CN104582923A - 一种用于辐射处理基底的设备 - Google Patents
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Abstract
本发明涉及一种用于辐射处理基底的设备，其在腔室内在用于装载待处理基底的基底托架上方具有至少一个辐射源，并且所述腔室包括用于维持该腔室内的气流的机构，该腔室具有至少一个气体入口和至少一个气体出口，其特征在于，所述至少一个气体入口如此设置在所述基底托架的区域内，即经由所述至少一个气体入口流入的气体首先环绕流过所述基底托架，随后它直接地和/或在环绕流过至少一个辐射源之后经由所述气体出口又离开所述腔室。
Description
本发明涉及一种用于电磁辐射辐照基底的设备，例如红外辐射(IR辐射)用于干燥基底和/或紫外辐射(UV辐射)用于交联UV硬化漆。
这种设备例如用作为涂漆设备的组成部分。这种涂漆设备通常在第一步骤中清洁基底表面。这例如可以借助空气压力和/或借助表面离子处理设备来完成，或者借助液体介质如水或水溶液或酒精溶液或溶剂溶液来喷射表面，或借助固体如喷射物或CO2，或借助于把基底沉入水溶液、酒精溶液或溶剂溶液，必要时借助波动作用，如超声波或微波。
在借助液体介质清洁时，随后的干燥可采用IR热辐射来进行。
然后，在第二步骤中施加真正的漆层，例如借助喷涂分散的漆。在此期间，在随后步骤中烘干已经涂漆的基底。这可以借助在循环空气中加热和/或借助施加红外线辐射(IR)在例如50-80℃的情况下完成。在此，通常存在于油漆中的溶剂大体上被蒸发。在当今应用极为广泛的UV硬化漆(即借助UV光线来交联的漆)的情况下，硬化是在溶剂蒸发之后的步骤完成的。根据应用而定，在处理步骤中采用IR和/或UV照灯。在本说明书中，借助IR辐射的干燥工艺和/或借助UV辐射的交联工艺被统一称之为辐射处理。
为了避免溶剂自由逃逸至环境或工作环境，该工艺根据现有技术在处理腔室内执行。此时应当保证存在持续气体交换，以便例如在基底周围将溶剂浓度维持得较低，进而也加速干燥和/或交联处理。根据现有技术，如图1示意所示，在封闭的腔室1内执行辐射处理。在此，在腔室1的靠上部分中设置辐射源9、9’、9”，而在靠下部分中布置有待装载基底的基底托架11，11’。在图1中，两根轴作为基底托架，这两根轴可以装载有待辐射处理的部件。辐射源9，9’，9”也可以布置在基底托架11，11’之下，但是通常加以避免，以免辐射源9，9’，9”被从基底滴落的残余油漆污染。
根据现有技术，在腔室盖上设置入流区域7，从入口3供入的气体如空气穿过该入流区域流向腔室。根据现有技术，该气体流过辐射源9，9’，9”，随后在基底11，11’流过，进入腔室的靠下区域，在这里气体通过出口5从腔室1被吸走。基于现有技术的这种结构，流动与重力共同作用，从而污物如灰尘以及溶剂可被有效吸走。在图1中，气流及其方向是示意性用箭头来表示的。
然而，根据现有技术的这种结构的缺点在于，流过基底的气流首先必须经过辐射源。辐射源在工作中通常很烫，这会导致气流的不受控升温。这意味着基底托架11，11’所遭受的气流没有确定的温度并且其中沿基底托架宽度甚至会出现温度梯度。然而，干燥和/或交联很大程度上受到当前温度的影响。因此，未定义的温度条件很快就会导致不受控的工艺。尤其是，当存在温度梯度时，会出现非均匀性。而且，因为辐射源本身通常温度不稳定而使得问题更为尖锐。在初始阶段，辐射源是较冷的，而当其长时间工作后将会明显加热。这种问题虽然可以通过辐射源上的明显冷却措施而得以减轻。但是，这种措施需要复杂的技术，因而很昂贵。
如上所述，期待提供一种用于辐射处理的设备，借此可减轻或优选完全避免现有技术的上述问题。
本发明的任务因而在于提供这样一种设备。
根据本发明，上述问题通过如权利要求1所述的设备得以解决。从属权利要求提供了本发明的优选实施方式。原则上，根据本发明如此解决这些问题，即在腔室内形成气流，其在进入腔室之后立即流经基底。由于气流此前没有流经可能向外辐射热量的辐射源，因此气流温度是明确规定的，或也可按简单方式设定为所需的稳定值。
下面结合附图举例详细说明本发明及其有利实施方式。
图1示出根据现有技术的用于辐射处理基底的设备，
图2示出根据本发明第一实施方式的用于辐射处理基底的设备，
图3示出根据本发明第二实施方式的用于辐射处理基底的设备。
图2示出根据第一实施方式的本发明设备。示出腔室201，其中设置有辐射源9、9’、9”和待辐照的基底11、11’。在该腔室内，在下方在基底11、11’附近设置气体入口203。根据该实施方式，在腔室盖区域设置气体出口205，在该气体出口上游可以设置盖腔室207。现在，在设备运行时，气体在进入腔室之后首先从基底11、11’旁边流过，之后气体环绕流过辐射源9、9’、9”，并经过可选的盖腔室207经由气体出口205流出。以这种方式明确规定在基底11、11’旁边流过的气体的温度，该过程可以在准确预定的且稳定的温度情况下进行。有利的是，在腔室的边缘区域设置成形件209，其可以充当集尘器。
图3示出本发明第二有利实施方式。在此，腔室301具有辐射源9、9’、9”，其设置在基底11、11’上方，并且不仅通过腔室下方区域内的第一入口303(基底11、11’下方)而且也通过腔室上方区域的第二入口305(辐射源9、9’、9”上方)施加气流。优选在腔室高度的一半处设置出口311、311’，它们优选对称设置。在该实施方式中，两股气流如图利用箭头所示在约一半高度处，即在辐射源9、9’、9”和基底11、11’之间彼此相遇，并且通过侧向设置的出口311、311’从腔室内部流出。本发明这个特别优选的实施方式的优点尤其是，气流中携带的灰尘颗粒趋于被送往腔室边缘。如果在那里还设置可以充当集尘器的成形件309，则腔室内也许存在的灰尘主要集聚在集尘器内，该灰尘主要朝向出口311、311’输送，但在路上从气流分离出来。根据一个特别有利的实施方式，在成形件309内分别设有一个可取下的容器313，从而在该容器内可以积聚灰尘，并且可以通过取下并清空容器来简单地清理灰尘。当然，这种容器也可以有利地应用在本发明的其他实施方式中。
此处公开了一种用于辐射处理基底的设备，其在腔室内在用于装载待处理基底的基底托架上方具有至少一个辐射源，并且所述腔室包括用于维持该腔室内的气流的机构，具有至少一个气体入口和至少一个气体出口，其特征在于，所述至少一个气体入口如此设置在所述基底托架的区域内，即经由所述至少一个气体入口流入的气体首先环绕流过所述基底托架，随后它直接地和/或在环绕流过至少一个辐射源之后经由所述气体出口又离开所述腔室。
在该设备中，气体出口可以如此设置在至少一个辐射源的区域内，即气体在环绕流过基底托架之后，环绕流过至少一个辐射源，随后它经由气体出口离开腔室。
气体出口可以设置在基底托架和至少一个辐射源之间的高度上。
在至少一个辐射源的区域内可以如此设置第二气体入口，即通过第二气体入口流入的气体首先环绕流过至少一个辐射源，随后它与从基底托架流过来的气体相遇，并与其一起经由气体出口从腔室流出。
在下方的腔室边缘上可以如此设置成形件，即在成形件区域内气流被减缓，该成形件相应地发挥集尘器的作用。
可以在成形件内设置可取下的容器。
Claims (6)
1.一种用于辐射处理基底的设备，其在腔室内在用于装载待处理基底的基底托架上方具有至少一个辐射源，并且所述腔室包括用于维持该腔室内的气流的机构，其具有至少一个气体入口和至少一个气体出口，其特征在于，所述至少一个气体入口如此设置在所述基底托架的区域内，即经由所述至少一个气体入口流入的气体首先环绕流过所述基底托架，随后它直接地和/或在环绕流过至少一个辐射源之后经由所述气体出口又离开所述腔室。
2.如权利要求1所述的设备，其特征在于，所述气体出口如此设置在所述至少一个辐射源的区域内，即气体在环绕流过所述基底托架之后，环绕流过所述至少一个辐射源，随后它经由所述气体出口离开所述腔室。
3.如权利要求1所述的设备，其特征在于，所述至少一个气体出口设置在基底托架与至少一个辐射源之间的高度上。
4.如权利要求3所述的设备，其特征在于，在所述至少一个辐射源的区域内如此设有第二气体入口，即通过所述第二气体入口流入的气体首先环绕流过所述至少一个辐射源，随后它与从所述基底托架流过来的气体相遇，并随其经由所述气体出口流出所述腔室。
5.如前述权利要求之一所述的设备，其特征在于，在靠下的腔室边缘上如此设置成形件，即在所述成形件区域内减缓流动并且所述成形件相应地发挥集尘器的作用。
6.如权利要求5所述的设备，其特征在于，至少在局部在所述成形件内设置可取下的容器。
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| EP1050395A2 (de) * | 1999-05-05 | 2000-11-08 | Institut für Oberflächenmodifizierung e.V. | Offener UV/VUV-Excimerstrahler und Verfahren zur Oberflächenmodifizierung von Polymeren |
| DE10153878A1 (de) * | 2001-11-02 | 2003-05-22 | Messer Griesheim Gmbh | Anlage zum Strahlungshärten |
| CN1663674A (zh) * | 2004-12-15 | 2005-09-07 | 江南大学 | 一种气流增效连续微波辐射固相合成反应方法与装置 |
| CN2866577Y (zh) * | 2005-11-15 | 2007-02-07 | 李朝基 | 纸板上光机的热风循环装置 |
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| DE3305173A1 (de) * | 1983-02-15 | 1984-08-16 | Technigraf GmbH, 6394 Grävenwiesbach | Durch zwangsluftstroemung kuehlbarer uv-strahler mit einer langbogenentladungslampe |
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| DE19916474A1 (de) * | 1999-04-13 | 2000-10-26 | Ist Metz Gmbh | Bestrahlungsgerät |
| JP4218192B2 (ja) * | 1999-08-05 | 2009-02-04 | 株式会社日立ハイテクノロジーズ | 基板処理装置及び処理方法 |
| DE102004023537B4 (de) * | 2003-07-24 | 2007-12-27 | Eisenmann Anlagenbau Gmbh & Co. Kg | Vorrichtung zur Aushärtung einer aus einem Material, das unter elektromagnetischer Strahlung aushärtet, insbesondere aus einem UV-Lack oder aus einem thermisch aushärtenden Lack, bestehenden Beschichtung eines Gegenstandes |
| DE102004059903B4 (de) * | 2004-12-13 | 2013-02-07 | Adphos Advanced Photonics Technologies Ag | Verfahren und Anlage zum Beschichten eines Matallbands mit einer lösemittelhaltigen Beschichtung und zum Trocknen und/oder Vernetzen derselben |
| FR2960816B1 (fr) * | 2010-06-02 | 2012-07-13 | Sidel Participations | Four pour le conditionnement thermique de preformes et procede de commande d'un dispositif de refroidissement par air equipant un tel four |
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2012
- 2012-08-31 DE DE102012017230.3A patent/DE102012017230A1/de not_active Withdrawn
-
2013
- 2013-07-26 CN CN201380044753.6A patent/CN104582923B/zh not_active Expired - Fee Related
- 2013-07-26 KR KR1020157007435A patent/KR102143978B1/ko active IP Right Grant
- 2013-07-26 JP JP2015528895A patent/JP6186437B2/ja not_active Expired - Fee Related
- 2013-07-26 US US14/424,604 patent/US9289743B2/en not_active Expired - Fee Related
- 2013-07-26 EP EP13747789.9A patent/EP2890542B1/de active Active
- 2013-07-26 WO PCT/EP2013/002228 patent/WO2014032754A1/de active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1076405A (zh) * | 1992-03-10 | 1993-09-22 | 波克股份有限公司 | 用于冷却挤出吹制薄膜的装置和方法 |
| EP1050395A2 (de) * | 1999-05-05 | 2000-11-08 | Institut für Oberflächenmodifizierung e.V. | Offener UV/VUV-Excimerstrahler und Verfahren zur Oberflächenmodifizierung von Polymeren |
| DE10153878A1 (de) * | 2001-11-02 | 2003-05-22 | Messer Griesheim Gmbh | Anlage zum Strahlungshärten |
| CN1663674A (zh) * | 2004-12-15 | 2005-09-07 | 江南大学 | 一种气流增效连续微波辐射固相合成反应方法与装置 |
| CN2866577Y (zh) * | 2005-11-15 | 2007-02-07 | 李朝基 | 纸板上光机的热风循环装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6186437B2 (ja) | 2017-08-23 |
| DE102012017230A1 (de) | 2014-03-06 |
| CN104582923B (zh) | 2016-10-12 |
| KR102143978B1 (ko) | 2020-08-13 |
| EP2890542B1 (de) | 2023-01-18 |
| JP2015536809A (ja) | 2015-12-24 |
| WO2014032754A1 (de) | 2014-03-06 |
| US20150202587A1 (en) | 2015-07-23 |
| KR20150048806A (ko) | 2015-05-07 |
| US9289743B2 (en) | 2016-03-22 |
| EP2890542A1 (de) | 2015-07-08 |
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