CN104617205A - 一种组合式圆形高功率集成led光源 - Google Patents
一种组合式圆形高功率集成led光源 Download PDFInfo
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- CN104617205A CN104617205A CN201510032362.3A CN201510032362A CN104617205A CN 104617205 A CN104617205 A CN 104617205A CN 201510032362 A CN201510032362 A CN 201510032362A CN 104617205 A CN104617205 A CN 104617205A
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- led
- light source
- high power
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510032362.3A CN104617205B (zh) | 2015-01-23 | 2015-01-23 | 一种组合式圆形高功率集成led光源 |
Applications Claiming Priority (1)
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CN201510032362.3A CN104617205B (zh) | 2015-01-23 | 2015-01-23 | 一种组合式圆形高功率集成led光源 |
Publications (2)
Publication Number | Publication Date |
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CN104617205A true CN104617205A (zh) | 2015-05-13 |
CN104617205B CN104617205B (zh) | 2017-12-05 |
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CN201510032362.3A Active CN104617205B (zh) | 2015-01-23 | 2015-01-23 | 一种组合式圆形高功率集成led光源 |
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CN (1) | CN104617205B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106486578A (zh) * | 2015-08-26 | 2017-03-08 | 深圳市斯迈得半导体有限公司 | 一种镜面铝基板日光灯管 |
CN107546220A (zh) * | 2017-02-28 | 2018-01-05 | 江苏罗化新材料有限公司 | Led光源及其制备方法 |
CN108598072A (zh) * | 2018-07-02 | 2018-09-28 | 江西科技师范大学 | 一种基于一体化支架的uv-led光源模块制备方法 |
CN108598240A (zh) * | 2017-12-13 | 2018-09-28 | 江西众光照明科技有限公司 | 一种高反射镜面玻璃板封装的cob光源及封装方法 |
CN111969096A (zh) * | 2020-08-31 | 2020-11-20 | 福建天电光电有限公司 | 芯片封装结构 |
CN112071972A (zh) * | 2020-09-04 | 2020-12-11 | 谷麦光电科技股份有限公司 | 一种led集成光源制造工艺及led集成光源 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US5714773A (en) * | 1996-10-15 | 1998-02-03 | Lucent Technologies Inc. | Photodiode array for remotely powered lightwave networks |
CN2692843Y (zh) * | 2004-04-15 | 2005-04-13 | 夏志清 | 扇形彩色发光二极管组合结构 |
CN201103859Y (zh) * | 2007-10-22 | 2008-08-20 | 张海永 | 四棱锥体式发光二极管模块组合灯芯支架 |
US20090129081A1 (en) * | 2005-03-01 | 2009-05-21 | Musco Corporation | Elective lighting fixture visors to reduce off-target glare and spill light |
CN103175011A (zh) * | 2013-03-27 | 2013-06-26 | 珠海市集利发展有限公司 | 面积等分对称式可调光led集成光源 |
CN204375788U (zh) * | 2015-01-23 | 2015-06-03 | 厦门多彩光电子科技有限公司 | 一种组合式圆形高功率集成led光源 |
-
2015
- 2015-01-23 CN CN201510032362.3A patent/CN104617205B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5714773A (en) * | 1996-10-15 | 1998-02-03 | Lucent Technologies Inc. | Photodiode array for remotely powered lightwave networks |
CN2692843Y (zh) * | 2004-04-15 | 2005-04-13 | 夏志清 | 扇形彩色发光二极管组合结构 |
US20090129081A1 (en) * | 2005-03-01 | 2009-05-21 | Musco Corporation | Elective lighting fixture visors to reduce off-target glare and spill light |
CN201103859Y (zh) * | 2007-10-22 | 2008-08-20 | 张海永 | 四棱锥体式发光二极管模块组合灯芯支架 |
CN103175011A (zh) * | 2013-03-27 | 2013-06-26 | 珠海市集利发展有限公司 | 面积等分对称式可调光led集成光源 |
CN204375788U (zh) * | 2015-01-23 | 2015-06-03 | 厦门多彩光电子科技有限公司 | 一种组合式圆形高功率集成led光源 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106486578A (zh) * | 2015-08-26 | 2017-03-08 | 深圳市斯迈得半导体有限公司 | 一种镜面铝基板日光灯管 |
CN107546220A (zh) * | 2017-02-28 | 2018-01-05 | 江苏罗化新材料有限公司 | Led光源及其制备方法 |
CN108598240A (zh) * | 2017-12-13 | 2018-09-28 | 江西众光照明科技有限公司 | 一种高反射镜面玻璃板封装的cob光源及封装方法 |
CN108598072A (zh) * | 2018-07-02 | 2018-09-28 | 江西科技师范大学 | 一种基于一体化支架的uv-led光源模块制备方法 |
CN111969096A (zh) * | 2020-08-31 | 2020-11-20 | 福建天电光电有限公司 | 芯片封装结构 |
CN112071972A (zh) * | 2020-09-04 | 2020-12-11 | 谷麦光电科技股份有限公司 | 一种led集成光源制造工艺及led集成光源 |
Also Published As
Publication number | Publication date |
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CN104617205B (zh) | 2017-12-05 |
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Denomination of invention: Combined type round high power integration LED (light emitting diode) light source Effective date of registration: 20190918 Granted publication date: 20171205 Pledgee: Xiamen finance Company limited by guarantee Pledgor: Xiamen Colorful Optoelectronics Technology Co.,Ltd. Registration number: Y2019990000252 |
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Date of cancellation: 20220221 Granted publication date: 20171205 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN DACOL PHOTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2019990000252 |
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