CN106001057B - A kind of waste and old screen and wiring board recovery method and device - Google Patents
A kind of waste and old screen and wiring board recovery method and device Download PDFInfo
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- CN106001057B CN106001057B CN201610420174.2A CN201610420174A CN106001057B CN 106001057 B CN106001057 B CN 106001057B CN 201610420174 A CN201610420174 A CN 201610420174A CN 106001057 B CN106001057 B CN 106001057B
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000002699 waste material Substances 0.000 title claims abstract description 28
- 238000011084 recovery Methods 0.000 title claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 85
- 238000012545 processing Methods 0.000 claims abstract description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 15
- 239000004568 cement Substances 0.000 claims abstract description 14
- 238000005057 refrigeration Methods 0.000 claims description 36
- 238000007710 freezing Methods 0.000 claims description 31
- 230000008014 freezing Effects 0.000 claims description 31
- 238000010298 pulverizing process Methods 0.000 claims description 8
- 230000004087 circulation Effects 0.000 claims description 6
- 238000003032 molecular docking Methods 0.000 claims description 3
- 230000032258 transport Effects 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 238000000926 separation method Methods 0.000 description 11
- 238000004064 recycling Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 238000005265 energy consumption Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000000505 pernicious effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000009418 renovation Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 231100000429 cutaneous necrosis Toxicity 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011027 product recovery Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
- B29B2017/0416—Cooling the plastics before disintegration, e.g. freezing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses a kind of waste and old screen and wiring board recovery methods, comprising the following steps: (1) carries out disassembly processing to waste and old screen and wiring board, obtain the touch screen and circuit board tabula rasa with OCA optical cement；(2) multistage is carried out to the touch screen and is cooled to OCA optical cement embrittlement；(3) obtained circuit board tabula rasa is freezed, low temperature processing fine crushing is then carried out；(4) touch screen by step (2) processing is subjected to cooling device progress cold energy feedback to the circuit board tabula rasa to the multistage cooling device in step (2) and in step (3), last touch screen returns to room temperature condition；The invention also discloses a kind of waste and old screen and wiring board recyclable devices；The present invention realizes pipeline processes, can greatly increase treatment effeciency, while reducing the loss of energy, mitigates the preheating burden of the cooling unit of higher temperature.
Description
Technical field
The present invention relates to electronic product recovery technology field, in particular to a kind of waste and old screen and wiring board recovery method and
Device.
Background technique
Embrittlement is a kind of cryomechanics behavior, refers to that material (mainly based on the organic materials such as plastics) is sent out by low-temperature treatment
The change of raw physical property becomes fragile and is easy to crush.Brittle temperature is the measurement of this cryomechanics behavior, in measuring
In, the experimental temperature that failure probability is 50% is generally defined as brittle temperature.
Usual screen is formed by 4 layers, and uppermost one layer of glass is cover-plate glass, and most of is sapphire material.
The second layer is touch inductor layer, mainly there is resistance-type and two kinds of condenser type.Screen has touch sensible layer function, mainly in glass
One layer of ITO (tin indium oxide or tin-doped indium oxide) is plated using magnetron sputtering technique on glass, this is a kind of indium (III race) oxidation
Object and tin (IV race) hopcalite.Third layer is usually front panel, is mainly used to install optical filter, generates image.Most
One layer is then backboard below, for handling the thin film transistor (TFT) of million meters.Wherein touch screen structure bonding and touch screen and display
The bonding of screen mould group has used OCA optical cement, and OCA optical cement solidifies under room temperature or medium temperature, and has the features such as cure shrinkage is small.
It can make OCA optical cement that embrittlement occur by certain low-temperature treatment, brittle temperature is about -150 DEG C.
It is printing pcb board that wiring board, which mainly forms,.The material for manufacturing pcb board is considerably complicated, including metal and asphalt mixtures modified by epoxy resin
The organic materials such as rouge.The specific brittle temperature of the organic material is related with many factors, Zou Liang, paper " the discarded route of Bai Qingzhong
The low-temperature grinding experimental study of plate " in refer to pcb board carry out processing fine crushing when, precooling temperature be -120 DEG C, cooling time
When for 5min, more fine fraction product, smoother particle surface and higher degree of dissociation can be obtained.
For liquid crystal touch screen, the currently used mode of doing over again has molybdenum filament patterning method, liquid nitrogen freezing, refrigerator freezing
Three kinds of method, the efficiency of molybdenum filament patterning method is very low, and to larger by the damage of cutting member, and the yields that causes to do over again is very low.Liquid nitrogen
The degumming effect of freezing is pretty good, but liquid nitrogen consumption is too big, and since moment generates subzero 196 degree (ideal gasification temperatures)
Low temperature, risk is also higher, if accidentally splashing on worker's skin, cutaneous necrosis can be immediately resulted in, due to being injected in touch screen
The liquid nitrogen moment of watch crystal, which generates subzero 196 degree of low temperature, enables outermost layer glass sharply shrink and burst, and due to liquid crystal display
Internal other parts not yet experience low temperature without shrinking, and thus more increase glass explosion probability, eventually lead to
Yields of doing over again is very low.Although the temperature of refrigerator freezing method is not achieved that liquid nitrogen is so low, but since its degumming principle is in case
Cold air and touch screen carry out it is cold and hot exchange, the process is steady and mild, and quick-fried screen phenomenon will not occur, return to greatly improve
Work yields, and it will not have hidden danger of hurting sb.'s feelings as liquid nitrogen, securely and reliably；There are also it only to need alternating current that can run, and makes
With low in cost.
It is further mentioned in useless circuit board recovery technology in " the low-temperature grinding experimental study of discarded circuit board " text, at machinery
Reason technology is small with its environmental pollution, easy to operate, treatment effeciency with higher and preferable economic benefit and be concerned, and
It was widely developed in past 20 years.The most importantly destruction step in mechanical treatment technical process, because it is directly
Decide the efficiency of later separation step, the yield of metal and purity.Circuit board substrate usually has a large amount of thermosetting resins, this
A little resinous polymers have characteristic hard and strong, resistant to high temperature, are in certain toughness under room temperature, cannot by general impact and directly
Attrition crushing mode is crushed.Recycling is thus crushed under room temperature, and there are various problems, such as impact pyrolysis, and pernicious gas generates, and does
Dust pollution in formula crushing, product particle shape is uneven and equipment long time running is also easy to produce amount of heat, causes equipment
The problems such as hot-spot, materials from bonding, occluding device, these problems can cause environmental pollution, reduce crush efficiency, cause subsequent
The reduction of the efficiency of separation.Typical solution is these non-brittle substances to be become brittle substance by freezing, then be subject to powder
It is broken.Therefore freeze grinding technology has very wide Research Prospects in the processing of useless circuit board.
It can be seen that cooling removal process in the prior art, cooling capacity waste is extremely serious, and energy consumption is high for recycling, at high cost.
Summary of the invention
The present invention provides a kind of waste and old screen and wiring board recovery methods, and energy consumption is effectively reduced, and reduce and pollute and improve
Recovery efficiency.
A kind of waste and old screen and wiring board recovery method, comprising the following steps:
(1) disassembly processing is carried out to waste and old screen and wiring board, obtains the touch screen and circuit board with OCA optical cement
Tabula rasa；
(2) multistage is carried out to the touch screen and is cooled to OCA optical cement embrittlement；
(3) obtained circuit board tabula rasa is freezed, low temperature processing fine crushing is then carried out；
(4) by by step (2) processing touch screen in step (2) multistage cooling device and step (3) in
Cooling device is carried out to the circuit board tabula rasa and carries out cold energy feedback, last touch screen returns to room temperature condition.
Waste and old screen is disassembled, available primary product；Then Direct Classification recycles for plastic shell and battery,
Wait be further processed；Careful dismantling processing is carried out to wiring board, obtains the electronic components such as chip and circuit board tabula rasa, first device
Part carries out renovation processing, further recycles.
Low temperature processing fine crushing is carried out after the freezing of circuit board tabula rasa, obtained product carries out electrostatic separation processing at room temperature,
After metal and plastics are carried out just point separation, can further it be separated with sifter.
The touch screen of the method for the present invention cools down, and brittle low temperature screen is fed back during output cold
The screen and circuit board tabula rasa that can come in conveying exchange heat, and reduce the loss of this portion of energy, mitigate higher temperature
Cooling unit burden.
Cold energy feedback mainly carries out in cooling spaces at different levels (fore-cooling room or freezing chamber), cooling with adjacent three-level
For space (low temperature fore-cooling room, medium temperature fore-cooling room and high temperature fore-cooling room), the touch screen that is returned from low temperature fore-cooling room and from high temperature
The touch screen that fore-cooling room's (high temperature fore-cooling room two-stage temperature higher than low temperature fore-cooling room) comes out is in medium temperature fore-cooling room (medium temperature fore-cooling room ratio
The high level-one temperature in low temperature fore-cooling room) in exchange heat, specifically, two deblocking temperatures differ 60 DEG C or so (between i.e. multistage cooling unit
The temperature difference between the temperature difference of level-one, high temperature fore-cooling room and low temperature fore-cooling room, can according to need and set) screen be separated by
3~5cm carries out Forced Convection Heat Transfer using blower, so realizes the transmitting and utilization of cooling capacity.
The present invention is lost brittle at low temperature easy in the property and circuit board tabula rasa of viscosity at low temperature using OCA optical cement
The freezing of the two is organically combined and is used by broken property.Pipeline processes are realized, place can be greatly increased
Manage efficiency.
Multistage cooling refers to the cooling carried out touch screen from high temperature to low temperature step by step, prevents screen instantaneous cooling and broken
It splits.
The cooling cooling cycle that can be multiple and different temperature and work independently of multistage, in order to further increase reduction energy
Consumption, it is preferred that in step (2), the touch screen is carried out multistage cooling using Cascade refrigeration cycle classification refrigeration.
Cascade refrigeration cycle applies in general to the refrigeration system that evaporating temperature is lower than -60 DEG C.In the Master's thesis of Dong Lin
" natural refrigerant R290/C02 Cascade refrigeration cycle experimental study " refers to that it had both been able to satisfy and evaporates under lower evaporating temperature
When suitable evaporating temperature, and can satisfy condensing pressure moderate when condensation at ambient temperature.Cascade refrigeration cycle is logical
Often formed by two (or several) using the single-stage refrigerating system of different refrigerants.Usual high-temperature systems are freezed using higher boiling
Agent, cryogenic system use low boiling point refrigerant, respectively become a refrigeration system using unitary system cryogen.It is made in high-temperature systems
The evaporation of cryogen is used to condense the refrigerant in cryogenic system.Refrigerant in cryogenic system, in evaporation to cooled object
It absorbs heat (producing cooling capacity).
OCA optical cement brittle temperature is about -150 degree, and screen is destroyed in order to prevent, and the present invention is in -150 degree reached
Staged cooling is carried out in chilling process, step temperature is rationally set, since staged cools down, moreover it is possible to make brittle low temperature
The screen that screen can come in during output to conveying exchanges heat, and has not only reduced the loss of this portion of energy, but also mitigate
The burden of fore-cooling room.Preferably, the temperature gradient of Cascade refrigeration cycle classification refrigeration setting be -5 DEG C~5 DEG C, -35
DEG C~-25 DEG C, -65 DEG C~-55 DEG C, -95 DEG C~-85 DEG C, -125 DEG C~-115 DEG C and -150 DEG C~-145 DEG C.
This six temperature gradients are arranged to be on the one hand to enable cooling capacity to be sufficiently secondary use by exchanging heat layer by layer, it is another
Aspect facilitates operation to make Mobile phone screen time locating for each fore-cooling room as close as possible.
The time required when consistent with environment temperature is reached using unsteady-state heat transfer estimation material, formula is as follows:
ρ is the density of object in formula, and c is specific heat capacity, and convection transfer rate of the h between body surface and air-flow, V/A is object
Body thickness, T0For the initial temperature of object, T is object final temperature, (after allowing heat transfer, the mistake of object and environment temperature
Difference is 1 DEG C), TtFor environment temperature locating for object.
In order to which embrittlement is better achieved, it is preferred that in step (2), the touch screen cools down respectively in each temperature gradient
2min~6.2min.
It is further preferred that temperature gradient be respectively -5 DEG C~5 DEG C, -35 DEG C~-25 DEG C, -65 DEG C~-55 DEG C, -95
DEG C~-85 DEG C, -125 DEG C~-115 DEG C and -150 DEG C~-145 DEG C in required cooling time be respectively 5~7min, 5~
7min, 4~6min, 3~5min, 2~4min, 2~3min.
It is further preferred that temperature gradient be respectively -5 DEG C~5 DEG C, -35 DEG C~-25 DEG C, -65 DEG C~-55 DEG C, -95
DEG C~-85 DEG C, -125 DEG C~-115 DEG C and -150 DEG C~-145 DEG C in the time required to be respectively 6~6.2min, 5.9~
6.1min, 4.9~5.1min, 4~4.1min, 3~3.2min, 2~2.2min.
For the recycling further combined with circuit board tabula rasa and screen, energy consumption is reduced, it is preferred that in step (3), the electricity
It is that -125 DEG C~-115 DEG C sections are cooled down that road plate tabula rasa, which is classified refrigeration medium temperature degree gradient by Cascade refrigeration cycle,.
In order to reach preferable refrigerating effect, it is preferred that in step (3), the cooling time of the circuit board tabula rasa is
1.5min~3.1min.
Recycling is divided into two parts by master-plan of the present invention: waste and old screen freezing recycling and the recycling of wiring board low-temperature grinding are expensive
Metal.What we recycled is mainly touch inductor layer, and each substance mainly uses OCA optics glue bond in the layer.Therefore, screen
Freezing recycling according to OCA optical cement at low temperature can deactivated characteristic, it is chilled to -150 DEG C or so, further takes out craft
Dismantling.Us are consumed in order to reduce cold energy and devises the fore-cooling room of multiple temperature gradients, cold energy feedback is carried out and (has cooled down completion
Screen be pre-chilled to also uncolled good screen), realize the secondary use of cooling capacity.PCB circuit board is showed at low temperature using it
Brittleness out makes it be broken into the lesser particle of partial size or powder under external force, then using electrostatic separation metal with it is broken
Plastics, to reach the target of recycling noble metal.In order to reduce cold consumption, facilitates recycling, need first to tear screen open before cooling
Point, lower chip in addition must be disassembled before wiring board freezing and is recycled, and circuit board tabula rasa and screen are only subjected to freezing processing.
Combined circuit plate tabula rasa and screen cooling procedure, whole flow process are designed using the theory of automated production, significantly
Improve production efficiency.So that the portability of entire technology is high, it is easily enlarged production scale.
The present invention also provides a kind of waste and old screen and wiring board recyclable devices, comprising:
Multistage cooling unit, the cooling chamber equipped with multiple and different cooling temperatures；
Supply unit is cooled down step by step, is transported touch screen by high temperature to low temperature and is passed through each cooling of multistage cooling unit step by step
Chamber；
Low temperature unit fine crushing, including freezing chamber and pulverizing chamber；For freeze and crush the circuit board tabula rasa in wiring board into
Row recycling.
Cold energy feedback supply unit, docking cool down supply unit step by step, and by the touch screen after embrittlement by low temperature to high temperature
Cold energy feedback is carried out by the cooling chamber of multistage cooling unit and the freezing chamber of low temperature unit fine crushing step by step.
In order to preferably carry out embrittlement, and the freezing of combined circuit plate tabula rasa to OCA optical cement, it is preferred that the multistage
Cooling unit is Cascade refrigeration cycle, be equipped with temperature gradient be -5 DEG C~5 DEG C, -35 DEG C~-25 DEG C, -65 DEG C~-55 DEG C, -
The freezing chamber of 95 DEG C~-85 DEG C, -125 DEG C~-115 DEG C and -150 DEG C~-145 DEG C of cooling chamber, the low temperature unit fine crushing is
The cooling chamber of -125 DEG C~-115 DEG C sections in the Cascade refrigeration cycle.
For more reasonable Arrangement cascade refrigeration circulation, it is preferred that there are two the Cascade refrigeration cycle is total, Mei Geyou
3 single stage compress circulation compositions, first Cascade refrigeration cycle low temperature portion temperature are -150 DEG C~-145 DEG C, two condensations
Evaporator temperature is respectively -95 DEG C~-85 DEG C, -35 DEG C~-25 DEG C；Second Cascade refrigeration cycle low temperature portion temperature be-
125 DEG C~-115 DEG C, two condenser/evaporator temperature are respectively -65 DEG C~-55 DEG C, -5 DEG C~5 DEG C.
In order to ensure circuit board tabula rasa will not restore toughness because of heating in crushing process, it is preferred that the pulverizing chamber
Equipped with the refrigerating module by its temperature control between -40 DEG C~-60 DEG C.To guarantee crushing effect.By pulverizing chamber and condensation temperature
Fore-cooling room for 65 DEG C~-55 DEG C comes round, and the cold wind using blower blowout freezes.Or liquid is filled with by timing in pulverizing chamber
The mixture of nitrogen and nitrogen maintains low temperature.
Beneficial effects of the present invention:
(1) cooling procedure in the embrittlement process of the embrittlement of OCA optical cement and circuit board tabula rasa is combined, realizes stream
Waterline processing, can greatly increase treatment effeciency.
(2) brittle low temperature screen is fed back into the screen and circuit that cold energy is come in conveying during exporting
Plate tabula rasa exchanges heat, and reduces the loss of this portion of energy, mitigates the preheating burden of the cooling unit of higher temperature, reduces energy
The consumption in source.
Detailed description of the invention
Fig. 1 is the waste and old screen of the method for the present invention and the process line frame graph of wiring board recovery method.
Fig. 2 is the structural schematic diagram of apparatus of the present invention.
Fig. 3 is the structural schematic diagram of the Cascade refrigeration cycle of apparatus of the present invention.
Specific embodiment
As shown in Figure 1, the waste and old screen and wiring board recovery method of the present embodiment, comprising the following steps:
(1) waste mobile phone is disassembled, available primary product has: lithium ion battery, Mobile phone screen (the present embodiment
In be touch screen), wiring board, phone housing etc.；
(2) then Direct Classification recycles for plastic shell and lithium ion battery, wait be further processed；
(3) using Cascade refrigeration cycle classification refrigeration, fore-cooling room and freezing chamber are set, the temperature gradient of setting is -5 DEG C
~5 DEG C, -35 DEG C~-25 DEG C, -65 DEG C~-55 DEG C and -95 DEG C~-85 DEG C be used as fore-cooling room, temperature gradient be -125 DEG C~-
115 DEG C and -150 DEG C~-145 DEG C are used as freezing chamber, and touch screen successively passes through the fore-cooling room and freezing chamber of this six temperature gradients
Carry out freezing processing；
(4) touch screen -150 DEG C or so at a temperature of handled after, according to -150 DEG C, -125 DEG C~-115 DEG C, -
95 DEG C~-85 DEG C, -65 DEG C~-55 DEG C, -35 DEG C~-25 DEG C, -5 DEG C~5 DEG C of temperature gradient route return, realize that cold energy returns
The cold energy of the touch screen of embrittlement processing is fed back to untreated touch screen, finally returned under room temperature by feedback；
Temperature gradient be respectively -5 DEG C~5 DEG C, -35 DEG C~-25 DEG C, -65 DEG C~-55 DEG C, -95 DEG C~-85 DEG C, -125
DEG C~-115 DEG C and -150 DEG C~-145 DEG C in the time required to be respectively 6.1min, 6min, 5min, 4.01min, 3.1min,
2.12min；
(5) lock out operation is carried out to the touch screen after embrittlement and feedback cold energy at room temperature；
(7) careful dismantling processing is carried out to PCB circuit board, obtains the electronic components such as chip and circuit board tabula rasa, first device
Part carries out renovation processing, further recycles；
(8) circuit board tabula rasa is cooled to -120 DEG C or so in the freezing chamber that temperature gradient is -125 DEG C~-115 DEG C,
Circuit board tabula rasa is cooled to -120 DEG C of about time-consuming 3.1min and carries out low temperature processing fine crushing again, and obtained product carries out at room temperature
Metal and plastics are carried out just point separation by electrostatic separation processing, after can further be separated with sifter.
As shown in Fig. 2, the waste and old screen and wiring board recyclable device of the present embodiment include:
Multistage cooling unit, the cooling chamber equipped with multiple and different cooling temperatures；Multistage cooling unit follows for cascade refrigeration
Ring, be equipped with temperature gradient be -5 DEG C~5 DEG C, -35 DEG C~-25 DEG C, -65 DEG C~-55 DEG C, -95 DEG C~-85 DEG C, -125 DEG C~-
115 DEG C and -150 DEG C~-145 DEG C of cooling chamber；Wherein -5 DEG C~5 DEG C, -35 DEG C~-25 DEG C, -65 DEG C~-55 DEG C, -95 DEG C
~-85 DEG C are used as fore-cooling room 1, and -125 DEG C~-115 DEG C and -150 DEG C~-145 DEG C are used as freezing chamber 2 and freezing chamber 3.
It there are two Cascade refrigeration cycle is total, is each made of 3 single stage compress circulations, as shown in figure 3, all including mutual
Low-temperature circulating 03, medium temperature circulation 02 and the high temperature circulation 01 of coupling；First Cascade refrigeration cycle low temperature portion temperature be-
150 DEG C~-145 DEG C, two condenser/evaporator temperature are respectively -95 DEG C~-85 DEG C, -35 DEG C~-25 DEG C；Second superposition type
Refrigeration cycle low temperature portion temperature is -125 DEG C~-115 DEG C, respectively -65 DEG C of two condenser/evaporator temperature~-55 DEG C, -5
DEG C~5 DEG C；
Supply unit 4 is cooled down step by step, is transported touch screen 7 by high temperature to low temperature and is passed through each cold of multistage cooling unit step by step
But chamber；
Low temperature unit 5 fine crushing is used for Freezing smashing circuit board tabula rasa 8, including freezing chamber 2 and pulverizing chamber 51, and low temperature is fine crushing
The freezing chamber 1 of unit is the cooling chamber in Cascade refrigeration cycle as -125 DEG C~-115 DEG C sections of freezing chamber；Pulverizing chamber 51
Equipped with the refrigerating module by its temperature control between -40 DEG C~-60 DEG C.It is also provided at normal temperature to smashed circuit board tabula rasa
81 carry out the electrostatic separation instrument 52 of electrostatic separation processing, and metal and plastics are carried out just point separation, is also provided with and further divides
From sifter 53.
Cold energy feedback supply unit 6, docking step by step cool down supply unit 5, and by the touch screen 71 after embrittlement by low temperature to
High temperature carries out cold energy feedback by the freezing chamber of cooling chamber and the low temperature unit fine crushing of multistage cooling unit step by step.
By testing the method and apparatus for using the present embodiment, removal process cold energy use rate is greatly promoted, close with screen
Degree takes 4000kg/m3, 0.5356J/g/K when c is -60 DEG C can calculate to obtain energy saving 80.34KJ/kg from -150 DEG C to 0 DEG C.
Due to wiring board low-temperature grinding, make broken more thorough, is conducive to subsequent electrostatic separation metal and broken plastics, may be used also
Stress is crushed to reduce, reduces the power consumption of pulverizer, saves energy.From room temperature cooling to -40 DEG C, the Specific comminution of different rotating speeds
Power consumption all decreases, Specific comminution power dissipation ratio room temperature low 30% or so；From room temperature cooling to -40 DEG C, since impact pyrolysis produces
Raw pernicious gas gas decreases, and about 20%~30%.Compared with the method for conventional burning pcb board, what we designed
The method crushed under room temperature is returned to after pcb board is freezed, more environmentally-friendly energy conservation does not generate harmful poisonous gas.
Claims (9)
1. a kind of waste and old screen and wiring board recyclable device characterized by comprising
Multistage cooling unit, the cooling chamber equipped with multiple and different cooling temperatures；
Supply unit is cooled down step by step, transports each cooling chamber that touch screen is passed through multistage cooling unit by high temperature to low temperature step by step；
Low temperature unit fine crushing, including freezing chamber and pulverizing chamber；
Cold energy feedback supply unit, docking step by step cool down supply unit, and by the touch screen after embrittlement by low temperature to high temperature step by step
Cold energy feedback is carried out by the freezing chamber of cooling chamber and the low temperature unit fine crushing of multistage cooling unit；
It is described multistage cooling unit be Cascade refrigeration cycle, be equipped with temperature gradient be -5 DEG C~5 DEG C, -35 DEG C~-25 DEG C, -65
DEG C~-55 DEG C, -95 DEG C~-85 DEG C, -125 DEG C~-115 DEG C and -150 DEG C~-145 DEG C of cooling chamber, the low temperature list fine crushing
The freezing chamber of member is the cooling chamber of -125 DEG C~-115 DEG C sections in the Cascade refrigeration cycle.
2. waste and old screen as described in claim 1 and wiring board recyclable device, which is characterized in that the cascade refrigeration follows
There are two ring is total, each it is made of 3 single stage compress circulations, first Cascade refrigeration cycle low temperature portion temperature is -150 DEG C
~-145 DEG C, two condenser/evaporator temperature are respectively -95 DEG C~-85 DEG C, -35 DEG C~-25 DEG C；Second cascade refrigeration follows
Ring low temperature portion temperature is -125 DEG C~-115 DEG C, and two condenser/evaporator temperature are respectively -65 DEG C~-55 DEG C, -5 DEG C~5
℃。
3. waste and old screen as described in claim 1 and wiring board recyclable device, which is characterized in that the pulverizing chamber is equipped with will
Refrigerating module of its temperature control between -40 DEG C~-60 DEG C.
4. a kind of waste and old screen and wiring board recovery method, which is characterized in that using such as claims 1 to 3 any claim
The waste and old screen and wiring board recyclable device, comprising the following steps:
(1) disassembly processing is carried out to waste and old screen and wiring board, obtains the touch screen and circuit board light with OCA optical cement
Plate；
(2) multistage is carried out to the touch screen and is cooled to OCA optical cement embrittlement；
(3) obtained circuit board tabula rasa is freezed, low temperature processing fine crushing is then carried out；
(4) by by step (2) processing touch screen to the multistage cooling device in step (2) and in step (3) to institute
It states circuit board tabula rasa and carries out cooling device progress cold energy feedback, last touch screen returns to room temperature condition.
5. waste and old screen as claimed in claim 4 and wiring board recovery method, which is characterized in that in step (2), to the touching
It touches screen and carries out multistage cooling using Cascade refrigeration cycle classification refrigeration.
6. waste and old screen as claimed in claim 5 and wiring board recovery method, which is characterized in that the Cascade refrigeration cycle
Classification refrigeration setting temperature gradient be -5 DEG C~5 DEG C, -35 DEG C~-25 DEG C, -65 DEG C~-55 DEG C, -95 DEG C~-85 DEG C, -125
DEG C~-115 DEG C and -150 DEG C~-145 DEG C.
7. waste and old screen as claimed in claim 6 and wiring board recovery method, which is characterized in that in step (2), the touch
Screen cools down 2min~6.2min respectively in each temperature gradient.
8. waste and old screen as claimed in claim 6 and wiring board recovery method, which is characterized in that in step (3), the circuit
It is that -125 DEG C~-115 DEG C sections are cooled down that plate tabula rasa, which is classified refrigeration medium temperature degree gradient by Cascade refrigeration cycle,.
9. waste and old screen as claimed in claim 8 and wiring board recovery method, which is characterized in that in step (3), the circuit
The cooling time of plate tabula rasa is 1.5min~3.1min.
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| CN110153091A (en) * | 2019-05-16 | 2019-08-23 | 深圳大视野志远科技有限公司 | A kind of touch screen method for cleaning |
| CN111872022A (en) * | 2020-07-09 | 2020-11-03 | 湖州巨旺墙体材料有限公司 | Low-cost refractory material rapid recycling process |
| CN112701371A (en) * | 2020-12-28 | 2021-04-23 | 上海龙旗科技股份有限公司 | Electronic product battery freezing and disassembling method |
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