CN104582294A - 蚀刻线速的自动调节方法和系统 - Google Patents
蚀刻线速的自动调节方法和系统 Download PDFInfo
- Publication number
- CN104582294A CN104582294A CN201410837485.XA CN201410837485A CN104582294A CN 104582294 A CN104582294 A CN 104582294A CN 201410837485 A CN201410837485 A CN 201410837485A CN 104582294 A CN104582294 A CN 104582294A
- Authority
- CN
- China
- Prior art keywords
- etching
- copper
- thick
- linear speed
- linear function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005530 etching Methods 0.000 title claims abstract description 120
- 238000000034 method Methods 0.000 title claims abstract description 41
- 230000001105 regulatory effect Effects 0.000 title claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 112
- 229910052802 copper Inorganic materials 0.000 claims abstract description 109
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 107
- 238000012886 linear function Methods 0.000 claims abstract description 70
- 238000004364 calculation method Methods 0.000 claims abstract description 4
- 238000012360 testing method Methods 0.000 claims description 71
- 238000012546 transfer Methods 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 abstract 2
- 238000001514 detection method Methods 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410837485.XA CN104582294B (zh) | 2014-12-26 | 2014-12-26 | 蚀刻线速的自动调节方法和系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410837485.XA CN104582294B (zh) | 2014-12-26 | 2014-12-26 | 蚀刻线速的自动调节方法和系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104582294A true CN104582294A (zh) | 2015-04-29 |
CN104582294B CN104582294B (zh) | 2017-11-03 |
Family
ID=53097187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410837485.XA Active CN104582294B (zh) | 2014-12-26 | 2014-12-26 | 蚀刻线速的自动调节方法和系统 |
Country Status (1)
Country | Link |
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CN (1) | CN104582294B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105636358A (zh) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | 一种pcb板蚀刻方法 |
CN109168266A (zh) * | 2018-07-25 | 2019-01-08 | 江苏博敏电子有限公司 | 一种印刷线路板电路图形蚀刻参数评估方法 |
CN113670370A (zh) * | 2021-07-16 | 2021-11-19 | 广州兴森快捷电路科技有限公司 | 蚀刻参数计算方法、装置、电子设备及存储介质 |
CN113804095A (zh) * | 2020-06-16 | 2021-12-17 | 健鼎(湖北)电子有限公司 | 一种便于测试铜厚的电路板及其铜厚测试方法 |
CN114786347A (zh) * | 2022-03-02 | 2022-07-22 | 深南电路股份有限公司 | 一种电路板的加工方法 |
CN115250576A (zh) * | 2021-04-28 | 2022-10-28 | 南通深南电路有限公司 | 印制线路板的蚀刻方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09316667A (ja) * | 1996-05-30 | 1997-12-09 | Sumitomo Metal Ind Ltd | エッチング加工方法 |
US20110059848A1 (en) * | 2007-08-30 | 2011-03-10 | E. I. Du Pont De Nemours And Company | Granular turf safe herbicidal compositions |
CN102573309A (zh) * | 2012-01-13 | 2012-07-11 | 东莞生益电子有限公司 | 采用动态蚀刻补偿法提高减成法pcb图形精度的方法 |
CN102595798A (zh) * | 2012-03-09 | 2012-07-18 | 深圳市中兴新宇软电路有限公司 | 柔性印制电路板0.05mm以下细线线路成型工艺 |
CN103874335A (zh) * | 2014-03-31 | 2014-06-18 | 广州杰赛科技股份有限公司 | 电路板蚀刻线宽控制方法 |
-
2014
- 2014-12-26 CN CN201410837485.XA patent/CN104582294B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09316667A (ja) * | 1996-05-30 | 1997-12-09 | Sumitomo Metal Ind Ltd | エッチング加工方法 |
US20110059848A1 (en) * | 2007-08-30 | 2011-03-10 | E. I. Du Pont De Nemours And Company | Granular turf safe herbicidal compositions |
CN102573309A (zh) * | 2012-01-13 | 2012-07-11 | 东莞生益电子有限公司 | 采用动态蚀刻补偿法提高减成法pcb图形精度的方法 |
CN102595798A (zh) * | 2012-03-09 | 2012-07-18 | 深圳市中兴新宇软电路有限公司 | 柔性印制电路板0.05mm以下细线线路成型工艺 |
CN103874335A (zh) * | 2014-03-31 | 2014-06-18 | 广州杰赛科技股份有限公司 | 电路板蚀刻线宽控制方法 |
Non-Patent Citations (1)
Title |
---|
崔浩: ""手机用COF制造工艺关键技术研究"", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105636358A (zh) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | 一种pcb板蚀刻方法 |
CN105636358B (zh) * | 2016-03-18 | 2018-09-07 | 奥士康科技股份有限公司 | 一种pcb板蚀刻方法 |
CN109168266A (zh) * | 2018-07-25 | 2019-01-08 | 江苏博敏电子有限公司 | 一种印刷线路板电路图形蚀刻参数评估方法 |
CN109168266B (zh) * | 2018-07-25 | 2019-12-03 | 江苏博敏电子有限公司 | 一种印刷线路板电路图形蚀刻参数评估方法 |
CN113804095A (zh) * | 2020-06-16 | 2021-12-17 | 健鼎(湖北)电子有限公司 | 一种便于测试铜厚的电路板及其铜厚测试方法 |
CN115250576A (zh) * | 2021-04-28 | 2022-10-28 | 南通深南电路有限公司 | 印制线路板的蚀刻方法 |
CN113670370A (zh) * | 2021-07-16 | 2021-11-19 | 广州兴森快捷电路科技有限公司 | 蚀刻参数计算方法、装置、电子设备及存储介质 |
CN113670370B (zh) * | 2021-07-16 | 2023-12-19 | 广州兴森快捷电路科技有限公司 | 蚀刻参数计算方法、装置、电子设备及存储介质 |
CN114786347A (zh) * | 2022-03-02 | 2022-07-22 | 深南电路股份有限公司 | 一种电路板的加工方法 |
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Publication number | Publication date |
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CN104582294B (zh) | 2017-11-03 |
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Denomination of invention: Method and system for automatically regulating etching line speed Effective date of registration: 20200323 Granted publication date: 20171103 Pledgee: China Co. truction Bank Corp Huizhou branch Pledgor: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020980000897 |
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Address after: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Patentee after: Huizhou techuang Electronic Technology Co.,Ltd. Address before: 516000 taiyangao Industrial Zone, Baihua Town, Huizhou City, Guangdong Province Patentee before: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. |
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Date of cancellation: 20220614 Granted publication date: 20171103 Pledgee: China Co. truction Bank Corp Huizhou branch Pledgor: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020980000897 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Automatic Adjustment Method and System of Etching Line Speed Effective date of registration: 20221213 Granted publication date: 20171103 Pledgee: China Co. truction Bank Corp Huidong branch Pledgor: Huizhou techuang Electronic Technology Co.,Ltd. Registration number: Y2022980026914 |