CN104635987B - A kind of method for splitting and its split system of the contact panel of OCA glue bonds - Google Patents
A kind of method for splitting and its split system of the contact panel of OCA glue bonds Download PDFInfo
- Publication number
- CN104635987B CN104635987B CN201510066852.5A CN201510066852A CN104635987B CN 104635987 B CN104635987 B CN 104635987B CN 201510066852 A CN201510066852 A CN 201510066852A CN 104635987 B CN104635987 B CN 104635987B
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- China
- Prior art keywords
- contact panel
- splitting
- oca glue
- sealing container
- time period
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The present invention provides a kind of method for splitting and its split system of the contact panel of OCA glue bonds, and the method for splitting of the contact panel comprises the following steps：Step is sealed, the contact panel for the OCA glue bonds that band is disassembled is sealed；Cooling step, cools down the contact panel of sealing so that the environment temperature where contact panel is maintained at subzero 90 DEG C to subzero between 150 DEG C, until cooling time reaches pre-set first time period；And splitting step, the contact panel after freezing is taken out, is cut the sensor of contact panel and cover board using hard tool.By the time that the contact panel of OCA glue bonds is placed on to cryofixation in the freezing environment set, so that OCA glue produces qualitative change, it will not have a negative impact at the same time to sensor and cover board, therefore, the fractionation of the contact panel to OCA glue bonds can be realized well, will not destroy the device on contact panel.
Description
Technical field
The present invention relates to a kind of method for splitting of touch panel, more particularly to a kind of contact panel of OCA glue bonds is torn open
Divide method, and be related to the split system for the method for splitting for employing the contact panel.
Background technology
For mesh first two material by that can not be split after OCA glue bonds, the OCA glue is for cementing transparent optical element
（Such as camera lens）Extraordinary adhesive, such as, in the production process of capacitive touch screen/touch panel, glass sensor and
Glass cover-plate needs by OCA glue laminatings, i.e., to be combined by the way that OCA is gluing between sensor and cover board, once have it is bad if
It can not disassemble.
The content of the invention
The technical problems to be solved by the invention are to need to provide a kind of can realize the contact panel of OCA glue bonds tear open
Solution, and then by the separated method for splitting of sensor and cover board.
In this regard, the present invention provides a kind of method for splitting of the contact panel of OCA glue bonds, comprise the following steps：
Step is sealed, the contact panel for the OCA glue bonds that band is disassembled is sealed；
Cooling step, cools down the contact panel of sealing so that the environment temperature where contact panel is maintained at zero
Lower 90 DEG C to subzero between 150 DEG C, until cooling time reaches pre-set first time period；
And splitting step, the contact panel after freezing is taken out, using hard tool by the sensor and lid of contact panel
Plate is cut.
The present invention is by the way that the contact panel of OCA glue bonds is placed in subzero 90 DEG C to subzero 150 DEG C of freezing environment
The time of cryofixation so that OCA glue produces qualitative change, while will not have a negative impact to sensor and cover board, therefore, it is possible to
The fractionation of the contact panel to OCA glue bonds is realized well；The sensor is sensor, the unlimited fixture of hard tool
The material of body, as long as the enough incision instrument of hardness is realized.
Further improvement of the present invention is that the splitting step further includes standing sub-step, and the standing sub-step takes
Go out the contact panel after freezing, realize and cut after time of repose reaches pre-set second time period.By splitting
Set in step and stand sub-step so that the sensor of contact panel and cover board will not be too fragile after freezing, reduce and cutting
To the destruction probability of sensor and cover board in open procedure.
Further improvement of the present invention is that in the standing sub-step, the pre-set second time period is 30s
To 300s.More preferably, in the standing sub-step, the pre-set second time period is 60s to 180s.
After the present invention takes out the contact panel after freezing, half a minute is stood to 5 minutes, or preferred standing 1 minute or so
Afterwards, realize that the fractionation to contact panel more efficiently, and can will not destroy the sensor and cover board for needing to cut.
Further improvement of the present invention is, in the cooling step, the environment temperature where controlling contact panel is kept
At subzero 100 DEG C to subzero between 130 DEG C.The present invention is it is required that the OCA glue produces qualitative change, and to sensor and cover board
Have no adverse effect, then, control of this refrigerating process to environment temperature is particularly critical, through experiment, the environment temperature
Subzero 100 DEG C to subzero 130 DEG C are controlled, effect is very good.
Further improvement of the present invention is, in the cooling step, the pre-set first time period is 25min
To 150min.More preferably, the pre-set first time period is 30min to 120min.
That is, it would be desirable to which the contact panel of fractionation is placed on 25min to 150min in the environment of freezing, you can reaches
Required effect, wherein, when temperature is lower, the duration of required first time period is smaller；If in subzero 100 DEG C of left sides
Right freezing environment is, it is necessary to freeze 120min or so；Freezing environment if in subzero 130 DEG C or so is, it is necessary to freeze 30min
Left and right.
The present invention also provides a kind of split system of the contact panel of OCA glue bonds, above-mentioned contact panel is employed
Method for splitting, and include thermometer and contact panel slot including sealing container and liquid nitrogen input unit, the sealing container；Institute
State thermometer to be arranged in sealing container, its temperature reading area is extend out to outside sealing container；The contact panel slot is used to insert
Contact panel is put, and is arranged in sealing container；The liquid nitrogen input unit is connected with sealing container, for sealing container
It is filled with liquid nitrogen and realizes cooling.
Carry out to sealing container being filled with nitrogen by liquid nitrogen input unit, until thermometer shows that the temperature of freezing environment reaches
It can stop inputting liquid nitrogen to subzero 30 DEG C or so, in such manner, it is possible to which so that the cooling time of sealing container is enough to maintain to first
Period terminates, and saves the consumption of liquid nitrogen, at the same can also the fine drastic change that must slow down temperature, the control to temperature range is more
Easily.
Further improvement of the present invention is that the contact panel slot includes one or more L-type card slots.Touched when described
When control panel slot includes multiple L-type card slots, the multiple L-type card slot array is arranged in sealing container.The L-type card slot
Setting, not only can be good at so that contact panel is inserted in sealing container, also playing contact panel well
Supporting role, good fixing effect, stability are strong；, can be more preferable and array is arranged at multiple L-type card slots in sealing container
The volume of the smaller sealing container in ground, makes full use of the liquid nitrogen cooling environment of sealing, the energy saving energy.
Compared with prior art, the beneficial effects of the present invention are：Set by the way that the contact panel of OCA glue bonds is placed on
The time of cryofixation in the freezing environment set so that OCA glue produces qualitative change, while will not be produced to sensor and cover board negative
Face is rung, and therefore, it is possible to realize the fractionation of the contact panel to OCA glue bonds well, will not destroy the device on contact panel
Part.
Brief description of the drawings
Fig. 1 is the structure diagram of an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawings, the preferably embodiment of the present invention is described in further detail：
Embodiment 1：
This example provides a kind of method for splitting of the contact panel of OCA glue bonds, comprises the following steps：
Step is sealed, the contact panel for the OCA glue bonds that band is disassembled is sealed；
Cooling step, cools down the contact panel of sealing so that the environment temperature where contact panel is maintained at zero
Lower 90 DEG C to subzero between 150 DEG C, until cooling time reaches pre-set first time period；
And splitting step, the contact panel after freezing is taken out, using hard tool by the sensor and lid of contact panel
Plate is cut.
This example is cold in subzero 90 DEG C to subzero 150 DEG C of freezing environment by the way that the contact panel of OCA glue bonds is placed on
Freeze regular time so that OCA glue produces qualitative change, while will not have a negative impact to sensor and cover board, therefore, it is possible to very
The fractionation of the contact panel to OCA glue bonds is realized well；The sensor is sensor.
In cooling step described in this example, the environment temperature where controlling contact panel can also preferably remain in subzero 100
DEG C to subzero between 130 DEG C.This example is it is required that the OCA glue produces qualitative change, and does not have negative shadow to sensor and cover board
Ring, then, control of this refrigerating process to environment temperature is particularly critical, through experiment, environment temperature control subzero 100
DEG C to subzero 130 DEG C, effect is very good.
In cooling step described in this example, the pre-set first time period is 25min to 150min.More preferably, institute
It is 30min to 120min to state pre-set first time period.That is, it would be desirable to which the contact panel of fractionation is placed on freezing
Environment in 25min to 150min, you can reach required effect, wherein, when temperature is lower, required first time period
Duration it is smaller；, it is necessary to freeze 120min or so, i.e. first time period is freezing environment if in subzero 100 DEG C or so
120min；Freezing environment if in subzero 130 DEG C or so is, it is necessary to freeze 30min or so, i.e., first time period is 30min.
Embodiment 2：
On the basis of embodiment 1, splitting step described in this example further includes standing sub-step, and the standing sub-step is taken out
Contact panel after freezing, realizes after time of repose reaches pre-set second time period and cuts.By splitting step
Set in rapid and stand sub-step so that the sensor of contact panel and cover board will not be too fragile after freezing, reduce and cutting
During to the destruction probability of sensor and cover board.
Stood described in this example in sub-step, the pre-set second time period is 30s to 300s.More preferably, it is described
Stand in sub-step, the pre-set second time period is 60s to 180s.
After this example takes out the contact panel after freezing, stand half a minute to 5 minutes, or it is preferred stand 1 minute or so it
Afterwards, realize that the fractionation to contact panel more efficiently, and can will not destroy the sensor and cover board for needing to cut.
Embodiment 3：
As shown in Figure 1, this example also provides a kind of split system of the contact panel of OCA glue bonds, employ embodiment 1 or
The method for splitting of contact panel described in embodiment 2, and including sealing container 1 and liquid nitrogen input unit 2, the sealing container 1
Including thermometer 3 and contact panel slot；The thermometer 3 is arranged in sealing container 1, its temperature reading area extend out to sealing
Outside container 1；The contact panel slot is used to insert contact panel 5, and is arranged in sealing container 1；The liquid nitrogen input dress
Put 2 with sealing container 1 to be connected, cooling is realized for being filled with liquid nitrogen to sealing container 1.
Carry out to sealing container 1 being filled with nitrogen by liquid nitrogen input unit 2, until thermometer 3 shows the temperature of freezing environment
Degree, which reaches subzero 30 DEG C or so, can stop inputting liquid nitrogen, in such manner, it is possible to which so that the cooling time of sealing container 1 is enough to maintain
First time period terminates, and saves the consumption of liquid nitrogen, at the same can also the fine drastic change that must slow down temperature, the control to temperature range
It is relatively easy to.
As shown in Figure 1, contact panel slot described in this example includes one or more L-type card slots 4.When the contact panel is inserted
When groove includes multiple L-type card slots 4, the multiple 4 array of L-type card slot is arranged in sealing container 1.The L-type card slot 4 is set
Put, not only can be good at so that contact panel 5 is inserted in sealing container 1, also playing good branch to contact panel 5
Support acts on, good fixing effect, and stability is strong；, can be more preferable and array is arranged at multiple L-type card slots 4 in sealing container 1
The volume of the smaller sealing container 1 in ground, makes full use of the liquid nitrogen cooling environment of sealing, the energy saving energy.
Above content is that a further detailed description of the present invention in conjunction with specific preferred embodiments, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to the present invention's
Protection domain.
Claims (9)
1. a kind of method for splitting of the contact panel of OCA glue bonds, it is characterised in that comprise the following steps：
Step is sealed, the contact panel of OCA glue bonds to be dismantled is sealed；
Cooling step, cools down the contact panel of sealing so that the environment temperature where contact panel is maintained at subzero 90
DEG C to subzero between 150 DEG C, OCA glue is caused to produce qualitative change until cooling time reaches pre-set first time period；
And splitting step, the contact panel after freezing is taken out, is cut the sensor of contact panel and cover board using hard tool
Open；
The splitting step further includes standing sub-step, and the sub-step that stands takes out the contact panel after freezing, until standing
Time realizes incision after reaching pre-set second time period.
2. the method for splitting of contact panel according to claim 1, it is characterised in that described in the standing sub-step
Pre-set second time period is 30s to 300s.
3. the method for splitting of contact panel according to claim 2, it is characterised in that described in the standing sub-step
Pre-set second time period is 60s to 180s.
4. the method for splitting of the contact panel according to claims 1 to 3 any one, it is characterised in that the cooling step
In rapid, the environment temperature where controlling contact panel is maintained at subzero 100 DEG C to subzero between 130 DEG C.
5. the method for splitting of the contact panel according to claims 1 to 3 any one, it is characterised in that the cooling step
In rapid, the pre-set first time period is 25min to 150min.
6. the method for splitting of contact panel according to claim 5, it is characterised in that described pre- in the cooling step
The first time period first set is 30min to 120min.
7. a kind of split system of the contact panel of OCA glue bonds, it is characterised in that employ as claim 1 to 6 is any one
The method for splitting of contact panel described in, and include temperature including sealing container and liquid nitrogen input unit, the sealing container
Meter and contact panel slot；The thermometer is arranged in sealing container, its temperature reading area is extend out to outside sealing container；It is described
Contact panel slot is used to insert contact panel, and is arranged in sealing container；The liquid nitrogen input unit and sealing container phase
Connection, cooling is realized for being filled with liquid nitrogen to sealing container.
8. the split system of contact panel according to claim 7, it is characterised in that the contact panel slot includes one
A or multiple L-type card slots.
9. the split system of contact panel according to claim 8, it is characterised in that when the contact panel slot includes
During multiple L-type card slots, the multiple L-type card slot array is arranged in sealing container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510066852.5A CN104635987B (en) | 2015-02-06 | 2015-02-06 | A kind of method for splitting and its split system of the contact panel of OCA glue bonds |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510066852.5A CN104635987B (en) | 2015-02-06 | 2015-02-06 | A kind of method for splitting and its split system of the contact panel of OCA glue bonds |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104635987A CN104635987A (en) | 2015-05-20 |
| CN104635987B true CN104635987B (en) | 2018-04-27 |
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| CN201510066852.5A Active CN104635987B (en) | 2015-02-06 | 2015-02-06 | A kind of method for splitting and its split system of the contact panel of OCA glue bonds |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106077019B (en) * | 2016-06-12 | 2019-01-11 | 浙江大学 | A kind of waste and old screen and wiring board recovery method and device based on air cooling |
| CN106001057B (en) * | 2016-06-12 | 2019-01-18 | 浙江大学 | A kind of waste and old screen and wiring board recovery method and device |
| CN106077020B (en) * | 2016-06-12 | 2019-01-18 | 浙江大学 | Waste and old screen and wiring board recovery method and device based on voluntarily cascade refrigeration |
| CN106271380A (en) * | 2016-08-29 | 2017-01-04 | 无锡博光电科技有限公司 | A kind of backlight freezing disassembling method |
| CN107225840A (en) * | 2017-04-21 | 2017-10-03 | 深圳市立德通讯器材有限公司 | Full laminating display screen disassembles separation method |
| CN109164930A (en) * | 2018-07-10 | 2019-01-08 | 信利光电股份有限公司 | A kind of ultra-thin glass sensor and preparation method thereof |
| CN114111148B (en) * | 2021-12-02 | 2023-06-16 | 深圳同兴达科技股份有限公司 | OCA disassembles platform |
| TWI790881B (en) | 2021-12-30 | 2023-01-21 | 財團法人工業技術研究院 | Double-sided adhesive and multilayer structure |
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|---|---|---|---|---|
| CN102629173A (en) * | 2012-02-28 | 2012-08-08 | 无锡丽格光电科技有限公司 | Method for disassembling and recycling capacitive touch screens |
| CN103170491A (en) * | 2011-12-21 | 2013-06-26 | 上海晨兴希姆通电子科技有限公司 | Low-temperature disassembling method of touch screen |
| CN103465604A (en) * | 2013-09-26 | 2013-12-25 | 无锡宇宁光电科技有限公司 | Rapid dismantling technology for tough screens |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5695529B2 (en) * | 2011-08-29 | 2015-04-08 | 綜研化学株式会社 | Laminated body and touch panel having the laminated body |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170491A (en) * | 2011-12-21 | 2013-06-26 | 上海晨兴希姆通电子科技有限公司 | Low-temperature disassembling method of touch screen |
| CN102629173A (en) * | 2012-02-28 | 2012-08-08 | 无锡丽格光电科技有限公司 | Method for disassembling and recycling capacitive touch screens |
| CN103465604A (en) * | 2013-09-26 | 2013-12-25 | 无锡宇宁光电科技有限公司 | Rapid dismantling technology for tough screens |
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| CN104635987A (en) | 2015-05-20 |
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Address after: 518000 Longhua District, Shenzhen City, Guangdong Province, Langkou Community, Dalang Street, Huarong Lutei Science and Technology Industrial Park, 3rd Floor, 4th Floor Patentee after: Shenzhen Taiguan Technology Co.,Ltd. Address before: 518000 No. 3 workshop of Huarong Lutei Science and Technology Industrial Park, Langkou Community, Dalang Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen City crown Polytron Technologies Inc. Address after: 518000 No. 3 workshop of Huarong Lutei Science and Technology Industrial Park, Langkou Community, Dalang Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen City crown Polytron Technologies Inc. Address before: 518000 Second to Third Floors of No. 3 Factory Building of Huarong Lutei Science and Technology Industrial Park, Langkou Community, Dalang Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN TOP GROUP TOUCH CONTROL TECHNOLOGY Co.,Ltd. |