CN104611730A - A cathode and a method of forming a cathode - Google Patents
A cathode and a method of forming a cathode Download PDFInfo
- Publication number
- CN104611730A CN104611730A CN201510053872.9A CN201510053872A CN104611730A CN 104611730 A CN104611730 A CN 104611730A CN 201510053872 A CN201510053872 A CN 201510053872A CN 104611730 A CN104611730 A CN 104611730A
- Authority
- CN
- China
- Prior art keywords
- bossing
- planar conductor
- negative electrode
- conductor plates
- plates
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/02—Electrodes; Connections thereof
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
A cathode for receiving electro deposition of metal, the cathode comprising a planar conductive sheet and raised portions disposed on at least one surface of the planar conductive sheet, wherein the planar conductive sheet and the raised portions are integrally formed.
Description
The application is the application number submitted for 09th for 03 month for 2011 is 200980135203.9, and denomination of invention is the divisional application of " negative electrode and negative electrode formation method ".
Technical field
The present invention relates to a kind of negative electrode for metal ion electrolysis, and a kind of negative electrode formation method.Particularly, but not exclusively, the present invention relates to a kind of negative electrode being particularly useful for cobalt ion or nickel ion electrolysis from solution.
Background technology
By the metal ion electrolysis in solution to obtain solid metal product, it is a kind of known technology for separating out relatively pure metal.In metal ion solution, put into solid state cathode, and apply electric current to this negative electrode, the galvanic deposit of metal then negative electrode can occur.Regularly the metallic product of negative electrode and attachment is removed from solution.Then, solid metal product is peeled off from negative electrode, and ideally, anticathode recycles.Material for negative electrode has suitable electroconductibility, deposits to enable metallic product.In addition, the material of negative electrode makes metallic product easily to remove from negative electrode, and metallic product can not be separated prematurely.Preferably, adopt the negative electrode of robustness (robust), such negative electrode can stand the circulation depositing and peel off repeatedly, and is only needing anticathode to carry out minimum process between circulation each time.
Galvanic deposit due to cobalt metal has intrinsic high internal stress, and therefore the galvanic deposit of cobalt metal is particularly difficult.If cobalt galvanic deposit, on the stainless steel billet of standard flat studding with insulation edge strip of a slab (edge strips), can cause cobalt metal sheet to have prematurely from the trend that negative electrode is separated.If remove insulation edge strip of a slab, cobalt metal, at negative electrode surrounding growth, which solves the problem of metal from premature disengagement negative electrode.But cobalt metal is more difficult to be removed from negative electrode, and negative electrode when removing metal, is caused to be destroyed possibly.Negative electrode is destroyed, and just may need to keep in repair each negative electrode continually, this will cause the increase of factory's operation cost.
Be many parts by cobalt galvanic deposit be favourable, because the cobalt galvanic deposit of many parts more easily processes in down stream train.
In prior art, the scheme proposed for the difficult problem existed in the galvanic deposit of solution cobalt is, the mask that insulated by one deck during manufacture negative electrode is applied on stainless steel blanket, and so, the conductive metallic portion of precipitation just exposes in the electrolytic solution.
Canadian Patent numbers 1,078,324 patent discloses so a kind of electrode, wherein mask is a kind of epoxy coating.Current-carrying part caves in relative to masking layer.One of problem of this negative electrode is in the severe rugged environment that is exposed in electrolytic solution and stripping program of masking film.Masking film is easy to fracture and damages, especially at the edge of current-carrying part.The destruction of masking film can cause on failure area, form metal deposition, and this causes masking film further to damage.So, negative electrode just can not use, and at set intervals, must peel off masking film from negative electrode, cleaning negative electrode, and again uses new masking film.
Canadian Patent numbers 1,066,657 patent discloses a kind of negative electrode, wherein, metal disk is attached on flat board or wiregrating.Insulating resin is filled into the void area around disk.Alternatively, be attached on assembly, resin is inserted void area by the indented wire of heavy gauge, the knee leaving steel wire is uncovered.In these negative electrodes, current-carrying part or flush with the insulating resin of surrounding, or exceed it.
Summary of the invention
The object of the invention is to overcome or at least alleviate above-mentioned one or more problems, and provide for human consumer or coml select.
In one form, although it needs not to be unique or embodiment the most widely, the invention provides a kind of negative electrode for receiving metal electrodeposition, this negative electrode comprises:
Planar conductor plates; And
Be positioned at the bossing at least one surface of this planar conductor plates, wherein this planar conductor plates is one-body molded with this bossing.
This negative electrode can also comprise:
Be positioned at the insulating material around this bossing, wherein the surface of this bossing exposes all the time.
Preferably, this bossing each has plane upper surface, and wherein the shape of this plane upper surface is selected from: circular, square, rhombus or ingot shape (lozenge) substantially substantially substantially substantially.
In a preferred embodiment, bossing forms the rear surface array of the front surface array being positioned at the front surface of planar conductor plates and the rear surface being positioned at planar conductor plates.Preferably, front surface array has the configuration substantially similar to rear surface array.Alternatively, front surface array has the configuration substantially different from rear surface array.
In another form, the invention provides a kind of formation for receiving the method for the negative electrode of metal electrodeposition, the method comprises:
Masking material is used to shelter the region of planar conductor plates, to form the conducting plates sheltered;
Apply chemical to the conducting plates sheltered, with the non-masking regional of chemical milling, thus form this planar conductor plates with integrally formed bossing and etching area, this bossing is formed in masking regional.
The method can also comprise:
Insulating material is applied to the etching area of planar conductor plates.
Further feature of the present invention will by following detailed description easy to understand.
Accompanying drawing explanation
For helping to understand the present invention and enable those skilled in the art to practical application the present invention, below with reference to accompanying drawing, only by way of example the preferred embodiments of the present invention are described.
Fig. 1 is the front elevation of the negative electrode according to the embodiment of the present invention;
Fig. 2 A is the sectional view of negative electrode shown in Fig. 1;
Fig. 2 B is the sectional view that Fig. 2 A comprises insulating material further;
Fig. 3 A is the sectional view of negative electrode according to another embodiment of the present invention;
Fig. 3 B is the sectional view that Fig. 3 A comprises insulating material further;
Fig. 4 is the front elevation of negative electrode according to another embodiment of the present invention;
Fig. 5 is the front elevation of negative electrode according to yet another embodiment of the invention;
Fig. 6 A is the schematic diagram of the first step of the method for formation negative electrode according to the embodiment of the present invention;
Fig. 6 B is the schematic diagram of the second step of the method for formation negative electrode according to the embodiment of the present invention;
Fig. 6 C is the schematic diagram of the third step of the method for formation negative electrode according to the embodiment of the present invention; And
Fig. 6 D is the schematic diagram of the 4th step of the method for formation negative electrode according to the embodiment of the present invention.
Embodiment
See Fig. 1, show the front elevation of the negative electrode 100 according to the embodiment of the present invention.Negative electrode 100 comprises planar conductor plates 105 and bossing 110.Aptly, planar conductor plates 105 is formed by metal.Bossing 110 be positioned at planar conductor plates 105 at least one on the surface and one-body molded with planar conductor plates 105.The bossing 110 be formed on a surface of planar conductor plates 105 forms array jointly.Preferably, bossing 110 forms front surface array 111 on the front surface of planar conductor plates 105, and on the rear surface of planar conductor plates 105, form rear surface array 112.Have enough distances between each bossing 110, make in common galvanic deposit circulation, the electrodeposit metals on each bossing 110 can not contact with the electrodeposit metals on contiguous bossing 110.
The size and dimension of bossing 110 can be different.Aptly, each bossing 110 has plane upper surface 113.In one embodiment, the circle of the shape of the plane upper surface 113 of each bossing 110 to be diameters be 10-40mm, as shown in Figure 1.Preferably, the diameter of the bossing 110 of each circle is 12mm.Alternatively, each bossing 110 can be designed there is the plane upper surface 113 that diameter is the circle of 30mm.Each diameter be the plane upper surface 113 of the bossing 110 of 12mm center between distance be preferably 23mm.Each diameter be the plane upper surface 113 of the bossing 110 of 30mm center between distance be preferably 38mm.
The edge of negative electrode 100 can be coated with the edge strip of a slab 130,131,132 of insulation, grows at the perimeter of negative electrode 100 to avoid electrodeposit metals.Traditional edge strip of a slab known in the art can be used.
Negative electrode 100 is connected with suspension rod 150, so that negative electrode 100 is introduced or shifted out electrolyzer, and provides the electrical connection with negative electrode.Traditional suspension rod known in the art can be used.
Fig. 2 A shows the sectional view of the negative electrode 100 of Fig. 1.In the present embodiment, the front surface array 111 of bossing 110 is positioned on the front surface of planar conductor plates 105, and then surface array 112 is positioned on the rear surface of planar conductor plates 105.Edge strip of a slab 130,132 can also be seen.Thickness for the manufacture of the planar conductor plates 105 of negative electrode 100 is preferably enough thick in have suitable rigidity, but also enough thin, with relatively light.Preferably, planar conductor plates 105 was that 6mm is thick before bossing 110 is formed.
As shown in Figure 2 A, front surface array 111 has the configuration identical with rear surface array 112.
Fig. 2 B shows the sectional view that Fig. 2 A comprises insulating material 120 further.Except the plane upper surface 113 of bossing 110, the surface coverage of planar conductor plates 105 has insulating material 120.Insulating material can be resin, coating or other analogous materials.Aptly, during use, insulating material 120 can stand the environment hanging negative electrode electrolyzer in the inner.The surface of insulating material 120 preferably flushes with the upper surface 113 of bossing 110.Alternatively, bossing 110 exceeds insulating material 120.
Fig. 3 A shows the sectional view of negative electrode 100 according to another embodiment of the present invention.Front surface array 111 has the configuration different from rear surface array 112.It will be understood by those skilled in the art that the array configurations of the bossing 110 on each surface of planar conductor plates 105 can be designed as and has many changes.
Fig. 3 B is the sectional view that Fig. 3 A comprises insulating material further.
Fig. 4 shows the front elevation of negative electrode 400 according to another embodiment of the present invention.In the present embodiment, the plane upper surface 113 of bossing 410 assumes diamond in shape.The bossing 410 of rhombus provides the conductive area larger than circle on the surface of negative electrode 400, because the arrangement of rhombus (" pack ") is higher than the area utilising efficiency of circular arrangement.The bossing 410 of rhombus, due to each point on angle, makes removing of electrodeposit metals easier.
Fig. 5 shows the front elevation of negative electrode 500 according to yet another embodiment of the invention, and wherein the plane upper surface 113 of bossing 510 is in ingot shape.The bossing 510 of each ingot shape has two parallel straight flanges, is connected by the outward extending arch section in the center of the bossing 510 from ingot shape.The bossing 510 of ingot shape provides higher conductive area to the ratio of insulation area for negative electrode 500.Preferably, the distance between the parallel straight edge of the bossing 510 of ingot shape is about 10-15cm, and the radius of arch section is about 5-10cm.The center of the bossing 510 of adjacent ingot shape preferably separates the distance of about 20-30cm.In a certain preferred embodiment, the distance between the parallel straight edge of the bossing 510 of ingot shape is 12cm, and the radius of arch section is 8cm.Center with the bossing 510 of the ingot shape of a line preferably separates the distance of 27cm, and the distance between the center of the bossing 510 of the ingot shape of adjacent lines is preferably 22cm.
The bossing 110 of negative electrode 100 is formed preferably by the surface of chemically etched metal planar conductor plates 105.Fig. 6 A, 6B, 6C and 6D respectively illustrate the schematic diagram of first step, second step, third step and the 4th step in the method according to the formation negative electrode 100 of the embodiment of the present invention.In a first step (Fig. 6 A), sequestering agent 610 is used to shelter in the region that planar conductor plates 105 will be formed bossing 110.Preferably, sequestering agent is adhesive tape.Preferably specific, sequestering agent is vinyl adhesive tape.
In the second step (Fig. 6 B), the non-masked surface of remainder is etched aptly to reach about 5mm dark.In a preferred embodiment, the surperficial 1mm that etching is remaining is dark.Preferably, by carrying out chemical milling, until the etched suitable degree of depth of metal to the metal flat conducting plates spraying ferric chloride Solution 620 sheltered.
In third step (Fig. 6 C), sequestering agent is removed from the bossing 110 formed; In the 4th step (Fig. 6 D), apply insulating material, to form the negative electrode 100 of finished product to etched surfaces.
Aptly, all chemical milling process is carried out, to form bossing 110 by the front surface of the planar conductor plates 105 of anticathode 100 and rear surface.
The method that bossing 110 manufactures negative electrode 110 is formed both fast easy by carrying out chemical milling to metal sheet 105.To flush with the insulating material 120 of surrounding due to bossing 110 or exceed the insulating material 120 of surrounding, being not easy when removing electrodeposit metals to damage insulating material 120.
The object of this specification sheets is to describe the present invention, but the invention is not restricted to the set of any one embodiment or specific features.Those skilled in the art will appreciate that, the change based on embodiment all falls into scope of the present invention.Such as, the size and shape of negative electrode can change, and the size of same bossing, quantity and shape also can change.In addition, the bossing on negative electrode can have more than one shape.
Should be appreciated that when not deviating from the spirit and scope of the present invention, can to described embodiment carry out various other change and amendment.
Claims (5)
1. chemical milling planar conductor plates is to form a method for negative electrode, said method comprising the steps of:
Masking material is used to shelter the region of planar conductor plates, to form the conducting plates sheltered;
Apply chemical to the conducting plates sheltered, with the non-masking regional of chemical milling, thus form the planar conductor plates with integrally formed bossing and etching area, this bossing is formed in masking regional;
Remove described masking material; And
Insulating material is applied to the etching area of described planar conductor plates.
2. method according to claim 1, wherein, uses masking material to shelter the front surface of planar conductor plates and rear surface, to form the conducting plates sheltered; And will be used on front surface that the chemical of the non-masking regional of chemical milling is applied to the conducting plates that this has been sheltered and rear surface, to form this planar conductor plates, this planar conductor plates has the front surface array of the integrated bossing be positioned on the front surface of this planar conductor plates and is positioned at the rear surface array of the integrated bossing on the rear surface of this planar conductor plates.
3. method according to claim 1, comprises step insulation edge strip of a slab being installed at least one limit of described planar conductor plates further.
4. method according to claim 1, wherein, described insulating material is applied to the etching area of this planar conductor plates, makes the upper surface flush of the surface of this insulating material and described bossing.
5. method according to claim 1, wherein, described in be used for the chemical of the non-masking regional of chemical milling be ferric chloride Solution.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2008904675A AU2008904675A0 (en) | 2008-09-09 | A cathode and a method of forming a cathode | |
| AU2008904675 | 2008-09-09 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801352039A Division CN102149854A (en) | 2008-09-09 | 2009-09-08 | A cathode and a method of forming a cathode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104611730A true CN104611730A (en) | 2015-05-13 |
Family
ID=42004709
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801352039A Pending CN102149854A (en) | 2008-09-09 | 2009-09-08 | A cathode and a method of forming a cathode |
| CN201510053872.9A Pending CN104611730A (en) | 2008-09-09 | 2009-09-08 | A cathode and a method of forming a cathode |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801352039A Pending CN102149854A (en) | 2008-09-09 | 2009-09-08 | A cathode and a method of forming a cathode |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20110233055A1 (en) |
| CN (2) | CN102149854A (en) |
| AU (1) | AU2009291494B2 (en) |
| CL (1) | CL2011000493A1 (en) |
| WO (1) | WO2010028428A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106011948A (en) * | 2016-08-01 | 2016-10-12 | 舒城联科表面处理有限公司 | Improved treatment method of starting sheet for cyclone electrolysis |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140054178A1 (en) * | 2012-08-22 | 2014-02-27 | Thomas W. Valentine | Electrode mask for electrowinning a metal |
| CN102828199A (en) * | 2012-08-31 | 2012-12-19 | 苏州竞立制氢设备有限公司 | Electrode plate of hydrogen production by water electrolysis and production method |
| CN103820822B (en) * | 2014-02-28 | 2016-06-08 | 金川集团股份有限公司 | A kind of permanent cathode plate for producing nickel button |
| JP6638589B2 (en) * | 2016-07-21 | 2020-01-29 | 住友金属鉱山株式会社 | Cathode plate for metal electrodeposition and method for producing the same |
| JP6724624B2 (en) * | 2016-07-21 | 2020-07-15 | 住友金属鉱山株式会社 | Metal electrodeposited cathode plate and method for producing the same |
| BR112019004699B1 (en) * | 2016-09-09 | 2022-08-16 | Glencore Technology Pty Ltd | SUSPENSION BAR FOR AN ELECTRODEPOSITION CELL OR AN ELECTROLYTE REFINING CELL AND ELECTRODEPOSITION CATHODE ASSEMBLY |
| JP6825470B2 (en) * | 2017-04-18 | 2021-02-03 | 住友金属鉱山株式会社 | Test power wearing cathode plate and its manufacturing method |
| JP6500937B2 (en) * | 2017-05-29 | 2019-04-17 | 住友金属鉱山株式会社 | Negative electrode plate for metal electrodeposition and method of manufacturing the same |
| AU2022245155A1 (en) | 2021-03-22 | 2023-10-26 | Sublime Systems, Inc. | Decarbonized cement blends |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US378423A (en) * | 1888-02-28 | Method of etching on one | ||
| US497982A (en) * | 1893-05-23 | Process of making dies or patterns for metal-working | ||
| GB658150A (en) * | 1948-06-12 | 1951-10-03 | Mond Nickel Co Ltd | Improvements relating to the electrolytic refining of metals |
| GB1294277A (en) * | 1970-06-12 | 1972-10-25 | Int Nickel Ltd | Electrodeposition of metals and cathodes therefor |
| US3875041A (en) * | 1974-02-25 | 1975-04-01 | Kennecott Copper Corp | Apparatus for the electrolytic recovery of metal employing improved electrolyte convection |
| DE2555419C2 (en) * | 1975-12-10 | 1985-11-21 | Weber, Otmar, Dipl.-Kfm., 5000 Köln | Cathode for the production of nickel bodies |
| US4139430A (en) * | 1976-04-01 | 1979-02-13 | Ronald Parkinson | Process of electrodeposition and product utilizing a reusable integrated cathode unit |
| GB1573449A (en) * | 1976-04-01 | 1980-08-20 | Falconbridge Nickel Mines Ltd | Reusable electrolysis cathode |
| US4040915A (en) * | 1976-06-15 | 1977-08-09 | The International Nickel Company, Inc. | Method for producing regular electronickel or S nickel rounds from electroplating baths giving highly stressed deposits |
| CA1082131A (en) * | 1977-10-11 | 1980-07-22 | Lucien Babin | Electrode for the electrolytic deposition of metals |
| US4517058A (en) * | 1983-11-02 | 1985-05-14 | Amax Inc. | Method for electroforming metal slugs and reusable integrated cathode unit |
| US5589043A (en) * | 1995-10-31 | 1996-12-31 | Edwards; James P. | Mask for plating metals and method of construction thereof |
| US6485621B2 (en) * | 2001-03-08 | 2002-11-26 | Noranda Inc. | Cathode |
| US7166203B2 (en) * | 2002-09-12 | 2007-01-23 | Teck Cominco Metals Ltd. | Controlled concentration electrolysis system |
| US7807028B2 (en) * | 2005-03-09 | 2010-10-05 | Xstrata Queensland Limited | Stainless steel electrolytic plates |
-
2009
- 2009-09-08 CN CN2009801352039A patent/CN102149854A/en active Pending
- 2009-09-08 AU AU2009291494A patent/AU2009291494B2/en not_active Expired - Fee Related
- 2009-09-08 US US13/062,150 patent/US20110233055A1/en not_active Abandoned
- 2009-09-08 CN CN201510053872.9A patent/CN104611730A/en active Pending
- 2009-09-08 WO PCT/AU2009/001172 patent/WO2010028428A1/en active Application Filing
-
2011
- 2011-03-08 CL CL2011000493A patent/CL2011000493A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106011948A (en) * | 2016-08-01 | 2016-10-12 | 舒城联科表面处理有限公司 | Improved treatment method of starting sheet for cyclone electrolysis |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102149854A (en) | 2011-08-10 |
| WO2010028428A1 (en) | 2010-03-18 |
| AU2009291494B2 (en) | 2015-05-07 |
| US20110233055A1 (en) | 2011-09-29 |
| CL2011000493A1 (en) | 2012-03-16 |
| AU2009291494A1 (en) | 2010-03-18 |
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Application publication date: 20150513 |