CN104625409A - Full-automatic laser spot welding device for IC chip - Google Patents
Full-automatic laser spot welding device for IC chip Download PDFInfo
- Publication number
- CN104625409A CN104625409A CN201510012255.4A CN201510012255A CN104625409A CN 104625409 A CN104625409 A CN 104625409A CN 201510012255 A CN201510012255 A CN 201510012255A CN 104625409 A CN104625409 A CN 104625409A
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- China
- Prior art keywords
- chip
- screw thread
- mount pad
- laser spot
- servo motor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/22—Spot welding
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a full-automatic laser spot welding device for an IC chip. The full-automatic laser spot welding device for the IC chip comprises a rack, an IC chip, a fixing seat, a servo motor, a lead screw, a movable installation seat, a laser welding head, a pneumatic vacuum sucker, a rotating servo motor, a wire welding machine and a conveyor. The chip to be machined is placed in a storage frame of the conveyor at first, the servo motor drives the movable installation seat and enables the pneumatic vacuum sucker to move to the center of the upper end of the conveyor, the pneumatic vacuum sucker moves downwards and sucks the chip to be machined, the servo motor drives the movable installation seat to move back again, the pneumatic vacuum sucker places the chip to be machined in a positioning die, a thin copper wire is conveyed to the welding position of the IC chip through the wire welding machine, the laser welding head emits high-energy electron beams, and therefore welding machining of the chip is completed. After one side of the chip is successfully machined, the rotating servo motor rotates to enable the IC chip to be changed to another direction for welding machining, and therefore full-automatic welding machining is achieved, and production efficiency is improved.
Description
Technical field
The present invention relates to a kind of welder, particularly relate to a kind of IC chip fully-automatic laser spot welding device.
Background technology
Along with the development of science and technology, electronic product is more and more advanced, volume is more and more less, and a large amount of uses being at all IC chip of electronic product development, current IC chip needs to be formed by welding with other circuit, and IC chip normally will contain tiny copper cash in multiple orientation, and current technology first welds an orientation, after first orientation has been welded, manually changed an orientation, thus cause efficiency extremely low.In view of above-mentioned defect, be necessary to design a kind of IC chip fully-automatic laser spot welding device in fact.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of IC chip fully-automatic laser spot welding device, solve the problem that existing solder technology efficiency is extremely low.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of IC chip fully-automatic laser spot welding device, comprise frame, IC chip, comprise holder, take motor, screw mandrel, mobile mount pad, laser welding system, Pneumatic vacuum suction, rotating servo motor, bonding equipment, conveyer, described fixed seating in frame top center right-hand member, the two screw thread is connected.Described servomotor is positioned at holder right-hand member center, the two screw thread is connected, described screw mandrel is positioned at servomotor left end center, itself and holder are movably connected, be connected with servomotor screw thread, described mobile mount pad is positioned at holder top, and the two is movably connected, described laser welding system is positioned at mobile mount pad left bottom center, and the two screw thread is connected.Described Pneumatic vacuum attracts the position in mobile mount pad top left, and the two screw thread is connected.Described electric rotating machine is positioned at frame top center left, and the two is movably connected.Described bonding equipment is positioned at electric rotating machine right center place, and it is connected with frame screw thread, and described conveyer is positioned at rotating servo motor center left, and it is connected with frame screw thread.
Further, described holder top is also provided with guide rail, and itself and mobile mount pad are movably connected, and are connected with holder screw thread.
Further, described place of mobile mount pad right-hand member bottom centre also establishes feed nut, and itself and screw mandrel are movably connected, and are connected with mobile mount pad screw thread.
Further, described Pneumatic vacuum is inhaled place of bottom centre and is also provided with vacuum cups, and the two screw thread is connected.
Further, described rotating servo motor top center place is also provided with positioning module, and the two screw thread is connected.
Further, described conveyer top is also provided with storing frame, and the two screw thread is connected.
Compared with prior art, first chip to be processed is placed in the storing frame in conveyer, driven by servomotor moves mount pad, pneumatic middle suction is made to move to conveyer upper end center place, the Pneumatic vacuum heart moves downward, chip to be processed picks up by vacuum cups, servomotor drives mobile mount pad back to move again, Pneumatic vacuum is inhaled and is placed in positioning module by chip to be processed, by bonding equipment, tiny copper cash is delivered to IC chips welding place, laser welding system sends high energy electron beam, thus complete chips welding processing, after side processes, rotating servo motor rotates, another orientation welding processing is changed from making IC chip, thus reach Full-automatic welding processing, improve production efficiency.
Accompanying drawing explanation
Fig. 1 is the front view of device
Frame 1 holder 2
Servomotor 3 screw mandrel 4
Mobile mount pad 5 laser welding system 6
Pneumatic vacuum inhales 7 rotating servo motors 8
Welding wire machine 9 conveyer 9
IC chip 10 guide rail 201
Feed nut 501 vacuum cups 701
Positioning module 801 storing frame 1001
Following detailed description of the invention will further illustrate in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Hereinafter, set forth multiple specific detail, to provide the thorough understanding to the concept forming described embodiment basis.But to one skilled in the art, embodiment described obviously can be put into practice when not have in these specific detail some or all.In other cases, well-known treatment step is not specifically described.
As shown in Figure 1, comprise frame 1, comprise holder 2, servomotor 3, screw mandrel 4, mobile mount pad 5, laser welding system 6, Pneumatic vacuum suction 7, rotating servo motor 8, welding wire machine 9, conveyer 10, described holder 2 is positioned at frame 1 top center right-hand member, and the two screw thread is connected.Described, servomotor 3 is positioned at holder 2 right-hand member center, the two screw thread is connected, described screw mandrel 4 is positioned at servomotor 3 left end center, itself and holder 2 are movably connected, be connected with servomotor 3 screw thread, described mobile mount pad 5 is positioned at holder 2 top, the two is movably connected, described laser welding system 6 is positioned at place of mobile mount pad 5 left end bottom centre, the two screw thread is connected, described Pneumatic vacuum is inhaled 7 and is positioned at mobile mount pad 5 top left, the two screw thread is connected, described electric rotating machine 8 is positioned on the left of frame 1 top center, the two is movably connected, described bonding equipment 9 is positioned at electric rotating machine 8 right center place, it is connected with frame 1 screw thread, described conveyer 10 is positioned at electric rotating machine 8 center left, it is connected with frame 1 screw thread, described holder 2 top is also provided with guide rail 201, itself and mobile installation 5 are movably connected, be connected with holder 2 screw thread, described place of mobile mount pad 5 right-hand member bottom centre also establishes feed nut 501, itself and screw mandrel 4 are movably connected, be connected with mobile mount pad 5 screw thread, described Pneumatic vacuum is inhaled 7 places of bottom centre and is also provided with vacuum cups 701, the two screw thread is connected, described positioning seat 8 top center place is also provided with positioning module 801, the two screw thread is connected, described conveyer, 10 tops are also provided with storing frame 1001, the two screw thread is connected, its mid frame 1, holder 2, mobile mount pad 5, it is the support fixed mechanism of component devices.First chip to be processed is placed in the storing frame 1001 in conveyer 10, servomotor 3 drives mobile mount pad 5 by screw mandrel 4, make Pneumatic vacuum inhale 7 and move to conveyer 10 upper end center place, the Pneumatic vacuum heart 7 moves downward, IC chip 11 to be processed picks up by vacuum cups 701, servomotor 3 drives mobile mount pad 5 back to move again, Pneumatic vacuum is inhaled 7 and is placed in positioning module 801 by IC chip 11 to be processed, by bonding equipment 9, tiny copper cash is delivered to IC chip 11 weld, laser welding system 6 sends high energy electron beam, thus complete chips welding processing, after side processes, rotating servo motor 8 rotates, another orientation welding processing is changed from making IC chip 11, thus reach Full-automatic welding processing, improve production efficiency.
The present invention is not limited to above-mentioned concrete embodiment, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion made, all drop within protection scope of the present invention.
Claims (6)
1. an IC chip fully-automatic laser spot welding device, comprise frame, IC chip, it is characterized in that comprising holder, take motor, screw mandrel, mobile mount pad, laser welding system, Pneumatic vacuum suction, rotating servo motor, bonding equipment, conveyer, described fixed seating in frame top center right-hand member, the two screw thread is connected.Described servomotor is positioned at holder right-hand member center, the two screw thread is connected, described screw mandrel is positioned at servomotor left end center, itself and holder are movably connected, be connected with servomotor screw thread, described mobile mount pad is positioned at holder top, and the two is movably connected, described laser welding system is positioned at mobile mount pad left bottom center, and the two screw thread is connected.Described Pneumatic vacuum attracts the position in mobile mount pad top left, and the two screw thread is connected.Described electric rotating machine is positioned at frame top center left, and the two is movably connected.Described bonding equipment is positioned at electric rotating machine right center place, and it is connected with frame screw thread, and described conveyer is positioned at rotating servo motor center left, and it is connected with frame screw thread.
2. a kind of IC chip fully-automatic laser spot welding device as claimed in claim 1, it is characterized in that described holder top is also provided with guide rail, itself and mobile mount pad are movably connected, and are connected with holder screw thread.
3. a kind of IC chip fully-automatic laser spot welding device as claimed in claim 2, it is characterized in that described place of mobile mount pad right-hand member bottom centre also establishes feed nut, itself and screw mandrel are movably connected, and are connected with mobile mount pad screw thread.
4. a kind of IC chip fully-automatic laser spot welding device as claimed in claim 3, it is characterized in that described Pneumatic vacuum is inhaled place of bottom centre and is also provided with vacuum cups, the two screw thread is connected.
5. a kind of IC chip fully-automatic laser spot welding device as claimed in claim 4, is characterized in that described rotating servo motor top center place is also provided with positioning module, and the two screw thread is connected.
6. a kind of IC chip fully-automatic laser spot welding device as claimed in claim 5, is characterized in that described conveyer top is also provided with storing frame, and the two screw thread is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510012255.4A CN104625409A (en) | 2015-01-09 | 2015-01-09 | Full-automatic laser spot welding device for IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510012255.4A CN104625409A (en) | 2015-01-09 | 2015-01-09 | Full-automatic laser spot welding device for IC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104625409A true CN104625409A (en) | 2015-05-20 |
Family
ID=53204891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510012255.4A Pending CN104625409A (en) | 2015-01-09 | 2015-01-09 | Full-automatic laser spot welding device for IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104625409A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108000016A (en) * | 2018-01-15 | 2018-05-08 | 山东建筑大学 | A kind of major diameter drill bit welder |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202411601U (en) * | 2011-12-20 | 2012-09-05 | 奥特力合自动化技术(北京)有限公司 | Spot welding and carrying device of integral chip |
| CN202861569U (en) * | 2012-04-18 | 2013-04-10 | 深圳市恒毅兴实业有限公司 | Circuit board welding-based welding system |
| CN203343637U (en) * | 2013-07-11 | 2013-12-18 | 陕西理工学院 | Automatic welding machine |
| CN203863216U (en) * | 2014-05-29 | 2014-10-08 | 温州市镭诺科技有限公司 | Positioning laser welding machine |
| CN104084697A (en) * | 2014-06-26 | 2014-10-08 | 长春光华微电子设备工程中心有限公司 | Laser cutting equipment for stainless steel chip |
-
2015
- 2015-01-09 CN CN201510012255.4A patent/CN104625409A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202411601U (en) * | 2011-12-20 | 2012-09-05 | 奥特力合自动化技术(北京)有限公司 | Spot welding and carrying device of integral chip |
| CN202861569U (en) * | 2012-04-18 | 2013-04-10 | 深圳市恒毅兴实业有限公司 | Circuit board welding-based welding system |
| CN203343637U (en) * | 2013-07-11 | 2013-12-18 | 陕西理工学院 | Automatic welding machine |
| CN203863216U (en) * | 2014-05-29 | 2014-10-08 | 温州市镭诺科技有限公司 | Positioning laser welding machine |
| CN104084697A (en) * | 2014-06-26 | 2014-10-08 | 长春光华微电子设备工程中心有限公司 | Laser cutting equipment for stainless steel chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108000016A (en) * | 2018-01-15 | 2018-05-08 | 山东建筑大学 | A kind of major diameter drill bit welder |
| CN108000016B (en) * | 2018-01-15 | 2023-11-21 | 山东建筑大学 | Major diameter drill bit welding set |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150520 |
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| RJ01 | Rejection of invention patent application after publication |