CN104630718A - Five-cavity full-automatic electron beam deposition system - Google Patents
Five-cavity full-automatic electron beam deposition system Download PDFInfo
- Publication number
- CN104630718A CN104630718A CN201310567063.0A CN201310567063A CN104630718A CN 104630718 A CN104630718 A CN 104630718A CN 201310567063 A CN201310567063 A CN 201310567063A CN 104630718 A CN104630718 A CN 104630718A
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- China
- Prior art keywords
- cavity
- vacuum
- load chamber
- pumping system
- loading
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Abstract
The invention relates to the technical field of preparing various thin films on glass, plastic and ceramic matrixes and particularly relates to a five-cavity full-automatic electron beam deposition system. The system comprises a suction system and five cavities which comprise a transmission cavity I, a loading cavity I, a process cavity, a loading cavity II and a transmission cavity II sequentially communicated, wherein the cavities are connected with the suction system; vacuum locking systems are arranged between the loading cavity I and the process cavity and between the loading cavity II and the process cavity; sample carrying plates are arranged in the loading cavity I, the process cavity and the loading cavity II. According to the system provided by the invention, the suction time after exchanging the sample carrying plate every time in the process cavity is shortened while the output is high, so that the process flow of the process cavity and pick-and-place of the sample carrying plate in the loading cavities I and II are carried out at the same time. Moreover, other parts except a process cavity door and doors of the loading cavities I and II in the clean room can be placed in a common environment, so that the cost is relatively low.
Description
Technical field
The present invention relates to the technical field all kinds of film preparing by glass, plastics and ceramic matrix, be specially a kind of five cavity full-automatic electronic bundle depositing systems.
Background technology
Make metallization of plastic surface by the application of electron beam deposition, organic materials and inorganic materials are combined, substantially increase its physics, chemical property, make its smooth surface, improve surface hardness.Former frosting is softer and predispose to damage, and by vacuum plating, hardness and wear resistance are effectively increased, and reduce water-intake rate, the more, pin hole is fewer for coating times, and water-intake rate reduces, and goods are not yielding, easily clean, not dust suction.Electron beam deposition method is the most ripe, the continuous automatic production method of the comparatively simple a kind of connection of operation of technology in the several method preparing thin-film material.Present stage is at glass, the equipment preparing film that on plastics and ceramic matrix, all kinds of film applications uses has two kinds, and a kind of be the electron beam deposition apparatus of single cavity, the secondary production overlong time of tables of equipment of this structure, cause output very low, do not have to join continuous ability of producing.Another kind of is import multi-chamber electron beam deposition apparatus, and can realize automatic production, but sample support plate is overall umbrella-shaped structure, because weight issue support plate size is less, single time yields poorly, and vacuum blocking mechanism size is comparatively large, and cost is higher.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of five cavity full-automatic electronic bundle depositing systems.The problems such as the production time existed in this system solution prior art is long, cost is higher.The present invention adopts five chambers of modular design to work under vacuum, improves production efficiency, reduces working service cost.
To achieve these goals, the present invention is by the following technical solutions:
A kind of five cavity full-automatic electronic bundle depositing systems, comprise air-bleed system and five cavitys, described five cavitys comprise be connected successively transmission cavity I, load chamber I, process cavity, load chamber II and transmission cavity II, each cavity is all connected with air-bleed system.
Described air-bleed system comprises vacuum-pumping system I, vacuum-pumping system II, vacuum-pumping system III, vacuum-pumping system IV and vacuum-pumping system V, wherein vacuum-pumping system I is communicated with load chamber I with transmission cavity I, described vacuum-pumping system II and vacuum-pumping system III all and process chamber, described vacuum-pumping system IV is communicated with transmission cavity I, load chamber I, process cavity, load chamber II and transmission cavity II, and described vacuum-pumping system V is communicated with load chamber II, transmission cavity II.
Described transmission cavity I, load chamber I, process cavity, load chamber II and transmission cavity II set gradually from top to bottom.
Vacuum-pumping system I is placed at described load chamber I top, vacuum-pumping system II is placed at described process cavity top, process cavity is that sidewall places vacuum-pumping system III, described vacuum-pumping system IV is connected with load chamber II with load chamber I, process cavity by pipeline, and vacuum-pumping system V is placed at described load chamber II top.Described load chamber I and be provided with vacuum lock closed system between load chamber II and process cavity.Sample support plate is equipped with in described load chamber I, process cavity and load chamber II.
Advantage of the present invention and beneficial effect are:
1. the present invention adopts high yield, modular design, and it is a kind of modularization five chamber (transmission cavity I, the load chamber I that can make to measure according to user, process cavity, load chamber II, transmission cavity II) electron beam deposition system that works under vacuum, production capacity is original 3.5 times.
2. the present invention only needs to open process cavity when changing electron beam gun crucible and film thickness gauge crystal-vibration-chip, only needs to open the replacing that load chamber door carries out sample substrate during normal work.Save the pumpdown time of process cavity after at every turn exchanging sample support plate for, allow the technological process of process cavity and load chamber I, load chamber II pick and place sample support plate and carry out simultaneously.Contrast import multi-chamber electron beam deposition apparatus, that the size of sample support plate can be done is comparatively large, and improve single output, simultaneously load chamber I, the size of the vacuum block sytem between load chamber II and process cavity is less, greatly reduces costs.
3. the present invention is when working, and can reach the following technical indicator of single cavity electron beam deposition system and Imported Electronic bundle depositing system equally:
(1) nobody automatically or manually glass can be realized, plastics and ceramic surface film preparation, omnidistance with industrial microcomputer realization control automatically;
(2) there is perfect warning function and safety mutually-locking device;
(3) various glass is applicable to, plastics and ceramic surface film preparation.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Wherein: 1 is transmission cavity I, 2 is vacuum-pumping system I, and 3 is load chamber I, and 4 is vacuum-pumping system II, and 5 is process cavity, and 6 is vacuum-pumping system III, and 7 is vacuum-pumping system IV, and 8 is load chamber II, and 9 is vacuum-pumping system V, and 10 is transmission cavity II.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
As shown in Figure 1, the present invention includes air-bleed system and five cavitys, described five cavitys comprise and arranging from top to bottom successively and the transmission cavity I1, the load chamber I3 that are connected, process cavity 5, load chamber II8 and transmission cavity II10, and each cavity is all connected with air-bleed system.
Described air-bleed system comprises vacuum-pumping system I2, vacuum-pumping system II4, vacuum-pumping system III6, vacuum-pumping system IV7 and vacuum-pumping system V9, and wherein vacuum-pumping system I2 is arranged at the top of load chamber I3 and is communicated with load chamber I3 with transmission cavity I1 respectively.Vacuum-pumping system II4 is placed at the top of process cavity 5, and the sidewall of process cavity 5 places vacuum-pumping system III6, and described vacuum-pumping system II4 is all communicated with process cavity 5 with vacuum-pumping system III6.Described vacuum-pumping system IV7 is communicated with transmission cavity I1, load chamber I3, process cavity 5, load chamber II8 and transmission cavity II10 by pipeline.Vacuum-pumping system V9 is placed at described load chamber II8 top, and described vacuum-pumping system V9 is communicated with load chamber II8, transmission cavity II10.
Vacuum lock closed system is provided with, as valve between described load chamber I3 and load chamber II8 and process cavity 5.Be equipped with specimen holder in described load chamber I3, process cavity 5 and load chamber II8, the sample support plate being loaded with sample substrate is arranged on specimen holder.
When the present invention assembles, transmission cavity I1, load chamber I3, process cavity 5, load chamber II8 and transmission cavity II10 are fixed by bolts on stand according to position respectively, be bolted together between each stand, more each vacuum-pumping system pipeline is communicated with transmission cavity I1, load chamber I3, process cavity 5, load chamber II8 and transmission cavity II10 respectively.Wherein, change sample support plate in sample technological process and load chamber I3 and load chamber II8 in process cavity 5 is carry out simultaneously, the great like this efficiency having given play to personnel, to save when changing substrate from air to the pumpdown time requiring vacuum tightness compared with single cavity electron beam deposition system at every turn, make working efficiency higher.Except process cavity door, load chamber I door, load chamber II door other part except clean room can be put in conventional environment, running cost is lower.
In the present invention, contrast import multi-chamber electron beam deposition apparatus, that the size of sample support plate can be done is larger, in the present embodiment, the diameter of specimen holder is 2000mm, improve single output, the size of the vacuum block sytem simultaneously between load chamber and process cavity is less, greatly reduces costs.Contrast 2.5 times that single cavity electron beam deposition system QEB-2000F electron beam deposition system cost is its cost, but changing sample support plate in sample technological process and load chamber I2 load chamber II8 in process cavity 5 is carry out simultaneously, save each when changing substrate from air to the pumpdown time requiring vacuum tightness, make efficiency reach 3.5 times of single cavity.Former single cavity electron beam deposition system operator are a people, and QEB-2000F electron beam deposition system operator are two people, but efficiency is original 3.5 times, the great like this efficiency having given play to personnel.Thus realizing the cost of former single cavity electron beam deposition system 2.5 times, production capacity is the target of 3.5 times of original system.
Claims (6)
1. a cavity full-automatic electronic bundle depositing system, it is characterized in that: comprise air-bleed system and five cavitys, described five cavitys comprise the transmission cavity I (1), load chamber I (3), process cavity (5), load chamber II (8) and the transmission cavity II (10) that are connected successively, and each cavity is all connected with air-bleed system.
2. by five cavity full-automatic electronic bundle depositing systems according to claim 1, it is characterized in that: described air-bleed system comprises vacuum-pumping system I (2), vacuum-pumping system II (4), vacuum-pumping system III (6), vacuum-pumping system IV (7) and vacuum-pumping system V (9), wherein vacuum-pumping system I (2) is communicated with load chamber I (3) with transmission cavity I (1), described vacuum-pumping system II (4) is all communicated with process cavity (5) with vacuum-pumping system III (6), described vacuum-pumping system IV (7) and transmission cavity I (1), load chamber I (3), process cavity (5), load chamber II (8) and transmission cavity II (10) is communicated with, described vacuum-pumping system V (9) and load chamber II (8), transmission cavity II (10) is communicated with.
3., by five cavity full-automatic electronic bundle depositing systems according to claim 2, it is characterized in that: described transmission cavity I (1), load chamber I (3), process cavity (5), load chamber II (8) and transmission cavity II (10) set gradually from top to bottom.
4. by five cavity full-automatic electronic bundle depositing systems according to claim 3, it is characterized in that: vacuum-pumping system I (2) is placed at described load chamber I (3) top, vacuum-pumping system II (4) is placed at described process cavity (5) top, process cavity (5) is that sidewall places vacuum-pumping system III (6), described vacuum-pumping system IV (7) is connected with load chamber II (8) with load chamber I (3), process cavity (5) by pipeline, and vacuum-pumping system V (9) is placed at described load chamber II (8) top.
5. by five cavity full-automatic electronic bundle depositing systems according to claim 1, it is characterized in that: described load chamber I (3) and be provided with vacuum lock closed system between load chamber II (8) and process cavity (5).
6., by five cavity full-automatic electronic bundle depositing systems according to claim 1, it is characterized in that: in described load chamber I (3), process cavity (5) and load chamber II (8), be equipped with sample support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310567063.0A CN104630718A (en) | 2013-11-13 | 2013-11-13 | Five-cavity full-automatic electron beam deposition system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310567063.0A CN104630718A (en) | 2013-11-13 | 2013-11-13 | Five-cavity full-automatic electron beam deposition system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104630718A true CN104630718A (en) | 2015-05-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310567063.0A Pending CN104630718A (en) | 2013-11-13 | 2013-11-13 | Five-cavity full-automatic electron beam deposition system |
Country Status (1)
| Country | Link |
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| CN (1) | CN104630718A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106865492A (en) * | 2017-02-09 | 2017-06-20 | 广东电网有限责任公司云浮供电局 | A kind of equipment and method of seal for sealing isolated ultra-fine tuftlet up for safekeeping |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6589351B1 (en) * | 1999-08-04 | 2003-07-08 | General Electric Company | Electron beam physical vapor deposition apparatus and crucible therefor |
| CN1458666A (en) * | 2002-05-17 | 2003-11-26 | 株式会社半导体能源研究所 | Producing device |
| DE102007045862A1 (en) * | 2007-09-25 | 2009-04-02 | Von Ardenne Anlagentechnik Gmbh | Process for applying molybdenum-containing coatings to substrates comprises passing them through vacuum chamber and then through deposition chamber where gaseous coating material is produced by bombardment of solid with electron beam |
| CN101562124A (en) * | 2008-04-18 | 2009-10-21 | 爱德牌工程有限公司 | Cluster apparatus for processing substrate and method for processing substrate using cluster apparatus |
| US20110229289A1 (en) * | 2010-03-16 | 2011-09-22 | Keita Nogi | Vacuum processing apparatus |
-
2013
- 2013-11-13 CN CN201310567063.0A patent/CN104630718A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6589351B1 (en) * | 1999-08-04 | 2003-07-08 | General Electric Company | Electron beam physical vapor deposition apparatus and crucible therefor |
| CN1458666A (en) * | 2002-05-17 | 2003-11-26 | 株式会社半导体能源研究所 | Producing device |
| DE102007045862A1 (en) * | 2007-09-25 | 2009-04-02 | Von Ardenne Anlagentechnik Gmbh | Process for applying molybdenum-containing coatings to substrates comprises passing them through vacuum chamber and then through deposition chamber where gaseous coating material is produced by bombardment of solid with electron beam |
| CN101562124A (en) * | 2008-04-18 | 2009-10-21 | 爱德牌工程有限公司 | Cluster apparatus for processing substrate and method for processing substrate using cluster apparatus |
| US20110229289A1 (en) * | 2010-03-16 | 2011-09-22 | Keita Nogi | Vacuum processing apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106865492A (en) * | 2017-02-09 | 2017-06-20 | 广东电网有限责任公司云浮供电局 | A kind of equipment and method of seal for sealing isolated ultra-fine tuftlet up for safekeeping |
| CN106865492B (en) * | 2017-02-09 | 2019-08-13 | 广东电网有限责任公司云浮供电局 | It is a kind of to seal the equipment and method of seal for isolating ultra-fine tuftlet up for safekeeping |
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Application publication date: 20150520 |
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