CN104551416A - Cutting device suitable for wafers - Google Patents
Cutting device suitable for wafers Download PDFInfo
- Publication number
- CN104551416A CN104551416A CN201410844772.3A CN201410844772A CN104551416A CN 104551416 A CN104551416 A CN 104551416A CN 201410844772 A CN201410844772 A CN 201410844772A CN 104551416 A CN104551416 A CN 104551416A
- Authority
- CN
- China
- Prior art keywords
- conveyer belt
- electricity cylinder
- electric cylinder
- axis electricity
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
Abstract
The invention discloses a cutting device suitable for wafers. The cutting device suitable for the wafers is characterized by comprising a bearing tray, conveying belts, a cutting module and a detecting module, wherein the conveying belts comprise a first conveying belt and a second conveying belt; the cutting module comprises a positioning electric cylinder and a laser cutter positioned on the positioning electric cylinder; the positioning electric cylinder comprises an x-axis electric cylinder body, a y-axis electric cylinder body and a z-axis electric cylinder body; and the laser cutter is positioned on the x-axis electric cylinder body. The cutting device suitable for the wafers has the advantages that whether wafers to be machined are fed or not is monitored by a material detecting module, and when the CCD (charge coupled device) detecting module detects the wafers, a control module starts the second conveying belt and the cutting module, so that part of energy can be saved; and by the design of the x-axis electric cylinder, the y-axis electric cylinder and the z-axis electric cylinder, the laser cutter can be easily positioned in a cutting process, and cutting accuracy and cutting efficiency are high. Moreover, by a counting module, statistical work of workers is facilitated, and the workload is greatly reduced.
Description
Technical field
The present invention relates to a kind of cutter sweep being applicable to wafer, belong to wafer cutting technique field.
Background technology
Along with the user demand of wafer is increasing, the efficiency of the processing of wafer needs raising badly.Adopt laser cutting mode mostly to wafer in the prior art, this mode is not only pollution-free but also efficiency is high, but in energy-conservation, because the power consumption of laser cutting itself is just relatively large, although therefore efficiency is high, but the energy resource consumption in actual production process is also very large, improves very large cost to the production of enterprise.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide a kind of wafer cutting device saving the energy.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
Be applicable to a cutter sweep for wafer, it is characterized in that, comprise bearing tray, conveyer belt, cutting module and inspection material module; Described bearing tray transmits on a moving belt; Described driving-belt comprises the first conveyer belt and the second conveyer belt; Described inspection material module installation is on the first conveyer belt, and described cutting module is arranged on the second conveyer belt; The laser cutter that described cutting module comprises the electric cylinder in location and is positioned on the electric cylinder in described location; The electric cylinder in described location comprises x-axis electricity cylinder, y-axis electricity cylinder and z-axis electricity cylinder; Described laser cutter is positioned on x-axis electricity cylinder.
Aforesaid a kind of cutter sweep being applicable to wafer, is characterized in that, one end of described x-axis electricity cylinder is arranged on described z-axis electricity cylinder, and described z-axis electricity cylinder is arranged on described y-axis electricity cylinder.
Aforesaid a kind of cutter sweep being applicable to wafer, is characterized in that, the end of described y-axis electricity cylinder is provided with the slide rail in z-axis direction, and described slide rail is used for the vertical sliding motion of z-axis electricity cylinder.
Aforesaid a kind of cutter sweep being applicable to wafer, is characterized in that, also comprise counting device; Described counting device is arranged on the rear of cutting module.
Aforesaid a kind of cutter sweep being applicable to wafer, is characterized in that, the side of described y-axis electricity cylinder is provided with start button and emergency stop switch.
Aforesaid a kind of cutter sweep being applicable to wafer, is characterized in that, the distance between described first conveyer belt and the second conveyer belt is 1-5mm; The level height of described first conveyer belt is than the level height height 1-3mm of the second conveyer belt.
The beneficial effect that the present invention reaches: whether employing supplied materials detection module carries out monitoring has wafer to be processed to send, when CCD inspection material module has detected wafer, control module starts the second conveyer belt and cutting module, the energy waste of a part can be saved like this, the design of x, y, z three axle electricity cylinder can make laser cutter in the process of cutting, be more prone to location, and cutting is accurate and efficiency is high.Meanwhile, counting module add the statistical work that can facilitate staff, greatly reduce workload.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
The implication of Reference numeral in figure:
1-inspection material module, 201-first conveyer belt, 202-second conveyer belt, 3-y axle electricity cylinder, 4-slide rail, 5-z axle electricity cylinder, 6-x axle electricity cylinder, 7-bearing tray, 8-counting module.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
A kind of cutter sweep being applicable to wafer that the present invention relates to, comprises bearing tray 7, conveyer belt, cutting module, inspection material module 1 and counting device.Bearing tray 7 transmits on a moving belt.Driving-belt comprises the first conveyer belt 201 and the second conveyer belt 2012, and inspection material module 1 is arranged on the first conveyer belt 201, and cutting module is arranged on the second conveyer belt 202.Counting device 8 is arranged on the rear of cutting module, can facilitate the statistical work of staff, greatly reduce workload, and counting device 8 can adopt infrared laser principle to count.
As Fig. 1, cutting module comprises the electric cylinder in location and laser cutter.Locate electric cylinder and comprise x-axis electricity cylinder 6, y-axis electricity cylinder 3 and z-axis electricity cylinder 5.Laser cutter is positioned on x-axis electricity cylinder 6.One end of x-axis electricity cylinder 6 is arranged on z-axis electricity cylinder 5, and z-axis electricity cylinder 5 is arranged on y-axis electricity cylinder 3.The end of y-axis electricity cylinder 3 is provided with the slide rail 4 in z-axis direction, and slide rail 4 is for the vertical sliding motion of z-axis electricity cylinder 5.Such z-axis electricity cylinder 5 carries out the slip in vertical direction i.e. z-axis direction on slide rail 4, and y-axis electricity cylinder 3 carries out the slip in y-axis direction, and x-axis electricity cylinder 6 carries out the slip in x-axis direction on z-axis electricity cylinder 5.The electric cylinder in whole location only has y-axis electricity cylinder 3 to be fixed.The side of y-axis electricity cylinder 3 is provided with start button and emergency stop switch, as the emergency button under emergency.
Inspection material module 1 comprises control module and CCD inspection material module.Control module is for the running of the startup and cutting module that control the second conveyer belt 202.Whether inspection material module 1 carries out monitoring has wafer to be processed to send, when CCD inspection material module has detected wafer, control module starts the second conveyer belt 202, the energy waste of a part can be saved, the design of x, y, z three axle electricity cylinder can make laser cutter in the process of cutting, be more prone to location, and cutting is accurate and efficiency is high.
First conveyer belt 201 and the separate work of the second conveyer belt 202, distance is between the two 1-5mm, is convenient to bearing tray like this from the first conveyer belt 201 be transferred to the second conveyer belt 202.Further, the level height of the first conveyer belt 201 than the level height height 1-3mm of the second conveyer belt 202 so that with bearing tray transition reposefully.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and distortion, these improve and distortion also should be considered as protection scope of the present invention.
Claims (6)
1. be applicable to a cutter sweep for wafer, it is characterized in that, comprise bearing tray, conveyer belt, cutting module and inspection material module; Described bearing tray transmits on a moving belt; Described driving-belt comprises the first conveyer belt and the second conveyer belt; Described inspection material module installation is on the first conveyer belt, and described cutting module is arranged on the second conveyer belt; The laser cutter that described cutting module comprises the electric cylinder in location and is positioned on the electric cylinder in described location; The electric cylinder in described location comprises x-axis electricity cylinder, y-axis electricity cylinder and z-axis electricity cylinder; Described laser cutter is positioned on x-axis electricity cylinder.
2. a kind of cutter sweep being applicable to wafer according to claim 1, is characterized in that, one end of described x-axis electricity cylinder is arranged on described z-axis electricity cylinder, and described z-axis electricity cylinder is arranged on described y-axis electricity cylinder.
3. a kind of cutter sweep being applicable to wafer according to claim 2, is characterized in that, the end of described y-axis electricity cylinder is provided with the slide rail in z-axis direction, and described slide rail is used for the vertical sliding motion of z-axis electricity cylinder.
4. a kind of cutter sweep being applicable to wafer according to claim 1, is characterized in that, also comprise counting device; Described counting device is arranged on the rear of cutting module.
5. a kind of cutter sweep being applicable to wafer according to claim 1, is characterized in that, the side of described y-axis electricity cylinder is provided with start button and emergency stop switch.
6. a kind of cutter sweep being applicable to wafer according to claim 1, is characterized in that, the distance between described first conveyer belt and the second conveyer belt is 1-5mm; The level height of described first conveyer belt is than the level height height 1-3mm of the second conveyer belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410844772.3A CN104551416A (en) | 2014-12-31 | 2014-12-31 | Cutting device suitable for wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410844772.3A CN104551416A (en) | 2014-12-31 | 2014-12-31 | Cutting device suitable for wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104551416A true CN104551416A (en) | 2015-04-29 |
Family
ID=53069052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410844772.3A Pending CN104551416A (en) | 2014-12-31 | 2014-12-31 | Cutting device suitable for wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104551416A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3345715A4 (en) * | 2015-08-31 | 2019-05-01 | Baoshan Iron & Steel Co., Ltd. | Method and system for dynamically following laser cutting with synchronous sheet transferring |
| EP3345714A4 (en) * | 2015-08-31 | 2019-05-15 | Baoshan Iron & Steel Co., Ltd. | Method and system for dynamically following laser cutting with magnetic belt |
| CN111843184A (en) * | 2020-07-17 | 2020-10-30 | 沈阳航空航天大学 | Metal foil numerical control cutting, gluing and direct forming additive manufacturing equipment and method |
| CN112775558A (en) * | 2020-12-24 | 2021-05-11 | 吉林瑞尔康隐形眼镜有限公司 | Laser marking limiting device and laser marking equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286763A (en) * | 2005-03-31 | 2006-10-19 | Disco Abrasive Syst Ltd | Laser machining method and laser machining apparatus for wafer |
| US20080066596A1 (en) * | 2004-05-20 | 2008-03-20 | Komatsu Insustries Corporation | Cutting Machine and Method of Moving Cutting Head |
| US20100181165A1 (en) * | 2009-01-20 | 2010-07-22 | Finn Jay G | Laser blanking from coil strip profile conveyor system |
| CN103406663A (en) * | 2013-08-19 | 2013-11-27 | 昆山远大精工机械有限公司 | Cutting torch driving type laser cutting device |
| CN203426596U (en) * | 2013-04-15 | 2014-02-12 | 东莞职业技术学院 | Automatic laser cutting machine capable of continuously feeding materials |
| CN103949780A (en) * | 2014-05-22 | 2014-07-30 | 傲科塑料制品（张家港）有限公司 | Conveying device for laser cutting |
| CN204504514U (en) * | 2014-12-31 | 2015-07-29 | 苏州凯锝微电子有限公司 | A kind of cutter sweep being applicable to wafer |
-
2014
- 2014-12-31 CN CN201410844772.3A patent/CN104551416A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080066596A1 (en) * | 2004-05-20 | 2008-03-20 | Komatsu Insustries Corporation | Cutting Machine and Method of Moving Cutting Head |
| JP2006286763A (en) * | 2005-03-31 | 2006-10-19 | Disco Abrasive Syst Ltd | Laser machining method and laser machining apparatus for wafer |
| US20100181165A1 (en) * | 2009-01-20 | 2010-07-22 | Finn Jay G | Laser blanking from coil strip profile conveyor system |
| CN203426596U (en) * | 2013-04-15 | 2014-02-12 | 东莞职业技术学院 | Automatic laser cutting machine capable of continuously feeding materials |
| CN103406663A (en) * | 2013-08-19 | 2013-11-27 | 昆山远大精工机械有限公司 | Cutting torch driving type laser cutting device |
| CN103949780A (en) * | 2014-05-22 | 2014-07-30 | 傲科塑料制品（张家港）有限公司 | Conveying device for laser cutting |
| CN204504514U (en) * | 2014-12-31 | 2015-07-29 | 苏州凯锝微电子有限公司 | A kind of cutter sweep being applicable to wafer |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3345715A4 (en) * | 2015-08-31 | 2019-05-01 | Baoshan Iron & Steel Co., Ltd. | Method and system for dynamically following laser cutting with synchronous sheet transferring |
| EP3345714A4 (en) * | 2015-08-31 | 2019-05-15 | Baoshan Iron & Steel Co., Ltd. | Method and system for dynamically following laser cutting with magnetic belt |
| CN111843184A (en) * | 2020-07-17 | 2020-10-30 | 沈阳航空航天大学 | Metal foil numerical control cutting, gluing and direct forming additive manufacturing equipment and method |
| CN112775558A (en) * | 2020-12-24 | 2021-05-11 | 吉林瑞尔康隐形眼镜有限公司 | Laser marking limiting device and laser marking equipment |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150429 |