CN104538836A - Liquid refrigeration piece used for high-power semiconductor laser device - Google Patents
Liquid refrigeration piece used for high-power semiconductor laser device Download PDFInfo
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- CN104538836A CN104538836A CN201410846400.4A CN201410846400A CN104538836A CN 104538836 A CN104538836 A CN 104538836A CN 201410846400 A CN201410846400 A CN 201410846400A CN 104538836 A CN104538836 A CN 104538836A
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Abstract
The invention provides a liquid refrigeration piece used for a high-power semiconductor laser device, and particularly provides a macro channel type liquid refrigeration piece. A liquid refrigeration piece body is of an on-chip structure and provided with a water passing area and a chip installation area, wherein the chip installation area is located at one end of the liquid refrigeration piece body and serves as a laser chip installation position, the water passing area is located in the position, close to the chip installation area, of the liquid refrigeration piece body, the water passing area of the liquid refrigeration piece body is divided into a face A and a face B which correspond to each other, the face A and the face B are located on the upper surface and the lower surface of the sheet refrigeration piece body respectively, a plurality of water outlet column holes C are formed in the face A of the water passing area, a plurality of water inlet column holes D are formed in the face B, and the water outlet column holes C of the face A are communicated with the water inlet column holes D of the face B. The liquid refrigeration piece is simple in structure and free of complex structures of microchannels, the through holes are adopted, the requirement for the refrigerant fluid granularity is not high, the risk that liquid refrigeration channels are corroded is low, and the reliability of the whole semiconductor laser device can be improved in the use process.
Description
Technical field
The invention belongs to laser and manufacture field, relate to a kind of liquid refrigerating chip for high-power semiconductor laser, particularly relate to a kind of grand channel-style liquid refrigerating chip.
Background technology
At present, high-power semiconductor laser has been widely used in fields such as industry, national defence, and the market demand is huge, and development prospect is wide.Along with the raising of semiconductor laser power, host material thermal diffusion will cause the change of stress, due to the deposition of heat, can cause the rising of semiconductor laser chip temperature, output wavelength change, make semiconductor laser cisco unity malfunction.In order to improve the power of semiconductor laser, reliability and stability, reducing production cost, must high-efficiency heat radiation structure be designed.Therefore, design and preparation low cost, high efficiency refrigerator are very necessary.
In prior art, the packing forms of power electron-like device has heat transfer cooling type, micro channels liquid refrigeration mode and efficient liquid cooling piece (200910023753.3).For high-power semiconductor laser, adopt the mode of Conduction cooled, radiating efficiency is lower, can cause device lifetime and reliability decrease, generally can only reach the power output of tens watts; According to the mode of micro channels liquid refrigeration, refrigerant liquid need adopt high-quality deionized water, and cost is higher, and long-time use can cause micro-channel tubes wall erosion or blocking, has had a strong impact on the reliability of semiconductor laser.
Chinese patent 200910023753.3 proposes a kind of liquid refrigerating chip architecture, although solve the vessel wall occlusion problem of micro channels liquid refrigeration, radiating effect has much room for improvement, and constrains further raising and the application of the power of semiconductor laser.
Summary of the invention
The object of the invention is to the shortcoming overcoming above-mentioned prior art, a kind of liquid refrigerating chip for high-power semiconductor laser is provided.
The object of the invention is to solve by the following technical programs:
Liquid refrigerating chip for high-power semiconductor laser comprises a cooling piece main body, and cooling piece main body is sheet assembling structure, and this laminated structure comprises upper surface and lower surface; Cooling piece main body is provided with water flowing district and chip installation area, and chip installation area is positioned at one end of liquid refrigerating chip main body, is the position that laser chip is installed; Water flowing district is positioned at the position near chip installation area in cooling piece main body; Mutually corresponding A face and B face are divided in the water flowing of cooling piece main body, and A face and B face lay respectively at upper surface and the lower surface of sheet cooling piece main body, and the A face in water flowing district is provided with multiple water outlet post holes C, B face and is provided with multiple water inlet post holes D; The water outlet post holes C in A face is communicated with the water inlet post holes D in B face.Described A face arranges seal area, is surrounded on around water outlet post holes C, or described B face arranges seal area, seal area is surrounded on around water post holes D, and seal area is the groove of annular, for placing sealing device.
Described cooling piece main body is provided with location hole, is used for fixing liquid refrigerating chip when reality uses.
When the water outlet post holes C in A face and B face intake post holes D one_to_one corresponding, i.e. a water inlet post holes D in the corresponding B face of a water outlet post holes C in A face; Both break-through are formed from A face to the through hole in B face, or for water outlet post holes C with enter post holes D and to interlock through form; The sectional area of described A face water outlet post holes C can be the same with the intake sectional area size of post holes D of B face, also can be less than the sectional area into water post holes D.Described can be petal-shaped from A face to the through hole in B face, also can be cylindrical or irregular polygon etc.
When the number of the water outlet post holes C in A face and the water inlet post holes D in B face is unequal, its corresponded manner can be 1 corresponding N number of water outlet post holes C of water inlet post holes D, N is greater than 1, and the cross-sectional area of water inlet post holes D is not less than the projected area sum of corresponding N number of water outlet post holes C on water inlet post holes D cross section; Also can be M corresponding 1 the water outlet post holes C of water inlet post holes D, M is greater than 1, the cross-sectional area sum of M water inlet post holes D is greater than the projected area sum of M water inlet post holes D on corresponding 1 water outlet post holes C cross section, ensureing that refrigerant liquid has larger pressure difference when flowing through water flowing district, strengthening radiating efficiency.
Time unequal according to the number of the water outlet post holes C in described A face and the water inlet post holes D in B face, the degree of depth of the water outlet post holes C in described A face and the water inlet post holes D in B face is all not less than the half of cooling piece body thickness, water flowing overlapping region is there is in water outlet post holes C with corresponding water inlet post holes D, for the pressure difference of balancing liquid in water flowing district, ensure the refrigeration of liquid optimum.
The water outlet post holes C in described A face and the water inlet post holes D diameter in B face are between 0.3 millimeter to 3.0 millimeters, if the diameter of post holes is excessive, the quantity of post holes can be lacked, and total area of dissipation can be little.The wall thickness that wall thickness between adjacent two the water inlet post holes D in described A face is not less than between 0.2 millimeter or adjacent two the water outlet post holes C in described B face is not less than 0.2 millimeter.
The water inlet post holes D in described A face and the water outlet post holes C in B face can be cylindrical hole, also can be rectangle square column hole, rhombus square column hole or polygon post holes.
Described chip installation area is arranged stress slow release layer, stress slow release layer is arranged on position, chip installation area in the mode of welding or metal bonding.Laser chip welding or metal bonding are on stress slow release layer, and the thermal coefficient of expansion of the material of stress slow release layer mates with laser chip, such as copper tungsten or pottery, and ceramic material is aluminium nitride or beryllium oxide.
The material of aforesaid liquid cooling piece is high thermal conductivity materials, such as copper, diamond, pottery.
The thickness of described liquid refrigerating chip main body is 1.0 millimeters to 10.0 millimeters; Length is 15 millimeters to 30 millimeters; Width is 8.0 millimeters to 30 millimeters.
The present invention has following beneficial effect:
(1) operation and maintenance is simple: this cooling piece does not have Micro Channel Architecture, employing be through hole, less demanding to refrigerating fluid granularity.
(2) making is simple, cost of manufacture is low: structure of the present invention is simple, is easy to machining, thus effectively reduces cost of manufacture.
(3) heat-sinking capability is strong: the present invention adopts liquid refrigerating, uses through hole, and area of dissipation is large, and divide to flow into multiple aperture from macropore and flow out, add turbulivity, heat-sinking capability is strong.
(4) reliability is high: comparing Micro Channel Architecture size due to water route size increases greatly, and therefore the risk that is corroded of refrigerating fluid passage is lower; In addition, add stress slow release layer structure, hard solder can be adopted without indium metallization processes, have high temperature resistant, thermal fatigue resistance, not oxidizable, storage life length, stable performance, the advantage such as reduction electromigration and electric heating migration, drastically increase the reliability of device.
Accompanying drawing explanation
Fig. 1 is the liquid refrigerating chip structural representation for high-power semiconductor laser of the present invention.
Fig. 2 is B face, the water flowing district structural representation of liquid refrigerating chip of the present invention.
Fig. 3 is the embodiment one of the liquid refrigerating chip for high-power semiconductor laser of the present invention.
Fig. 4 is the embodiment two of liquid refrigerating chip of the present invention.
Fig. 5 is B face, the water flowing district schematic diagram of liquid refrigerating chip embodiment two of the present invention.
Fig. 6 is the embodiment three of liquid refrigerating chip of the present invention.
Fig. 7 is B face, the water flowing district schematic diagram of liquid chiller embodiment three of the present invention.
Fig. 8 is liquid chiller embodiment three cross-sectional view of the present invention.
Fig. 9 is the water inlet post holes D of liquid chiller embodiment three of the present invention and the perspective view of water outlet post holes C.
Drawing reference numeral illustrates: 1 is cooling piece main body, and 2 is chip installation area, and 3 is seal area, and 4 is the A face in water flowing district, 5 is the B face in water flowing district, and 6 is water outlet post holes C, and 7 is water inlet post holes D, 8 is stress slow release layer, and 9 is location hole, and 10 is the projection of water inlet post holes D on water outlet post holes C.
Embodiment
The present invention is described in detail below in conjunction with accompanying drawing and concrete embodiment:
Fig. 1 is the structural representation of liquid refrigerating chip of the present invention, and a kind of liquid refrigerating chip for high-power semiconductor laser comprises cooling piece main body 1, and cooling piece main body is sheet assembling structure, and this laminated structure comprises upper surface and lower surface; Cooling piece main body 1 is provided with water flowing district and chip installation area 2, and chip installation area 2 is positioned at one end of liquid refrigerating chip main body 1, is the position that laser chip is installed; Water flowing district is positioned at the position near chip installation area 2 in cooling piece main body 1; Mutually corresponding A face 4 and B face 5 are divided in the water flowing of cooling piece main body, A face 4 and B face 5 lay respectively at upper surface and the lower surface of sheet cooling piece main body, the structure in A face 4 can with reference to B face 5 structural representation of the liquid chiller of figure 2 with reference to the structure in figure 1, B face.The A face 4 in water flowing district is provided with multiple water outlet post holes C 6, B face 5 and is provided with multiple water inlet post holes D 7; The water outlet post holes C 6 in A face is communicated with the water inlet post holes D7 in B face.Described A face 4 arranges seal area 3, is surrounded on water outlet post holes C 6 around, or described B face 5 arranges seal area, seal area is surrounded on around water post holes D7, and seal area 3 is the groove of annular, for placing sealing device.
Fig. 3 is the embodiment one of liquid refrigerating chip of the present invention, and cooling piece main body 1, except comprising the structure in Fig. 1, also comprises location hole 9 and stress slow release layer 8.Location hole 9 is the through hole in cooling piece main body 1, for fixing liquid refrigerating chip.Stress slow release layer 8 is arranged on chip installation area 2, and mounting means is the mode of welding or metal bonding.Laser chip welding or metal bonding are on stress slow release layer 8, and the thermal coefficient of expansion of the material of stress slow release layer 8 mates with laser chip, such as copper tungsten, aluminium nitride ceramics, beryllium oxide ceramics.
Fig. 4 is the embodiment two of liquid refrigerating chip of the present invention, cooling piece main body 1 comprises water flowing district, chip installation area 2 and location hole 9, mutually corresponding A face 4 and face, 5 two, B face are divided in water flowing, A face, water flowing district 4 is provided with multiple water outlet post holes C 6, B face, water flowing district 5 is provided with multiple water inlet post holes D 7, can with reference to the B face structure chart of the embodiment two of figure 5, A face water outlet post holes C 6 and water inlet post holes D 7 one_to_one corresponding, both break-through are formed from A face to the through hole in B face, the shape of described through hole is petal-shaped, water flowing district is arranged in centrosymmetric form, increase contact area when refrigerant liquid flows through water flowing district, add radiating efficiency.
Fig. 6 is the embodiment three of liquid refrigerating chip of the present invention, and the cooling piece main body of liquid refrigerating chip of the present invention comprises water flowing district, chip installation area 2, installing hole 9.The structure chart in the A face 4 of mutual corresponding D and the B face, water flowing district of face, B face 5, A structural reference Fig. 6, B face structural reference Fig. 7 is divided in water flowing.A face, water flowing district 4 is provided with multiple water outlet post holes C 6, B face is provided with multiple water inlet post holes D 7, and the corresponding N number of water outlet post holes C 6 of each water inlet post holes D 7, N is greater than 1, the sectional area that now must meet water inlet post holes D7 is not less than the projection 10 area sum of corresponding N number of water outlet post holes C6 on water inlet post holes D7 cross section, dash area in Fig. 9 is the projection 10 of water outlet post holes C 6 on water inlet post holes D7 cross section, refrigerant liquid can be flowed by dash area, other parts hinder the flowing of refrigerant liquid, ensure that refrigerant liquid has larger pressure difference when flowing through water flowing district, strengthen radiating efficiency.
Fig. 8 is the profile of the liquid refrigerating chip of embodiment three, the degree of depth of the water outlet post holes C 6 in described A face and the water inlet post holes D7 in B face is all not less than the half of cooling piece body thickness, water flowing overlapping region is there is in water outlet post holes C6 with corresponding water inlet post holes D7, namely the degree of depth of post holes D of intaking and the degree of depth of water outlet post holes C have overlapping region, increase the water flowing face into water post holes D and water outlet post holes C, reduce the pressure difference of liquid in water flowing district, in the application of embodiment three can equilibrium pressure poor, ensure the refrigeration of liquid optimum.
The water outlet post holes C in described A face and B face water inlet post holes D diameter are between 0.3 millimeter to 3.0 millimeters, if the diameter of post holes is excessive, the quantity of post holes can be lacked, and total area of dissipation can be little.Wall thickness between adjacent two water inlet post holes D or water outlet post holes C is not less than 0.2 millimeter.
The thickness of described liquid refrigerating chip is 1.0 millimeters to 10.0 millimeters; Length is 15 millimeters to 30 millimeters; Width is 8.0 millimeters to 30 millimeters.
The material of aforesaid liquid cooling piece is high thermal conductivity materials, such as copper, diamond, pottery.
Claims (10)
1. for a liquid refrigerating chip for high-power semiconductor laser, it is characterized in that: comprise cooling piece main body, cooling piece main body is sheet assembling structure, and this laminated structure comprises upper surface and lower surface; Cooling piece main body is provided with water flowing district and chip installation area, and chip installation area is positioned at one end of liquid refrigerating chip main body, is the position that laser chip is installed; Water flowing district is positioned at the position near chip installation area in cooling piece main body; Mutually corresponding A face and face, two, B face are divided in the water flowing of cooling piece main body, described A face and described B face lay respectively at upper surface and the lower surface of sheet cooling piece main body, described A face is provided with multiple water outlet post holes C, and described B face is provided with multiple water inlet post holes D; The water outlet post holes C in described A face is communicated with the water inlet post holes D in described B face.
2. a kind of liquid refrigerating chip for high-power semiconductor laser according to claim 1, it is characterized in that: the water outlet post holes C in described A face and described B face intake post holes D one_to_one corresponding, both break-through are formed from A face to the through hole in B face, and the cross-sectional area of water outlet post holes C is equal to or less than the cross-sectional area into water post holes D.
3. a kind of liquid refrigerating chip for high-power semiconductor laser according to claim 1, it is characterized in that: the intake corresponded manner of post holes D of water outlet post holes C and the described B face in described A face is 1 corresponding N number of water outlet post holes C of post holes D of intaking, and N is greater than 1; Or the intake corresponded manner of post holes D of the water outlet post holes C in described A face and described B face is M corresponding 1 the water outlet post holes C of post holes D of intaking, the cross-sectional area sum that M is greater than 1, M water inlet post holes D is greater than the projected area sum of M water inlet post holes D on corresponding 1 water outlet post holes C cross section.
4. according to a kind of liquid refrigerating chip for high-power semiconductor laser one of claim 1-3 Suo Shu, it is characterized in that: described A face arranges seal area, the environmental seal district being surrounded on water outlet post holes C is the groove of annular, for placing sealing device; Or described B face arranges seal area, and seal area is surrounded on around water post holes D, seal area is the groove of annular, for placing sealing device.
5. according to a kind of liquid refrigerating chip for high-power semiconductor laser one of claim 1-3 Suo Shu, it is characterized in that: described cooling piece main body is provided with location hole, for fixing liquid refrigerating chip.
6. a kind of liquid refrigerating chip for high-power semiconductor laser according to claim 2, is characterized in that: described is petal-shaped from A face to the shape of through holes in B face, or cylindrical, or irregularly shaped.
7. a kind of liquid refrigerating chip for high-power semiconductor laser according to claim 3, it is characterized in that: the degree of depth of the water outlet post holes C in described A face and the water inlet post holes D in described B face is all not less than the half of cooling piece body thickness, and the water outlet post holes C in A face exists water flowing overlapping region with the water inlet post holes D in corresponding B face.
8. a kind of liquid refrigerating chip for high-power semiconductor laser according to claim 3, is characterized in that: the water outlet post holes C in described A face and the water inlet post holes D shape in B face are column type, or rectangle, or rhombus, or polygon.
9. according to a kind of liquid refrigerating chip for high-power semiconductor laser one of claim 1-3 Suo Shu, it is characterized in that: described chip installation area is arranged stress slow release layer, described stress slow release layer is arranged on chip installation area in the mode of welding or metal bonding, and the material of stress slow release layer is copper tungsten, aluminium nitride or beryllium oxide.
10. according to a kind of liquid refrigerating chip for high-power semiconductor laser one of claim 1-3 Suo Shu, it is characterized in that: the thickness of described liquid refrigerating chip main body is 1.0 millimeters-10.0 millimeters; Length is 15 millimeters-30 millimeters; Width is 8.0 millimeters-30 millimeters; The water outlet post holes C in described A face and the water inlet post holes D diameter in B face are at 0.3 millimeter-3.0 millimeters; The wall thickness that wall thickness between adjacent two the water inlet post holes D in described A face is not less than between 0.2 millimeter or adjacent two the water outlet post holes C in described B face is not less than 0.2 millimeter.
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| CN201410846400.4A CN104538836B (en) | 2014-12-31 | 2014-12-31 | A kind of liquid refrigerating chip for high-power semiconductor laser |
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| CN104538836B CN104538836B (en) | 2018-02-02 |
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| CN107800028A (en) * | 2017-11-28 | 2018-03-13 | 武汉锐科光纤激光技术股份有限公司 | A kind of cooling structure for high power pump source |
| CN113363802A (en) * | 2021-01-29 | 2021-09-07 | 安徽科技学院 | High-power semiconductor laser lens cooling system |
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Address after: 710077 high power semiconductor laser Industrial Park, Shaanxi, Xi'an, Shaanxi Province, No. 86, No. 56 Applicant after: FOCUSLIGHT TECHNOLOGIES INC. Address before: 710077 Shaanxi province hi tech Zone, Xi'an Province, No. 86, No. 56, high power semiconductor laser industry park Applicant before: Xi'an Focuslight Technology Co., Ltd. |
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