CN104742489A - Panel device treatment method - Google Patents
Panel device treatment method Download PDFInfo
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- CN104742489A CN104742489A CN201310750603.9A CN201310750603A CN104742489A CN 104742489 A CN104742489 A CN 104742489A CN 201310750603 A CN201310750603 A CN 201310750603A CN 104742489 A CN104742489 A CN 104742489A
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- face equipment
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Abstract
The invention relates to the technical field of panel display and in particular relates to a panel device treatment method. The panel structure at least comprises a first substrate, a bonding layer and a second substrate, wherein the bonding layer is arranged between the first substrate and the second substrate. The panel device treatment method at least comprises the following steps: providing a refrigeration system with a containing space, and refrigerating the panel device in the containing space of the refrigeration system.
Description
Technical field
The present invention relates to technical field of flat panel display, particularly relate to a kind of face equipment processing method.
Background technology
Along with the development of touch-control Display Technique, capacitor touch-control display screen is applied more and more widely, generally display layer and touch sensitive layer is all comprised in the touching display screen of existing electronic equipment, electrode such as pixel electrode, public electrode and TFT (the ThinFilm Transistor for realizing liquid crystal display is included in display layer, TFT) arrays etc., include the electrode for detecting the touch of touching display screen in touch sensitive layer.Generally, touch sensitive layer and display layer from upper (direction of electronic equipment outer surface) of touching display screen to stack, realize its touch-control and Presentation Function respectively.
But display layer and touch sensitive layer are all accurate electronic building bricks, in the operations such as back segment module laminating, very easily cause damage; And after its finished product, can not weight or percussion, sharppointed article also can not be used to write on touch-control sensing layer, otherwise can damage be caused; In addition, its aging speed wants fast a lot of relative to other parts of electronic product, and therefore, the repair rate of touch-control display module is very high.
At present aborning, after the appearance of touch-control display Module examines is bad, defective products directly does usually scraps process, without the method disassembling recovery, causes the waste of portion's material.And usual touch-control display module bad or to damage may be only that touch-control sensing layer is wherein malfunctioning, can not normal operating, or be only the damage of cover-plate glass, or be only sandwiched when cover-plate glass attaches touch-control sensing layer the impurity affecting outward appearance, or be only that display layer cannot normally show etc., if touch-control is shown module directly to do and scrap process, virtually cause the waste of a large amount of good available portions material.The patent No. be 201110275441.9 a patent " touch module disassembles recovery method " disclose a kind of disassembling method, its technical process comprises: be heated to glue thawing, cutting, immersion, frictioning etc., come although finally touch module can be split, but its complex technical process, cost are high and expend man-hour more, be still difficult to make up the waste doing the good portion material caused when scrapping process.
Summary of the invention
In view of this, the invention provides and a kind ofly split effective face equipment processing method.
A kind of face equipment processing method, described panel construction at least comprises a first substrate, adhesive linkage one second substrate, described adhesive linkage is arranged between described first substrate and second substrate, described face equipment processing method at least comprises the following steps: provide the refrigeration system that has a receiving space, freezing in the receiving space described face equipment being placed in described refrigeration system.
In described face equipment processing method provided by the invention, described first substrate at least has a first surface, and described second substrate at least has a second surface, and described first surface directly contacts with described adhesive linkage with second surface.
In described face equipment processing method provided by the invention, described first surface has one first functional area and one first neighboring area, described first functional area is positioned at the middle position of described first surface, described first neighboring area around and adjacent described first functional area, described first functional area is formed with one first functional layer, described first neighboring area is formed with one first barrier bed; Described second surface has one second functional area and a second week edge regions, described second functional area is positioned at the middle position of described second surface, described second week edge regions around and adjacent described second functional area, described second functional area is formed with one second functional layer, described second week edge regions is formed with one second barrier bed, the projection on the first surface of described second functional area covers described first functional area completely, described second week edge regions projection section on the first surface or all cover described first neighboring area.
In described face equipment processing method preparation method provided by the invention, described adhesive linkage has homogeneous thickness perpendicular on described first surface direction.
In described face equipment processing method preparation method provided by the invention, also comprise refrigerant in described refrigeration system, described refrigerant is dry ice.
In described face equipment processing method preparation method provided by the invention, the cooling time of described dry ice is 15-25 minute.
In described face equipment processing method preparation method provided by the invention, the cryogenic temperature of described dry ice is-50 DEG C ~-60 DEG C.
In described face equipment processing method preparation method provided by the invention, described step is specially, and described dry ice is placed in the bottom of refrigeration system, is placed on described dry ice by a barrier film, then is placed on described barrier film by described face equipment.
In described face equipment processing method preparation method provided by the invention, at least comprise refrigerant in described refrigeration system, described refrigerant is liquid nitrogen.
In described face equipment processing method preparation method provided by the invention, be provided with netted interlayer in described refrigeration system, described face equipment is placed on described netted interlayer.
In face equipment processing method provided by the invention, when face equipment is placed in refrigeration system, due to the first substrate in face equipment, adhesive linkage is different with the coefficient of expansion of second substrate, therefore, under freezing environment, described first substrate, the deformation quantity of adhesive linkage and second substrate is different, described adhesive linkage loses adhesive property, thus first substrate is increased, distance between second substrate and adhesive linkage, described first substrate and second substrate are easily split come, avoid the waste that whole panel will be abandoned caused portion's material when first substrate or second substrate damage, improve the rate of recovery and the utilization rate of parts, and split process is simplified.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of the face equipment in embodiment 1 provided by the invention;
Fig. 2 is the structural representation of face equipment processing method in Fig. 1;
Fig. 3 is the schematic flow sheet of the processing method of face equipment described in Fig. 2.
Detailed description of the invention
For face equipment processing method provided by the invention is described, be described in detail below in conjunction with Figure of description and explanatory note.
Embodiment 1
As shown in Figure 1 and Figure 2, its be face equipment in embodiment 1 provided by the invention structural representation and, described face equipment 100 at least comprises the structural representation of first substrate 101, adhesive linkage 103 and a second substrate 102 face equipment processing method, and described adhesive linkage 103 is arranged between described first substrate 101 and second substrate 102.Described first substrate 101 has a first surface 101a, and described first surface 101a directly contacts with described adhesive linkage 103.Described second substrate 102 has the surperficial 102b of a second surface 102a and the 3rd of opposing setting, and described second surface 102a contacts with described adhesive linkage 103.In the present embodiment, be parallel to each other between described first surface 101a and described second surface 102a, the 3rd surperficial 102b, on described adhesive linkage 103, any one is in perpendicular to the span on described first surface 101a direction unanimously, and namely described adhesive linkage 103 has homogeneous thickness perpendicular on described first surface 101a direction.
Described first surface 101a has one first functional area and one first neighboring area (not shown), described first functional area is positioned at described first surface 101a middle position, described first neighboring area around and adjacent described first functional area.Described first functional area is formed with one first functional layer, described first functional layer is a capacitance touching control sensing layer in the present embodiment, in other embodiments, described first functional layer can also be anti-fingerprint rete, anti-reflecting layer, or is the superimposed body of two or more rete any in above-mentioned several rete.Described first neighboring area is formed with one first barrier bed, described first barrier bed is made up of non-transparent material, and described first barrier bed covers described first neighboring area completely.In present embodiment, adhesive linkage 103 covers whole described first surface 101a, and in another embodiment, adhesive linkage also only can cover the first barrier bed.
Described second surface 102a has one second functional area and a second week edge regions (not shown), and described second functional area is positioned at described second surface 101a middle position, and described second week edge regions is around described second functional area.Described second functional area is formed with one second functional layer, described second functional layer is a chromatic filter layer in the present embodiment, in other embodiments, described first functional layer can also be anti-fingerprint rete, anti-reflecting layer, or is the superimposed body of two or more rete any in above-mentioned several rete.Described second week edge regions is formed with one second barrier bed, described second barrier bed is made up of non-transparent material, and described second barrier bed covers described second week edge regions completely.The projection on the first surface of described second functional area covers described first functional area completely, and the projection on the first surface of described second functional area does not cover described first neighboring area, namely the projection on the first surface of described second functional area overlaps completely with described first functional area.Described second week edge regions projection section on the first surface or all cover described first neighboring area, and the projection on the first surface of described second week edge regions does not cover described first functional area.
In other embodiments, described first surface 101a also can not arrange any functional layer, and the relation that is not parallel to each other between described first surface 101a and described second surface 102a or the 3rd surperficial 102b.Described first substrate and second substrate can be transparent insulation substrate, as transparent glass substrate or transparent resin, transparent membrane substrate, also can be nontransparent insulated substrate.Described adhesive linkage 103 adopts transparent adhesive material such as glue, optical cement etc. to make.
Described refrigeration system 10 at least has a receiving space and refrigerant, and described refrigerant is positioned in described receiving space, and described refrigeration system can be the freezing freezer of a routine, also can be the casing with heat insulation effect.In the present embodiment, described refrigerant is dry ice 20, and the cooling time of described dry ice is 20 minutes.
Described face equipment processing method at least comprises the steps:
Step S01: the refrigeration system that has a receiving space is provided.
Described refrigeration system 10 at least has a receiving space and refrigerant, and described refrigerant is positioned in described receiving space, and described refrigeration system can be the freezing freezer of a routine, also can be the casing with heat insulation effect.
Step S02: be placed in by dry ice in the receiving space of refrigeration system, is covered in a barrier film on described dry ice.
The quality of described dry ice is by 15kg, it is placed in the bottom of described receiving space, the temperature of described refrigeration system inside is-50 DEG C ~-60 DEG C, in present embodiment, described barrier film is polyethylene (PE) plastic sheeting, in other embodiments, the film of other materials can also be covered as the separation layer on dry ice.
Step S03: face equipment is placed on described barrier film.
In present embodiment, face equipment to be dismantled is placed on described PE film, waits for 20 minutes quietly.
In present embodiment, described face equipment at least comprises a first substrate, an adhesive linkage and a second substrate, and described adhesive linkage is arranged between described first substrate and second substrate.Described first substrate has a first surface, and described first surface directly contacts with described adhesive linkage.Described second substrate has a second surface and one the 3rd surface of opposing setting, and described second surface contacts with described adhesive linkage.In the present embodiment, be parallel to each other between described first surface and described second surface, the 3rd surface, on described adhesive linkage, any one is in perpendicular to the span on described first surface direction unanimously, and namely described adhesive linkage has homogeneous thickness perpendicular on described first surface direction.
Described first surface has one first functional area and one first neighboring area (not shown), and described first functional area is positioned at described first surface middle position, described first neighboring area around and adjacent described first functional area.Described first functional area is formed with one first functional layer, described first functional layer is a capacitance touching control sensing layer in the present embodiment, in other embodiments, described first functional layer can also be anti-fingerprint rete, anti-reflecting layer, or is the superimposed body of two or more rete any in above-mentioned several rete.Described first neighboring area is formed with one first barrier bed, described first barrier bed is made up of non-transparent material, and described first barrier bed covers described first neighboring area completely.
Described second surface has one second functional area and a second week edge regions (not shown), and described second functional area is positioned at described second surface middle position, and described second week edge regions is around described second functional area.Described second functional area is formed with one second functional layer, described second functional layer is a chromatic filter layer in the present embodiment, in other embodiments, described first functional layer can also be anti-fingerprint rete, anti-reflecting layer, or is the superimposed body of two or more rete any in above-mentioned several rete.Described second week edge regions is formed with one second barrier bed, described second barrier bed is made up of non-transparent material, and described second barrier bed covers described second week edge regions completely.The projection on the first surface of described second functional area covers described first functional area completely, and the projection on the first surface of described second functional area does not cover described first neighboring area, namely the projection on the first surface of described second functional area overlaps completely with described first functional area.Described second week edge regions projection section on the first surface or all cover described first neighboring area, and the projection on the first surface of described second week edge regions does not cover described first functional area.
Step S04: take out described face equipment and split.
In the present embodiment, the described dry ice of 15kg can use 1.5 days, can split altogether the panel construction of 1500, can disassemble S04 in batches: take out described face equipment and split.
When face equipment is placed in refrigeration system, due to the first substrate in face equipment, adhesive linkage is different with the coefficient of expansion of second substrate, therefore, under freezing environment, described first substrate, the deformation quantity of adhesive linkage and second substrate is different, described adhesive linkage loses adhesive property, thus first substrate is increased, distance between second substrate and adhesive linkage, described first substrate and second substrate are easily split come, avoid the waste that whole panel will be abandoned caused portion's material when first substrate or second substrate damage, improve the rate of recovery and the utilization rate of parts, and split process is simplified.And disassemble compared to heating of the prior art, the split process of the present embodiment is simpler.
Embodiment 2
The processing method of the face equipment of present embodiment and the difference of embodiment 1 are: described cooling time is 15 minutes.
Embodiment 3
The processing method of the face equipment of present embodiment and the difference of embodiment 1 are: described cooling time is 25 minutes.
Embodiment 4
The processing method difference from Example 1 of the face equipment in present embodiment is: described refrigerant is liquid nitrogen, described refrigeration system is the refrigerator in a rectangular structure, its at least comprise one bottom and four sidewalls, four described sidewalls are end to end and be connected with described bottom in its same side, four described sidewalls and described bottom form described receiving space jointly, sidewall described in relative two is provided with the netted interlayer parallel with described bottom, the liquid nitrogen of 10 liters is injected described refrigerator, and described cooling time is 10-15 minute.In other embodiments, the shape that described refrigeration system also can be other is such as cylindrical etc., and described netted interlayer also can be arranged according to other forms.
In other embodiments, also the mixture of dry ice and liquid nitrogen can be positioned over counter plate structure in refrigeration system and carry out freezing disassembling.
It is more than the better embodiment of face equipment processing method provided by the invention; the restriction to rights protection scope of the present invention can not be interpreted as; those skilled in the art should know; without departing from the inventive concept of the premise; also can do multiple improvement or replacement; these all improvement or replacement all should in the scope of the present invention, and namely the scope of the present invention should be as the criterion with claim.
Claims (10)
1. a face equipment processing method, described panel construction at least comprises a first substrate, adhesive linkage one second substrate, and described adhesive linkage is arranged between described first substrate and second substrate, and described face equipment processing method at least comprises the following steps:
The refrigeration system that one has a receiving space is provided, freezing in the receiving space described face equipment being placed in described refrigeration system.
2. face equipment processing method as claimed in claim 1, it is characterized in that: described first substrate at least has a first surface, described second substrate at least has a second surface, and described first surface directly contacts with described adhesive linkage with second surface.
3. face equipment processing method as claimed in claim 2, it is characterized in that: described first surface has one first functional area and one first neighboring area, described first functional area is positioned at the middle position of described first surface, described first neighboring area around and adjacent described first functional area, described first functional area is formed with one first functional layer, described first neighboring area is formed with one first barrier bed; Described second surface has one second functional area and a second week edge regions, described second functional area is positioned at the middle position of described second surface, described second week edge regions around and adjacent described second functional area, described second functional area is formed with one second functional layer, described second week edge regions is formed with one second barrier bed, the projection on the first surface of described second functional area covers described first functional area completely, described second week edge regions projection section on the first surface or all cover described first neighboring area.
4. face equipment processing method as claimed in claim 2, is characterized in that: described adhesive linkage has homogeneous thickness perpendicular on described first surface direction.
5. face equipment processing method as claimed in claim 2, it is characterized in that: also comprise refrigerant in described refrigeration system, described refrigerant is dry ice.
6. face equipment processing method as claimed in claim 5, is characterized in that: the cooling time of described dry ice is 15-25 minute.
7. face equipment processing method as claimed in claim 6, is characterized in that: the cryogenic temperature of described dry ice is-50 DEG C ~-60 DEG C.
8. face equipment processing method as claimed in claim 6, is characterized in that: described step is specially, described dry ice is placed in the bottom of refrigeration system, be placed on described dry ice by a barrier film, then be placed on described barrier film by described face equipment.
9. face equipment processing method as claimed in claim 2, it is characterized in that: at least comprise refrigerant in described refrigeration system, described refrigerant is liquid nitrogen.
10. face equipment processing method as claimed in claim 9, it is characterized in that: be provided with netted interlayer in described refrigeration system, described face equipment is placed on described netted interlayer.
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CN201310750603.9A CN104742489A (en) | 2013-12-30 | 2013-12-30 | Panel device treatment method |
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CN201310750603.9A CN104742489A (en) | 2013-12-30 | 2013-12-30 | Panel device treatment method |
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CN113386421A (en) * | 2021-06-26 | 2021-09-14 | 苏州星辰排版印刷有限公司 | Glass panel and production process thereof |
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CN113386421B (en) * | 2021-06-26 | 2022-09-23 | 苏州星辰排版印刷有限公司 | Glass panel and production process thereof |
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Application publication date: 20150701 |