CN204504515U - A kind of wafer cutting device - Google Patents
A kind of wafer cutting device Download PDFInfo
- Publication number
- CN204504515U CN204504515U CN201420861060.8U CN201420861060U CN204504515U CN 204504515 U CN204504515 U CN 204504515U CN 201420861060 U CN201420861060 U CN 201420861060U CN 204504515 U CN204504515 U CN 204504515U
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- China
- Prior art keywords
- electricity cylinder
- axis electricity
- cylinder
- module
- cutting device
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- Expired - Fee Related
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Abstract
The utility model discloses a kind of wafer cutting device, it is characterized in that, comprise conveyer belt, be positioned at cutting module above described conveyer belt; The laser cutter that described cutting module comprises the electric cylinder in location and is positioned on the electric cylinder in described location; The electric cylinder in described location comprises x-axis electricity cylinder, y-axis electricity cylinder and z-axis electricity cylinder; Described laser cutter is positioned on x-axis electricity cylinder.The beneficial effect that the utility model reaches: whether employing supplied materials detection module carries out monitoring has wafer to be processed to send, when CCD inspection material module has detected wafer, control module starts cutting module and cuts, the energy waste of a part can be saved, the design of x, y, z three axle electricity cylinder can make laser cutter in the process of cutting, be more prone to location, and cutting is accurate and efficiency is high.
Description
Technical field
The utility model relates to a kind of wafer cutting device, belongs to wafer cutting technique field.
Background technology
Along with the user demand of wafer is increasing, the efficiency of the processing of wafer needs raising badly.Adopt laser cutting mode mostly to wafer in the prior art, this mode is not only pollution-free but also efficiency is high, but in energy-conservation, because the power consumption of laser cutting itself is just relatively large, although therefore efficiency is high, but the energy resource consumption in actual production process is also very large, improves very large cost to the production of enterprise.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is to provide a kind of wafer cutting device saving the energy.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
A kind of wafer cutting device, is characterized in that, comprise conveyer belt, is positioned at cutting module above described conveyer belt; The laser cutter that described cutting module comprises the electric cylinder in location and is positioned on the electric cylinder in described location; The electric cylinder in described location comprises x-axis electricity cylinder, y-axis electricity cylinder and z-axis electricity cylinder; Described laser cutter is positioned on x-axis electricity cylinder.
Aforesaid a kind of wafer cutting device, is characterized in that, one end of described x-axis electricity cylinder is arranged on described z-axis electricity cylinder, and described z-axis electricity cylinder is arranged on described y-axis electricity cylinder.
Aforesaid a kind of wafer cutting device, is characterized in that, the end of described y-axis electricity cylinder is provided with the slide rail in z-axis direction, and described slide rail is used for the vertical sliding motion of z-axis electricity cylinder.
Front described a kind of wafer cutting device, is characterized in that, also comprise supplied materials detection module; Described supplied materials detection module comprises control module and CCD inspection material module.
Aforesaid a kind of wafer cutting device, is characterized in that, described control module is for the running of the transfer rate and cutting module that control conveyer belt.
Aforesaid a kind of wafer cutting device, is characterized in that, the side of described y-axis electricity cylinder is provided with start button and emergency stop switch.
The beneficial effect that the utility model reaches: whether employing supplied materials detection module carries out monitoring has wafer to be processed to send, when CCD inspection material module has detected wafer, control module starts cutting module and cuts, the energy waste of a part can be saved, the design of x, y, z three axle electricity cylinder can make laser cutter in the process of cutting, be more prone to location, and cutting is accurate and efficiency is high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
The implication of Reference numeral in figure:
1-supplied materials detection module, 2-conveyer belt, 3-y axle electricity cylinder, 4-slide rail, 5-z axle electricity cylinder, 6-x axle electricity cylinder.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection domain of the present utility model with this.
A kind of wafer cutting device that the utility model relates to, comprises conveyer belt 2, is positioned at cutting module above conveyer belt 2 and supplied materials detection module 1.
As Fig. 1, cutting module comprises the electric cylinder in location and laser cutter.Locate electric cylinder and comprise x-axis electricity cylinder 6, y-axis electricity cylinder 3 and z-axis electricity cylinder 5.Laser cutter is positioned on x-axis electricity cylinder 6.One end of x-axis electricity cylinder 6 is arranged on z-axis electricity cylinder 5, and z-axis electricity cylinder 5 is arranged on y-axis electricity cylinder 3.The end of y-axis electricity cylinder 3 is provided with the slide rail 4 in z-axis direction, and slide rail 4 is for the vertical sliding motion of z-axis electricity cylinder 5.Such z-axis electricity cylinder 5 carries out the slip in vertical direction i.e. z-axis direction on slide rail 4, and y-axis electricity cylinder 3 carries out the slip in y-axis direction, and x-axis electricity cylinder 6 carries out the slip in x-axis direction on z-axis electricity cylinder 5.The electric cylinder in whole location only has y-axis electricity cylinder 3 to be fixed.The side of y-axis electricity cylinder 3 is provided with start button and emergency stop switch, as the emergency button under emergency.
Supplied materials detection module 1 comprises control module and CCD inspection material module.Control module is for the running of the transfer rate and cutting module that control conveyer belt 2.Whether supplied materials detection module 1 carries out monitoring has wafer to be processed to send, when CCD inspection material module has detected wafer, control module starts cutting module and cuts, the energy waste of a part can be saved, the design of x, y, z three axle electricity cylinder can make laser cutter in the process of cutting, be more prone to location, and cutting is accurate and efficiency is high.
The above is only preferred embodiment of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvement and distortion, these improve and distortion also should be considered as protection domain of the present utility model.
Claims (6)
1. a wafer cutting device, is characterized in that, comprises conveyer belt, is positioned at cutting module above described conveyer belt; The laser cutter that described cutting module comprises the electric cylinder in location and is positioned on the electric cylinder in described location; The electric cylinder in described location comprises x-axis electricity cylinder, y-axis electricity cylinder and z-axis electricity cylinder; Described laser cutter is positioned on x-axis electricity cylinder.
2. a kind of wafer cutting device according to claim 1, is characterized in that, one end of described x-axis electricity cylinder is arranged on described z-axis electricity cylinder, and described z-axis electricity cylinder is arranged on described y-axis electricity cylinder.
3. a kind of wafer cutting device according to claim 2, is characterized in that, the end of described y-axis electricity cylinder is provided with the slide rail in z-axis direction, and described slide rail is used for the vertical sliding motion of z-axis electricity cylinder.
4. a kind of wafer cutting device according to claim 1, is characterized in that, also comprises supplied materials detection module; Described supplied materials detection module comprises control module and CCD inspection material module.
5. a kind of wafer cutting device according to claim 4, is characterized in that, described control module is for the running of the transfer rate and cutting module that control conveyer belt.
6. a kind of wafer cutting device according to claim 1, is characterized in that, the side of described y-axis electricity cylinder is provided with start button and emergency stop switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420861060.8U CN204504515U (en) | 2014-12-31 | 2014-12-31 | A kind of wafer cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420861060.8U CN204504515U (en) | 2014-12-31 | 2014-12-31 | A kind of wafer cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204504515U true CN204504515U (en) | 2015-07-29 |
Family
ID=53702519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420861060.8U Expired - Fee Related CN204504515U (en) | 2014-12-31 | 2014-12-31 | A kind of wafer cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204504515U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104551388A (en) * | 2014-12-31 | 2015-04-29 | 苏州凯锝微电子有限公司 | Wafer cutting device |
-
2014
- 2014-12-31 CN CN201420861060.8U patent/CN204504515U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104551388A (en) * | 2014-12-31 | 2015-04-29 | 苏州凯锝微电子有限公司 | Wafer cutting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 Termination date: 20151231 |
|
| EXPY | Termination of patent right or utility model |