CN101246812A - Substrate processing apparatus - Google Patents

Abstract

The invention provides a substrate processing apparatus for processing substrate. The substrate processing apparatus is composed of an indexer block, a first processing block and a second processing block that are provided in parallel with one another. The indexer block is provided with an indexer robot. The first processing block is provided with a plurality of back surface cleaning units and a first main robot. The second processing block is provided with a plurality of end surface cleaning units, a plurality of top surface cleaning units and a second main robot.

Description

Substrate board treatment

Technical field

The present invention relates to a kind of substrate board treatment that substrate is handled.

Background technology

All the time, for semiconductor wafer, photomask are carried out various processing with glass substrate, CD with substrates such as substrates with glass substrate, liquid crystal indicator, adopt substrate board treatment.

For example, in TOHKEMY 2004-146708 communique, put down in writing the substrate board treatment of roll-over unit with the surface that makes substrate and back side upset.In this substrate board treatment,, dispose central robot (carrying unit) in order to carrying substrate at the substantial middle place of rectangle handling part.

In handling part, dispose the back side cleaning unit that the back side of substrate is carried out a plurality of (for example 4) of clean respectively in the mode of surrounding central robot.And then, in handling part, on the position that can come access by central robot, dispose roll-over unit.

End side at handling part is provided with the protractor portion that possesses a plurality of accepting containers of accommodating substrate.In this protractor portion, be provided with from above-mentioned accepting container and take out the substrate before handling or treated substrate is contained in board carrying machinery hand in the above-mentioned accepting container.

As in the above-mentioned structure, pass to central robot behind the substrate before board carrying machinery hand is handled from any accepting container taking-up, and after this central robot receives treated substrate, be contained in the accepting container.

If central robot receives from board carrying machinery hand and handles substrate before, then the substrate that receives is passed to roll-over unit.Roll-over unit overturns the substrate that receives from central robot, so that the surface is towards the below.Then, central robot receives the substrate that overturns by roll-over unit, and this substrate is moved into back side cleaning unit arbitrarily.

Then, if the processing in the cleaning unit of the above-mentioned back side arbitrarily finishes, central robot then passes to roll-over unit once more after back side cleaning unit is taken out of this substrate.Roll-over unit overturns the substrate that carried out in the cleaning unit overleaf handling, so that the surface is towards the top.

Then, central robot receives the substrate that overturns by roll-over unit and passes to board carrying machinery hand.Board carrying machinery hand will be contained in the accepting container from the treated substrate that central robot receives.

But, in above-mentioned substrate board treatment in the past, because porter's ordinal number amount of substrate is more, so the action of central robot complicates.In addition, in recent years, require the peripheral end face of substrate is also carried out clean.If on the basis of said structure, also be provided for the peripheral end face of substrate is carried out the end face cleaning unit of clean, then the action of central robot becomes more complicated.In this case, be difficult to many substrates of high efficiency carrying, so the disposal ability in the processing substrate obviously descends.

In addition, have and a kind ofly possess the surface treatment unit that is used for substrate surface is handled, be used for the back side processing unit that substrate back is handled and make substrate surface and the substrate board treatment of the roll-over unit of back side upset.In this substrate board treatment,, dispose the central robot of carrying substrate at the substantial middle place of rectangle handling part.

In handling part, dispose surface treatment unit and back side processing unit in the mode of surrounding central robot.And then, in handling part, on the position that can come access by central robot, dispose roll-over unit.

End side at handling part is provided with the protractor portion that possesses a plurality of accepting containers of accommodating substrate.In this protractor portion, be provided with from above-mentioned accepting container and take out the substrate before handling or treated substrate is contained in board carrying machinery hand in the above-mentioned accepting container.

As in the above-mentioned structure, pass to central robot behind the substrate before board carrying machinery hand is handled from accepting container taking-up arbitrarily, and after this central robot receives treated substrate, be contained in the accepting container.

If central robot receives from board carrying machinery hand and handles substrate before, then the substrate that receives is moved in the surface clean unit.If the processing in the surface clean unit finishes, central robot is then taken out of substrate from the surface clean unit, then, passes to roll-over unit.Roll-over unit overturns the substrate that receives from central robot, so that the surface is towards the below.Then, central robot receives the substrate that overturns by roll-over unit, and this substrate is moved in the cleaning unit of the back side.

If the processing in the cleaning unit of the back side finishes, central robot is then taken out of substrate and is passed to roll-over unit once more from back side cleaning unit.Roll-over unit overturns the substrate that carried out in the cleaning unit overleaf handling, so that the surface is towards the top.

Then, central robot receives the substrate that overturns by roll-over unit and passes to board carrying machinery hand.Board carrying machinery hand will be contained in the accepting container from the treated substrate that central robot receives.

So, the carrying of the substrate between surface treatment unit, back side processing unit and roll-over unit is undertaken by a central robot.Thus, porter's ordinal number amount of substrate increases, and the action of central robot complicates.So, be difficult to many substrates of high efficiency carrying, so the disposal ability in the processing substrate descends.

Summary of the invention

The objective of the invention is to, a kind of substrate board treatment that can improve disposal ability is provided.

Above-mentioned purpose of the present invention can realize in the following manner.

(1) the invention provides a kind of substrate board treatment, it is handled the substrate with surface and back side, and this substrate board treatment has: first and second processing region, and it is adjacent to each other and dispose, and is used for substrate is handled; Move into and take out of the zone, it moves into and takes out of substrate to first processing region; The first handing-over zone, it is arranged on to move into and takes out of between the zone and first processing region; The second handing-over zone, it is arranged between first processing region and second processing region, and wherein, first processing region has: first handling part; First Handling device, it is carrying substrate between the first handing-over zone, first handling part and the second handing-over zone, and second processing region has: second handling part; Second Handling device, it is carrying substrate between the second handing-over zone and second handling part, moves into to take out of the zone and have: the container loading part, it loads in order to accommodate the accepting container of substrate; The 3rd Handling device, it is carrying substrate between the accepting container that is loaded into the container loading part and the first handing-over zone, and, any one party in first and second handling part has the back side clean portion in order to the cleaning base plate back side, the first handing-over zone, the second handing-over zone and in second Handling device with the zone of the regional opposition side of second handing-over at least one zone on have turning device, this turning device with so that the surface of substrate and the back side overturn.

In this substrate board treatment, carry out from move into take out of the zone take out of to the moving into of substrate of first processing region, carry out the processing of substrate at first processing region and second processing region.In first processing region, by first Handling device carrying substrate between the first handing-over zone, first handling part and the second handing-over zone.In second processing region, by second Handling device carrying substrate between the second handing-over zone and second handling part.In addition, take out of in the zone moving into, by the 3rd Handling device carrying substrate between the accepting container that is loaded into the container loading part and the first handing-over zone.

The first handing-over zone, the second handing-over zone and in second Handling device with the zone of the regional opposition side of second handing-over at least one zone in, by turning device substrate is overturn, so that the back side is towards the top, and the side in first and second handling part, portion is cleaned the back side of substrate by back side clean.

By such structure, in first processing region and second processing region, can carry out board carrying that is undertaken by first Handling device and the board carrying that is undertaken by second Handling device simultaneously.Thus, can carry many substrates expeditiously.Thereby can shorten the board carrying time in first processing region and second processing region.Its result can improve the disposal ability in the substrate board treatment.

(2) also can be, any one party in first and second handling part has end face clean portion, described end face clean portion peripheral end to substrate when keeping substrate back cleans, turning device overturns to the surface and the back side of the substrate that cleans by end face clean portion, and clean portion in the back side is cleaned the back side of the substrate by the turning device upset.

In this case, in any one party of first and second handling part, in the back side that keeps substrate, pass through the peripheral end of end face clean portion cleaning base plate.The substrate that cleans by end face clean portion the first handing-over zone, the second handing-over zone and in second Handling device with the zone of the regional opposition side of second handing-over at least one zone in, by turning device overturn in the surface and the back side.And in any one party of first and second handling part, by back side clean portion to cleaning by the back side of the substrate of turning device upset.

Like this, after passing through the peripheral end of end face clean portion cleaning base plate, by the back side of back side clean portion cleaning base plate.Thus, even to be held the back side of substrate contaminated because of the back side of substrate in end face clean portion, the pollution of this substrate back also is removed in the clean portion overleaf.Thus, cleaning base plate fully neatly.

(3) also can be, end face clean portion has a plurality of end face cleaning units of multi-layer configuration, and clean portion in the back side has a plurality of back sides cleaning unit of multi-layer configuration.

In this case,, area occupied can be reduced, and the cleaning at the back side of the cleaning of peripheral end of many substrates and many substrates can be carried out expeditiously by a plurality of end face cleaning units of multi-layer configuration and a plurality of back sides cleaning unit.Thereby, can further improve the disposal ability in the substrate board treatment.

(4) also can be that any one party in first and second handling part has the surface cleaning processing portion in order to the cleaning base plate surface.

In this case, in any one party handling part in first and second handling part, by the surface of surface cleaning processing portion cleaning base plate.

(5) also can be that surface cleaning processing portion has a plurality of surface clean unit of multi-layer configuration.

In this case,, area occupied can be reduced, and the cleaning on the surface of many substrates can be carried out expeditiously by a plurality of surface clean of multi-layer configuration unit.Thereby, can further improve the disposal ability in the substrate board treatment.

(6) also can be, turning device has first and second turning device, the first handing-over zone has the first substrate loading part and first turning device in order to mounting substrate, the second handing-over zone has the second substrate loading part and second turning device in order to mounting substrate, first handling part has back side clean portion, second handling part has end face clean portion and surface cleaning processing portion, first Handling device is at the first substrate loading part, the second substrate loading part, first turning device, carrying substrate between second turning device and the back side clean portion, second Handling device is at the second substrate loading part, second turning device, carrying substrate between end face clean portion and the surface cleaning processing portion, the 3rd Handling device is at accepting container, carrying substrate between the first substrate loading part and first turning device.

In this case, untreatment base takes out from accepting container by the 3rd Handling device, and is loaded into the first substrate loading part.The substrate that is loaded into the first substrate loading part is loaded into the second substrate loading part by first Handling device.The substrate that is loaded into the second substrate loading part is moved into a side in end face clean portion and the surface cleaning processing portion by second Handling device.

Substrate after cleaning by the side in end face clean portion and the surface cleaning processing portion is moved into the opposing party in end face clean portion and the surface cleaning processing portion by second Handling device.By the substrate after surface cleaning processing portion and the cleaning of end face clean portion, move into second turning device by second Handling device.Overturn and make the substrate of the back side with second turning device, move into back side clean portion by first Handling device towards the top.With the substrate after the cleaning of back side clean portion, move into first turning device by first Handling device.Overturning by first turning device makes the surface towards the substrate of top, is turned back in the accepting container by the 3rd Handling device.

By such structure, can carry out board carrying by first Handling device and the board carrying by second Handling device simultaneously.Thus, can carry many substrates expeditiously.Thereby can shorten the handling time of substrate in the substrate board treatment.Its result can improve the disposal ability in the substrate board treatment.

In addition, by after the peripheral end of end face clean portion cleaning base plate, use the back side of back side clean portion cleaning base plate, thus, even the back side of substrate is contaminated in end face clean portion, the back pollution of this substrate also is removed in the clean portion overleaf.Thus, cleaning base plate fully neatly.

In addition, second the handing-over zone in, when can substrate be overturn by second turning device, from second Handling device to the first Handling device transferring substrates.In addition, first the handing-over zone in, when can substrate be overturn by first turning device, from first Handling device to the 3rd Handling device transferring substrates.Thus, can further shorten the handling time of substrate, and further improve the disposal ability in the substrate board treatment.

(7) also can be, first turning device makes substrate overturn around rotating shaft, and the connecting line of the position of the position of first Handling device and the 3rd Handling device intersects when this rotating shaft and handing-over substrate; And second turning device makes substrate overturn around rotating shaft, and the connecting line of the position of the position of first Handling device and second Handling device intersects when this rotating shaft and handing-over substrate.

In this case, first turning device is under needn't the situation of conversion direction, can between the first and the 3rd Handling device, join substrate, and second turning device is under needn't the situation of conversion direction, can between first and second Handling device, joins substrate.Thereby, can realize the simplification of the first and second turning device structure, simultaneously, realize cost degradation.In addition, because first and second turning device needn't conversion direction, so improve the disposal ability in the substrate board treatment.

(8) also can be, the first handing-over zone has the first substrate loading part in order to mounting substrate, the second handing-over zone has second substrate loading part and the turning device in order to mounting substrate, first handling part has surface cleaning processing portion, second handling part has end face clean portion and back side clean portion, first Handling device is at the first substrate loading part, the second substrate loading part, turning device, and carrying substrate between the surface cleaning processing portion, second Handling device is at the second substrate loading part, turning device, carrying substrate between end clean portion and the back side clean portion, the 3rd Handling device is carrying substrate between the accepting container and the first substrate loading part.

In this case, untreatment base takes out from accepting container by the 3rd Handling device, and is loaded into the first substrate loading part.The substrate that is loaded into the first substrate loading part is loaded into the second substrate loading part by first Handling device.The substrate that is loaded into the second substrate loading part is moved into end face clean portion by second Handling device.

With the substrate after the cleaning of end face clean portion, move into turning device by second Handling device.Overturning by turning device makes the substrate of the back side towards the top, moves into back side clean portion by second Handling device.With the substrate after the cleaning of back side clean portion, move into turning device by second Handling device.Overturning by turning device makes the surface towards the substrate of top, moves into surface cleaning processing portion by first Handling device.Substrate with after the cleaning of surface cleaning processing portion is loaded into the first substrate loading part by first Handling device.Be loaded into the substrate of the first substrate loading part, turn back in the accepting container by the 3rd Handling device.

By such structure, can carry out simultaneously by the board carrying of first Handling device and the board carrying that is undertaken by second Handling device.Thus, can carry many substrates expeditiously.Thereby can shorten the handling time of substrate in the substrate board treatment.Its result can improve the disposal ability in the substrate board treatment.

In addition, after peripheral end, by the back side of back side clean portion cleaning base plate with end face clean portion cleaning base plate.Thus, even the back side of substrate is contaminated in end face clean portion, the back pollution of this substrate also is removed in the clean portion overleaf.Thus, cleaning base plate fully neatly.

In addition, second the handing-over zone in, when can substrate be overturn by turning device, from second Handling device to the first Handling device transferring substrates.Thus, the handling time of substrate can be further shortened, and the disposal ability in the substrate board treatment can be further improved.

In addition, in said structure, also can be with after the surface of surface cleaning processing portion cleaning base plate, by the peripheral end and the back side of end face clean portion and back side clean portion cleaning base plate.

(9) also can be, turning device makes substrate overturn around rotating shaft, and this rotating shaft intersects with connecting line in the position of the position of handing-over first Handling device during substrate and second Handling device.

In this case, turning device can join substrate under needn't the situation of conversion direction between first and second Handling device.Thereby, when can realize the simplification of turning device structure, realize cost degradation.In addition, because turning device needn't conversion direction, so improve the disposal ability in the substrate board treatment.

(10) also can be that the opposing party in first and second handling part has the surface cleaning processing portion in order to the cleaning base plate surface.

In this case, the first handing-over zone, the second handing-over zone and in second Handling device with the zone of the regional opposition side of second handing-over at least one zone in, by turning device substrate is overturn and to make its back side towards the top, and in a side of first and second handling part, portion is cleaned the back side of substrate by back side clean.Substrate after cleaning with back side clean portion, overturning once more by turning device makes its surface towards the top.In the opposing party of first and second handling part, by the surface of surface cleaning processing portion cleaning base plate.

By such structure, in first processing region and second processing region, can carry out board carrying by first Handling device and the board carrying by second Handling device simultaneously.Thus, can carry many substrates expeditiously.Thereby can shorten the board carrying time in first processing region and second processing region.Its result can improve the disposal ability in the substrate board treatment.

(11) also can be, clean portion in the back side has a plurality of back sides cleaning unit of multi-layer configuration, and surface cleaning processing portion has a plurality of surface clean unit of multi-layer configuration.

In this case,, area occupied can be reduced, and the back side cleaning of many substrates and the surface clean of many substrates can be carried out expeditiously by multi-layer configuration a plurality of back sides cleaning unit and a plurality of surface clean unit.Thereby, can further improve the disposal ability in the substrate board treatment.

(12) also can be, turning device has first and second turning device, the first handing-over zone has the first substrate loading part and first turning device in order to mounting substrate, the second handing-over zone has the second substrate loading part and second turning device in order to mounting substrate, first handling part has back side clean portion, second handling part has surface cleaning processing portion, first Handling device is at the first substrate loading part, the second substrate loading part, first turning device, carrying substrate between second turning device and the back side clean portion, second Handling device is at the second substrate loading part, carrying substrate between second turning device and the surface cleaning processing portion, the 3rd Handling device is at the accepting container that is loaded into the container loading part, carrying substrate between the first substrate loading part and first turning device.

In this case, in first processing region, by first Handling device carrying substrate between the first substrate loading part, the second substrate loading part, first turning device, second turning device and back side clean portion.In second processing region, by second Handling device carrying substrate between the second substrate loading part, second turning device and surface cleaning processing portion.Take out of in the zone moving into, by the 3rd Handling device carrying substrate between the accepting container that is loaded into the container loading part, the first substrate loading part and first turning device.

By such structure, in first processing region and second processing region, can carry out board carrying by first Handling device and the board carrying by second Handling device simultaneously.Thus, can carry many substrates expeditiously.Thereby can shorten the board carrying time in first processing region and second processing region.Its result can improve the disposal ability in the substrate board treatment.

In addition, in the first handing-over zone, when can overturn to substrate by first turning device, transferring substrates between first Handling device and the 3rd Handling device.And, in the second handing-over zone, when can overturn to substrate by second turning device, transferring substrates between first Handling device and second Handling device.Thus, the handling time of substrate can be further shortened, and the disposal ability in the substrate board treatment can be further improved.

(13) also can be, first turning device makes substrate overturn around rotating shaft, and this rotating shaft intersects with connecting line in the position of the position of handing-over first Handling device during substrate and the 3rd Handling device; Second turning device makes substrate overturn around rotating shaft, and this rotating shaft intersects with connecting line in the position of the position of handing-over first Handling device during substrate and second Handling device.

In this case, first turning device is under needn't the situation of conversion direction, can join substrate between the first and the 3rd Handling device, second turning device can join substrate under needn't the situation of conversion direction between first and second Handling device.Thereby, when can realize the simplification of the first and second turning device structure, realize cost degradation.In addition, because first and second turning device needn't conversion direction, so improve the disposal ability in the substrate board treatment.

(14) also can be, the first handing-over zone has the first substrate loading part in order to mounting substrate, the second handing-over zone has turning device, first handling part has surface cleaning processing portion, second handling part has back side clean portion, first Handling device is carrying substrate between the first substrate loading part, turning device and surface cleaning processing portion, second Handling device is carrying substrate between turning device and back side clean portion, and the 3rd Handling device is carrying substrate between the accepting container that is loaded into the container loading part and the first substrate loading part.

In this case, in first processing region, by first Handling device carrying substrate between the first substrate loading part, turning device and surface cleaning processing portion.In second processing region, by second Handling device carrying substrate between turning device and back side clean portion.Take out of in the zone moving into, by the 3rd Handling device carrying substrate between the accepting container that is loaded into the container loading part, the first substrate loading part.

By such structure, in first processing region and second processing region, can carry out board carrying by first Handling device and the board carrying by second Handling device simultaneously.Thus, can carry many substrates expeditiously.Thereby can shorten the board carrying time in first processing region and second processing region.Its result can improve the disposal ability in the substrate board treatment.

In addition, in the second handing-over zone, when can overturn to substrate by turning device, transferring substrates between first Handling device and second Handling device.Thus, the handling time of substrate can be further shortened, and the disposal ability in the substrate board treatment can be further improved.

(15) also can be, turning device makes substrate overturn around rotating shaft, and this rotating shaft intersects with connecting line in the position of the position of handing-over first Handling device during substrate and second Handling device.

In this case, turning device can join substrate under needn't the situation of conversion direction between first and second Handling device.Thereby, when can realize the simplification of turning device structure, realize cost degradation.In addition, because turning device needn't conversion direction, so improve the disposal ability in the substrate board treatment.

(16) also can be, the first handing-over zone has the first substrate loading part in order to mounting substrate, the second handing-over zone has the second substrate loading part in order to mounting substrate, has turning device with the zone of the regional opposition side of second handing-over, first handling part has surface cleaning processing portion, second handling part has back side clean portion, first Handling device is at the first substrate loading part, carrying substrate between the second substrate loading part and the surface cleaning processing portion, second Handling device is at the second substrate loading part, carrying substrate between turning device and the back side clean portion, the 3rd Handling device is carrying substrate between the accepting container that is loaded into the container loading part and the first substrate loading part.

In this case, in first processing region, by first Handling device carrying substrate between the first substrate loading part, the second substrate loading part and surface cleaning processing portion.In second processing region, by second Handling device carrying substrate between the second substrate loading part, turning device and back side clean portion.Take out of in the zone moving into, by the 3rd Handling device carrying substrate between the accepting container that is loaded into the container loading part, the first substrate loading part.

By such structure, in first processing region and second processing region, can carry out board carrying by first Handling device and the board carrying by second Handling device simultaneously.Thus, can carry many substrates expeditiously.Thereby can shorten the handling time of substrate in first processing region and second processing region.Its result can improve the disposal ability in the substrate board treatment.

(17) also can be that turning device has first and second turning device of configuration up and down.

In this case, make by the substrate of clean portion in the back side before cleaning with first turning device and to overturn, and make by the substrate after the cleaning of back side clean portion with second turning device and to overturn.Therefore, even contaminated, can prevent that also pollutant from transferring to through on the cleaned substrate in the back side via turning device by the back side of the substrate of clean portion in the back side before cleaning.Therefore, can make by the clean state of substrate maintenance after the cleaning of back side clean portion.

(18) also can be, first turning device be used for the substrate before cleaning by back side clean portion is overturn, and second turning device is used for the substrate after cleaning by back side clean portion is overturn.

In this case, even contaminated, can prevent that also pollutant from transferring to through on the cleaned substrate in the back side via turning device by the back side of the substrate of clean portion in the back side before cleaning.

Therefore, can make by the clean state of substrate maintenance after the cleaning of back side clean portion.

(19) also can be, turning device has: first maintaining body, and it is kept substrate with the state perpendicular to first; Second maintaining body, it is kept substrate with the state perpendicular to first; Supporting member, its with first and second maintaining body to be supported in the equitant mode of first direction of principal axis; Whirligig, it makes supporting member rotate integratedly around second with first and second retaining member, and this second is approximately perpendicular to first.

In this case, by at least one side in first and second maintaining body, keep substrate with state perpendicular to first.Under this state, first and second maintaining body rotates around second that is approximately perpendicular to first integratedly by whirligig.Thus, the substrate that is kept by first maintaining body or second maintaining body is overturn.

At this, above-mentioned first～the 3rd Handling device has two carrying maintaining parts respectively, and, carry out moving into of substrate when taking out of for turning device adopting these two carrying maintaining parts, by two carrying maintaining parts are configured at the direction overlaid parallel with first, thus, can two substrates be moved into first and second maintaining body simultaneously, and can two substrates be taken out of from first and second maintaining body simultaneously by two carrying maintaining parts by two carrying maintaining parts.Therefore, when can carry out rapidly taking out of, can overturn to many substrates expeditiously for moving into of the substrate of turning device.

(20) also can be, first and second maintaining body has shared upset retaining member, this shared upset retaining member has one side and the another side perpendicular to first, first maintaining body has: a plurality of first support portions, the one side that it is arranged on shared upset retaining member is used for the peripheral part of supporting substrate; The first upset retaining member, the one side of itself and shared upset retaining member is opposed and be provided with; A plurality of second support portions, the face that it is arranged on the opposed first upset retaining member of shared upset retaining member is used for the peripheral part of supporting substrate; First driving mechanism, it moves at least one side in the first upset retaining member and the shared upset retaining member, make and between following two states, optionally shift, this two states is meant, the state that the first upset retaining member and shared upset retaining member are separated from each other out on first direction and the first upset retaining member and shared upset retaining member be approaching state mutually, and second maintaining body have: a plurality of the 3rd support portions, the another side that it is arranged on shared upset retaining member is used for the peripheral part of supporting substrate; The second upset retaining member, the another side of itself and shared upset retaining member is opposed and be provided with; A plurality of the 4th support portions, it is arranged on the face with the opposed second upset retaining member of shared upset retaining member, is used for the peripheral part of supporting substrate; Second driving mechanism, it moves at least one side in the second upset retaining member and the shared upset retaining member, make and between following two states, optionally shift, this two states is meant that the state that the second upset retaining member and shared upset retaining member are separated from each other and the second upset retaining member and shared upset retaining member be approaching state mutually on first direction.

In this case, under the state that first upset retaining member and the shared upset retaining member is separated from each other out, substrate is moved between a plurality of first support portions and a plurality of second support portion, wherein, these a plurality of first support portions are arranged on the one side of shared upset retaining member, and these a plurality of second support portions are arranged on the face with the opposed first upset retaining member of shared upset retaining member.Under this state, by first driving mechanism at least one side in first upset retaining member and the shared upset retaining member is moved, making win upset retaining member and shared upset retaining member approaching mutually.Thus, the peripheral part that keeps substrate by a plurality of first and second support portion.

Under this state, make the first upset retaining member, the second upset retaining member and shared upset retaining member around second rotation integratedly by whirligig.Thus, the substrate that is kept by the first upset retaining member and shared upset retaining member is overturn.

In addition, under the state that second upset retaining member and the shared upset retaining member is separated from each other out, substrate is moved between a plurality of the 3rd support portions and a plurality of the 4th support portion, wherein, these a plurality of the 3rd support portions are arranged on the another side of shared upset retaining member, and these a plurality of the 4th support portions are arranged on the face with the opposed second upset retaining member of shared upset retaining member.Under this state, by second driving mechanism at least one side in the second upset retaining member and the shared upset retaining member is moved, make that the second upset retaining member and shared upset retaining member are approaching mutually.Thus, the peripheral part that keeps substrate by the a plurality of the 3rd and the 4th support portion.

Under this state, make the first upset retaining member, the second upset retaining member and shared upset retaining member around second rotation integratedly by whirligig.Thus, the substrate that is kept by the second upset retaining member and shared upset retaining member is overturn.

(21) the invention provides another kind of substrate board treatment, it is handled the substrate with surface and back side, this substrate board treatment has: first and second processing region, and this first and second processing region is adjacent to each other and dispose, and is used for substrate is handled; Move into and take out of the zone, it moves into and takes out of substrate to first processing region; First junction, it joins substrate moving into to take out of between the zone and first processing region, second junction, it joins substrate between first processing region and second processing region, and wherein, first processing region has: first handling part; First Handling device, it is carrying substrate between first junction, first handling part and second junction, and second processing region has: second handling part; Second Handling device, it is carrying substrate between second junction and second handling part, moves into to take out of the zone and have: the container loading part, it is used to load the accepting container of accommodating substrate; The 3rd Handling device, it is carrying substrate between the accepting container that is loaded into the container loading part and first junction, side in first and second handling part has the back side clean portion that is used for the cleaning base plate back side, at least one side in first junction and second junction has switching mechanism, this switching mechanism is between first Handling device and the 3rd Handling device, when perhaps between first Handling device and second Handling device, carrying out substrate delivery/reception, overturn in the surface of substrate and the back side.

In this substrate board treatment, carry out from move into take out of the zone take out of to the moving into of substrate of first processing region, carry out the processing of substrate at first processing region and second processing region.In addition, join substrate between the zone and first processing region moving into to take out of, and between first processing region and second processing region, join substrate by second junction by first junction.

In first processing region, by first Handling device carrying substrate between first junction, first handling part and second junction.In second processing region, by second Handling device carrying substrate between second junction, second handling part.In addition, take out of in the zone moving into, by the 3rd Handling device carrying substrate between the accepting container that is loaded into the container loading part and first junction.

In this case, in first processing region and second processing region, can carry out board carrying by first Handling device and the board carrying by second Handling device simultaneously.Thus, can carry many substrates expeditiously.Thereby can shorten the handling time of substrate in first processing region and second processing region.Its result can improve the disposal ability in the substrate board treatment.

In addition, among at least one side in first junction and second junction, between first Handling device and the 3rd Handling device, perhaps between first Handling device and second Handling device, in the handing-over substrate, overturn in the surface of substrate and the back side by switching mechanism.The square tube of the back side of the substrate after the upset in first and second handling part crossed back side clean portion and is cleaned.

In this case, in the handing-over substrate, substrate is overturn, can further shorten the handling time of substrate thus.Therefore, can further improve disposal ability in the substrate board treatment.

(22) also can be, side in first and second handling part or the opposing party have end clean portion, the peripheral end of its cleaning base plate when keeping substrate back, switching mechanism overturns to the surface and the back side of the substrate after cleaning by end clean portion, and clean portion in the back side is cleaned the back side of the substrate by the switching mechanism upset.

In this case, a side or the opposing party of first and second handling part, in the back side that keeps substrate, by the peripheral end of end face clean portion cleaning base plate.By the substrate after the cleaning of end face clean portion, among at least one side in first junction and second junction, be reversed by its surface of switching mechanism and the back side.And a side of first and second handling part, the back side of the substrate that overturns by switching mechanism is cleaned by back side clean portion.

Like this, after passing through the peripheral end of back side clean portion cleaning base plate, the back side by back side clean portion cleaning base plate, thus, even the back side because of the back side substrate that keeps substrate in end face clean portion is contaminated, the also clean portion pollution of removing this substrate back overleaf.Therefore, can make substrate keep clean state.

(23) also can be that the opposing party in first and second handling part has the surface cleaning processing portion in order to the cleaning base plate surface.

In this case, among at least one side in first junction and second junction, substrate is overturn, so that its back side is towards the top by switching mechanism, and the side in first and second handling part, the back side of the substrate after the upset is cleaned by back side clean portion.Substrate with after the cleaning of back side clean portion overturns by switching mechanism, once more so that its surface is towards the top.The opposing party of first and second handling part, by the surface of surface cleaning processing portion cleaning base plate.Thus, the surface of cleaning base plate and the back side fully neatly.

Description of drawings

Fig. 1 is the figure that the substrate board treatment structure in first execution mode is shown.

Fig. 2 is the figure that the substrate board treatment structure in first execution mode is shown.

Fig. 3 is the figure that the substrate board treatment structure in first execution mode is shown.

Fig. 4 A, Fig. 4 B are the figure that the first master manipulator structure is shown.

Fig. 5 A, Fig. 5 B are the figure that the roll-over unit structure is shown.

Fig. 6 is the figure that the roll-over unit structure is shown.

Fig. 7 is the figure that the roll-over unit structure is shown.

Fig. 8 is the figure that end face cleaning unit SSB structure is shown.

Fig. 9 A, Fig. 9 B are the figure that the end face cleaning device structure of end face cleaning unit SSB is shown.

Figure 10 is the figure that surface clean cell S S structure is shown.

Figure 11 is the figure that back side cleaning unit SSR structure is shown.

Figure 12 is the figure that the substrate board treatment structure in second execution mode is shown.

Figure 13 A, Figure 13 B are the figure that the roll-over unit structure in second execution mode is shown.

Figure 14 A, Figure 14 B, Figure 14 C, Figure 14 D are the figure that the roll-over unit action in second execution mode is shown.

Figure 15 E, Figure 15 F, Figure 15 G are the figure that the roll-over unit action in second execution mode is shown.

Figure 16 is the figure that the substrate board treatment structure in the 3rd execution mode is shown.

Figure 17 is the figure that the substrate board treatment structure in the 3rd execution mode is shown.

Figure 18 is the figure that the substrate board treatment structure in the 4th execution mode is shown.

Figure 19 is the figure that the substrate board treatment structure in the 4th execution mode is shown.

Figure 20 is the figure that the substrate board treatment structure in the 5th execution mode is shown.

Figure 21 A, Figure 21 B, Figure 21 C, Figure 21 D are the figure that the roll-over unit action in the 5th execution mode is shown.

Figure 22 E, Figure 22 F, Figure 22 G are the figure that the roll-over unit action in the 5th execution mode is shown.

Figure 23 is the figure that the substrate board treatment structure in the 6th execution mode is shown.

Figure 24 is the figure that the substrate board treatment structure in the 6th execution mode is shown.

Figure 25 is the figure that the substrate board treatment structure in the 7th execution mode is shown.

Figure 26 is the figure that the substrate board treatment structure in the 7th execution mode is shown.

Embodiment

Below, with reference to the substrate board treatment in the description of drawings embodiments of the present invention.

In the following description, so-called substrate, be meant semiconductor wafer, liquid crystal indicator with glass substrate, PDP (plasma display panel (PDP)) with glass substrate, photomask with glass substrate, CD with substrate etc.

In addition, in the following description, the face that forms the substrate of various patterns such as circuit pattern is called the surface, and the face of its opposition side is called the back side.In addition, will be called lower surface, and will be called upper surface towards the face of the substrate of top towards the face of the substrate of below.

(1) first execution mode

(1-1) structure of substrate board treatment

Fig. 1～Fig. 3 is the schematic diagram that the substrate board treatment structure in first execution mode is shown.Fig. 1 is the vertical view of substrate board treatment, and Fig. 2 is the end view when arrow B 1 direction is observed substrate board treatment Fig. 1.In addition, Fig. 3 is the A1-A1 line profile of Fig. 1.

As shown in Figure 1, substrate board treatment 100 is made of the protractor district 10, first treatment region 11 and second treatment region 12 that are set up in parallel mutually.In protractor district 10, be provided with a plurality of carrier loading stages 40, protractor manipulator IR and control part 4.On each carrier loading stage 40, be mounted with the carrier C that accommodates many substrate W in the mode of multilayer.

Protractor manipulator IR is can move in arrow U direction, can and can the mode of lifting constitute on above-below direction around the vertical axis rotation.On protractor manipulator IR, upper and lower settings is useful on hand IRH1, the IRH2 of handing-over substrate W.Hand IRH1, IRH2 are in order to the periphery and the peripheral end of the lower surface of maintenance substrate W.Control part 4 is made of the computer that comprises CPU (central processing unit), each structural portion in its control basal plate processing unit 100.

As depicted in figs. 1 and 2, at first treatment region 11, be provided with a plurality of back side cleaning unit SSR (being 4) and the first master manipulator MR1 in Fig. 2.A plurality of back side cleaning unit SSR are disposed at a side's of first treatment region 11 side (with reference to Fig. 2) in the mode of stacked on top of one another.The first master manipulator MR1 is arranged at the substantial middle portion of treatment region 11, and it is can and can the mode of lifting constituting on above-below direction around the vertical axis rotation.

On the first master manipulator MR1, upper and lower settings is useful on hand MRH1, the MRH2 of handing-over substrate W.Hand MRH1, MRH2 keep the periphery and the peripheral end of the lower surface of substrate W.

In second treatment region 12, be provided with a plurality of surface clean cell S S (being 4), a plurality of end face cleaning unit SSB (being 4) and the second master manipulator MR2 in Fig. 2 in Fig. 2.A plurality of surface clean cell S S are disposed at a side's of second treatment region 12 side in the mode of stacked on top of one another, and a plurality of end face cleaning unit SSB then are disposed at the opposing party's of second treatment region 12 side (with reference to Fig. 2) in the mode of stacked on top of one another.The second master manipulator MR2 is arranged at the substantial middle portion of second treatment region 12, and it is with can be around vertical axis rotatable and can the mode of lifting constitute on above-below direction.

As shown in Figure 3, between the protractor district 10 and first treatment region 11, the substrate loading part PASS1 that upper and lower settings is useful on the roll-over unit RT1 that substrate W is overturn and is used for handing-over substrate W between the protractor manipulator IR and the first master manipulator MR1.Between first treatment region 11 and second treatment region 12, upper and lower settings is useful on roll-over unit RT2 that substrate W is overturn and the substrate loading part PASS2 that joins substrate W between the first master manipulator MR1 and the second master manipulator MR2.About roll-over unit RT1, RT2, be elaborated in the back.

Be provided with optical sensor (not shown) at substrate loading part PASS1, PASS2 in order to the existence that detects substrate W.Thus, can judge whether substrate W is loaded among substrate loading part PASS1, the PASS2.In addition, at substrate loading part PASS1, PASS2, be provided with a plurality of supporting pins 51 in order to the lower surface of supporting substrate W.When joining substrate W between the protractor manipulator IR and the first master manipulator MR1 and between the first master manipulator MR1 and the second master manipulator MR2, substrate W is loaded on the supporting pin 51 of substrate loading part PASS1, PASS2 temporarily.

(1-2) summary of substrate board treatment action

Then, with reference to accompanying drawing 1～Fig. 3 the action of substrate board treatment 100 is described.In addition, below the action of each structural element of Shuo Ming substrate board treatment 100 is controlled by the control part among Fig. 14.

At first, in protractor district 10, take out untreated substrate W the carrier C of protractor manipulator IR on being loaded into carrier loading stage 40.When protractor manipulator IR moves to arrow U direction, rotate, and this substrate W is loaded on the substrate loading part PASS1 around vertical axis.The substrate W that is loaded in substrate loading part PASS1 is received by the first master manipulator MR1 of first treatment region 11, then, is loaded on the substrate loading part PASS2.The substrate W that is loaded in substrate loading part PASS2 is received by the second master manipulator MR2 of second treatment region 12, then, moves among the end face cleaning unit SSB.

In end face cleaning unit SSB, substrate W end face is carried out clean.Below, will be referred to as the end face clean to the clean of substrate W end face.In addition, the end face clean about by end face cleaning unit SSB is described in detail in the back.

Taken out of from end face cleaning unit SSB by the second main frame tool MR2 through the cleaned substrate W of end face, then, move among the surface clean cell S S.In surface clean cell S S, clean is carried out on the surface of substrate W.Below, will be referred to as surface cleaning processing to the clean on substrate W surface.In addition, the surface cleaning processing about by surface clean cell S S is described in detail in the back.

Taken out of from surface clean cell S S by the second master manipulator MR2 through the substrate W after the surface cleaning processing, then move among the roll-over unit RT2.In roll-over unit RT2, his-and-hers watches face that upward substrate W overturns so that its back side towards the top.The substrate W that overturn is taken out of from roll-over unit RT2 by the first master manipulator MR1 of first treatment region 11, then, moves among the cleaning unit SSR of the back side.

Among the cleaning unit SSR, clean is carried out at the substrate W back side overleaf.Below, will be referred to as back side clean to the clean at the substrate W back side.In addition, the back side clean about by back side cleaning unit SSR is described in detail in the back.Cleaned substrate W is taken out of from back side cleaning unit SSR by the first master manipulator MR1 through the back side, then, moves among the roll-over unit RT1.At roll-over unit RT1, to the substrate W of the back side towards the top overturn so that its surface towards the top.

The substrate W that overturn is taken out of from roll-over unit RT1 by the protractor manipulator IR in protractor district 10, and is contained in the carrier C on the carrier loading stage 40.

(1-3) concrete structure of master manipulator

(1-3-1) structure of first master manipulator and second master manipulator

The detailed structure of the first and second master manipulator MR1, MR2 then, is described.At this, describe at the detailed structure of the first master manipulator MR1.The structure of the second master manipulator MR2 also structure with the first master manipulator MR1 shown below is identical.Fig. 4 A is the end view of the first master manipulator MR1, and Fig. 4 B is the vertical view of the first master manipulator MR1.

Shown in Fig. 4 A and Fig. 4 B, the first master manipulator MR1 possesses pedestal part 21, and with respect to pedestal part 21 liftables and rotatably be provided with lifting rotating part 22.Lifting rotating part 22 is connected with hand MRH1 by multi-joint type arm AM1, and is connected with hand MRH2 by multi-joint type arm AM2.

Lift drive mechanism 25 on above-below direction the lifting of lifting rotation section 22 by in pedestal part 21, being provided with, and the rotation Drive Structure of passing through to be provided with in pedestal part 21 26 is rotated around vertical axis.

Multi-joint type arm AM1, AM2 are driven independently by not shown driving mechanism respectively, and when making hand MRH1, MRH2 keep certain posture respectively, in the horizontal direction advance and retreat.

Hand MRH1, MRH2 respectively with respect to lifting rotating part 22 with the certain height setting, hand MRH1 is provided with above higher than MRH2.It is constant that the difference in height M1 of hand MRH1 and hand MRH2 (Fig. 4 A) keeps.

Hand MRH1, MRH2 are of similar shape, and form U font roughly respectively.Hand MRH1 has two claw H11 that almost parallel ground extends, and hand MRH2 has two claw H12 that almost parallel ground extends.

In addition, on hand MRH1, MRH2, be separately installed with a plurality of supporting pins 23.In the present embodiment, along being loaded into hand MRH1, the periphery of substrate W above the MRH2, four supporting pins 23 have been installed respectively equably roughly.The periphery and the peripheral end that keep the lower surface of substrate W by these four supporting pins 23.

(1-3-2) the action example of first master manipulator

The concrete action example of the first master manipulator MR1 then, is described with reference to Fig. 1.

The first master manipulator MR1 at first receives untreatment base W by hand MRH2 from substrate loading part PASS1.Then, the first master manipulator MR1 takes out of the substrate W of the back side towards the top by hand MRH1 from roll-over unit RT2.This substrate W is the substrate W through end face clean and surface cleaning processing.Then, the untreatment base W that remains on hand MRH2 is loaded into substrate loading part PASS2.

Then, the first master manipulator MR1 takes out of through the cleaned substrate W in the back side from back side cleaning unit SSR arbitrarily by hand MRH2, and will be moved among the cleaning unit SSR of this back side by the substrate W that hand MRH1 keeps.Then, the first master manipulator MR1 will move into roll-over unit RT1 through the cleaned substrate W in the back side by what hand MRH2 kept.

The first master manipulator MR1 carries out so a series of action continuously.In addition, in above-mentioned action example, the action of the action of hand MRH1 and hand MRH2 also can on the contrary.

The first master manipulator MR1 is following three operations at porter's ordinal number amount of a substrate W: the carrying from substrate loading part PASS1 to substrate loading part PASS2; Carrying from roll-over unit RT2 to back side cleaning unit SSR; And carrying from back side cleaning unit SSR to roll-over unit RT1.

(1-3-3) action of second master manipulator

The concrete action example of the second master manipulator MR2 then, is described with reference to Fig. 1.

The second master manipulator MR2 at first receives untreatment base W by hand MRH4 from substrate loading part PASS2.Then, the second master manipulator MR2 takes out of through the cleaned substrate W of end face from end face cleaning unit SSB arbitrarily by hand MRH3, and the substrate W that will remain on hand MRH4 moves among this end face cleaning unit SSB.Then, the second master manipulator MR2 takes out of through the substrate W after the surface cleaning processing from surface clean cell S S arbitrarily by hand MRH4, and the substrate W that will remain on hand MRH3 moves among this surface clean cell S S.Then, the second master manipulator MR2 substrate W that will remain on hand MRH4 moves among the roll-over unit RT2.

The second master manipulator MR2 carries out so a series of action continuously.In addition, in above-mentioned action example, the action of the action of hand MRH3 and hand MRH4 also can on the contrary.

The second master manipulator MR2 is following three operations at porter's ordinal number amount of a substrate W: the carrying from substrate loading part PASS2 to end face cleaning unit SSB; Carrying from end face cleaning unit SSB to surface clean cell S S; And carrying from surface clean cell S S to roll-over unit RT2.

The action of the second master manipulator MR2 like this and the action of the aforesaid first master manipulator MR1 are carried out simultaneously.

(1-4) structure of roll-over unit and action

Then, the structure to roll-over unit RT1, RT2 describes.In addition, roll-over unit RT1 has identical structure with RT2.

Fig. 5 A, Fig. 5 B are the roll-over unit RT1 of Fig. 1, the structural representation of RT2.Fig. 5 A is the end view of roll-over unit RT1, RT2, and Fig. 5 B is the vertical view of roll-over unit RT1, RT2.In addition, Fig. 6 is the stereogram that the major part outward appearance of roll-over unit RT1, RT2 is shown, and Fig. 7 is the stereogram that a part of outward appearance of roll-over unit RT1, RT2 is shown.

Shown in Fig. 5 A, Fig. 5 B, roll-over unit RT1, RT2 comprise first supporting member 41, second supporting member 42, many base plate supports pin 43a and 43b, first movable part 44, second movable part 45, fixed head 46, link mechanism 47 and rotating mechanism 48.

As shown in Figure 6, first supporting member 41 is made of the six roots of sensation rod member with radial extension.On each leading section of six roots of sensation rod member, be respectively arranged with base plate supports pin 43a.Equally, as shown in Figure 7, second supporting member 42 also is made of the six roots of sensation rod member with radial extension.On each leading section of this six roots of sensation rod member, be respectively arranged with base plate supports pin 43b.

In addition, in the present embodiment, first and second supporting member 41,42 is made of six roots of sensation rod member, but not only be defined in this, first and second supporting member 41,42 by the member of the rod member of other any amount or other arbitrary shapes constitute also can, for example have along shapes such as the disk of the periphery of a plurality of base plate supports pin 43a, 43b or polygonals.

First movable part 44 among Fig. 6 constitutes with " コ " shape, and extend in vertical direction one end and the other end, and extend to arrow U direction the intermediate portion.First supporting member 41 is fixed on the end of first movable part 44.The other end of first movable part 44 is connected with link mechanism 47.Equally, second movable part 45 among Fig. 7 constitutes with " コ " shape, and second supporting member 42 is fixed on the end of second movable part 45.The other end of second movable part 45 is connected with link mechanism 47.Link mechanism 47 is installed on the rotating shaft of rotating mechanism 48.This link mechanism 47 and rotating mechanism 48 are installed on the fixed head 46.

Be built-in with cylinder etc. in the link mechanism 47 in Fig. 6, thus can optionally move first movable part 44 with second movable part 45 so that it is in relative state that separates or close state.In addition, in rotating mechanism 48, be built-in with motor etc., thereby can make the axle rotation of first movable part 44 and second movable part 45, for example Rotate 180 degree by link mechanism 47 around horizontal direction.

At this, the action to roll-over unit RT1, RT2 describes with reference to accompanying drawing.At first, by the first or second master manipulator MR1, MR2 (Fig. 1) substrate W is moved among roll-over unit RT1, the RT2.Under first movable part 44 and second movable part 45 state separated from each other in vertical direction, substrate W is moved and is loaded on a plurality of base plate supports pin 43b of second supporting member 42 by the first or second master manipulator MR1, MR2.

Then, shown in Fig. 5 A,, make first movable part 44 and second movable part 45 move to state adjacent to each other in vertical direction by the action of link mechanism 47.Thus, the two-sided of substrate W supported by a plurality of base plate supports pin 43a, 43b respectively.

Then, first movable part 44 passes through the action of rotating mechanism 48 around the axle Rotate 180 degree parallel with the direction of arrow U with second movable part 45.Thus, substrate W is with first movable part 44 and second movable part 45, when remaining on a plurality of base plate supports pin 43a, the 43b that is arranged on first supporting member 41 and second supporting member 42, and the Rotate 180 degree.Thus, substrate W overturns.

Then, by the action of link mechanism 47, make first movable part 44 and second movable part 45 move to state separated from each other in vertical direction.Under this state, substrate W is taken out of from roll-over unit RT1, RT2 by the protractor manipulator IR or the first master manipulator MR1.

(1-5) concrete structure of end face cleaning unit

Fig. 8 is the figure in order to the structure of explanation end face cleaning unit SSB.As shown in Figure 8, end face cleaning unit SSB has rotary chuck 201, and this rotary chuck 201 keeps substrate W in order to level, and substrate W is rotated around the vertical rotating shaft by substrate W center.

Rotary chuck 201 is fixed in the upper end by the rotating shaft 203 of chuck rotary drive mechanism 204 rotations.In addition, on rotary chuck 201, be formed with air-breathing path (not shown), by under the state that substrate W is loaded on the rotary chuck 201, discharging the gas in the air-breathing path, thus with the back side vacuum suction of substrate W on rotary chuck 201, therefore can keep substrate W with flat-hand position.

On the side of rotary chuck 201 and the top in the end face cleaning unit SSB, be provided with end face cleaning device travel mechanism 230.The bar-shaped supporting member 220 that extends downwards is installed in end face cleaning device travel mechanism 230.Supporting member 220 by end face cleaning device travel mechanism 230 in the horizontal direction (with reference to arrow M among Fig. 8) move.

On the bottom of supporting member 220, the end face cleaning device 210 of the drum that has roughly is installed in the mode of extending in the horizontal direction.Therefore, end face cleaning device 210 moves with supporting member 220 by end face cleaning device travel mechanism 230.

End face cleaning device 210 is positioned at absorption and remains on the roughly the same height of substrate W on the rotary chuck 201.Thus, the end face R of an end of end face cleaning device 210 and substrate W is opposed.In the following description, will with an end of the opposed end face cleaning device 210 of end face R of substrate W as the front.

When the end face clean of beginning substrate W, end face cleaning device 210 moves to the endface position of substrate W by end face cleaning device travel mechanism 230.In addition, when finishing the end face clean of substrate W, end face cleaning device 210 moves to the position of the end face R that leaves substrate W by end face cleaning device travel mechanism 230.

End face cleaning device 210 is connected with cleaning solution supplying pipe 241 and blast pipe 244.Supply with cleaning fluid by cleaning solution supplying pipe 241 to the inner space (purge chamber 211 described later) of end face cleaning device 210.In addition, blast pipe 244 is connected with exhaust portion 245.Exhaust portion 245 is drawn the air of end face cleaning device 210 inner spaces and is got rid of via blast pipe 244.

Below, describe end face cleaning device 210 in detail.Fig. 9 A, Fig. 9 B are the figure in order to end face cleaning device 210 structures of the end face cleaning unit SSB in the key diagram 8.The longitudinal sectional drawing of end face cleaning device 210 has been shown in Fig. 9 A, the front view of end face cleaning device 210 has been shown in Fig. 9 B.

Shown in Fig. 9 A, be formed with purge chamber 211 in the inside of the shell 210a of the general cylindrical shape shape of end face cleaning device 210.In addition, shown in Fig. 9 A and Fig. 9 B, be formed with the opening 212 of connection purge chamber 211 and outside in the face side of shell 210a.The mode that opening 212 enlarges to both sides from central portion gradually with width up and down have circular-arc above and below.When the end face clean of substrate W, the end face R that absorption is remained on the substrate W on the rotary chuck 201 is inserted in the opening 212.

In purge chamber 211, dispose brush 213 with drum roughly in the mode of extending in vertical direction.On the outer peripheral face of brush 213, be formed with the groove 213a of V font in the whole circumference direction.Brush 213 is installed on the rotating shaft 214 that vertical direction is extended.The top and bottom of rotating shaft 214 are rotatably installed in the swivel bearing of the upper and lower that is formed at purge chamber 211.Thus, brush 213 is rotatably supported by purge chamber 211 and rotating shaft 214.

When the clear processing of the end face that carries out substrate W, the groove 213a that is formed on brush 213 contacts with the end face R of the substrate W of rotation.Thus, the end face R of brush 213 cleaning base plate W.

The top of end face cleaning device 210 is connected with above-mentioned cleaning solution supplying pipe 241 and blast pipe 244.Cleaning solution supplying pipe 241 cleaning solution supplying path 241a, the 241b interior with being formed on shell 210a is connected.Shown in Fig. 9 A, cleaning solution supplying path 241a extends to the top inner face of purge chamber 211 from the outside of shell 210a.In addition, cleaning solution supplying path 241b extends to the lower inner face of purge chamber 211 from the outside of shell 210a.In Fig. 9 A, only show the part of cleaning solution supplying path 241b.

Thus, when the end face clean of substrate W, the cleaning fluid that supplies to end face cleaning device 210 sprays to the end face R of substrate W from above-below direction, and the end face R of this substrate W then contacts with brush 213 in purge chamber 211.Thus, the end face R of substrate W is cleaned expeditiously.

Blast pipe 244 is inserted in the purge chamber 211 by the hole portion that is arranged on shell 210a top.Thus, the air in the purge chamber 211 is attracted by the exhaust portion among Fig. 8 245, and discharges by blast pipe 244.So, in purge chamber 211, its inner air is discharged from by exhaust portion 245, therefore discharges the cleaning fluid of volatilization and the mist of cleaning fluid expeditiously.

(1-6) detailed description of surface clean unit and back side cleaning unit

Then, each structure to surface clean cell S S among Fig. 1 and back side cleaning unit SSR describes.

Figure 10 is the schematic diagram that surface clean cell S S structure is shown, and Figure 11 is the schematic diagram that back side cleaning unit SSR structure is shown.In surface clean cell S S and back side cleaning unit SSR as shown in figure 10, adopted the clean (below, be referred to as scrub process) of the substrate W of brush respectively.

As shown in figure 10, surface clean cell S S possesses rotary chuck 61, and these rotary chuck 61 usefulness are so that substrate W when keeping level, makes substrate W around the vertical axis rotation by substrate W center.Rotary chuck 61 is fixed on the upper end by the rotating shaft 63 of chuck rotary drive mechanism 62 rotations.In addition, same with the rotary chuck 201 of above-mentioned end face cleaning unit SSB, rotary chuck 61 keeps substrate W by the lower surface of vacuum suction substrate W.In addition, surface clean cell S S also can adopt the mechanical type rotary chuck (with reference to Figure 11 described later) of the peripheral end that keeps substrate W to replace absorption type rotary chuck 61.

As mentioned above, the surface is moved among the surface clean cell S S towards the substrate W of the state of top.Handle if carry out scrub process and rinsing, then adsorb the back side that keeps substrate W by rotary chuck 61.

Arranged outside at rotary chuck 61 has motor 64.Motor 64 is connected with rotating shaft 65.On rotating shaft 65, be connected with arm 66 in the mode of extending in the horizontal direction, and be provided with the brush cleaning tool 70 of general cylindrical shape shape at the front end of arm 66.

In addition, be provided with the liquid nozzle 71 that spues above rotary chuck 61, this liquid spues nozzle 71 in order to supply with cleaning fluid or rinsing liquid (pure water) to the surface of the substrate W that is kept by rotary chuck 61.

On liquid spues nozzle 71, be connected with supply pipe 72, optionally supply with cleaning fluid and rinsing liquid to the liquid nozzle 71 that spues by this supply pipe 72.

When scrub process, motor 64 makes rotating shaft 65 rotations.Thus, arm 66 rotates in horizontal plane, and brush cleaning tool 70 to be the center with rotating shaft 65 move between the top position at the foreign side position of substrate W and substrate W center.Be provided with not shown elevating mechanism at motor 64.Elevating mechanism rises and descends by making rotating shaft 65, makes brush cleaning tool 70 descend and rise in the outer fix of substrate W and the top position at substrate W center.

When the beginning scrub process, the surface is rotated by rotary chuck 61 towards the substrate W of top state.In addition, supply with cleaning fluid or rinsing liquids by supply pipe 72 to spue nozzle 71 of liquid.Thus, supply with cleaning fluid or rinsing liquid to the substrate W surface of rotation.Under this state, brush cleaning tool 70 rocks and lifting action by rotating shaft 65 and arm 66.Thus, scrub process is carried out on the surface of substrate W.In addition, owing in surface clean cell S S, adopted absorption type rotary chuck 61, therefore can periphery and the peripheral end of substrate W be cleaned simultaneously.

Then, utilize Figure 11, illustrate that the surface clean cell S S difference of back side cleaning unit SSR and Figure 10 advances.As shown in figure 11, the back side cleaning unit SSR mechanical type rotary chuck 81 that possesses the peripheral end that keeps substrate W replaces keeping by vacuum suction substrate W lower surface the absorption type rotary chuck 61 of substrate.When carrying out scrub process and rinsing and handle, under the state of the periphery of the lower surface that keeps substrates by the rotary supporting pin on the rotary chuck 61 82 and peripheral end, be rotated when making substrate W keep flat-hand position.

The back side is moved among the cleaning unit SSR of the back side towards the substrate W of top state.Thus, substrate W remains in the rotary chuck 81 with the state of the back side towards the top.Then, carry out as above-mentioned same scrub process for the back side of substrate W.

But, in above-mentioned end face cleaning unit SSB and surface clean cell S S, the back side of adsorbing substrate W by absorption type rotary chuck 201,61.At this moment, sometimes form the absorption trace at the back side of substrate W.Among the cleaning unit SSR,, can eliminate the absorption trace that in end face clean and surface cleaning processing, forms overleaf by the back side of cleaning base plate W.

(1-7) effect of first execution mode

In the present embodiment, first treatment region 11 is provided with the first master manipulator MR1, and second treatment region 12 is provided with the second master manipulator MR2.At this moment, can carry out the carrying of the substrate W in first treatment region 11 and the carrying of the substrate W in second treatment region 12 simultaneously.Thus, can shorten the handling time of substrate W, so can improve the disposal ability of substrate board treatment 100.

In addition, in the substrate board treatment 100 of present embodiment, after substrate W was carried out end face clean and surface cleaning processing, cleaning unit SSR carried out back side clean to substrate W by the back side.At this moment, even in end face cleaning unit SSB or surface clean cell S S,, also can eliminate the absorption trace at the substrate W back side by back side clean after this because absorption type rotary chuck 201,61 has formed the absorption trace at the back side of substrate W.Thus, cleaning base plate W fully neatly.

In addition, in the present embodiment, roll-over unit RT1 is arranged at the position between the protractor manipulator IR and the first master manipulator MR1, and simultaneously, roll-over unit RT2 is arranged at the position between the first master manipulator MR1 and the second master manipulator MR2.At this moment, when can make substrate W upset, substrate is passed to the first master manipulator MR1 from the second master manipulator MR2.Equally, when can make substrate W upset, substrate is passed to protractor manipulator IR from the first master manipulator MR1.Thus, the carrying operation of the first and second master manipulator MR1, MR2 can be reduced, the disposal ability of substrate board treatment 100 can be further improved.

In addition, in the present embodiment, porter's ordinal number amount of the substrate W that is undertaken by the first master manipulator MR1 is identical with porter's ordinal number amount of the substrate W that is undertaken by the second master manipulator MR2.At this moment, this thing happens hardly: a master manipulator with among the first and second master manipulator MR1, the MR2 makes it be in the situation of holding state for the action that cooperates another master manipulator.Thus, carrying substrate W expeditiously can further improve the disposal ability of substrate board treatment 100.

In addition, in the substrate board treatment 100 of present embodiment, dispose a plurality of back side cleaning unit SSR in the mode of multilayer at side's side of first treatment region 11.Side's side and the opposing party's side at second treatment region 12 dispose a plurality of surface clean cell S S and end face cleaning unit SSB in the mode of multilayer respectively.Thus, compare, can realize the miniaturization of substrate board treatment 100 significantly and save spatialization with the situation of a plurality of cleaning unit planar configuration.

In addition, in the present embodiment, the substrate W before the clean of the back side be reversed by different roll-over unit RT1, RT2 mutually through the cleaned substrate W in the back side.At this moment, even the back side of the substrate W before the clean of the back side is contaminated, pollutant can not transferred to through on the cleaned substrate W in the back side yet.Thus, can make the back side keep clean state through the cleaned substrate W in the back side.

In addition, in the present embodiment, by a plurality of surface clean cell S S and a plurality of back side cleaning unit SSR are loaded into short transverse setting so that the mode of multilayer is stacked, can realize the miniaturization of the structure (structure of so-called platform) of substrate board treatment 100 thus, and, the surface clean cell S S of requirement, the back side cleaning unit SSR of requirement and the end face cleaning unit SSB of requirement can be set easily by surface clean cell S S, back side cleaning unit SSR and end face cleaning unit SSB are equipped on the above-mentioned short transverse.

(2) second execution modes

Then, at the substrate board treatment in second execution mode of the present invention, illustrate and the above-mentioned first execution mode difference.

Figure 12 is the schematic diagram of the substrate board treatment structure in second execution mode.As shown in figure 12, the substrate board treatment 100a in second execution mode possesses roll-over unit RT1a, RT2a as follows, to replace roll-over unit RT1, RT2.In addition, two substrate loading part PASS1, PASS2 are set respectively.

(2-1) roll-over unit

Figure 13 A is the end view of roll-over unit RT1a, RT2a, and Figure 13 B is the stereogram of roll-over unit RT1a, RT2a.In addition, roll-over unit RT1a, RT2a have identical structure.

As shown in FIG. 13A, roll-over unit RT1a, RT2a comprise supporting bracket 31, fixed head 32, a pair of linear guides 33a and 33b, pair of supporting members 35a and 35b, a countercylinder 37a and 37b, the first portable plate 36a, the second portable plate 36b and rotating driver 38.

Supporting bracket 31 is set up in the mode of extending at above-below direction, and in the mode that the central portion of 31 the one side from the support portion extends to horizontal direction fixed head 32 is installed.In the zone of the supporting bracket 31 of the one side side of fixed head 32, be provided with perpendicular to the upwardly extending linear guides 33a in the side of fixed head 32.In addition, in the zone of the supporting bracket 31 of the another side side of fixed head 32, be provided with perpendicular to the upwardly extending linear guides 33b in the side of fixed head 32.Linear guides 33a, 33b are to be set up fixed head 32 symmetrical modes.

In the one side side of fixed head 32, to be provided with supporting member 35a in the upwardly extending mode in the side that is parallel to fixed head 32.Supporting member 35a is slidably mounted in linear guides 33a via coupling member 34a.Be connected with cylinder 37a at supporting member 35a, make supporting member 35a carry out lifting along linear guides 33a by this cylinder 37a.At this moment, supporting member 35a moves on perpendicular to the direction of fixed head 32 when keeping certain posture.In addition, on supporting member 35a the first portable plate 36a to be installed with the opposed mode of the one side of fixed head 32.

In the another side side of fixed head 32, to be provided with supporting member 35b in the upwardly extending mode in the side that is parallel to fixed head 32.Supporting member 35b is slidably mounted on the linear guides 33b via coupling member 34b.On supporting member 35b, be connected with cylinder 37b, make supporting member 35b carry out lifting along linear guides 33b by this cylinder 37b.At this moment, supporting member 35b moves on perpendicular to the direction of fixed head 32 when keeping certain posture.In addition, on supporting member 35b the second portable plate 36b to be installed with the opposed mode of the another side of fixed head 32.

In the present embodiment, the first portable plate 36a and the second portable plate 36b under fixed head 32 state farthest, with between the first portable plate 36a and the fixed head 32 apart between M2 and the second portable plate 36b and the fixed head 32 apart from M3 be set at and Fig. 4 A, Fig. 4 B shown in the hand MRH1 of the first master manipulator MR1 and the difference in height between the hand MRH2 (the hand MRH3 of the second master manipulator MR2 and the difference in height between the hand MRH4) M1 about equally.

Rotating driver 38 makes supporting bracket 31 rotate around the trunnion axis HA that is parallel to arrow U (Fig. 1) direction, and thus, the first portable plate 36a, the second portable plate 36b and the fixed head 32 that are connected in supporting bracket 31 rotate around trunnion axis HA (to the θ direction).

Shown in Figure 13 B, the first portable plate 36a, fixed head 32 and the second portable plate 36b form tabular respectively.

In addition, as shown in FIG. 13A, be provided with a plurality of supporting pin 39a, be provided with a plurality of supporting pin 39b at its another side in one side with the opposed fixed head 32 of the first portable plate 36a.In addition, be provided with a plurality of supporting pin 39c, be provided with a plurality of supporting pin 39d in one side with the fixed head 32 opposed second portable plate 36b in one side with the fixed head 32 opposed first portable plate 36a.

In the present embodiment, supporting pin 39a, 39b, 39c, 39d are respectively arranged with six.These supporting pins 39a, 39b, 39c, 39d are along the periphery of the substrate W that moves into roll-over unit RT1, RT2 and dispose.In addition, supporting pin 39a, 39b, 39c, 39d have identical length.Thus, at the first portable plate 36a and the second portable plate 36b under fixed head 32 state farthest, distance between the front end of the front end of distance between the front end of the front end of supporting pin 39a and supporting pin 39d and supporting pin 39b and supporting pin 39c is substantially equal to hand MRH1 and the difference in height between the hand MRH2 (the hand MRH3 of the second master manipulator MR2 and the difference in height between the hand MRH4) M1 of the first master manipulator MR1 shown in Fig. 4 A, Fig. 4 B.

In addition, also can the appropriate change first portable plate 36a and fixed head 32 between apart between M2 and the second portable plate 36b and the fixed head 32 apart from M3.But, at the first portable plate 36a and the second portable plate 36b under fixed head 32 state farthest, distance with between the front end of the front end of supporting pin 39c and supporting pin 39d is set at greater than the difference in height between hand MRH1 and the hand MRH2 (difference in height between hand MRH3 and the hand MRH4) M1.

(2-2) summary of substrate board treatment action

Then, with reference to Fig. 1 and Figure 12 the summary that substrate board treatment 100a moves is described.

At first, in protractor district 10, protractor manipulator IR takes out two untreated substrate W with hand IRH1, IRH2 a, carrier the carrier C on being loaded in carrier loading stage 40.Then, protractor manipulator IR two substrate W that will remain on hand IRH1, IRH2 pass to two substrate loading part PASS1 successively.

Then, the first master manipulator MR1 of first treatment region 11 receives two substrate W with hand MRH1, MRH2 successively from two substrate loading part PASS1, and these two substrate W are loaded into two substrate loading part PASS2 successively.Then, the second master manipulator MR2 of second treatment region 12 receives two substrate W with hand MRH3, MRH4 successively from two substrate loading part PASS2, and these two substrate W are moved among two end face cleaning unit SSB successively.

Then, the second master manipulator MR2 takes out of through cleaned two the substrate W of end face from two end face cleaning unit SSB successively with hand MRH3, MRH4, and these two substrate W are moved among two surface clean cell S S successively.Then, the second master manipulator MR2 takes out of through two substrate W after the surface cleaning processing from two surface clean cell S S successively with hand MRH3, MRH4, and these two substrate W are moved among the roll-over unit RT2a simultaneously.

In roll-over unit RT2a, his-and-hers watches face that upward two substrate W overturn so that its back side towards the top.Action about roll-over unit RT2a describes in the back.

Then, the first master manipulator MR1 of first treatment region 11 takes out of two the substrate Ws of the back side towards the top with hand MRH1, MRH2 simultaneously from roll-over unit RT2a, and these two substrate W are moved among the cleaning unit SSR of the back side successively.Then the first master manipulator MR1 takes out of through cleaned two the substrate W in the back side successively from two back side cleaning unit SSR, and these two substrate W are moved among the roll-over unit RT1a simultaneously.

In roll-over unit RT1a, to two the substrate Ws of the back side towards the top overturn so that its surface towards the top.Action about roll-over unit RT1a then describes in the back.Then, the protractor manipulator IR in protractor district 10 takes out of two substrate W that overturn with hand IRH1, IRH2 successively from roll-over unit RT1a, and these two substrate W are contained in the carrier C on the carrier loading stage 40.Thus, finish a series of action of the substrate board treatment 100a in second execution mode.

In addition, by the hand IRH1 of protractor manipulator IR and the difference in height of hand IRH2 are set at difference in height (difference in height between hand MRH3 and the hand MRH4) M1 that is substantially equal between hand MRH1 and the hand MRH2, protractor manipulator IR can be taken out of two substrate W simultaneously from roll-over unit RT1a.

In addition, by the interval of two substrate loading part PASS1 and the interval of two substrate loading part PASS2 are set at hand MRH1 and the difference in height between the hand MRH2 (difference in height between hand MRH3 and the hand MRH4) M1 that is substantially equal to shown in Fig. 4 A, Fig. 4 B, make the first master manipulator MR1 receive two substrate W simultaneously from two substrate loading part PASS1.In addition, the first master manipulator MR1 can be loaded into two substrate W on two substrate loading part PASS2 simultaneously.And then, make the second master manipulator MR2 receive two substrate W simultaneously from two substrate loading part PASS2.In addition, if the hand IRH1 of protractor manipulator IR and the difference in height of hand IRH2 are set at difference in height (difference in height between hand MRH3 and the hand MRH4) M1 that is substantially equal between hand MRH1 and the hand MRH2, then protractor manipulator IR can be loaded into two substrate W on two substrate loading part PASS1 simultaneously.

(2-3) action of roll-over unit

Then, the structure to roll-over unit RT1a, RT2a describes.Figure 14 A, Figure 14 B, Figure 14 C, Figure 14 D, Figure 15 E, Figure 15 F, Figure 15 G are the figure that is used to illustrate the action of roll-over unit RT1a, RT2a.In addition, because the action of each operation of roll-over unit RT1a, RT2b is identical, so, in Figure 14 A, Figure 14 B, Figure 14 C, Figure 14 D and Figure 15 E, Figure 15 F, Figure 15 G, be that example describes with the action of roll-over unit RT2a.

Shown in Figure 14 A,, keep hand MRH3, the MRH4 of the second master manipulator MR2 of substrate W to advance simultaneously between the first portable plate 36a and the fixed head 32 and between the second portable plate 36b and the fixed head 32.In addition, the advance and retreat direction of hand MRH3, the MRH4 of the second master manipulator MR2 intersects vertically in the direction of above-mentioned arrow U (Figure 13 A, Figure 13 B).In addition, each supporting pin 39a, 39b, 39c, the 39d of roll-over unit RT1a, RT2a are arranged at and are moving into when taking out of substrate W respectively and hand IRH1, IRH2, hand MRH1MRH2 and the discontiguous position of hand MRH3, MRH4.

Then, as shown in Figure 14B, hand MRH3, MRH4 retreat when descending at the same time.Thus, substrate W is loaded on supporting pin 39a, the 39d.At this moment, in roll-over unit RT2a, upper surface is loaded onto on supporting pin 39a, the 39d towards the substrate W of top.

Then, shown in Figure 14 C, cylinder 37a (Figure 13 A) descends supporting member 35a, and simultaneously, cylinder 37b (Figure 13 A) rises supporting member 35b.Thus, a side substrate W is kept by the supporting pin 39a of the supporting pin 39c of the first portable plate 36a and fixed head 32, and the opposing party's substrate W is kept by the supporting pin 39b of the supporting pin 39d of the second portable plate 36b and fixed head 32.

Under this state, shown in Figure 14 D, the first portable plate 36a, fixed head 32 and the second portable plate 36b be subjected to rotating driver 38 driving and integratedly at θ direction (around trunnion axis HA) Rotate 180 degree.Thus, the substrate W that kept of the substrate W that is kept by supporting pin 39a, 39c and supporting pin 39b, 39d is reversed.In this case, in roll-over unit RT2a, the back side of substrate W is towards the top.

Then, shown in Figure 15 E, cylinder 37a descends supporting member 35a, and simultaneously, cylinder 37b rises supporting member 35b.Thus, when the first portable plate 36a descended, the second portable plate 36b rose.Therefore, a side substrate W is in the state that is supported by the supporting pin 39c of the first portable plate 36a, and the opposing party's substrate W then is in the state of the supporting pin 39b support of the plate 32 that is fixed.

Under this state, shown in Figure 15 F, hand MRH1, the MRH2 of the first master manipulator MR1 (Figure 10) rises when advancing by the below of the substrate supported W of supporting pin 39b institute and by the below of the substrate supported W of supporting pin 39c institute.Thus, receive by the substrate supported W of supporting pin 39b institute, and receive by the substrate supported W of supporting pin 39c institute by hand MRH2 by hand MRH1.In addition, the advance and retreat direction of hand MRH1, the MRH2 of the first master manipulator MR1 and above-mentioned arrow U (Fig. 1) direction intersect vertically.

Then, shown in Figure 15 G, retreat simultaneously, take out of two substrate W from roll-over unit RT2a by hand MRH1, MRH2.

(2-4) effect of second execution mode

In the present embodiment, the first and second master manipulator MR1, MR2 carry out taking out of of two substrate W simultaneously to roll-over unit RT1a, RT2a and move into upset.And then roll-over unit RT1a, RT2a overturn simultaneously to two substrate W.Thus, can carry out many substrate overturns expeditiously.Its result can improve the disposal ability among the substrate board treatment 100a.

In addition, carry two substrates simultaneously, can further improve the disposal ability of substrate board treatment 100a by protractor manipulator IR, the first master manipulator MR1 and the second master manipulator MR2.

In addition, with first execution mode similarly, after substrate W is carried out end face clean and surface cleaning processing, substrate W is carried out back side clean.Therefore, even, also can eliminate this absorption trace by back side clean because of absorption type rotary chuck 201,61 forms the absorption trace at the back side of substrate W.Therefore, cleaning base plate W fully neatly.

(3) the 3rd execution modes

Then, the substrate board treatment in the 3rd execution mode of the present invention illustrates the difference that is different from above-mentioned first execution mode.

(3-1) structure of substrate board treatment

Figure 16 and 17 is schematic diagrames that the substrate board treatment structure in the 3rd execution mode is shown.Figure 16 is the vertical view of substrate board treatment, and Figure 17 is the A2-A2 line profile of Figure 16.

As shown in figure 16, in the substrate board treatment 100b of the 3rd execution mode, be provided with a plurality of (for example being 4) surface clean cell S S at side's side of first treatment region 11.In addition, be provided with a plurality of (for example being 4) back side cleaning unit SSR, be provided with a plurality of (for example being 4) end face cleaning unit SSB at the opposing party's side of second treatment region 12 at side's side of second treatment region 12.In addition, as shown in figure 17, upper and lower settings has substrate loading part PASS1, PASS2 between the protractor district 10 and first treatment region 11, and upper and lower settings has roll-over unit RT1, RT2 and substrate loading part PASS3 between first treatment region 11 and second treatment region 12.

In addition, in the surface clean cell S S of substrate board treatment 100b, adopt the mechanical type rotary chuck (with reference to Figure 11) of the peripheral end that keeps substrate W.

(3-2) summary of substrate board treatment action

Then, with reference to Figure 16 and Figure 17 the summary that substrate board treatment 100b moves is described.

At first, in protractor district 10, protractor manipulator IR takes out untreated substrate W from a carrier C who is loaded on the carrier loading stage 40.When protractor manipulator IR moves to arrow U direction,, thereby this substrate W is loaded into substrate loading part PASS1 around the vertical axis rotation.

The substrate W that is loaded in substrate loading part PASS1 is received by the first master manipulator MR1 of first treatment region 11, then, is loaded on the substrate loading part PASS3.The substrate W that is loaded on the substrate loading part PASS3 is received by the second master manipulator MR2 of second treatment region 12, then, is moved among the end face cleaning unit SSB.Then, taken out of from end face cleaning unit SSB by the second master manipulator MR2, then moved among the roll-over unit RT1 through the cleaned substrate W of end face.

Among the roll-over unit RT1, the substrate W that his-and-hers watches face upward overturns, so that the back side of substrate is towards the top.The substrate W that overturn is taken out of from roll-over unit RT1 by the second master manipulator MR2, then moves into back side cleaning unit SSR.Then, cleaned substrate W is taken out of from back side cleaning unit SSR by the second master manipulator MR2 through the back side, is then moved among the roll-over unit RT2.

Among the roll-over unit RT2, the substrate W towards the top overturns to the back side, so that the surface of substrate is towards the top.The substrate W that overturn is taken out of from roll-over unit RT2 by the first master manipulator MR1 of first treatment region 11, then moves into surface clean cell S S.Substrate W through surface cleaning processing is taken out of from surface clean cell S S by the first master manipulator MR1, then is loaded on the substrate loading part PASS2.The substrate W that is loaded into substrate loading part PASS2 is received by the protractor manipulator IR in protractor district 10, and is contained in the carrier C.

In substrate board treatment 100b, the first master manipulator MR1 is following three operations at porter's ordinal number amount of a substrate W: the carrying from substrate loading part PASS1 to substrate loading part PASS3; Carrying from roll-over unit RT2 to surface clean cell S S; And carrying from surface clean cell S S to substrate loading part PASS2.

In addition, the second master manipulator MR2 is following four operations at porter's ordinal number amount of a substrate W: the carrying from substrate loading part PASS3 to end face cleaning unit SSB; Carrying from end face cleaning unit SSB to roll-over unit RT1; Carrying from roll-over unit RT1 to back side cleaning unit SSR; And carrying from back side cleaning unit SSR to roll-over unit RT2.

At this moment, porter's ordinal number amount of the second master manipulator MR2 is more than porter's ordinal number amount of the first master manipulator MR1.Therefore, the disposal ability of whole base plate processing unit 100b depends on the transporting velocity of the second master manipulator MR2 to substrate W.

(3-3) effect of the 3rd execution mode

With first execution mode similarly, in the present embodiment, carrying by carrying out the substrate W in first treatment region 11 simultaneously and the carrying of the substrate W in second treatment region 12 can be shortened the handling time of substrate W.Thus, can improve disposal ability among the substrate board treatment 100b.

In addition, in the present embodiment, after substrate W is carried out the end face clean, substrate W is carried out back side clean.Thus, even when end face is handled, form the absorption trace, also can eliminate this absorption trace by back side clean after this at the back side of substrate W.In addition, owing in surface clean cell S S, adopt the mechanical type rotary chuck, so, even carry out surface cleaning processing after the clean overleaf, can not form the absorption trace once more at the back side of substrate W yet.

(3-4) variation of the 3rd execution mode

In the substrate board treatment 100b of the 3rd execution mode, adopt roll-over unit RT1a, the RT2a of expression in the above-described 2nd embodiment to replace roll-over unit RT1, RT2 also can.At this moment, because many substrate W are overturn expeditiously, therefore can make every effort to improve the disposal ability among the substrate board treatment 100b.

In addition, by substrate loading part PASS1, PASS2, PASS3 respectively are provided with two respectively, and similarly carry two substrate W simultaneously, can further improve the disposal ability among the substrate board treatment 100b with above-mentioned second execution mode.

(4) the 4th execution modes

Then, the substrate board treatment in the 4th execution mode of the present invention illustrates the difference that is different from above-mentioned first execution mode.

(4-1) structure of substrate board treatment

Figure 18 and Figure 19 are the schematic diagrames that the substrate board treatment structure in the 4th execution mode is shown.Figure 18 is the vertical view of substrate board treatment.Figure 19 is the end view when arrow B 2 directions are observed substrate board treatment Figure 18.

As Figure 18 and shown in Figure 19, among the substrate board treatment 100c in the 4th execution mode, be provided with a plurality of (being 8 in Figure 19) back side cleaning unit SSR at first treatment region 11.A plurality of back side cleaning unit SSR dispose in the mode of four of stacked on top of one another respectively at side's side and the opposing party's side of first treatment region 11.

Be provided with a plurality of (being 8 in Figure 19) surface clean cell S S at second treatment region 12.A plurality of surface clean cell S S dispose in the mode of four of stacked on top of one another respectively at side's side and the opposing party's side of second treatment region 12.

(4-2) summary of substrate board treatment action

The action of substrate board treatment 100c then, is described with reference to Figure 18 and Figure 19.

At first, in protractor district 10, protractor manipulator IR takes out untreated substrate W from a carrier C who is loaded on the carrier loading stage 40.When protractor manipulator IR moves to arrow U direction, rotate, and this substrate W is passed to roll-over unit RT1 around vertical axis.This moment, the surface of substrate W is towards the top.

In roll-over unit RT1, W overturns to substrate, so that its back side is towards the top.The substrate W that overturn is taken out of from roll-over unit RT1 by the first master manipulator MR1 of first treatment region 11, then moves into back side cleaning unit SSR.Then, among the cleaning unit SSR substrate W is carried out back side clean overleaf.Cleaned substrate W is taken out of from back side cleaning unit SSR by the first master manipulator MR1 through the back side, then moves into roll-over unit RT2.

In roll-over unit RT2, the substrate W towards the top overturns to the back side, so that its surface is towards the top.The substrate W that overturn is taken out of from roll-over unit RT2 by the second master manipulator MR2 of second treatment region 12, then moves into surface clean cell S S.Then, in surface clean cell S S, substrate W is carried out surface cleaning processing.In addition, in surface clean cell S S, any one in employing absorption type rotary chuck 61 (Figure 10) and the mechanical type rotary chuck 81 (Figure 11) also can.But, by adopting absorption type rotary chuck 61, can be in surface clean cell S S simultaneously periphery and the peripheral end to substrate W clean.

Taken out of from surface clean cell S S by the second master manipulator MR2 through the substrate W after the surface cleaning processing, then be loaded into substrate loading part PASS2.The substrate W that is loaded into substrate loading part PASS2 is received by the master manipulator MR1 of first treatment region, then is loaded into substrate loading part PASS1.The substrate W that is loaded into substrate loading part PASS1 is received by the protractor manipulator IR in protractor district 10, and is contained in the carrier C.

(4-3) action of master manipulator

(4-3-1) the action example of first master manipulator

The concrete action example of the first master manipulator MR1 then, is described with reference to Figure 18.

The first master manipulator MR1 at first takes out of the untreatment base W of the back side towards the top by hand MRH2 from roll-over unit RT1.Then, the first master manipulator MR1 takes out of through the cleaned substrate W in the back side from any one of back side cleaning unit SSR by hand MRH1, and the above-mentioned untreatment base W that will remain on hand MRH2 moves into this back side cleaning unit SSR.Then, the first master manipulator MR1 takes out of the substrate W of surface towards the top with hand MRH2 from substrate loading part PASS2.This substrate W is through the substrate W after back side clean and the surface cleaning processing.

Then, the first master manipulator MR1 cleaned substrate W in the above-mentioned back side of process that will remain on hand MRH1 moves into roll-over unit RT2.Then, the first master manipulator MR1 substrate W through back side clean and surface cleaning processing that will remain on hand MRH2 is loaded on the substrate loading part PASS1.

The first master manipulator MR1 carries out so a series of action continuously.In addition, in above-mentioned action example, the action of the action of hand MRH1 and hand MRH2 also can on the contrary.

The first master manipulator MR1 is following three operations at porter's ordinal number amount of a substrate W: the carrying from roll-over unit RT1 to back side cleaning unit SSR; Carry from back side cleaning unit SSR to roll-over unit RT2; And carrying from substrate loading part PASS2 to substrate loading part PASS1.

(4-3-2) action of second master manipulator

The concrete action example of the second master manipulator MR2 then, is described with reference to Figure 18.

The second master manipulator MR2, at first by hand MRH4 from roll-over unit RT2 take out of the surface towards the top through the cleaned substrate W in the back side.Then, the second master manipulator MR2 takes out of through the substrate W after the surface cleaning processing by hand MRH3 any one from surface clean cell S S, and the substrate W that will remain on hand MRH4 moves into this surface clean cell S S.Then, the second master manipulator MR2 substrate W that will remain on after the process surface cleaning processing of hand MRH3 is loaded into substrate loading part PASS2.

The second master manipulator MR2 carries out so a series of action continuously.In addition, in above-mentioned action example, the action of the action of hand MRH3 and hand MRH4 also can on the contrary.

The second master manipulator MR2 is following two operations at porter's ordinal number amount of a substrate W: the carrying from roll-over unit RT2 to surface clean cell S S; And carrying from surface clean cell S S to substrate loading part PASS2.

So action of the second master manipulator MR2 is carried out simultaneously with the action of the aforesaid first master manipulator MR1.In the present embodiment, the second master manipulator MR2 is less than the porter ordinal number amount of the first master manipulator MR1 to substrate W to porter's ordinal number amount of substrate W.Therefore, the disposal ability of whole base plate processing unit 100c depends on the transporting velocity of the first master manipulator MR1 to substrate W.

(4-4) effect of the 4th execution mode

In the present embodiment, be provided with the first master manipulator MR1, be provided with the second master manipulator MR2 at second treatment region 12 at first treatment region 11.At this moment, can carry out the carrying of the substrate W in first treatment region 11 and the carrying of the substrate W in second treatment region 12 simultaneously.Thus, can shorten the handling time of substrate W, therefore can improve the disposal ability of substrate board treatment 100c.

In addition, roll-over unit RT1 is arranged at the position between the protractor manipulator IR and the first master manipulator MR1, and roll-over unit RT2 is arranged at the position between the first master manipulator MR1 and the second master manipulator MR2 simultaneously.At this moment, when can make substrate W upset, substrate W is passed to the first master manipulator MR1 from protractor manipulator IR.Equally, when can make substrate W upset, substrate W is passed to the second master manipulator MR2 from the first master manipulator MR1.Thus, respectively substrate is moved into the situation of taking out of roll-over unit RT1, RT2 with the first and second master manipulator MR1, MR2 and compared, can reduce the carrying operation of the first and second master manipulator MR1, MR2.Thereby, can further improve the disposal ability of substrate board treatment 100c.

In addition, in the substrate board treatment 100c of present embodiment, side's side and the opposing party's side at first treatment region 11 dispose a plurality of back side cleaning unit SSR in the multilayer mode, dispose a plurality of surface clean cell S S at side's side and the opposing party's side of second treatment region 12 in the multilayer mode.Thus, compare, can realize the further miniaturization of substrate board treatment 100c and save spatialization with the situation that disposes a plurality of cleaning units with planar fashion.

In addition, in the present embodiment, come to overturn to the substrate W before the clean of the back side with through the cleaned substrate W in the back side by mutual different roll-over unit RT1, RT2.At this moment, even the back side of the substrate W before the clean of the back side is contaminated, pollutant can not transferred to through on the cleaned substrate W in the back side yet.Thus, the back side through the cleaned substrate W in the back side can be maintained under the clean state.

In addition, in the present embodiment, by a plurality of surface clean cell S S and a plurality of back side cleaning unit SSR are arranged on the short transverse in multilayer laminated mode, thus, can realize the miniaturization of the structure (so-called platform structure) of substrate board treatment 100c, simultaneously, because surface clean cell S S and back side cleaning unit SSR are arranged on the above-mentioned short transverse, the surface clean cell S S of requirement and the back side cleaning unit SSR of requirement can be set easily thus.

(5) the 5th execution modes

Then, the substrate board treatment in the 5th execution mode of the present invention illustrates the difference that is different from above-mentioned the 4th execution mode.

Figure 20 is the generalized section of the substrate board treatment in the 5th execution mode.As shown in figure 20, the substrate board treatment 100d in the 5th execution mode possesses roll-over unit RT1a, the RT2a shown in Figure 13 A, Figure 13 B, to replace roll-over unit RT1, RT2.In addition, substrate loading part PASS1, PASS2 respectively are provided with two respectively.

(5-1) summary of substrate board treatment action

The summary of substrate board treatment 100d action then, is described with reference to Figure 20.

At first, in the protractor district, protractor manipulator IR takes out two untreated substrate W with hand IRH1, IRH2 a, carrier the carrier C on being loaded in carrier loading stage 40.Then, protractor mechanical type IR two substrate W that will remain on hand IRH1, IRH2 pass to roll-over unit RT1a successively.

In roll-over unit RT1a, two untreatment base W that his-and-hers watches face upward overturn, so that its back side is towards the top.Action about roll-over unit RT1a describes in the back.

Then, the first master manipulator MR1 of first treatment region 11 takes out of two the substrate Ws of the back side towards the top with hand MRH1, MRH2 simultaneously from roll-over unit RT1a.Then, the first master manipulator MR1, two substrate W that will remain on hand MRH1, MRH2 move into two back side cleaning unit SSR (Figure 18) successively.Then, the first master manipulator MR1 takes out of through cleaned two the substrate W in the back side from two back side cleaning unit SSR successively with hand MRH1, MRH2.

Then, the first master manipulator MR1 will remain on moving into simultaneously among the roll-over unit RT2a through cleaned two the substrate W in the back side of hand MRH1, MRH2.In roll-over unit RT2a to the back side towards above two substrate W overturn so that its surface is towards the top.Action about roll-over unit RT2a describes in the back.

Then, the second master manipulator MR2 of second treatment region 12 takes out of two the substrate Ws of surface towards the top with hand MRH3, MRH4 simultaneously from roll-over unit RT2a.Then, the second master manipulator MR2, two substrate W that will remain on hand MRH3, MRH4 move into two surface clean cell S S (Figure 18) successively.Then, the second master manipulator MR2 takes out of through two substrate W after the surface cleaning processing from two surface clean cell S S successively with hand MRH3, MRH4.

Then, the second master manipulator MR2, two substrate W that will remain on hand MRH3, MRH4 are loaded into two substrate loading part PASS2 successively.Then, the first master manipulator MR1 of first treatment region 11 receives two substrate W that are loaded into two substrate loading part PASS2 successively with hand MRH1, MRH2.Then, the first master manipulator MR1 is loaded into two substrate loading part PASS1 successively with two substrate W.Then, the protractor manipulator IR in protractor district 10 receives and is loaded into two substrate W of two substrate loading part PASS1, and is contained in the carrier C.Thus, finish a succession of action of substrate board treatment 100d in the 5th execution mode.

(5-2) action of roll-over unit

The action of roll-over unit RT1a, RT2a then, is described.Figure 21 A, Figure 21 B, Figure 21 C, Figure 21 D and Figure 22 E, Figure 22 F, Figure 22 G are the figure that is used to illustrate roll-over unit RT1a, RT2a action.In addition, because the action of each operation of roll-over unit RT1a, RT2a is identical, therefore, in Figure 21 A, Figure 21 B, Figure 21 C, Figure 21 D and Figure 22 E, Figure 22 F, Figure 22 G, be that an example describes with the action of roll-over unit RT2a.

Shown in Figure 21 A, keep hand MRH1, the MRH2 of the first master manipulator MR1 of substrate W advancing between the first portable plate 36a and the fixed head 32 and between the second portable plate 36b and the fixed head 32 simultaneously.In addition, the advance and retreat direction of hand MRH1, the MRH2 of the first master manipulator MR1 and above-mentioned arrow U (Figure 18) direction intersect vertically.In addition, each supporting pin 39a, 39b of roll-over unit RT1a, RT2a, 39c, 39d are arranged at and are moving into when taking out of substrate W respectively and hand IRH1, IRH2, hand MRH1, MRH2 and the discontiguous position of hand MRH3, MRH4.

Then, shown in Figure 21 B, hand MRH1, MRH2 retreat when descending at the same time.Thus, substrate W is loaded on supporting pin 39a, the 39d.At this moment, in roll-over unit RT2a, the back side is loaded onto on supporting pin 39a, the 39d towards the substrate W of top.

Then, shown in Figure 21 C, cylinder 37a (Figure 13 A) descends supporting member 35a, and simultaneously, cylinder 37b (Figure 13 A) rises supporting member 35b.Thus, a side substrate W is kept by the supporting pin 39a of the supporting pin 39c of the first portable plate 36a and fixed head 32, and the opposing party's substrate W is kept by the supporting pin 39b of the supporting pin 39d of the second portable plate 36b and fixed head 32.

Under this state, shown in Figure 21 D, the first portable plate 36a, fixed head 32 and the second portable plate 36b be subjected to rotating driver 38 driving and integratedly to θ direction (around trunnion axis HA) Rotate 180 degree.Thus, substrate W that is kept by supporting pin 39a, 39c and the substrate W that is kept by supporting pin 39b, 39d are reversed.In this case, in roll-over unit RT2a, the surface of substrate W is towards the top.

Then, shown in Figure 22 E, cylinder 37a descends supporting member 35a, and simultaneously, cylinder 37b rises supporting member 35b.Thus, when the first portable plate 36a descended, the second portable plate 36b rose.Therefore, a side substrate W is in the state that is supported by the supporting pin 39c of the first portable plate 36a, and the opposing party's substrate W is in the state of the supporting pin 39b support of the plate 32 that is fixed.

Under this state, shown in Figure 22 F, hand MRH3, the MRH4 of the second master manipulator MR2 rises when advancing by the below of the substrate supported W of supporting pin 39b institute and by the below of the substrate supported W of supporting pin 39c institute.Thus, receive by the substrate supported W of supporting pin 39b institute, and receive by the substrate supported W of supporting pin 39c institute by hand MRH4 by hand MRH3.In addition, the advance and retreat direction of hand MRH3, the MRH4 of the second master manipulator MR2 and above-mentioned arrow U (Figure 18) direction intersect vertically.

Then, shown in Figure 22 G, retreat simultaneously, take out of two substrate W from roll-over unit RT2a by making hand MRH3, MRH4.

(5-3) effect of the 5th execution mode

In the present embodiment, the first and second master manipulator MR1, MR2 move into two substrate W simultaneously and take out of roll-over unit RT1a, RT2a.And then roll-over unit RT1a, RT2a overturn to two substrate W simultaneously.Thus, can overturn to many substrates expeditiously.Its result can improve the disposal ability among the substrate board treatment 100d.

In addition, carry two substrate W simultaneously, can further improve the disposal ability among the substrate board treatment 100d by protractor manipulator IR, the first master manipulator MR1 and the second master manipulator MR2.

(6) the 6th execution modes

Then, the substrate board treatment in the 6th execution mode of the present invention illustrates the difference that is different from above-mentioned the 4th execution mode.

(6-1) structure of substrate board treatment

Figure 23 and 24 is schematic diagrames that the substrate board treatment structure in the 6th execution mode is shown.Figure 23 is the vertical view of substrate board treatment, and Figure 24 is the A3-A3 line profile of Figure 23.

As shown in figure 23, in the substrate board treatment 100e of the 6th execution mode, be provided with a plurality of (for example being 8) surface clean cell S S at first treatment region 11.In addition, be provided with a plurality of (for example being 8) back side cleaning unit SSR at second treatment region 12.In addition, as shown in figure 24, upper and lower settings has substrate loading part PASS1, PASS2 between the protractor district 10 and first treatment region 11, and upper and lower settings has roll-over unit RT1, RT2 between first treatment region 11 and second treatment region 12.

(6-2) summary of substrate board treatment action

Then, with reference to Figure 23 and Figure 24 the summary that substrate board treatment 100e moves is described.

At first, in protractor district 10, protractor manipulator IR takes out untreated substrate W from a carrier C who is loaded on the carrier loading stage 40.When protractor manipulator IR moves to arrow U direction,, thereby this substrate W is loaded into substrate loading part PASS1 around the vertical axis rotation.

The substrate W that is loaded in substrate loading part PASS1 is received by the first master manipulator MR1 of first treatment region 11, then moves into surface clean cell S S.Then, taken out of from surface clean cell S S by the first master manipulator MR1, then move among the roll-over unit RT1 through the substrate W after the surface cleaning processing.

In roll-over unit RT1, the substrate W that his-and-hers watches face upward overturns, so that the back side of substrate is towards the top.The substrate W that overturn is taken out of from roll-over unit RT1 by the second master manipulator MR2 of second treatment region 12, then moves into back side cleaning unit SSR.Then, cleaned substrate W is taken out of from back side cleaning unit SSR by the second master manipulator MR2 through the back side, then moves among the roll-over unit RT2.

In roll-over unit RT2, the substrate W towards the top overturns to the back side, so that the surface of substrate is towards the top.The substrate W that overturn is taken out of from roll-over unit RT2 by the first master manipulator MR1 of first treatment region 11, then is loaded into substrate loading part PASS2.The substrate W that is loaded into substrate loading part PASS2 is received by the protractor manipulator IR in protractor district 10, and is contained in the carrier C.

In substrate board treatment 100e, the first master manipulator MR1 is following three operations at porter's ordinal number amount of a substrate W: the carrying from substrate loading part PASS1 to surface clean cell S S; Carrying from surface clean cell S S to roll-over unit RT1; And carrying from roll-over unit RT2 to substrate loading part PASS2.

In addition, the second master manipulator MR2 is following two operations at porter's ordinal number amount of a substrate W: the carrying from roll-over unit RT1 to back side cleaning unit SSR; And carrying from back side cleaning unit SSR to roll-over unit RT2.

Same with above-mentioned the 4th execution mode, the second master manipulator MR2 is less than the porter ordinal number amount of the first master manipulator MR1 to substrate W to porter's ordinal number amount of substrate W.Therefore, the disposal ability of whole base plate processing unit 100e depends on the transporting velocity of the first master manipulator MR1 to substrate W.

(6-3) effect of the 6th execution mode

In the present embodiment, can carry out the carrying of the substrate W in first treatment region 11 and the carrying of the substrate W in second treatment region 12 simultaneously, can shorten the handling time of substrate W thus, thereby improve the disposal ability of substrate board treatment 100e.

In addition, by roll-over unit RT1, RT2 being arranged at the position between the first master manipulator MR1 and the second master manipulator MR2, when can overturn to substrate W, handing-over substrate W between the first master manipulator MR1 and the second master manipulator MR2.Thus, move into the situation of taking out of substrate W to roll-over unit RT1, RT2 respectively with the first and second master manipulator MR1, MR2 and compare, can further reduce porter's ordinal number amount of the first and second master manipulator MR1, MR2.Thereby, can further improve the disposal ability of substrate board treatment 100e.

(6-4) variation of the 6th execution mode

In the substrate board treatment 100e of the 6th execution mode, adopt roll-over unit RT1a, the RT2a of expression in the above-described 2nd embodiment to replace roll-over unit RT1, RT2 also can.At this moment, owing to can overturn expeditiously, therefore can improve the disposal ability of substrate board treatment 100e to many substrate W.

In addition, by substrate loading part PASS1, PASS2 respectively are provided with two respectively, and same with above-mentioned second execution mode, carry two substrate W simultaneously, can further improve the disposal ability of substrate board treatment 100e.

(7) the 7th execution modes

Then, the substrate board treatment in the 7th execution mode of the present invention illustrates the difference that is different from above-mentioned the 4th execution mode.

(7-1) structure of substrate board treatment

Figure 25 and 26 is schematic diagrames that the substrate board treatment structure in the 7th execution mode is shown.Figure 25 is the vertical view of substrate board treatment, and Figure 26 is the A4-A4 line profile of Figure 25.As Figure 25 and shown in Figure 26, in the substrate board treatment 100f of the 7th execution mode, upper and lower settings has substrate loading part PASS1, PASS2 between the protractor district 10 and first treatment region 11, between first treatment region 11 and second treatment region 12, upper and lower settings has substrate loading part PASS3, the PASS4 that has with substrate loading part PASS1, PASS2 same structure.In addition, the side side upper and lower settings at first treatment region 11 and second treatment region 12 has roll-over unit RT1, RT2.

(7-2) summary of substrate board treatment action

The summary of the action of substrate board treatment 100f then, is described with reference to Figure 25 and Figure 26.At first, in protractor district 10, protractor manipulator IR takes out untreated substrate W from a carrier C who is loaded on the carrier loading stage 40.When protractor manipulator IR moves to arrow U direction,, thereby this substrate W is loaded into substrate loading part PASS1 around the vertical axis rotation.

The substrate W that is loaded into substrate loading part PASS1 is received by the first master manipulator MR1 of first treatment region 11, then, is loaded on substrate loading part PASS3.The substrate W that is loaded into substrate loading part PASS3 is received by the second master manipulator MR2 of second treatment region 12, then moves into roll-over unit RT1.

In roll-over unit RT1, the substrate W that his-and-hers watches face upward overturns, so that the back side of substrate is towards the top.The substrate W that overturn is taken out of from roll-over unit RT1 by the second master manipulator MR2, then moves into back side cleaning unit SSR.Then, cleaned substrate W is taken out of from back side cleaning unit SSR by the second master manipulator MR2 through the back side, then moves among the roll-over unit RT2.

In roll-over unit RT2, the substrate W towards the top overturns to the back side, so that the surface of substrate is towards the top.The substrate W that overturn is taken out of from roll-over unit RT2 by the second master manipulator MR2, then is loaded into substrate loading part PASS4.The substrate W that is loaded into substrate loading part PASS4 is received by the first master manipulator MR1 of first treatment region 11, then moves into surface clean cell S S.

Then, taken out of from surface clean cell S S by the first master manipulator MR1, then be loaded into substrate loading part PASS2 through the substrate W after the surface cleaning processing.The substrate W that is loaded into substrate loading part PASS2 is received by the protractor manipulator IR in protractor district 10, and is contained in the carrier C.

(7-3) effect of the 7th execution mode

In the present embodiment, can carry out the carrying of the substrate W in first treatment region 11 and the carrying of the substrate W in second treatment region 12 simultaneously.Thus, can shorten the handling time of substrate W, therefore can improve the disposal ability of substrate board treatment 100f.

(7-4) variation of the 7th execution mode

In the substrate board treatment 100f of the 7th execution mode, adopt roll-over unit RT1a, the RT2a of expression in the above-described 2nd embodiment to replace roll-over unit RT1, RT2 also can.At this moment, owing to can overturn expeditiously, therefore can improve the disposal ability among the substrate board treatment 100f to many substrate W.

In addition, by substrate loading part PASS1, PASS2, PASS3, PASS4 respectively are provided with two respectively, and similarly carry two substrate W simultaneously, can further improve the disposal ability of substrate board treatment 100f with above-mentioned second execution mode.

(8) other execution modes

In the above-mentioned first above-mentioned execution mode, untreated substrate W is transported to second treatment region 12 via substrate loading part PASS1, PASS2 from protractor district 10, but not only be defined in this, can be transported to second treatment region 12 from protractor district 10 via roll-over unit RT1, RT2.

In addition, in the above-described 3rd embodiment, after end face clean of carrying out substrate W and back side clean, carry out the surface cleaning processing of substrate W, but not only be defined in this, after substrate W is carried out surface treatment, carry out the end face clean of substrate W and the back side clean of substrate W and also can.

In addition, in above-mentioned the 3rd, the 6th and the 7th execution mode, by roll-over unit RT1 the substrate W before the clean of the back side is overturn, and by roll-over unit RT2 to overturning through the cleaned substrate W in the back side, but not only be defined in this, overturn to the substrate W before the clean of the back side and through the cleaned substrate W in the back side by shared roll-over unit and also can.

In addition, in above-mentioned first～the 3rd execution mode, the configuration of surface clean cell S S, back side cleaning unit SSR and end face cleaning unit SSB can suitably be changed according to its processing speed.For example, with end face cleaning unit SSB be arranged at first treatment region 11 also can, perhaps surface clean cell S S and back side cleaning unit SSR can be arranged on common treatment region.

In addition, in the above-described 4th embodiment, be transported to protractor district 10 via substrate loading part PASS1, PASS2 from second treatment region 12 through the substrate W after the surface cleaning processing, but not only be defined in this, can be transported to protractor district 10 from second treatment region 12 via roll-over unit RT1, RT2.

In addition, in above-mentioned the 4th～the 7th execution mode, the reversed in order of surface cleaning processing and back side clean also can.

In addition, in above-mentioned the 4th～the 7th execution mode, the sequence of movement of protractor manipulator IR and master manipulator MR1, MR2 can suitably change according to roll-over unit RT1, RT2, surface clean cell S S, back side cleaning unit SSR and end face cleaning unit SSB processing speed.

In addition, each quantity of roll-over unit RT1, RT2, RT1a, RT2a, surface clean cell S S, back side cleaning unit SSR and end face cleaning unit SSB can suitably change according to its processing speed.

In addition, in above-mentioned first～the 7th execution mode, as protractor manipulator IR and master manipulator MR1, MR2, adopted the multi-joint type conveying robot that makes hand advance and retreat and move by linear joint along straight line, but not only be defined in this, can adopt the straight ejector half conveying robot that makes hand advance and retreat along linear slide and move with respect to substrate W.

(9) correspondence of each key element of each structural element of the present invention and execution mode

Below, describe at the corresponding example between each key element of each inscape of the present invention and execution mode, but the present invention not only is defined in this.

In the above-described embodiment, showing first treatment region 11 is examples of first processing region, second treatment region 12 is examples of second processing region, protractor district 10 moves into the example of taking out of the zone, zone between the protractor 10 and first treatment region 11 is the example of the first handing-over zone or first junction, and the zone between first treatment region 11 and second treatment region 12 is the example of the second handing-over zone or second junction.

In addition, at least one unit that shows among surface clean cell S S, back side cleaning unit SSR and the end face cleaning unit SSB is the example of first or second handling part, the first master manipulator MR1 is the example of first Handling device, the second master manipulator MR2 is the example of second Handling device, carrier C is the example of accepting container, carrier loading stage 40 is examples of container loading part, and protractor manipulator IR is the example of the 3rd Handling device.

In addition, showing end face cleaning unit SSB is the example of end face clean portion, back side cleaning unit SSR is the example of back side clean portion, surface clean cell S S is the example of surface cleaning processing portion, roll-over unit RT1, RT2, RT1a, RT1b are the examples of (first or second) turning device or switching mechanism, and substrate loading part PASS1, PASS2, PASS3, PASS4 (first or second) are the examples of substrate loading part.

In addition, show fixed head 32, the first portable plate 36a, supporting pin 39a, 39c and cylinder 37a are the examples of first maintaining body, fixed head 32, the second portable plate 36b, supporting pin 39b, 39d and cylinder 37b are the examples of second maintaining body, supporting bracket 31 is examples of supporting member, rotating driver 38 is examples of whirligig, fixed head 32 is examples of shared upset retaining member, supporting pin 39a is the example of first support portion, the first movable platen 36a is the example of the first upset retaining member, supporting pin 39c is the example of second support portion, cylinder 37a is the example of first driving mechanism, supporting pin 39b is the example of the 3rd support portion, the second portable plate 36b is the example of the second upset retaining member, and supporting pin 39d is the example of the 4th support portion, and cylinder 37b is the example of second driving mechanism.

In addition, as each structural element of the present invention, also can adopt the structure that has in the present invention to be put down in writing or other various key elements of performance.

Claims (23)

1. substrate board treatment, it is handled the substrate with surface and back side, it is characterized in that, has:

First and second processing region, described first and second processing region is adjacent to each other and dispose, and in order to substrate is handled;

Move into and take out of the zone, described move into take out of the zone substrate is moved into and taken out of to above-mentioned first processing region;

The first handing-over zone, the described first handing-over zone is arranged on above-mentioned moving into and takes out of between zone and above-mentioned first processing region,

The second handing-over zone, the described second handing-over zone is arranged between above-mentioned first processing region and above-mentioned second processing region, wherein,

Above-mentioned first processing region has:

First handling part;

First Handling device, described first Handling device is carrying substrate between the above-mentioned first handing-over zone, above-mentioned first handling part and the above-mentioned second handing-over zone,

Above-mentioned second processing region has:

Second handling part;

Second Handling device, described second Handling device is carrying substrate between above-mentioned second handing-over zone and above-mentioned second handling part,

Above-mentioned moving into taken out of the zone and had:

The container loading part, described container loading part is accommodated the accepting container of substrate in order to loading;

The 3rd Handling device, described the 3rd Handling device is carrying substrate between accepting container that is loaded into the said vesse loading part and the above-mentioned first handing-over zone,

And any one party in above-mentioned first and second handling part has the back side clean portion in order to the cleaning base plate back side,

The above-mentioned first handing-over zone, the second handing-over zone and in above-mentioned second Handling device with the zone of the regional opposition side of above-mentioned second handing-over at least one zone on have turning device, described turning device overturns in order to the surface and the back side to substrate.

2. substrate board treatment as claimed in claim 1 is characterized in that,

Any one party handling part in above-mentioned first and second handling part has end face clean portion, and described end face clean portion peripheral end to substrate when keeping substrate back cleans,

Above-mentioned turning device overturns to the surface and the back side of the substrate that cleans by above-mentioned end face clean portion,

Above-mentioned back side clean portion is cleaned the back side of the substrate by above-mentioned turning device upset.

3. substrate board treatment as claimed in claim 2 is characterized in that,

Above-mentioned end face clean portion has a plurality of end face cleaning units with the multilayer form configuration, and above-mentioned back side clean portion has a plurality of back sides cleaning unit with the multilayer form configuration.

4. substrate board treatment as claimed in claim 2 is characterized in that,

Any one party handling part in above-mentioned first and second handling part has surface cleaning processing portion, and described surface cleaning processing portion is in order to the cleaning base plate surface.

5. substrate board treatment as claimed in claim 4 is characterized in that,

Above-mentioned surface cleaning processing portion has a plurality of surface clean unit with the multilayer form configuration.

6. substrate board treatment as claimed in claim 4 is characterized in that,

Above-mentioned turning device has first and second turning device,

The above-mentioned first handing-over zone has the first substrate loading part and above-mentioned first turning device of mounting substrate,

The above-mentioned second handing-over zone has the second substrate loading part and above-mentioned second turning device of mounting substrate,

Above-mentioned first handling part has above-mentioned back side clean portion,

Above-mentioned second handling part has above-mentioned end face clean portion and above-mentioned surface cleaning processing portion,

Above-mentioned first Handling device is carrying substrate between the above-mentioned first substrate loading part, the above-mentioned second substrate loading part, above-mentioned first turning device, above-mentioned second turning device and above-mentioned back side clean portion,

Above-mentioned second Handling device is carrying substrate between the above-mentioned second substrate loading part, above-mentioned second turning device, above-mentioned end face clean portion and above-mentioned surface cleaning processing portion,

Above-mentioned the 3rd Handling device is carrying substrate between above-mentioned accepting container, the above-mentioned first substrate loading part and above-mentioned first turning device.

7. substrate board treatment as claimed in claim 6 is characterized in that,

Above-mentioned first turning device makes substrate overturn around rotating shaft, and the connecting line of the position of this rotating shaft and above-mentioned first Handling device when the handing-over substrate and the position of above-mentioned the 3rd Handling device intersects; Above-mentioned second turning device makes substrate overturn around rotating shaft, and the connecting line of the position of this rotating shaft and above-mentioned first Handling device when the handing-over substrate and the position of above-mentioned second Handling device intersects.

8. substrate board treatment as claimed in claim 4 is characterized in that,

The above-mentioned first handing-over zone has the first substrate loading part in order to mounting substrate,

The above-mentioned second handing-over zone has the second substrate loading part and the above-mentioned turning device in order to mounting substrate,

Above-mentioned first handling part has above-mentioned surface cleaning processing portion,

Above-mentioned second handling part has above-mentioned end face clean portion and above-mentioned back side clean portion,

Above-mentioned first Handling device is carrying substrate between the above-mentioned first substrate loading part, the above-mentioned second substrate loading part, above-mentioned turning device and above-mentioned surface cleaning processing portion,

Above-mentioned second Handling device is carrying substrate between the above-mentioned second substrate loading part, above-mentioned turning device, above-mentioned end face clean portion and above-mentioned back side clean portion,

Above-mentioned the 3rd Handling device is carrying substrate between above-mentioned accepting container and the above-mentioned first substrate loading part.

9. substrate board treatment as claimed in claim 8 is characterized in that,

Above-mentioned turning device makes substrate overturn around rotating shaft, and the connecting line of the position of this rotating shaft and above-mentioned first Handling device when the handing-over substrate and the position of above-mentioned second Handling device intersects.

10. substrate board treatment as claimed in claim 1 is characterized in that,

Above-mentioned first and the opposing party of second handling part have surface cleaning processing portion, described surface cleaning processing portion is in order to the cleaning base plate surface.

11. substrate board treatment as claimed in claim 10 is characterized in that,

Above-mentioned back side clean portion has a plurality of back sides cleaning unit with the multilayer form configuration, and above-mentioned surface cleaning processing portion has a plurality of surface clean unit with the multilayer form configuration.

12. substrate board treatment as claimed in claim 10 is characterized in that,

Above-mentioned turning device has first and second turning device,

The above-mentioned first handing-over zone has the first substrate loading part and above-mentioned first turning device in order to mounting substrate,

The above-mentioned second handing-over zone has the second substrate loading part and above-mentioned second turning device in order to mounting substrate,

Above-mentioned first handling part has above-mentioned back side clean portion,

Above-mentioned second handling part has above-mentioned surface cleaning processing portion,

Above-mentioned first Handling device is carrying substrate between the above-mentioned first substrate loading part, the above-mentioned second substrate loading part, above-mentioned first turning device, above-mentioned second turning device and above-mentioned back side clean portion,

Above-mentioned second Handling device is carrying substrate between the above-mentioned second substrate loading part, above-mentioned second turning device and above-mentioned surface cleaning processing portion,

Above-mentioned the 3rd Handling device is carrying substrate between the accepting container that is loaded into the said vesse loading part, the above-mentioned first substrate loading part and above-mentioned first turning device.

13. substrate board treatment as claimed in claim 12 is characterized in that,

Above-mentioned first turning device makes substrate overturn around rotating shaft, and the connecting line of the position of this rotating shaft and above-mentioned first Handling device when the handing-over substrate and the position of above-mentioned the 3rd Handling device intersects,

Above-mentioned second turning device makes substrate overturn around rotating shaft, and the connecting line of the position of this rotating shaft and above-mentioned first Handling device when the handing-over substrate and the position of above-mentioned second Handling device intersects.

14. substrate board treatment as claimed in claim 10 is characterized in that,

The above-mentioned first handing-over zone has the first substrate loading part in order to mounting substrate

The above-mentioned second handing-over zone has above-mentioned turning device,

Above-mentioned first handling part has above-mentioned surface cleaning processing portion,

Above-mentioned second handling part has above-mentioned back side clean portion,

Above-mentioned first Handling device is carrying substrate between the above-mentioned first substrate loading part, above-mentioned turning device and above-mentioned surface cleaning processing portion,

Above-mentioned second Handling device is carrying substrate between above-mentioned turning device and above-mentioned back side clean portion,

Above-mentioned the 3rd Handling device is carrying substrate between accepting container that is loaded into the said vesse loading part and the above-mentioned first substrate loading part.

15. substrate board treatment as claimed in claim 14 is characterized in that,

Above-mentioned turning device makes substrate overturn around rotating shaft, and the connecting line of the position of this rotating shaft and above-mentioned first Handling device when the handing-over substrate and the position of above-mentioned second Handling device intersects.

16. substrate board treatment as claimed in claim 10 is characterized in that,

The above-mentioned first handing-over zone has the first substrate loading part in order to mounting substrate,

The above-mentioned second handing-over zone has the second substrate loading part in order to mounting substrate,

Have above-mentioned turning device with the zone of the regional opposition side of above-mentioned second handing-over,

Above-mentioned first handling part has above-mentioned surface cleaning processing portion,

Above-mentioned second handling part has above-mentioned back side clean portion,

Above-mentioned first Handling device is carrying substrate between the above-mentioned first substrate loading part, the above-mentioned second substrate loading part and above-mentioned surface cleaning processing portion,

Above-mentioned second Handling device is carrying substrate between the above-mentioned second substrate loading part, above-mentioned turning device and above-mentioned back side clean portion,

Above-mentioned the 3rd Handling device is carrying substrate between accepting container that is loaded into the said vesse loading part and the above-mentioned first substrate loading part.

17. as claim 14 or 16 described substrate board treatments, it is characterized in that,

Above-mentioned turning device has first and second turning device of configuration up and down.

18. substrate board treatment as claimed in claim 17 is characterized in that,

Above-mentioned first turning device is in order to overturning to the substrate before implementing to clean by above-mentioned back side clean portion, and above-mentioned second turning device is in order to overturn to the substrate after implementing to clean by above-mentioned back side clean portion.

19. substrate board treatment as claimed in claim 1 is characterized in that,

Above-mentioned turning device has:

First maintaining body, described first maintaining body is in order to be kept substrate with the state perpendicular to first;

Second maintaining body, described second maintaining body in order to substrate to be kept perpendicular to above-mentioned first state;

Supporting member, described supporting member in order to above-mentioned first and second maintaining body to be supported in the equitant mode of above-mentioned first direction;

Whirligig, described whirligig make above-mentioned supporting member rotate integratedly around second with above-mentioned first and second retaining member, and wherein, this second is approximately perpendicular to above-mentioned first.

20. substrate board treatment as claimed in claim 19 is characterized in that,

Above-mentioned first and second maintaining body has shared upset retaining member, and this shared upset retaining member has perpendicular to above-mentioned first one side and another side,

Above-mentioned first maintaining body has:

A plurality of first support portions, described a plurality of first support portions are arranged on the above-mentioned one side of above-mentioned shared upset retaining member, and in order to the peripheral part of supporting substrate;

The first upset retaining member, the above-mentioned one side of described first upset retaining member and above-mentioned shared upset retaining member is opposed and be provided with;

A plurality of second support portions, described a plurality of second support portions are arranged on the face with the opposed above-mentioned first upset retaining member of above-mentioned shared upset retaining member, and in order to the peripheral part of supporting substrate;

First driving mechanism, described first driving mechanism moves at least one side in above-mentioned first upset retaining member and the above-mentioned shared upset retaining member, make and between following two states, optionally shift, this two states is meant, state that above-mentioned first upset retaining member and above-mentioned shared upset retaining member are separated from each other on above-mentioned first direction and the above-mentioned first upset retaining member and above-mentioned shared upset retaining member be approaching state mutually, and

Above-mentioned second maintaining body has:

A plurality of the 3rd support portions, described a plurality of the 3rd support portions are arranged on the above-mentioned another side of above-mentioned shared upset retaining member, and in order to the peripheral part of supporting substrate;

The second upset retaining member, the above-mentioned another side of described second upset retaining member and above-mentioned shared upset retaining member is opposed and be provided with;

A plurality of the 4th support portions, described a plurality of the 4th support portions are arranged on the face with the opposed above-mentioned second upset retaining member of above-mentioned shared upset retaining member, and in order to the peripheral part of supporting substrate;

Second driving mechanism, described second driving mechanism moves at least one side in above-mentioned second upset retaining member and the above-mentioned shared upset retaining member, make and between following two states, optionally shift, this two states is meant that state that above-mentioned second upset retaining member and above-mentioned shared upset retaining member are separated from each other and the above-mentioned second upset retaining member and above-mentioned shared upset retaining member be approaching state mutually on above-mentioned first direction.

21. a substrate board treatment, it is handled the substrate with surface and back side, it is characterized in that, has:

First and second processing region, described first and second processing region is adjacent to each other and dispose, and in order to substrate is handled;

Move into and take out of the zone, described move into take out of the zone substrate is moved into and taken out of to above-mentioned first processing region;

First junction, described first junction above-mentioned move into to take out of between zone and above-mentioned first processing region join substrate,

Second junction, described second junction join substrate between above-mentioned first processing region and above-mentioned second processing region, wherein,

Above-mentioned first processing region has:

First handling part;

First Handling device, described first Handling device is carrying substrate between above-mentioned first junction, above-mentioned first handling part and above-mentioned second junction,

Above-mentioned second processing region has:

Second handling part;

Second Handling device, described second Handling device is carrying substrate between above-mentioned second junction and above-mentioned second handling part,

Above-mentioned moving into taken out of the zone and had:

The container loading part, described container loading part is accommodated the accepting container of substrate in order to loading;

The 3rd Handling device, described the 3rd Handling device is carrying substrate between accepting container that is loaded into the said vesse loading part and above-mentioned first junction,

And the side in above-mentioned first and second handling part has the back side clean portion in order to the cleaning base plate back side,

At least one side in above-mentioned first junction and second junction has switching mechanism, described switching mechanism is between first Handling device and the 3rd Handling device, perhaps between first Handling device and second Handling device, in the handing-over substrate, overturn in the surface of substrate and the back side.

22. substrate board treatment as claimed in claim 21 is characterized in that,

A side or the opposing party in above-mentioned first and second handling part have end face clean portion, and described end face clean portion peripheral end to substrate when keeping substrate back cleans,

Above-mentioned switching mechanism overturns to the surface and the back side of the substrate that cleans by above-mentioned end face clean portion,

Above-mentioned back side clean portion is cleaned the back side of the substrate by above-mentioned switching mechanism upset.

23. substrate board treatment as claimed in claim 21 is characterized in that,

The opposing party in above-mentioned first and second handling part has surface cleaning processing portion, and described surface cleaning processing portion is cleaned in order to the surface to substrate.

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