particularly to a kind of Work treatment installations that can handle multi-disc workpiece simultaneously.
Background technique
With semicon industry competition, in semiconductor technology process, in addition to technique processing quality
Having outside strict demand, each producer is also constantly seeking to improve technique processing efficiency and is reducing the new way of technique processing cost, this
Kind new way includes improving processing unit (plant) and/or improvement process flow.
Such as Chinese patent application CN200810126565.9 disclose it is a kind of can with the device of the multiple substrates of batch machining,
The device includes chamber body, three or more support columns and the multiple support teeth extended from three or more support columns, adjacent branch
It supports between cog and forms the line of rabbet joint to support substrate.When processing substrate, multiple substrates are placed in chamber body, and in a substantially parallel manner
Arrange multiple substrate.The device is compared to can only once process the device of a piece of workpiece, although improving work pieces process efficiency,
But when this stacked processing unit (plant) being used to process multiple substrates, substrate is supplied from the side of device and flowed through to gas, causes
Substrate surface treatment uniformity is difficult to control, in addition, the by-product or pollutant of the attachment of upper substrate surface are easy to influence lower layer
The processing of substrate is fallen on underlying basal.
In order to solve above-mentioned apparatus, Chinese patent application CN201010180970.6 discloses one kind
Board, the board include reaction cavity, rotating seat, chip-bearing disc, heater and jet thrust.Reaction cavity has opening.Rotation
Swivel base is set in reaction cavity.Chip-bearing disc is set on rotating seat, and rotating seat can drive crystal chip bearing disc spins.Chip is held
Load plate includes multiple supporting regions of at least two different-diameters, and on the surface of chip-bearing disc, these supporting regions are applicable in right
Multiple chips should be loaded.Heater is set to the lower section of chip-bearing disc, and is located in rotating seat.Jet thrust is covered on reaction cavity
Opening on, to discharge reaction gas on the surface towards chip-bearing disc.Though the board is effectively utilized making for chip-bearing disc
Replacement need to be corresponded to achieve the purpose that improve production capacity, reduce cost, however when needing to process different wafer sizes with space
Entire chip-bearing disc, therefore, the board are in actual use, not convenient enough, flexible.
Summary of the invention
The object of the present invention is to provide a kind of easy to use, flexible, and structure is simple, can handle multi-disc workpiece simultaneously
Work treatment installation.
To achieve the above object, Work treatment installation proposed by the present invention, comprising: process cavity and Workpiece carrier mechanism,
The Workpiece carrier mechanism includes:
Support shaft, the support shaft run through the bottom wall of process cavity, and one end of support shaft is located in process cavity, support shaft
The other end be located at process cavity bottom wall lower section；
Big chuck, the big chuck are fixed at one end of support shaft, and big chuck is supported by support shaft, big chuck receiving
In process cavity, there is big chuck bottom and the side wall to be formed that raises upward along bottom, the bottom of big chuck and side wall to surround appearance
Receive space, the bottom of big chuck offers the through-hole that several groups run through kilocalorie pan bottom；
Several small chucks, several small chucks are contained in the accommodation space of big chuck, and each small chuck correspondence is placed in
Above one group of through-hole of big chuck, each small chuck has a chuck main body, the top of chuck main body offer downwards accommodating chamber with
Accommodate workpiece, the chuck main body of small chuck offers one group of perforation, group perforation respectively with the accommodating chamber of small chuck and big chuck
Corresponding one group of through-hole connection；
Supporting plate, the supporting plate are arranged in parallel in below the bottom wall of process cavity, and the bottom wall of supporting plate and process cavity, which seals, to be connected
It connects；
One group of pillar, this group of pillar can be contained in the one group of through-hole and corresponding with this group of through-hole small chuck of big chuck
In perforation, the bottom end of each pillar is each passed through the bottom wall of process cavity and is fixedly connected with supporting plate；
First driving device, the first driving device and support shaft are located at the company of one end below the bottom wall of process cavity
It connects, first driving device drives support shaft rotation, to drive kilocalorie disc spins；And
Third driving device, the third driving device are connect with supporting plate, third driving device drive supporting plate rise or under
Drop, so that pillar be driven to rise or fall in process cavity.
In one embodiment, the size and shape of the accommodating chamber of small chuck and the size and shape of workpiece are consistent.
In one embodiment, several small chucks are independent of one another, and each small chuck carries independent workpiece, can be according to workpiece
Size and shape replaces small chuck.
In one embodiment, several small chucks are independent of one another, and each small chuck carries independent workpiece, each small chuck carrying
The size and shape of workpiece can be identical or different.
In conclusion the present invention is by configuring several small chucks, when needing processing simultaneously with identical or different size and
When the workpiece of shape, the small chuck of the accommodating chamber with corresponding size and shape only need to be selected, and small chuck is placed in kilocalorie
The accommodation space of disk, without replacing entire big chuck, therefore, compared with the prior device, Work treatment installation of the present invention exists
Using upper more convenient, more flexible, and Work treatment installation structure of the present invention is simple, can handle multi-disc workpiece simultaneously, improve
Work pieces process efficiency reduces work pieces process cost.
Detailed description of the invention
Fig. 1 discloses the schematic diagram of the section structure of the first embodiment of Work treatment installation of the present invention.
Fig. 2 discloses schematic diagram when Work treatment installation processing workpiece of the present invention.
Fig. 3 discloses the structural schematic diagram of an embodiment of the small chuck of Work treatment installation of the present invention.
Fig. 4 discloses the structural schematic diagram of the another embodiment of the small chuck of Work treatment installation of the present invention.
Fig. 5 discloses the schematic diagram of an embodiment of the big chuck of Work treatment installation of the present invention.
Fig. 6 discloses the schematic diagram of the another embodiment of the big chuck of Work treatment installation of the present invention.
Fig. 7 discloses the schematic diagram of the section structure of the second embodiment of Work treatment installation of the present invention.
Fig. 8 discloses the schematic diagram of the section structure of the 3rd embodiment of Work treatment installation of the present invention.
Fig. 9 discloses the structural schematic diagram of the another embodiment of the small chuck of Work treatment installation of the present invention.
Specific embodiment
By the technology contents that the present invention will be described in detail, construction feature, reached purpose and efficacy, below in conjunction with embodiment
And schema is cooperated to be described in detail.
Refering to fig. 1, the schematic diagram of the section structure of the first embodiment of Work treatment installation of the present invention is disclosed.Such as Fig. 1 institute
Show, which includes process cavity 110 and Workpiece carrier mechanism 210." workpiece " described here can be wafer, base
Plate, substrate or its similarity piece.
Process cavity 110 has 111, two pairs of side walls 112 of roof and the bottom wall 113 opposite with roof 111, process cavity
110 111, two pairs of side walls 112 of roof and bottom wall 113 surround a space, carry out technique processing to accommodate workpiece.Process cavity
110 one side wall 112 offers the workpiece entrance 114 for picking and placing workpiece, is provided with valve 310 at workpiece entrance 114,
Valve 310 is used to open or closes workpiece entrance 114.According to different process requirements, the roof 111 of process cavity 110 can
To offer air inlet 115, the bottom wall 113 of process cavity 110 can offer several symmetrical exhaust outlets 116.Wherein,
The lower section of air inlet 115 is equipped with the spray head 410 for being contained in process cavity 110, and process gas is via air inlet 115 and spray head
410 enter process cavity 110 and are uniformly distributed in process cavity 110.
Workpiece carrier mechanism 210 includes support shaft 211 and the big chuck 212 being arranged in support shaft 211.Support shaft 211
Through the bottom wall 113 of process cavity 110, one end of support shaft 211 is located in process cavity 110, the other end position of support shaft 211
In the lower section of the bottom wall 113 of process cavity 110.Big chuck 212 is fixed at one end of support shaft 211, and big chuck 212 is by propping up
Support axis 211 is supported and is contained in process cavity 110.In conjunction with Fig. 5, big chuck 212 has bottom and upward convex along bottom margin
The side wall formed is acted, the bottom of big chuck 212 and side wall surround accommodation space, and the bottom of big chuck 212 offers multiple groups and runs through
The through-hole 213 of big 212 bottom of chuck, every group of through-hole 213 include three through-holes 213, and three 213 roughly triangular points of through-hole
Cloth, the shape of through-hole 213 are circle.
Workpiece carrier mechanism 210 further includes multiple small chucks 214, the through-hole of the quantity of small chuck 214 and big chuck 212
213 group number is identical, and small chuck 214 is contained in the accommodation space of big chuck 212 and corresponding one group for being placed in big chuck 212 is logical
213 top of hole, small chuck 214 is placed in the accommodation space of big chuck 212 by fixed device (not shown), small to prevent
Chuck 214 slides.In conjunction with Fig. 3, small chuck 214 has a chuck main body 2141, the top of the chuck main body 2141 of small chuck 214 to
Under offer accommodating chamber 2142 to accommodate workpiece 510.The chuck main body 2141 of small chuck 214 offers one group of perforation 215, the group
Perforation 215 is connected to the accommodating chamber 2142 of small chuck 214, and 215 quantity comprising perforation 215 of group perforation and big chuck 212 are every
The quantity for the through-hole 213 that group through-hole 213 includes is consistent, and therefore, correspondingly, group perforation 215 includes three perforation 215, the group
215 one group of through-hole 213 corresponding with big chuck 212 of perforation are connected.Preferably, the chuck main body 2141 of small chuck 214
Top opens up downwards accommodating chamber 2142 along certain gradient, so that workpiece 510 is put into the accommodating chamber 2142 of small chuck 214.Lesser calorie
The size and shape of 214 accommodating chamber 2142 of disk are almost the same with the size and shape of workpiece 510, such as the size of workpiece 510
When being 4 inches, 6 inches, 8 inches, 12 inches or 18 inches, the accommodating chamber 2142 of small chuck 214 can be designed to and workpiece
The size that 510 size matches.Each small chuck 214 has the chuck main body 2141 of identical size and shape.As shown in figure 4,
Small chuck 214 ' has the chuck main body of identical size and shape with small chuck 214, and difference is only that the receipts of small chuck 214 '
Cavity is smaller than the accommodating chamber of small chuck 214, to accommodate small size workpiece 510.Small chuck 214,214 ' can be by aluminium, stainless steel
Or one or more of copper material is made.Independently of one another, each small carrying of chuck 214,214 ' is independent for each small chuck 214,214 '
Workpiece 510, small chuck 214,214 ' can be replaced according to the size and shape of workpiece 510.What each small chuck 214,214 ' carried
The size and shape of workpiece can be identical or different.
Workpiece carrier mechanism 210 further includes one group of pillar 216, this group of pillar 216 is contained in process cavity 110 and fixation is set
It sets on the bottom wall 113 of process cavity 110.The quantity and 212 every groups of through-holes of big chuck for the pillar 216 that this group of pillar 216 includes
The quantity of 213 through-holes 213 for including is consistent, and therefore, correspondingly, this group of pillar 216 includes three pillars 216, three pillars 216
It can be contained in the perforation 215 of one group of through-hole 213 and small chuck 214 corresponding with this group of through-hole 213 of big chuck 212.Branch
One end that support axis 211 is located at 113 lower section of bottom wall of process cavity 110 is filled by vacuum rotary feedthroughs 217 and the first driving
218 connections are set, first driving device 218 drives vacuum rotary feedthroughs 217 and support shaft 211 to rotate, to drive kilocalorie
Disk 212 rotates.Connecting plate 219 is arranged in the lower section of the bottom wall 113 of process cavity 110, and with the bottom wall of process cavity 110 113
It is arranged in parallel, connecting plate 219 and support shaft 211 are located at one end below the bottom wall 113 of process cavity 110 and pass through vacuum sealing biography
Dynamic device 217 is connected.Scalable cutting ferrule 220 is arranged between the bottom wall 113 of process cavity 110 and connecting plate 219 and is arranged
It is located at one end of 113 lower section of bottom wall of process cavity 110 in support shaft 211.By the way that scalable cutting ferrule 220 and vacuum sealing is arranged
Transmission device 217 can prevent the gas in process cavity 110 from leaking.Fixing axle 221 is parallel to the setting of support shaft 211, fixed
Axis 221 is set to the lower section of the bottom wall 113 of process cavity 110 and is fixedly connected with the bottom wall of process cavity 110 113.Fixing axle
A pair of of loading plate 222 is provided on 221, this is located at the opposite both ends of fixing axle 221 to loading plate 222.Screw rod 223 with should
Loading plate 222 is connected and is arranged in parallel with fixing axle 221, screw rod 223 passes through connecting plate 219 and loading plate 222, screw rod 223
Bottom end connect with the second driving device 224, the second driving device 224 be drivingly connected plate 219 risen or fallen along screw rod 223,
To drive big chuck 212 to rise or fall in process cavity 110.First driving device 218 and the second driving device 224 can
To select motor.
Refering to fig. 1 and Fig. 2, it illustrates how to handle work using Work treatment installation of the present invention by taking gas phase etching technics as an example
Part 510.Firstly, selecting corresponding small chuck 214 according to the size and shape of workpiece 510 to be processed, small chuck 214 is placed in
In big chuck 212, in the present embodiment, big chuck 212 can accommodate four small chuck 214, and big chuck 212 accommodates small chuck
214 quantity depends on the size of big chuck 212 and small chuck 214.Then, workpiece 510 is loaded into small chuck 214,
Second driving device 224 be drivingly connected plate 219 along screw rod 223 decline, thus drive big chuck 212 in process cavity 110 under
It is down to " loaded " position, three pillars 216 are contained in one group of through-hole 213 of big chuck 212 and corresponding small with this group of through-hole 213
In the perforation 215 of chuck 214, three pillars 216 are stretched out from the perforation 215 of small chuck 214, open valve 310, workpiece 510
Enter process cavity 110 from workpiece entrance 114 and be placed on three pillars 216, You Sangen pillar 216 is held up.The
Two driving devices 224 are drivingly connected plate 219 and rise along screw rod 223, so that big chuck 212 be driven to rise in process cavity 110
To the top of three pillars 216, the workpiece 510 on pillar 216 is fallen into small chuck 214, to complete first small chuck 214
Workpiece load.Make it is spaced apart between the bottom of big chuck 212 and the top of three pillars 216, to guarantee big chuck
212 do not interfere in rotary course with pillar 216.Then, first driving device 218 drives vacuum rotary feedthroughs
217 and support shaft 211 rotate, so that big chuck 212 be driven to rotate, make second group of through-hole 213 of big chuck 212 and second small
Chuck 214 is located at the top of three pillars 216.Second driving device 224 is drivingly connected plate 219 and declines along screw rod 223, thus band
It moves big chuck 212 and drops to " loaded " position in process cavity 110, three pillars 216 be contained in big chuck 212 second group is logical
In the perforation 215 of hole 213 and second small chuck 214 corresponding with this group of through-hole 213, three pillars 216 are small from second
It is stretched out in the perforation 215 of chuck 214, workpiece 510 enters process cavity 110 from workpiece entrance 114 and is placed on three
On pillar 216, You Sangen pillar 216 is held up.Second driving device 224 is drivingly connected plate 219 and rises along screw rod 223, thus band
The top that big chuck 212 rises to three pillars 216 in process cavity 110 is moved, the workpiece 510 on pillar 216 falls into second
In a small chuck 214, so that the workpiece for completing second small chuck 214 loads.And so on, it completes to own in big chuck 212
The workpiece of small chuck 214 loads.Then, valve 310 is closed, big chuck 212 and spray head are adjusted by the second driving device 224
Spacing between 410, to reach optimised process position.Process gas enters process cavity via air inlet 115 and spray head 410
110, first driving device 218 drives big chuck 212 to rotate, to guarantee the etching homogeneity of every workpiece 510.Remaining technique
Gas and process gas react the product generated with workpiece 510 and are excluded by exhaust outlet 116 to outside process cavity 110.Gas phase is carved
After etching technique, open valve 310, take workpiece 510 away from small chuck 214, take the process of workpiece 510 as follows: rotation is big
Chuck 212 makes one group of through-hole 213 of big chuck 212 and small chuck 214 corresponding with this group of through-hole 213 be located at three pillars
216 top, the second driving device 224 is drivingly connected plate 219 and declines along screw rod 223, to drive big chuck 212 in process cavity
Decline in body 110, three pillars 216 are contained in this group of through-hole 213 of big chuck 212 and corresponding small with this group of through-hole 213
In the perforation 215 of chuck 214, three pillars 216 are stretched out from the perforation 215 of small chuck 214, and three pillars 216 are by small chuck
The jack-up of workpiece 510 in 214 leaves small chuck 214, and workpiece 510 is taken away from three pillars 216.Then, the second driving device
224 are drivingly connected plate 219 rises along screw rod 223, so that big chuck 212 be driven to rise to three pillars in process cavity 110
216 top, spaced apart between the bottom of big chuck 212 and the top of three pillars 216, first driving device 218
It drives vacuum rotary feedthroughs 217 and support shaft 211 to rotate, so that big chuck 212 be driven to rotate, makes the of big chuck 212
Two groups of through-holes 213 and small chuck 214 corresponding with this group of through-hole 213 are located at the top of three pillars 216, the second driving device
224 are drivingly connected plate 219 declines along screw rod 223, so that big chuck 212 is driven to decline in process cavity 110, three pillars
216 are contained in the perforation 215 of second group of through-hole 213 of big chuck 212 and small chuck 214 corresponding with this group of through-hole 213,
Three pillars 216 are stretched out from the perforation 215 of small chuck 214, three pillars 216 by the workpiece 510 in small chuck 214 jack up from
Small chuck 214 is opened, workpiece 510 is taken away from three pillars 216.And so on, by the workpiece 510 in all small chucks 214 by
One takes away.When needing to handle various sizes of workpiece 510, small chuck 214 corresponding with 510 size of workpiece need to be only changed.
In order to avoid process gas etching technics cavity 110 and Workpiece carrier mechanism 210, in process cavity 110 and Workpiece carrier mechanism
210 surfaces that contact with process gas coat one layer of erosion-resisting coating, such as: oxide layer, ceramics, Teflon, silicon carbide or
Silicon nitride etc..
According to different process requirements, can process cavity 110 111, two pairs of side walls 112 of roof and bottom wall 113 with
And temperature control equipment (not shown) is set in big chuck 212, spray head 410, it can also be in the roof of process cavity 110
Several halogen lamp of 111 installations or infrared lamp (not shown), after gas phase etching technics, to pass through for assisting heating
Halogen lamp or infrared 510 surface of light irradiation workpiece, 510 surface temperature of workpiece increase rapidly, react process gas with workpiece 510
What is generated is product evaporated, and is excluded by exhaust outlet 116 to outside process cavity 110.
Refering to Fig. 6, the schematic diagram of the another embodiment of big chuck is disclosed.In this embodiment, big 212 ' bottom of chuck
The shape of the through-hole 213 ' opened up be it is arc-shaped, the center of circle of circular arc is consistent with the center of circle of big chuck 212 '.By by through-hole 213 '
It designs in the arc-shaped, workpiece is loaded or during taking workpiece away, even if through-hole 213 ' and pillar are not aligned completely, slightly partially
Difference, pillar remain to insertion through-hole 213 '.Obviously, other than round and arc-shaped, through-hole can also have other shapes.
Refering to Fig. 7, the schematic diagram of the section structure of the second embodiment of Work treatment installation of the present invention is disclosed.It is real with first
It applies example to compare, the difference of second embodiment is: being provided with supporting plate 610, supporting plate 610 below the bottom wall 113 of process cavity 110
It is parallel with the bottom wall 113 of process cavity 110, the bottom end of each pillar 216 be each passed through the bottom wall 113 of process cavity 110 and with support
Plate 610 is fixedly connected, by supporting plate 610 support pillar 216, each pillar 216 pass through 110 bottom wall 113 of process cavity one end by
Elastic sealing element 710 surrounds, and one end of elastic sealing element 710 is fixedly connected with the bottom wall 113 of process cavity 110, elastic packing
The other end of part 710 is fixedly connected with supporting plate 610, and third driving device (not shown) is connect with supporting plate 610, third driving dress
Driving supporting plate 610 is set to rise or fall, so that pillar 216 is driven to rise or fall in process cavity 110, third driving device
Motor or cylinder can be selected.Other than aforementioned difference, the other structures of second embodiment are and shown in first embodiment
Counter structure is identical, and details are not described herein.
It still illustrates how to handle workpiece 510 using the Work treatment installation by taking gas phase etching technics as an example.Firstly, according to
The size and shape of workpiece 510 to be processed select corresponding small chuck 214, and small chuck 214 is placed in big chuck 212.So
Afterwards, workpiece 510 is loaded into small chuck 214, third driving device drives supporting plate 610 to rise, to drive pillar 216 in technique
Rise in cavity 110, pillar 216 is contained in the one group of through-hole 213 and lesser calorie corresponding with this group of through-hole 213 of big chuck 212
In the perforation 215 of disk 214, pillar 216 is stretched out from the perforation 215 of small chuck 214, opens valve 310, and workpiece 510 is from workpiece
Enter process cavity 110 at entrance 114 and be placed on pillar 216, is held up by pillar 216.The driving of third driving device
Supporting plate 610 declines, to drive pillar 216 to drop to the lower section of big 212 bottom of chuck in process cavity 110, on pillar 216
Workpiece 510 fall into small chuck 214, so that the workpiece for completing first small chuck 214 loads.Make the bottom of big chuck 212
It is spaced apart between the top of pillar 216, to guarantee that big chuck 212 does not occur to do in rotary course with pillar 216
It relates to.Then, first driving device 218 drives vacuum rotary feedthroughs 217 and support shaft 211 to rotate, to drive big chuck
212 rotations, make second group of through-hole 213 of big chuck 212 and second small chuck 214 be located at the top of pillar 216.Third driving
Device drives supporting plate 610 to rise, so that pillar 216 be driven to rise in process cavity 110, pillar 216 is contained in big chuck 212
Second group of through-hole 213 and second small chuck 214 corresponding with this group of through-hole 213 perforation 215 in, pillar 216 is from
It is stretched out in the perforation 215 of two small chuck 214, workpiece 510 enters process cavity 110 and is placed from workpiece entrance 114
On pillar 216, held up by pillar 216.Third driving device drives supporting plate 610 to decline, to drive pillar 216 in process cavity
The lower section of big 212 bottom of chuck is dropped in body 110, the workpiece 510 on pillar 216 is fallen into second small chuck 214, thus
The workpiece for completing second small chuck 214 loads.And so on, complete the workpiece dress of all small chucks 214 in big chuck 212
It carries.Then, valve 310 is closed, between can adjusting between big chuck 212 and spray head 410 by the second driving device 224
Away to reach optimised process position.Process gas enters process cavity 110 via air inlet 115 and spray head 410, and first drives
Dynamic device 218 drives big chuck 212 to rotate, to guarantee the etching homogeneity of every workpiece 510.Remaining process gas and technique
Gas reacts the product generated with workpiece 510 and is excluded by exhaust outlet 116 to outside process cavity 110.Gas phase etching technics terminates
Afterwards, valve 310 is opened, workpiece 510 is taken away from small chuck 214, takes the process of workpiece 510 as follows: rotating big chuck 212, make
The one group of through-hole 213 and small chuck 214 corresponding with this group of through-hole 213 of big chuck 212 are located at the top of pillar 216, third
Driving device drives supporting plate 610 to rise, so that pillar 216 be driven to rise in process cavity 110, pillar 216 is contained in kilocalorie
In the perforation 215 of this group of through-hole 213 of disk 212 and small chuck 214 corresponding with this group of through-hole 213, pillar 216 is from small chuck
It is stretched out in 214 perforation 215, the jack-up of workpiece 510 in small chuck 214 is left small chuck 214 by pillar 216, and workpiece 510 is from branch
It is taken away on column 216.Then, third driving device driving supporting plate 610 decline, thus drive pillar 216 in process cavity 110 under
It is down to the lower section of big 212 bottom of chuck, spaced apart between the bottom of big chuck 212 and the top of pillar 216, first drives
Dynamic device 218 drives vacuum rotary feedthroughs 217 and support shaft 211 to rotate, so that big chuck 212 be driven to rotate, makes kilocalorie
Second group of through-hole 213 of disk 212 and small chuck 214 corresponding with this group of through-hole 213 are located at the top of pillar 216, and third is driven
Dynamic device driving supporting plate 610 rises, so that pillar 216 be driven to rise in process cavity 110, pillar 216 is contained in big chuck
In the perforation 215 of 212 second group of through-hole 213 and small chuck 214 corresponding with this group of through-hole 213, pillar 216 is from small chuck
It is stretched out in 214 perforation 215, the jack-up of workpiece 510 in small chuck 214 is left small chuck 214 by pillar 216, and workpiece 510 is from branch
It is taken away on column 216.And so on, the workpiece 510 in all small chucks 214 is taken away one by one.It is various sizes of when needing to handle
When workpiece 510, small chuck 214 corresponding with 510 size of workpiece need to be only changed.
Refering to Fig. 8, the schematic diagram of the section structure of the 3rd embodiment of Work treatment installation of the present invention is disclosed.It is real with second
It applies example to compare, the present embodiment can be considered as a kind of simplification of second embodiment, in the present embodiment, eliminate vacuum sealing biography
Dynamic device, connecting plate, scalable cutting ferrule, fixing axle, loading plate, screw rod and the second driving device, remaining structure are real with second
It is identical to apply counter structure shown in example.In the present embodiment, the spacing between big chuck 212 and spray head 410 is in technique mistake
It is unable to adjust in journey.
Refering to Fig. 9, the structural schematic diagram of the another embodiment of the small chuck of Work treatment installation of the present invention is disclosed.Lesser calorie
Disk 214 " has chuck main body 2141 ", if the top of chuck main body 2141 " offers several accommodating chambers 2142 " downwards to accommodate
Dry workpiece, the size and shape of the accommodating chamber 2142 " of small chuck 214 " and the size and shape of workpiece are consistent.Small chuck 214 " is received
It is dissolved in the accommodation space of big chuck.The chuck main body 2141 " of small chuck 214 " offers several groups perforation 215 ", every group of perforation
215 " respectively one group of through-hole corresponding with an accommodating chamber 2142 " of small chuck and big chuck be connected to, one group of pillar can be contained in
In the perforation 215 " of the one group of through-hole and small chuck 214 " corresponding with this group of through-hole of big chuck, to pick and place workpiece.Work as needs
When handling various sizes of workpiece, small chuck 214 " corresponding with workpiece size need to be only changed.
It can be seen from the above, the present invention, by configuring several small chucks, when needs while processing has identical or different size
And shape workpiece when, only need to select the small chuck of the accommodating chamber with corresponding size and shape, and small chuck is placed in greatly
The accommodation space of chuck, without replacing entire big chuck, therefore, and compared with the prior device, Work treatment installation of the present invention
It is more convenient in use, more flexible, and Work treatment installation structure of the present invention is simple, can handle multi-disc workpiece simultaneously, improves
Work pieces process efficiency, reduces work pieces process cost.
In conclusion the present invention is illustrated by above embodiment and correlative type, oneself is specific, full and accurate to disclose correlation
Technology implements those skilled in the art accordingly.And embodiment described above is used only to illustrate the present invention, rather than
Interest field of the invention for limiting, of the invention should be defined by claim of the invention.As for member described herein
The change of number of packages purpose or the replacement of equivalence element etc. still all should belong to interest field of the invention.
Claims (4)
1. a kind of Work treatment installation characterized by comprising process cavity and Workpiece carrier mechanism, the Workpiece carrier machine
Structure includes:
Support shaft, the support shaft run through the bottom wall of process cavity, and one end of support shaft is located in process cavity, support shaft it is another
One end is located at the lower section of the bottom wall of process cavity；
Big chuck, the big chuck are fixed at one end of support shaft, and big chuck is supported by support shaft, and big chuck is contained in work
Skill cavity, big chuck have bottom and the side wall to be formed that raises upward along bottom, and it is empty that the bottom of big chuck and side wall surround receiving
Between, the bottom of big chuck offers the through-hole that several groups run through kilocalorie pan bottom；
Several small chucks, several small chucks are contained in the accommodation space of big chuck, and several small chucks are placed on side by side
On big chuck, each small chuck is corresponding to be placed in above one group of through-hole of big chuck, and each small chuck has chuck main body, chuck
The top of main body offers accommodating chamber downwards to accommodate workpiece, and the chuck main body of small chuck offers one group of perforation, group perforation
One group of through-hole connection corresponding with the accommodating chamber of small chuck and big chuck, small chuck can be replaced to adapt to corresponding work respectively
Part；
Supporting plate, the supporting plate are arranged in parallel in below the bottom wall of process cavity, and the bottom wall of supporting plate and process cavity is tightly connected；
One group of pillar, this group of pillar can be contained in the perforation of the one group of through-hole and small chuck corresponding with this group of through-hole of big chuck
In, the bottom end of each pillar is each passed through the bottom wall of process cavity and is fixedly connected with supporting plate；
First driving device, one end that the first driving device is located at below the bottom wall of process cavity with support shaft are connect, the
One driving device drives support shaft rotation, to drive kilocalorie disc spins；And
Third driving device, the third driving device are connect with supporting plate, and third driving device driving supporting plate rises or falls, from
And pillar is driven to rise or fall in process cavity.
2. Work treatment installation according to claim 1, which is characterized in that the size and shape of the accommodating chamber of the small chuck
Shape is consistent with the size and shape of workpiece.
3. Work treatment installation according to claim 1, which is characterized in that several small chucks are independent of one another, each small
Chuck carries independent workpiece, can replace small chuck according to the size and shape of workpiece.
4. Work treatment installation according to claim 1, which is characterized in that several small chucks are independent of one another, each small
Chuck carries independent workpiece, and the size and shape of the workpiece of each small chuck carrying can be identical or different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310553944.7A CN104637857B (en) | 2013-11-08 | 2013-11-08 | Work treatment installation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310553944.7A CN104637857B (en) | 2013-11-08 | 2013-11-08 | Work treatment installation |
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| CN104637857A CN104637857A (en) | 2015-05-20 |
| CN104637857B true CN104637857B (en) | 2019-04-16 |
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| CN112863992B (en) * | 2021-01-12 | 2023-01-17 | 广东中图半导体科技股份有限公司 | Plasma etching device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101192554A (en) * | 2006-11-29 | 2008-06-04 | 爱德牌工程有限公司 | System and method for introducing a substrate into a process chamber |
| JP4680657B2 (en) * | 2005-04-08 | 2011-05-11 | 株式会社アルバック | Substrate transfer system |
| CN102439710A (en) * | 2010-03-25 | 2012-05-02 | 应用材料公司 | Segmented substrate loading for multiple substrate processing |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7321299B2 (en) * | 2005-06-08 | 2008-01-22 | Axcelis Technologies, Inc. | Workpiece handling alignment system |
| CN100358097C (en) * | 2005-08-05 | 2007-12-26 | 中微半导体设备(上海)有限公司 | Semiconductor technology processing system and method |
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2013
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4680657B2 (en) * | 2005-04-08 | 2011-05-11 | 株式会社アルバック | Substrate transfer system |
| CN101192554A (en) * | 2006-11-29 | 2008-06-04 | 爱德牌工程有限公司 | System and method for introducing a substrate into a process chamber |
| CN102439710A (en) * | 2010-03-25 | 2012-05-02 | 应用材料公司 | Segmented substrate loading for multiple substrate processing |
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Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Patentee after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. fourth 1690 Patentee before: ACM (SHANGHAI) Inc. |