CN104575500B - Application, speech recognition system and method for the electronic skin in speech recognition - Google Patents
Application, speech recognition system and method for the electronic skin in speech recognition Download PDFInfo
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- CN104575500B CN104575500B CN201310508179.7A CN201310508179A CN104575500B CN 104575500 B CN104575500 B CN 104575500B CN 201310508179 A CN201310508179 A CN 201310508179A CN 104575500 B CN104575500 B CN 104575500B
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Abstract
The invention discloses a kind of speech recognition systems, including:Electronic skin, the electronic skin include sensitive layer flexible, and at least one upper and lower surface of the sensitive layer is nonplanar structure, and upper electrode layer and lower electrode layer are respectively formed in the upper and lower surface of the sensitive layer;Data processing module, receives the signal from electronic skin and signal is sent to display module by treated;Display module receives and shows the signal from data processing module.The identifying system of the present invention has synchronous identification, and discrimination is high, the small and easy to carry advantage of volume letter, simultaneously because using flexible thin-film material, it may be convenient to by this device integration at wearable electronic.
Description
Technical field
The application belongs to sensor field, knows more particularly to a kind of application of electronic skin in speech recognition and voice
Other system and recognition methods.
Background technology
With the fast development of the communication technology and being constantly progressive for computer science and technology, speech recognition is one and makes us looking steadily
The high-new intelligent human-machine interaction technology of purpose, it is related to phonetics, sound generating mechanism, microelectric technique, computer information processing skill
The multi-disciplinary integrated technology such as art, voice process technology, Circuits and Systems and sensing technology, application have become
One has emulative emerging high-tech industry.Intelligent sound identifies industry as one of China's strategic emerging industries, one
Directly paid much attention to by authorities at different levels of country, has been put into multinomial national science and technology development plan and policy support field.
The speech recognition technology reported at present is all based on greatly sound template, large vocabulary continuous speech recognition, acoustic model
The methods of.However, these traditional speech recognition technologies face many problems, such as in noisy environment, accent or dialect etc.
In the case that unsharp pronunciation and more people pronounce simultaneously, voice input effect is poor, and discrimination is not high or even None- identified.
It is that traditional voice acquisition module is carried out by capturing the aerial transmitting signal of voice there are the main reason for problem above
Voice collecting, and extraneous other sound sources interference influences whether the voice data of acquisition.
Invention content
A kind of application that the purpose of the present invention is to provide electronic skins in speech recognition and speech recognition system and side
Method, to solve the problems, such as that voice input effect is poor in the prior art, discrimination is not high.
To achieve the above object, the present invention provides the following technical solutions:
The embodiment of the present application discloses application of the electronic skin in speech recognition, and the electronic skin includes flexible
Sensitive layer, at least one upper and lower surface of the sensitive layer are nonplanar structure, and the upper surface of the sensitive layer is under
Upper electrode layer and lower electrode layer are respectively formed on surface.
The invention also discloses a kind of speech recognition systems, including:
Electronic skin, the electronic skin include sensitive layer flexible, and the upper and lower surface of the sensitive layer is extremely
One of few is nonplanar structure, and upper electrode layer and lower electrode layer are respectively formed in the upper and lower surface of the sensitive layer;
Data processing module, receives the signal from electronic skin and signal is sent to display module by treated;
Display module receives and shows the signal from data processing module.
Preferably, in above-mentioned speech recognition system, the material of the sensitive layer is dimethyl silicone polymer (PDMS),
Thickness range is 2~50 μm, preferably 50 μm.
Preferably, in above-mentioned speech recognition system, the material of the sensitive layer is high molecular material, the high score
One or more groups of the sub- material in poly- polyethylene terephthalate, polyvinyl alcohol, polyvinyl formal, polyethylene
It closes.
Preferably, in above-mentioned speech recognition system, flexibility is additionally provided between the sensitive layer and lower electrode layer
Supporting layer.
Preferably, in above-mentioned speech recognition system, the supporting layer is polyethylene (PE) film, and thickness range is
1~100 μm, preferably 12 μm.
Preferably, in above-mentioned speech recognition system, the support layer material is also selected from high transparency high flexibility
Polyvinyl chloride(PVC)Film, polyvinylidene chloride(PVDC), polyethylene terephthalate(PET)In film it is a kind of or
A variety of combinations.
Preferably, in above-mentioned speech recognition system, the upper electrode layer and lower electrode layer material be selected from gold, platinum,
One or more combinations in nickel, silver, indium, copper, aluminium, carbon nanotube, graphene, nano silver wire.
Preferably, in above-mentioned electronic skin, the upper electrode layer and lower electrode layer electrode are by vapor deposition, chemistry
Deposition, printing, spraying or sputtering mode are formed.
Preferably, in above-mentioned speech recognition system, the nonplanar structure is the multiple more pyramid bodies protruded out.
Preferably, in above-mentioned speech recognition system, the bottom surface of each centrum is the pros of 10 μm of 10 μ m
The angle of shape, side and bottom surface is 54.7 °, vertebral height be 7.06 μm, between centrum spacing be 1 ~ 100 μm, between centrum between
Away from preferably 10 μm.
The invention also discloses a kind of audio recognition methods, including;
The vibration signal of vocal cords is acquired using above-mentioned electronic skin;
The vibration signal of acquisition is filtered, is amplified, and extracts characteristic signal;
Analysis and identification is carried out to characteristic signal using temporal analysis or frequency domain analysis, and recognition result is passed through into display
Module is shown.
Compared with the prior art, the advantages of the present invention are as follows:
The electronic skin of the present invention is blended with novel micro nanometer sensing technology, very due to the use of nontoxic and biocompatibility
Good ultra-thin elastic thin-film material, therefore can combine together well with human skin, be built into wearable device can bring it is super
Good user experience;Simultaneously because the unique nanostructure of sensitive material makes sensitivity higher, the stabilization that the equipment has
Property is more preferable;In addition entire device light and small dexterity have the advantages that it is easy to carry.
The speech recognition system that the present invention is obtained by above-mentioned electronic skin has synchronous identification, and discrimination is high, volume letter
Advantage small, easy to carry and wearable.
Description of the drawings
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments described in application, for those of ordinary skill in the art, without creative efforts,
Other drawings may also be obtained based on these drawings.
Fig. 1 show the schematic diagram of speech recognition system in the specific embodiment of the invention;
Fig. 2 show the sectional view of electronic skin in the specific embodiment of the invention;
Fig. 3 show the SEM figures of silicon wafer template in the specific embodiment of the invention;
Fig. 4 show the SEM figures of the PDMS fexible films of template construct as shown in Figure 3;
Fig. 5 show the schematic diagram to speech recognition using the speech recognition system in the embodiment of the present invention.
Specific implementation mode
The international competition of current information industry has increasingly shown as the contention to science and technology, speech recognition industry conduct
Strategic and perspective important emerging technology industry is always domestic and international scientific circles and industrial circle focus of attention.The present invention relates to
And a kind of novel voice identification technology and corresponding device, the present invention are proposed with vocal cords generation when the acquisition pronunciation of micro-nano sensor
Vibration signal, rather than as traditional speech recognition technology by acquisition module capture the aerial transmitting signal of voice, then
The pretreatments such as it is amplified, filters to vibration signal, extraction characteristic signal utilizes the identifications such as temporal analysis, frequency domain analysis point
Analysis, to obtain a kind of easy, feasible, system vibration signal recognition, finally shows recognition result.
The present invention is innovated on the basis of traditional voice identification technology, is concentrated mainly on the acquisition mode of voice signal
On extraction element, there is synchronous identification, discrimination is high, the small and easy to carry advantage of volume letter, simultaneously because using flexible
Thin-film material, it may be convenient to by this device integration at wearable electronic.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out detailed retouch
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, the every other implementation that those of ordinary skill in the art are obtained without making creative work
Example, shall fall within the protection scope of the present invention.
Join shown in Fig. 1, in the embodiment of the present invention, speech recognition system includes electronic skin, data processing module and display
Module.
Electronic skin is acquiring the vibration signal of vocal cords;Data processing module is filtered the vibration signal of acquisition,
Amplification, and characteristic signal is extracted, analysis and identification is carried out to characteristic signal using temporal analysis or frequency domain analysis, and will identification
As a result it is shown by display module.
Join shown in Fig. 2, the electronic skin in the present embodiment includes supporting layer 1 flexible, is formed in 1 upper surface of supporting layer
Sensitive layer 2 flexible, and it is respectively formed in the upper electrode layer 3 and lower electrode layer of 1 lower surface of 2 upper surface of sensitive layer and supporting layer
4。
The material of sensitive layer 2 is preferably PDMS(Dimethyl silicone polymer), the material of sensitive layer 2 can also be other high scores
Sub- material, such as any one or more in poly- polyethylene terephthalate, polyvinyl alcohol, polyvinyl formal, polyethylene.
The upper surface of sensitive layer 2 is nonplanar structure, and the centrum 21 of preferably several protrusions, the bottom surface of each centrum 21 is
For 10 μ m, 10 μm of square, the angle of side and bottom surface is 54.7 °, and vertebral height is 7.06 μm, and spacing is between centrum
10μm。
In other embodiments, the shape of 2 upper surface of sensitive layer may be other wavy equal nonplanar structures.
It will be readily apparent, the lower surface of sensitive layer 2 may be set to be molded non-planar, correspondingly, under sensitive layer 2
Surface is also required to one layer of electrode layer of setting.
Supporting layer 1 is preferably the ultra-thin PE of high transparency high flexibility(Polyethylene)Film, thickness are preferably 12 μm.
PE membrane actions be to help patterning PDMS films in silicon wafer surface and template can complete delamination, simultaneously
As substrate supports PDMS films.
The material of upper electrode layer 3 and lower electrode layer 4 is selected from gold, platinum, nickel, silver, indium, copper, aluminium, carbon nanotube, graphene, silver
One or more combinations in nano wire.
The integral thickness of above-mentioned electronic skin, supporting layer 1 and sensitive layer 2 is less than 70 μm, which has
Pliability identical with human skin and Young's modulus, weight is also ultralight light, can directly be binded with skin, is a kind of wearable
Property device.
The production method of above-mentioned electronic skin is as follows:
S1, making can form the template of nonplanar structure
The present embodiment produces the template with micro-structure using techniques such as photoetching, etchings in MEMS processing and manufacturing technologies
(It is preferred that 4 cun of silicon wafers).Silicon wafer surface is first subjected to clean processing, then spin coating photoresist, front baking, photoetching, development, rear baking,
Pattern transfer to Silicon Wafer is finally obtained into the template with micro-structure, specific preparation method is as follows using etching:
1, making sheet
By design prove after using making figure Software on Drawing drawing, the width and height and pattern of simple increase pattern
Between spacing be all conducive to the raising of device sensitivity, but after integrating, micro- pattern is preferably pyramid structure, and bottom of tower face is 10
The angle of the square that 10 μm of μ m, side and bottom surface is 54.7 °, and the distance of tower top to bottom surface is 7.06 μm, pattern spacing
It is 10 μm, mask plate is done according to the size of drawing.
2, prepare 4 cun of Silicon Wafers
Silicon Wafer uses 4 cun of single-sided polishings, single side 300nm thermal oxides SiO2Layer Silicon Wafer, MOS grade acetones, deionized water
15 minutes ultrasonic respectively, then MOS grades of EtOH Sonicates dry up after ten minutes, and following 105 DEG C dry 10 minutes.
3, graphical photoresist
A, whirl coating:In ready 4 cun of silicon wafer surfaces spin coating 6-7um photoresists, preferably AZ4620, pre- rotating speed
500rpm time 6s, spin coating rotating speed 400rpm time 30s;
B, front baking:In 95 ° of lower front bakings, 210 seconds;
C, it exposes:Using MA6 contact photoetching machines, 24 s are exposed under Low-vacuum mode;
D, develop:The proportioning of developer solution used is tetramethylammonium hydroxide:Deionized water=1:8,95 s of developing time;
E, rear to dry:95 °, 180 seconds are dried afterwards.
4, pattern transfer is to Silicon Wafer
A, it removes photoresist:Remaining photoresist glued membrane after equipment for burning-off photoresist by plasma removal development;
B, dry etching:Use reactive ion etching(RIE)Remove patterned SiO2Layer, 6 minutes time
C, wet method orientation etching:It is etched at 78 DEG C 9 minutes with 30% KOH solution, is finally formed instead in silicon wafer surface
Tetragonous wimble structure is joined shown in Fig. 3.
, template surface formed one layer of organic molecule layer
In template surface working process(It is applied as being vapor-deposited or smoking)A thin layer of organic matter(Trim,ethylchlorosilane or
Person's perfluoro capryl trichlorosilane) molecular layer ensures the complete delamination of energy in the PDMS films and template of silicon wafer surface.
, on organic molecule layer form sensitive layer
Then the spin coating on organic molecule layer(It is preferred that rotating speed is in 3000r/min, time 30S)A kind of transparent liquid is high
Molecularly Imprinted Polymer(Such as dimethyl silicone polymer, the preferably proportional quantity of initiator and reactant is mass ratio 1:10,)It is allowed to uniform
It is formed one layer very thin(Preferred thickness is 50 μm)Film.
, on sensitive layer formed one layer of supporting layer
Again in the seamless bubble-free of above-mentioned film surface(There is the case where bubble, gap to be also included within the inside)Ground forms a floor height
The ultra-thin PE of transparent high flexibility(Polyethylene)Film(Thickness is preferably 12 μm).
, heat treatment, by after solidification sensitive layer and supporting layer removed from template
It heats under vacuum conditions again(Preferable temperature is at 65~75 DEG C)Processing a period of time(It is preferred that 2~3h)After wait until
It states Liquid polymeric polymer P DMS films to be fully cured, while also combining together completely with PE films, next cured height
Molecularly Imprinted Polymer film is stripped down from silicon wafer template surface, to just micro- pattern complex in silicon wafer template to PDMS
The film with pyramid micro-structure is prepared on fexible film, the film integral thickness<70 μm, as shown in Figure 4.
, respectively at the upper surface of sensitive layer and the lower surface of supporting layer form upper electrode layer and lower electrode layer
Finally in the uniformly coating respectively of the upper and lower surface of film(Such as vapor deposition, chemical deposition, this patent are preferably deposited)One
Layer ultrathin nanometer conductive film(The Au particles that the preferred purity of the present invention is 99.9999%, vapor deposition Au conduction film thicknesses are 100nm), this
When be formed the ultrathin flexible conduction electrons skin with multiple sensitive sites.
Then each extraction on the Au conductive nano layers of ultrathin flexible conduction electrons skin top and bottom(Such as viscous pressure, welding,
The preferably viscous pressure of this patent)One flexible electrode(Such as diameter 0.1mm enameled wires, 20 μ m-thicks and the flat copper for carrying pressure-sensitive adhesive
It is foil belt, flexible ultra-thin(10 μ m-thicks)Copper foil, this patent preferably flexible ultra-thin copper foil).
Last spin coating(It is preferred that rotating speed is in 5000r/min, time 30S)One layer of PDMS is allowed to be formed uniformly one layer very thin(It is thick
Degree<10μm)Au conductive layers protective layer, be just built into condenser type ultrathin flexible electronic skin.
A piece of ultrathin flexible electronic skin is chosen, physics cutting goes out 2 small pieces to differ in size(It is preferred that going out the mm of 15mm × 15
With 2 of the mm of 20mm × 15), then have respectively in these small pieces and fix flexible wire in the one edge of pattern plane and make
Electrode, finally on a transparent substrate(Such as glass, PDMS films etc., this patent preferred thickness is the PDMS films of 2mm)This two panels is had
Pattern plane is seamless applying just to constitute ultra-thin wearable flexible device.
Device measures its base impedance in bare die, using resistance measurement tool, while adding a small voltage(It is excellent
Select 2~5V);Its background noise is tested with oscillograph under device light condition, the vibration signal of vocal cords when then acquisition is pronounced
It was found that background noise is excessive, vibration signal can not effectively be screened from noise.By our outer end circuit tests and point
It analyses and device is optimized, since the vibration of vocal cords makes sensor impedance generate larger change when device is placed on vocal cords
Change, the range of the voltage fluctuation generated on sampling resistor is higher than the ambient noise that oscilloscope measurement comes out, generated voltage
Saltus step level can be separated from noise level, and then tested circuit identification.It again will by the filter in circuit
Ambient noise signal, which filters, just obtains effective pulse wave signal, is emitted using wireless blue tooth after amplifying circuit amplifies signal
The display over the display that vocal cord vibration wave synchronizes when technology transmits signals to the reception device on display to pronounce
Out.
Join shown in Fig. 5, device is pasted onto at vocal cords, vocal cords will produce corresponding vibration when we speak pronunciation, pass
Sensor can collect vibration signal automatically, using in Bluetooth transmission to display after the conversion identification of external circuit(It is preferred that 7 cun
pad), the waveform on display the different waveform of amplitude, frequency can occurs according to weight, length of pronunciation etc..
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also include other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The above is only the specific implementation mode of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also answered
It is considered as the protection domain of the application.
Claims (12)
1. application of the electronic skin in speech recognition, the electronic skin includes sensitive layer flexible, the sensitive layer
At least one upper and lower surface is nonplanar structure, is respectively coated and is formed in the upper and lower surface of the sensitive layer
Upper electrode layer and lower electrode layer, wherein the upper electrode layer and/or lower electrode layer formed on the nonplanar structure is also non-flat
Face structure.
2. a kind of speech recognition system, which is characterized in that including:
Electronic skin, the electronic skin include sensitive layer flexible, the upper and lower surface of the sensitive layer at least it
One is nonplanar structure, is respectively coated in the upper and lower surface of the sensitive layer and is formed with upper electrode layer and lower electrode layer,
Wherein, the upper electrode layer and/or lower electrode layer formed on the nonplanar structure is also nonplanar structure;
Data processing module, receives the signal from electronic skin and signal is sent to display module by treated;
Display module receives and shows the signal from data processing module.
3. speech recognition system according to claim 2, it is characterised in that:The material of the sensitive layer is poly dimethyl silicon
Oxygen alkane, thickness range are 2~50 μm.
4. speech recognition system according to claim 2, it is characterised in that:The material of the sensitive layer is macromolecule material
Material, the high molecular material in poly- polyethylene terephthalate, polyvinyl alcohol, polyvinyl formal, polyethylene one
Kind or a variety of combinations.
5. speech recognition system according to claim 2, it is characterised in that:Between the sensitive layer and lower electrode layer also
It is provided with supporting layer flexible.
6. speech recognition system according to claim 5, it is characterised in that:The supporting layer is polyethylene film, thick
Ranging from 1~100 μm of degree.
7. speech recognition system according to claim 5, it is characterised in that:The support layer material is also selected from height
Polyvinyl chloride film, the polyvinylidene chloride of transparent high flexibility, it is one or more in pet film
Combination.
8. speech recognition system according to claim 2, it is characterised in that:The upper electrode layer and lower electrode layer material
One or more combinations in gold, platinum, nickel, silver, indium, copper, aluminium, carbon nanotube, graphene, nano silver wire.
9. speech recognition system according to claim 2, it is characterised in that:The upper electrode layer and lower electrode layer electrode
It is to be formed by way of vapor deposition, chemical deposition, printing, spraying or sputtering.
10. speech recognition system according to claim 2, it is characterised in that:The nonplanar structure be protrude out it is more
A more pyramid bodies.
11. speech recognition system according to claim 10, it is characterised in that:The bottom surface of each centrum is 10 μm
The angle of × 10 μm of square, side and bottom surface is 54.7 °, and vertebral height is 7.06 μm, and spacing is 1~100 μ between centrum
m。
12. a kind of audio recognition method, which is characterized in that including;
The vibration signal of vocal cords is acquired using any electronic skin of claim 2 to 11;
The vibration signal of acquisition is filtered, is amplified, and extracts characteristic signal;
Analysis and identification is carried out to characteristic signal using temporal analysis or frequency domain analysis, and recognition result is passed through into display module
Display.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
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CN201310508179.7A CN104575500B (en) | 2013-10-24 | 2013-10-24 | Application, speech recognition system and method for the electronic skin in speech recognition |
US14/764,165 US9816882B2 (en) | 2013-01-29 | 2014-01-28 | Electronic skin, preparation method and use thereof |
EP14746641.1A EP2953012B1 (en) | 2013-01-29 | 2014-01-28 | Electronic skin, preparation method and use thereof |
PCT/CN2014/071631 WO2014117724A1 (en) | 2013-01-29 | 2014-01-28 | Electronic skin, preparation method and use thereof |
AU2014211862A AU2014211862B2 (en) | 2013-01-29 | 2014-01-28 | Electronic skin, preparation method and use thereof |
KR1020157022839A KR101877108B1 (en) | 2013-01-29 | 2014-01-28 | Electronic skin, preparation method and use thereof |
JP2015554045A JP6180547B2 (en) | 2013-01-29 | 2014-01-28 | Electronic skin and its manufacturing method and use |
CA2899676A CA2899676C (en) | 2013-01-29 | 2014-01-28 | Electronic skin, preparation method and use thereof |
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