CN106001057A - Method and device for recycling waste screen and circuit board - Google Patents
Method and device for recycling waste screen and circuit board Download PDFInfo
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- CN106001057A CN106001057A CN201610420174.2A CN201610420174A CN106001057A CN 106001057 A CN106001057 A CN 106001057A CN 201610420174 A CN201610420174 A CN 201610420174A CN 106001057 A CN106001057 A CN 106001057A
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- Prior art keywords
- temperature
- screen
- waste
- circuit board
- touch screen
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
- B29B2017/0416—Cooling the plastics before disintegration, e.g. freezing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention discloses a method for recycling a waste screen and circuit board. The method comprises the following steps: (1) dismantling the waste screen and circuit board to obtain a touch screen with OCA and circuit board tabula rasa; (2) carrying out multi-stage cooling on the touch screen until the OCA embrittles; (3) freezing the obtained circuit board tabula rasa, and then carrying out low-temperature comminution treatment; and (4) adopting the touch screen subjected to the treatment in the step (2) to carry out cold energy feedback on a multi-stage cooling device in the step (2) and a device for cooling the circuit board tabula rasa in the step (3), and returning the touch screen to the room temperature condition; the invention further discloses a device for recycling a waste screen and circuit board. According to the invention, pipelining processing is realized, the processing efficiency is greatly improved, energy loss is reduced, and preheating burden of a cooling unit with higher temperature is alleviated.
Description
Technical field
The present invention relates to electronic product recovery technology field, particularly to a kind of waste and old screen and wiring board
Recovery method and device.
Background technology
Embrittlement is a kind of cryomechanics behavior, refers to material (mainly based on organic materials such as plastics) warp
Cross the change of K cryogenic treatment generation physical property, become fragile and easily pulverize.Brittle temperature is this low temperature
Measuring of mechanical behavior, in measuring, typically specifies the experimental temperature that failure probability is 50%
For brittle temperature.
Generally screen is formed by 4 layers, and uppermost one layer of glass is cover-plate glass, and most of is
Sapphire material.The second layer is touch inductor layer, mainly has resistance-type and condenser type two kinds.Screen
There is touch sensible layer function, on glass, mainly apply magnetron sputtering technique plating last layer ITO (oxygen
Change indium stannum, or tin-doped indium oxide), this is a kind of indium (III race) oxide and stannum (IV race) oxygen
The mixture of compound.Third layer is usually front panel, is mainly used to install optical filter, generates image.
Bottom one layer is then backboard, is used for processing the thin film transistor (TFT) of million meters.Wherein touch screen structure glues
Connecing and bonding with display screen module with touch screen employ OCA optical cement, OCA optical cement is in room temperature
Or solidify under middle temperature, and there are the features such as cure shrinkage is little.By certain K cryogenic treatment so that
There is embrittlement in OCA optical cement, its brittle temperature is about-150 DEG C.
It is printing pcb board that wiring board mainly comprises.The material manufacturing pcb board is considerably complicated, including
The organic material such as metal and epoxy resin.The concrete brittle temperature of this organic material has with many factors
Closing, it is right to mention in the paper " the low-temperature grinding experimental study of discarded circuit board " of Zou Liang, Bai Qingzhong
When pcb board carries out in small, broken bits process, it is-120 DEG C at precooling temperature, when cooling time is 5min, can
To obtain more fine fraction product, smoother particle surface and higher degree of dissociation.
For liquid crystal touch screen, the most conventional mode of doing over again has molybdenum filament patterning method, liquid nitrogen freezing
Method, refrigerator freezing method three kinds, the efficiency of molybdenum filament patterning method is the lowest, and to the damage of cut part relatively
Greatly, the yields that causes doing over again is the lowest.The degumming effect of liquid nitrogen freezing is pretty good, but liquid nitrogen consumption is too
Greatly, and owing to moment produces the low temperature of subzero 196 degree (preferable gasification temperatures), danger is the highest,
If imprudence splashes on workman's skin, cutaneous necrosis can be immediately resulted in, owing to being injected in touch screen surface
The liquid nitrogen moment of glass produces subzero 196 degree of low temperature makes outermost layer glass drastically shrink and burst, and
Owing to the internal other parts of liquid crystal display screen not yet experience low temperature without shrinking, the most more increase
Glass explosion probability, ultimately results in yields of doing over again the lowest.Although the temperature of refrigerator freezing method reaches not
The lowest to liquid nitrogen, but owing to its degumming principle is that cold air and touch screen carry out cold and hot friendship in case
Changing, this process is steady and gentle, quick-fried screen phenomenon will not occur, thus be greatly improved yields of doing over again,
And will not there is hidden danger of hurting sb.'s feelings in it as liquid nitrogen, safe and reliable；It is also had only to need civil power just can transport
OK, use cost is cheap.
" the low-temperature grinding experimental study of discarded circuit board " literary composition further mentions and reclaims skill at useless circuit board
In art, mechanical treatment technology is little with its environmental pollution, simple to operate, have higher treatment effeciency and
Preferably economic benefit and receive much concern, and be widely developed in past 20 years.At machinery
Destruction step is the most important thing is, because it directly decides later separation step during treatment technology
Efficiency, the yield of metal and purity.Circuit board substrate is generally with a large amount of thermosetting resins, and these are set
Lipopolymer has characteristic hard and strong, resistant to elevated temperatures, in certain toughness under room temperature, it is impossible to by typically
Impact and direct attrition crushing mode pulverized.Thus pulverize recovery under room temperature and there is various problem,
As impacted pyrolysis, harmful gas produces, the dust pollution in dry type pulverizing, and product particle shape is uneven,
And equipment long time running is easily generated amount of heat, cause equipment hot-spot, materials from bonding, stifled
The problems such as plug equipment, these problems can cause environmental pollution, reduces crush efficiency, causes follow-up separation
The reduction of efficiency.Typical solution is that these non-brittle materials are become crisp by freezing
Matter, then pulverized.Therefore freeze grinding technology has the most wide in the process of useless circuit board
Research Prospects.
It can be seen that cooling removal process of the prior art, cold waste is extremely serious, reclaims energy
Consumption is big, and cost is high.
Summary of the invention
The invention provides a kind of waste and old screen and wiring board recovery method, effectively reduce energy consumption, reduce
Pollute and improve organic efficiency.
A kind of waste and old screen and wiring board recovery method, comprise the following steps:
(1) waste and old screen and wiring board are carried out dismounting process, obtain touching with OCA optical cement
Touch screen and circuit board tabula rasa；
(2) described touch screen is carried out the multistage OCA optical cement that is cooled to brittle；
(3) the circuit board tabula rasa that freezing obtains, then carries out low temperature process in small, broken bits；
(4) touch screen that will process through step (2) is to the multistage chiller in step (2)
And the device cooling down described circuit board tabula rasa in step (3) carries out cold energy feedback,
Rear touch screen returns room temperature condition.
Waste and old screen is disassembled, available primary product；Cabinet and battery are the most straight
Connect classification to reclaim, to treat to process further；Wiring board is carefully disassembled process, obtains chip etc.
Electronic devices and components and circuit board tabula rasa, components and parts carry out renovation process, reclaim further.
Carrying out low temperature process in small, broken bits after circuit board tabula rasa freezing, the product obtained at room temperature carries out electrostatic
Separating treatment, after metal and plastics carry out just point separation, available sifter separates further.
The touch screen of the inventive method is lowered the temperature, and by brittle low temperature screen in the mistake exported
Screen and circuit board tabula rasa that in journey, feedback cold energy is come in conveying carry out heat exchange, decrease this part
The loss of energy, alleviates the burden of the cooling unit of higher temperature.
Cold energy feedback is mainly carried out, with phase in cooling spaces at different levels (fore-cooling room or refrigerating chamber)
As a example by three grades of adjacent coolings space (low temperature fore-cooling room, Zhong Wen fore-cooling room and high temperature fore-cooling room), from low
Temperature fore-cooling room return touch screen and from high temperature fore-cooling room (high temperature fore-cooling room two-stage higher than low temperature fore-cooling room
Temperature) touch screen out is in Zhong Wen fore-cooling room (Zhong Wen fore-cooling room one-level higher than low temperature fore-cooling room temperature)
In carry out heat exchange, concrete, two deblocking temperatures differ about 60 DEG C (the most multistage cooling unit interval one-levels
The temperature difference, the temperature difference between high temperature fore-cooling room and low temperature fore-cooling room, can be set as required)
Screen be separated by 3～5cm, utilize blower fan to carry out Forced Convection Heat Transfer, so realize the transmission of cold with
Utilize.
The present invention utilize OCA optical cement lose at low temperatures on the character of viscosity and circuit board tabula rasa
Under low temperature, brittle breakable character, organically combines the freezing of the two and is used.Realize
Pipeline processes, can be greatly increased treatment effeciency.
Multistage cooling refers to from high temperature to low temperature, touch screen is carried out cooling step by step, prevents screen moment
Cool down and fragmentation.
Multistage cooling can be multiple different temperatures and the cooling circulation worked independently, in order to carry further
High minimizing energy consumption, it is preferred that in step (2), carries out multistage cooling and uses multiple described touch screen
Stacked kind of refrigeration cycle classification is freezed.
Cascade refrigeration cycle applies in general to the evaporating temperature refrigeration system less than-60 DEG C.At Dong Lin
Master's thesis " experimentation of natural refrigerant R290/C02 Cascade refrigeration cycle " mention that it was both
Suitable evaporating temperature when can meet evaporation under relatively low evaporating temperature, can meet in ambient temperature again
Condensing pressure moderate during lower condensation.Cascade refrigeration cycle is generally used not by two (or several)
Form with the single-stage refrigerating system of cold-producing medium.Generally high-temperature systems uses high boiling point cold-producing medium, low temperature system
System uses low boiling point refrigerant, respectively becomes a refrigeration system using unitary system cryogen.High temperature system
In system, the evaporation of cold-producing medium is used for condensing the cold-producing medium in cryogenic system.Cold-producing medium in cryogenic system,
(producing cold) is absorbed heat to cooled object when evaporation.
OCA optical cement brittle temperature is about-150 degree, and in order to prevent screen to be destroyed, the present invention exists
The chilling process of-150 degree reached carries out staged cooling, step temperature is rationally set, due to rank
Ladder type is lowered the temperature, moreover it is possible to make the screen that brittle low temperature screen can be come in during output to conveying
Curtain carries out heat exchange, had both decreased the loss of this portion of energy, and had alleviated again the burden of fore-cooling room.Preferably
, the thermograde that described Cascade refrigeration cycle classification refrigeration is arranged is-5 DEG C～5 DEG C,
-35 DEG C～-25 DEG C ,-65 DEG C～-55 DEG C ,-95 DEG C～-85 DEG C ,-125 DEG C～-115 DEG C and-150 DEG C～-145 DEG C.
These six thermogrades are set partly in order to make the cold can be fully by two by heat exchange layer by layer
Secondary utilization, on the other hand, in order to make Mobile phone screen the most close in the time residing for each fore-cooling room, side
Just operate.
Material reaches the time required time consistent with ambient temperature to use unsteady-state heat transfer to estimate, formula is such as
Under:
In formula, ρ is the density of object, and c is specific heat capacity, and h is the heat convection between body surface and air-flow
Coefficient, V/A is object thickness, T0For the initial temperature of object, T is object final temperature, (permits
Perhaps, after heat transfer terminates, object is 1 DEG C with the error of ambient temperature), TtAmbient temperature residing for object.
In order to embrittlement is better achieved, it is preferred that in step (2), described touch screen is in each temperature
Gradient cools down 2min～6.2min respectively.
It is further preferred that thermograde be respectively-5 DEG C～5 DEG C ,-35 DEG C～-25 DEG C ,-65 DEG C
～the time of required cooling in-55 DEG C ,-95 DEG C～-85 DEG C ,-125 DEG C～-115 DEG C and-150 DEG C～-145 DEG C
It is respectively 5～7min, 5～7min, 4～6min, 3～5min, 2～4min, 2～3min.
It is further preferred that thermograde be respectively-5 DEG C～5 DEG C ,-35 DEG C～-25 DEG C ,-65 DEG C
～required time is respectively in-55 DEG C ,-95 DEG C～-85 DEG C ,-125 DEG C～-115 DEG C and-150 DEG C～-145 DEG C
6～6.2min, 5.9～6.1min, 4.9～5.1min, 4～4.1min, 3～3.2min, 2～2.2min.
For the recovery further combined with circuit board tabula rasa and screen, reduce energy consumption, it is preferred that step
(3), in, during described circuit board tabula rasa is freezed by Cascade refrigeration cycle classification, thermograde is
-125 DEG C～-115 DEG C of sections cool down.
In order to reach preferable refrigerating effect, it is preferred that in step (3), described circuit board tabula rasa
Cool time be 1.5min～3.1min.
Recovery is divided into two parts by master-plan of the present invention: waste and old screen freezing recovery and wiring board low temperature
Pulverize and reclaim noble metal.The mainly touch inductor layer that we reclaim, in this layer, each material is mainly
Bond with OCA optical cement.Therefore, screen freezing is reclaimed and can be lost at low temperatures according to OCA optical cement
The characteristic of deactivation, is chilled to about-150 DEG C by it, further takes out manual disassembling.In order to reduce cold energy
Consume us and devise the fore-cooling room of multiple thermograde, carry out cold energy feedback and (the most cooled complete
The most uncolled good screen pre-cooling given by screen), it is achieved the secondary of cold utilizes.PCB, profit
The fragility shown at low temperatures with it so that it is be broken under external force the less granule of particle diameter or
Powder body, is then used by electrostatic separation metal and broken plastics, to reach to reclaim the target of noble metal.In order to
Reducing cold consumption, convenient recovery, need before cooling first to be split by screen, additionally wiring board is freezing
Before must disassemble lower chip and recycle, only circuit board tabula rasa and screen are carried out freezing processing.
Combined circuit plate tabula rasa and screen cooling procedure, use the theory of automated production to design whole
Flow process, substantially increases production efficiency.Make the portable high of whole technology, it is easy to expanding production
Scale.
Present invention also offers a kind of waste and old screen and wiring board retracting device, including:
Multistage cooling unit, is provided with the cooling chamber of multiple different chilling temperature；
Cool down supply unit step by step, transport touch screen by high temperature to low temperature step by step by multistage cooling unit
Each cooling chamber；
Low temperature unit in small, broken bits, including refrigerating chamber and pulverizing chamber；For freezing and pulverize the electricity in wiring board
Road plate tabula rasa reclaims.
Cold energy feedback supply unit, docking cools down supply unit step by step, and by the touch screen after embrittlement by
Low temperature is entered by the cooling chamber of multistage cooling unit and the refrigerating chamber of low temperature unit in small, broken bits step by step to high temperature
Row cold energy feeds back.
In order to preferably OCA optical cement be carried out embrittlement, and the freezing of combined circuit plate tabula rasa, excellent
Choosing, described multistage cooling unit is Cascade refrigeration cycle, be provided with thermograde for-5 DEG C～5 DEG C,
-35 DEG C～-25 DEG C ,-65 DEG C～-55 DEG C ,-95 DEG C～-85 DEG C ,-125 DEG C～-115 DEG C and-150 DEG C～-145 DEG C
Cooling chamber, the refrigerating chamber of described low temperature unit in small, broken bits is in described Cascade refrigeration cycle
The cooling chamber of-125 DEG C～-115 DEG C sections.
In order to more reasonable Arrangement cascade refrigeration circulates, it is preferred that described Cascade refrigeration cycle has
Two, each circulation by 3 single stage compress forms, first Cascade refrigeration cycle low temperature part temperature
Degree for-150 DEG C～-145 DEG C, two condenser/evaporator temperature be respectively-95 DEG C～-85 DEG C,
-35 DEG C～-25 DEG C；Second Cascade refrigeration cycle low temperature portion temperature is-125 DEG C～-115 DEG C, two
Individual condenser/evaporator temperature is respectively-65 DEG C～-55 DEG C ,-5 DEG C～5 DEG C.
Toughness will not be recovered because of intensification, it is preferred that institute in order to ensure circuit board tabula rasa in crushing process
The pulverizing chamber stated is provided with its temperature control refrigerating module between-40 DEG C～-60 DEG C.Thus ensure to pulverize effect
Really.Being come round the fore-cooling room that pulverizing chamber and condensation temperature are 65 DEG C～-55 DEG C, utilize that blower fan blows out is cold
Wind freezes.Or in pulverizing chamber, the mixture maintenance low temperature of liquid nitrogen and nitrogen it is filled with by timing.
Beneficial effects of the present invention:
(1) by the cooling procedure phase in the embrittlement of OCA optical cement and the embrittlement process of circuit board tabula rasa
In conjunction with, it is achieved that pipeline processes, treatment effeciency can be greatly increased.
(2) brittle low temperature screen is fed back during output what cold energy was come in conveying
Screen and circuit board tabula rasa carry out heat exchange, decrease the loss of this portion of energy, alleviate higher temperature
Cooling unit preheating burden, reduce the energy consumption.
Accompanying drawing explanation
Fig. 1 is waste and old screen and the flowline block diagram of wiring board recovery method of the inventive method.
Fig. 2 is the structural representation of apparatus of the present invention.
Fig. 3 is the structural representation of the Cascade refrigeration cycle of apparatus of the present invention.
Detailed description of the invention
As it is shown in figure 1, the waste and old screen of the present embodiment and wiring board recovery method, comprise the following steps:
(1) disassembling waste mobile phone, available primary product has: lithium ion battery,
Mobile phone screen (being touch screen in the present embodiment), wiring board, phone housing etc.；
(2) cabinet and lithium ion battery then Direct Classification reclaims, to treat to process further；
(3) utilize Cascade refrigeration cycle classification to freeze, fore-cooling room and refrigerating chamber are set, setting
Thermograde is that-5 DEG C～5 DEG C ,-35 DEG C～-25 DEG C ,-65 DEG C～-55 DEG C and-95 DEG C～-85 DEG C are as pre-cooling
Room, thermograde be-125 DEG C～-115 DEG C and-150 DEG C～-145 DEG C as refrigerating chamber, touch screen is successively
Freezing processing is carried out through the fore-cooling room of these six thermogrades and refrigerating chamber；
(4) after touch screen processes at a temperature of about-150 DEG C, according to-150 DEG C ,-125 DEG C
～-115 DEG C ,-95 DEG C～-85 DEG C ,-65 DEG C～-55 DEG C ,-35 DEG C～-25 DEG C ,-5 DEG C～the thermograde of 5 DEG C
Route returns, it is achieved cold energy feedback, feeds back to the cold energy of the brittle touch screen processed without place
The touch screen of reason, finally returns under room temperature condition；
Thermograde be respectively-5 DEG C～5 DEG C ,-35 DEG C～-25 DEG C ,-65 DEG C～-55 DEG C ,-95 DEG C～-85 DEG C,
In-125 DEG C～-115 DEG C and-150 DEG C～-145 DEG C required time be respectively 6.1min, 6min, 5min,
4.01min、3.1min、2.12min；
(5) at ambient temperature the touch screen after embrittlement feedback cold energy is carried out lock out operation；
(7) PCB is carefully disassembled process, obtain the electronic devices and components such as chip and electricity
Road plate tabula rasa, components and parts carry out renovation process, reclaim further；
(8) circuit board tabula rasa is cooled in the refrigerating chamber that thermograde is-125 DEG C～-115 DEG C
About-120 DEG C, circuit board tabula rasa is cooled to-120 DEG C of about time-consuming 3.1min and carries out low temperature place in small, broken bits again
Reason, the product obtained at room temperature carries out electrostatic separation process, and metal and plastics carry out just point separation,
Rear available sifter separates further.
As in figure 2 it is shown, the waste and old screen of the present embodiment and wiring board retracting device include:
Multistage cooling unit, is provided with the cooling chamber of multiple different chilling temperature；Multistage cooling unit is multiple
Stacked kind of refrigeration cycle, be provided with thermograde be-5 DEG C～5 DEG C ,-35 DEG C～-25 DEG C ,-65 DEG C～-55 DEG C,
-95 DEG C～-85 DEG C ,-125 DEG C～-115 DEG C and the cooling chamber of-150 DEG C～-145 DEG C；Wherein-5 DEG C～5 DEG C,
-35 DEG C～-25 DEG C ,-65 DEG C～-55 DEG C ,-95 DEG C～-85 DEG C as fore-cooling room 1 ,-125 DEG C～-115 DEG C and
-150 DEG C～-145 DEG C as refrigerating chamber 2 and refrigerating chamber 3.
Cascade refrigeration cycle has two, and each circulation by 3 single stage compress forms, such as Fig. 3 institute
Show, all include the cold cycle 03 intercoupled, middle temperature circulation 02 and high temperature circulation 01；First
Individual Cascade refrigeration cycle low temperature portion temperature is-150 DEG C～-145 DEG C, and two condenser/evaporator temperature are divided
Wei-95 DEG C～-85 DEG C ,-35 DEG C～-25 DEG C；Second Cascade refrigeration cycle low temperature portion temperature is
-125 DEG C～-115 DEG C, two condenser/evaporator temperature are respectively-65 DEG C～-55 DEG C ,-5 DEG C～5 DEG C；
Cooling supply unit 4 step by step, transports touch screen 7 by high temperature to low temperature step by step by multistage cooling
Each cooling chamber of unit；
Low temperature unit in small, broken bits 5, for freezing and pulverizing circuit board tabula rasa 8, including refrigerating chamber 2 and pulverizing
Room 51, as refrigerating chamber in the refrigerating chamber 1 i.e. Cascade refrigeration cycle of low temperature unit in small, broken bits
The cooling chamber of-125 DEG C～-115 DEG C sections；Pulverizing chamber 51 is provided with its temperature control between-40 DEG C～-60 DEG C
Refrigerating module.It is also provided with at normal temperatures the circuit board tabula rasa 81 after pulverizing being carried out at electrostatic separation
The electrostatic separation instrument 52 of reason, carries out metal and plastics just point separation, is also provided with separating further
Sifter 53.
Cold energy feedback supply unit 6, docking cooling supply unit 5 step by step, and by the touch after embrittlement
Screen 71 is passed through the cooling chamber of multistage cooling unit and the cold of low temperature unit in small, broken bits step by step by low temperature to high temperature
Freeze room and carry out cold energy feedback.
Through the method and apparatus that test uses the present embodiment, removal process cold energy use rate carries significantly
Rise, take 4000kg/m with screen density3, 0.5356J/g/K when c is-60 DEG C, from-150 DEG C to 0 DEG C,
Energy-conservation 80.34KJ/kg can be calculated.
Due to wiring board low-temperature grinding, make broken the most thorough, be conducive to the most subsequently electrostatic separation metal and
Broken plastics, it is also possible to reduce and pulverize stress, reduce the power consumption of pulverizer, save energy.Cold from room temperature
But arriving-40 DEG C, the Specific comminution power consumption of different rotating speeds all decreases, Specific comminution power dissipation ratio room temperature
Low by about 30%；Being cooled to-40 DEG C from room temperature, the harmful gas gas produced due to impact pyrolysis has
Reduced, about 20%～30%.Compared with the conventional method burning pcb board, our design general
The method returning to after pcb board freezing pulverize under room temperature, more environmentally-friendly energy-conservation, do not produce harmful poisonous gas
Body.
Claims (10)
1. a waste and old screen and wiring board recovery method, it is characterised in that comprise the following steps:
(1) waste and old screen and wiring board are carried out dismounting process, obtain touching with OCA optical cement
Touch screen and circuit board tabula rasa；
(2) described touch screen is carried out the multistage OCA optical cement that is cooled to brittle；
(3) the circuit board tabula rasa that freezing obtains, then carries out low temperature process in small, broken bits；
(4) touch screen that will process through step (2) is to the multistage chiller in step (2)
And the device cooling down described circuit board tabula rasa in step (3) carries out cold energy feedback,
Rear touch screen returns room temperature condition.
Waste and old screen the most as claimed in claim 1 and wiring board recovery method, it is characterised in that
In step (2), described touch screen is carried out multistage cooling and uses Cascade refrigeration cycle classification refrigeration.
Waste and old screen the most as claimed in claim 2 and wiring board recovery method, it is characterised in that
The thermograde that described Cascade refrigeration cycle classification refrigeration is arranged be-5 DEG C～5 DEG C ,-35 DEG C～-25 DEG C,
-65 DEG C～-55 DEG C ,-95 DEG C～-85 DEG C ,-125 DEG C～-115 DEG C and-150 DEG C～-145 DEG C.
Waste and old screen the most as claimed in claim 3 and wiring board recovery method, it is characterised in that
In step (2), described touch screen cools down 2min～6.2min in each thermograde respectively.
Waste and old screen the most as claimed in claim 3 and wiring board recovery method, it is characterised in that
In step (3), described circuit board tabula rasa is by thermograde in Cascade refrigeration cycle classification refrigeration
Cool down for-125 DEG C～-115 DEG C of sections.
Waste and old screen the most as claimed in claim 5 and wiring board recovery method, it is characterised in that
In step (3), the cool time of described circuit board tabula rasa is 1.5min～3.1min.
7. a waste and old screen and wiring board retracting device, it is characterised in that including:
Multistage cooling unit, is provided with the cooling chamber of multiple different chilling temperature；
Cool down supply unit step by step, transport touch screen by high temperature to low temperature step by step by multistage cooling unit
Each cooling chamber；
Low temperature unit in small, broken bits, including refrigerating chamber and pulverizing chamber；
Cold energy feedback supply unit, docking cools down supply unit step by step, and by the touch screen after embrittlement by
Low temperature is entered by the cooling chamber of multistage cooling unit and the refrigerating chamber of low temperature unit in small, broken bits step by step to high temperature
Row cold energy feeds back.
Waste and old screen the most as claimed in claim 7 and wiring board retracting device, it is characterised in that
Described multistage cooling unit is Cascade refrigeration cycle, be provided with thermograde for-5 DEG C～5 DEG C,
-35 DEG C～-25 DEG C ,-65 DEG C～-55 DEG C ,-95 DEG C～-85 DEG C ,-125 DEG C～-115 DEG C and-150 DEG C～-145 DEG C
Cooling chamber, the refrigerating chamber of described low temperature unit in small, broken bits is in described Cascade refrigeration cycle
The cooling chamber of-125 DEG C～-115 DEG C sections.
Waste and old screen the most as claimed in claim 8 and wiring board retracting device, it is characterised in that
Described Cascade refrigeration cycle has two, and each circulation by 3 single stage compress forms, first
Cascade refrigeration cycle low temperature portion temperature is-150 DEG C～-145 DEG C, and two condenser/evaporator temperature are respectively
For-95 DEG C～-85 DEG C ,-35 DEG C～-25 DEG C；Second Cascade refrigeration cycle low temperature portion temperature is
-125 DEG C～-115 DEG C, two condenser/evaporator temperature are respectively-65 DEG C～-55 DEG C ,-5 DEG C～5 DEG C.
Waste and old screen the most as claimed in claim 8 and wiring board retracting device, it is characterised in that
Described pulverizing chamber is provided with its temperature control refrigerating module between-40 DEG C～-60 DEG C.
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| CN106001057B (en) | 2019-01-18 |
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