CN104507264B - It is a kind of to be used for the manufacture craft of 30 microns of fine-lines - Google Patents
It is a kind of to be used for the manufacture craft of 30 microns of fine-lines Download PDFInfo
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- CN104507264B CN104507264B CN201410849439.1A CN201410849439A CN104507264B CN 104507264 B CN104507264 B CN 104507264B CN 201410849439 A CN201410849439 A CN 201410849439A CN 104507264 B CN104507264 B CN 104507264B
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Abstract
It is used for the manufacture craft of 30 microns of fine-lines the invention discloses a kind of, comprises the following steps：（1）Pre-treatment；（2）Press mold；（3）Exposure；（4）Development；（5）Etching；（6）Corresponding etching to compensate.By the above-mentioned means, the present invention has the advantages that modern design, delicate execution, production efficiency stabilization, qualification rate are high for the manufacture craft of 30 microns of fine-lines, there are extensive market prospects in the popularization of the manufacture craft for 30 microns of fine-lines.
Description
Technical field
Field is made the present invention relates to wiring board, it is more particularly to a kind of to be used for the manufacture craft of 30 microns of fine-lines.
Background technology
In circuit board industry, the fast development of miniaturization of electronic products and TP (touch-screen) industry, FPC（FPC）
Also high density, miniaturization development have been pushed to, original minimum line width/line-spacing can not expire for 50um/50um growth requirement
The development of sufficient market processing procedure, therefore research to fine-line and make and arrived urgent period.
The content of the invention
The present invention solves the technical problem of provide it is a kind of be used for the manufacture craft of 30 microns of fine-lines, by adopting
With the condition and parameter for controlling each step, so that overall flow optimization design, production efficiency is stable, qualification rate is high,
There are extensive market prospects in popularization for the manufacture craft of 30 microns of fine-lines.
In order to solve the above technical problems, the present invention provide it is a kind of be used for the manufacture craft of 30 microns of fine-lines, including with
Lower step：
（1）Pre-treatment：From 9um thin copper foil as make 30um line widths line-spacing plate, etching can be effectively reduced
The depth of groove, while also reducing pool effect, chooses the black glue piece film or the glass film, and be that 12-18 is micro- from thickness
The dry film of rice；
（2）Press mold：Press mold processing is carried out using wet press, water replaces the air being attached in the coarse space of copper face, plasticizing
Macromolecule photoresistive surface, dissolve each other with macromolecule photoresistance, form high molecular mixture, to control temperature be 90-98 DEG C, pressure is 4-
5kg, speed are that 1-1.5m/min, hydraulic pressure are that 0.5-1.0kg, water-carrying capacity are 40-60cc/min；
（3）Exposure：It is exposed using parallel exposing machine, setting exposure parameter is 30000mJ, energy gage is arranged on 9-11
Lattice；
（4）Development：Speed control is that 3.5m/min, breakpoint are that 40-70% is developed；
（5）Etching：Control etching breakpoint to be more than 85%, etching factor to be 4-6, keep the speed of whole line width etching consistent；
（6）Corresponding etching to compensate：
（a）For the independent lines of the most side of dense wire two, the single edge of circuit is compensated to more than 35 microns toward outside,
（b）It is overall to increase at least 5 microns of corner's line width for dense wire lead corner,
（c）It is thin for independent lines, line width is compensated to more than 35 microns.
In a preferred embodiment of the present invention, step（1）In the dry film thickness be 15 microns.
In a preferred embodiment of the present invention, step（2）In press mold condition be temperature be 95 DEG C, pressure be 4.2kg,
Speed is that 1.2m/min, hydraulic pressure are that 0.7kg, water-carrying capacity are 50cc/min.
In a preferred embodiment of the present invention, step（2）Middle use pure water, to go removing chloride influence, keep
Water pipe cleans, avoids the generation of incrustation scale, avoids water from being stained with roller and conveying device, the cleaning for keeping film laminator.
In a preferred embodiment of the present invention, step（3）In energy gage be arranged on 11 lattice.
In a preferred embodiment of the present invention, step（4）In the breakpoint be 65%.
In a preferred embodiment of the present invention, step（5）The uniformity of middle etching is more than 95%.
In a preferred embodiment of the present invention, step（a）The middle independent lines by the most side of dense wire two are mended toward outside
Repay to 40 microns.
In a preferred embodiment of the present invention, step（b）It is middle that dense wire lead turning is integrally increased 10 microns.
In a preferred embodiment of the present invention, step（c）The middle line width that independent lines are thin is compensated to 50 microns.
The beneficial effects of the invention are as follows：The manufacture craft that the present invention is used for 30 microns of fine-lines has novel in design, essence
The advantages of thin making, production efficiency are stably, qualification rate is high, have in the popularization of the manufacture craft for 30 microns of fine-lines
Extensive market prospects.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, it can also obtain other according to these accompanying drawings
Accompanying drawing, wherein：
Fig. 1 is a kind of schematic flow sheet for the manufacture craft that present invention is used for 30 microns of fine-lines.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
Referring to Fig. 1, the embodiment of the present invention includes：
It is a kind of to be used for the manufacture craft of 30 microns of fine-lines, comprise the following steps：
（1）Pre-treatment：From 9um thin copper foil as make 30um line widths line-spacing plate, etching can be effectively reduced
The depth of groove, while also reducing pool effect, chooses the black glue piece film or the glass film, and be that 12-18 is micro- from thickness
The dry film of rice；The making of 30um fine-lines, the experience of etching fine-line is taken charge of according to me, copper foil is more thin more is conducive to fine-line
Making, the depth of etched recesses can be effectively reduced from ultra-thin copper, while pool effect is also reduced, so from 9um
Thin copper foil make 30um line width line-spacing plate；The film that exploitation test is used is common Kodak's black film, and the later stage can basis
Volume production demand is used can all have better than black glue piece in the glass film, the circuit effect such as light leak rate, refractive index, the halation of the glass film
The film；The thickness of dry film also determines the depth of etched recesses, at the same the consideration analytically spent be also need by dry film selection compared with
It is thin to meet parsing 30um/30um line widths/line-spacing, but because the thickness of dry film equally determines the size of adhesive force, can not
The thin of dry film is pursued simply, so doing resolution contrast survey to dry film in advance from 15um and 20um FX915 and FX920
Examination, as a result shows that 15um dry film is better than 20um dry film；
（2）Press mold：Press mold processing is carried out using wet press, water replaces the air being attached in the coarse space of copper face, plasticizing
Macromolecule photoresistive surface, dissolve each other with macromolecule photoresistance, form high molecular mixture, to control temperature be 90-98 DEG C, pressure is 4-
5kg, speed are that 1-1.5m/min, hydraulic pressure are that 0.5-1.0kg, water-carrying capacity are 40-60cc/min；
（3）Exposure：It is exposed using parallel exposing machine, setting exposure parameter is 30000mJ, energy gage is arranged on 9-11
Lattice；
（4）Development：Control of the roughness and dry film of good copper face to energy brings preferable dry film adhesive force and development
Parsing effect, speed control is that 3.5m/min, breakpoint are that 40-70% is developed；
（5）Etching：Control the speed that etching breakpoint is 4-6 more than 85%, etching factor, the whole line width of holding is etched unanimously,
Optimal etch uniformity is found by calculating and testing:Improve the etch uniformity sprayed above and below etching, whole line width etching
Speed it is consistent, keep etch copper thickness average, by the uniformity controlling of etching more than 95%；
（6）Corresponding etching to compensate：
（a）For the independent lines of the most side of dense wire two, the single edge of circuit is compensated to more than 35 microns toward outside,
（b）It is overall to increase at least 5 microns of corner's line width for dense wire lead corner,
（c）It is thin for independent lines, line width is compensated to more than 35 microns.
Preferably, step（1）In the dry film thickness be 15 microns.
Preferably, step（2）In press mold condition be temperature be 95 DEG C, pressure be that 4.2kg, speed are 1.2m/min, water
Pressure is that 0.7kg, water-carrying capacity are 50cc/min.
Preferably, step（2）Middle use pure water, to go removing chloride influence, the cleaning of holding water pipe, avoid incrustation scale
Produce, avoid water from being stained with roller and conveying device, the cleaning for keeping film laminator.
Preferably, step（3）In energy gage be arranged on 11 lattice.
Preferably, step（4）In the breakpoint be 65%.
Preferably, step（5）The uniformity of middle etching is more than 95%.
Preferably, step（a）The middle independent lines by the most side of dense wire two are compensated to 40 microns toward outside.
Preferably, step（b）It is middle that dense wire lead turning is integrally increased 10 microns.
Preferably, step（c）The middle line width that independent lines are thin is compensated to 50 microns.
The beneficial effect that the present invention is used for the manufacture craft of 30 microns of fine-lines is：
First, find to imitate in line width/line-spacing 30um/30um parsing by the resolution test to FX915 and FX920 dry films
Really see, the parsing effect dry film edge-smoothing of FX915 dry films, totally；And the parsing effect line edges of FX920 dry films are obscured,
It is not smooth enough, and sawtooth presence, it is unfavorable for the well resolved effect of test；Thin dry film is advantageously in etching work procedure solution simultaneously
Analysis, so the dry film specifically selected, which is Du Pont 15um as exploitation, mainly uses dry film, excellent performance；
2nd, optimal etch uniformity is found by calculating and testing:The etch uniformity sprayed above and below etching is improved, it is whole
The speed of individual line width etching is consistent, keeps etch copper thickness average, by the uniformity controlling of etching more than 95%；
3rd, by using RTR processing procedures in follow-up make, the degree with automation, production efficiency are stable, qualification rate is high
Advantage, so it is the most suitable subsequently to make fine-line.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (10)
1. a kind of be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that comprises the following steps：
（1）Pre-treatment：From 9um thin copper foil as make 30um line widths line-spacing plate, etched recesses can be effectively reduced
Depth, while also reduce pool effect, choose the black glue piece film or the glass film, and be 12-18 microns from thickness
Dry film；
（2）Press mold：Press mold processing is carried out using wet press, water displacement is attached to air, plasticizing high score in the coarse space of copper face
Sub- photoresistive surface, dissolve each other with macromolecule photoresistance, form high molecular mixture, to control temperature be 90-98 DEG C, pressure be 4-5kg,
Speed is that 1-1.5m/min, hydraulic pressure are that 0.5-1.0kg, water-carrying capacity are 40-60cc/min；
（3）Exposure：It is exposed using parallel exposing machine, setting exposure parameter is 30000mJ, energy gage is arranged on 9-11 lattice；
（4）Development：Speed control is that 3.5m/min, breakpoint are that 40-70% is developed；
（5）Etching：Control etching breakpoint to be more than 85%, etching factor to be 4-6, keep the speed of whole line width etching consistent；
（6）Corresponding etching to compensate：
（a）For the independent lines of the most side of dense wire two, the single edge of circuit is compensated to more than 35 microns toward outside,
（b）It is overall to increase at least 5 microns of corner's line width for dense wire lead corner,
（c）It is thin for independent lines, line width is compensated to more than 35 microns.
2. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（1）In
The thickness of the dry film is 15 microns.
3. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（2）In
Press mold condition be temperature be 95 DEG C, pressure be that 4.2kg, speed are that 1.2m/min, hydraulic pressure are that 0.7kg, water-carrying capacity are 50cc/min.
4. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（2）In adopt
With pure water, to go, removing chloride is influenceed, holding water pipe is cleaned, avoid the generation of incrustation scale, avoid water from being stained with roller and conveying
Device, the cleaning for keeping film laminator.
5. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（3）In
Energy gage is arranged on 11 lattice.
6. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（4）In
The breakpoint is 65%.
7. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（5）Middle erosion
The uniformity at quarter is more than 95%.
8. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（a）It is middle to incite somebody to action
The independent lines of the most side of dense wire two are compensated to 40 microns toward outside.
9. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（b）It is middle to incite somebody to action
Dense wire lead turning integrally increases 10 microns.
10. according to claim 1 be used for the manufacture craft of 30 microns of fine-lines, it is characterised in that step（c）It is middle to incite somebody to action
The thin line width of independent lines is compensated to 50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410849439.1A CN104507264B (en) | 2014-12-31 | 2014-12-31 | It is a kind of to be used for the manufacture craft of 30 microns of fine-lines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410849439.1A CN104507264B (en) | 2014-12-31 | 2014-12-31 | It is a kind of to be used for the manufacture craft of 30 microns of fine-lines |
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| Publication Number | Publication Date |
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| CN104507264A CN104507264A (en) | 2015-04-08 |
| CN104507264B true CN104507264B (en) | 2017-10-20 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107877108B (en) * | 2017-12-05 | 2019-09-03 | 扬州华盟电子有限公司 | A kind of heat dissipation metal mould group and preparation method thereof |
| CN108024455A (en) * | 2017-12-14 | 2018-05-11 | 悦虎电路(苏州)有限公司 | A kind of production method of 1.5mil wiring boards |
| CN108024454A (en) * | 2017-12-14 | 2018-05-11 | 悦虎电路(苏州)有限公司 | A kind of line build-out method based on 1.5mil wiring boards |
| CN109219251B (en) * | 2018-08-30 | 2020-11-13 | 广州广合科技股份有限公司 | Manufacturing method of fine circuit of flexible circuit board |
| CN109152229A (en) * | 2018-10-22 | 2019-01-04 | 台山市精诚达电路有限公司 | A kind of production method of flex circuit application |
| CN109348626A (en) * | 2018-10-23 | 2019-02-15 | 同健(惠阳)电子有限公司 | A kind of technology of wiring board dynamic compensation |
| CN111200912B (en) * | 2020-03-02 | 2021-08-03 | 厦门弘信电子科技集团股份有限公司 | Precision-improved fine line manufacturing method |
Citations (3)
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|---|---|---|---|---|
| CN103068174A (en) * | 2011-10-24 | 2013-04-24 | 悦虎电路(苏州)有限公司 | Manufacturing method for metallization slotted hole circuit board |
| CN104080275A (en) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | Method for manufacturing stepped circuit board |
| CN104105354A (en) * | 2013-04-15 | 2014-10-15 | 上海嘉捷通电路科技有限公司 | Method of manufacturing high-aperture ratio fine printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006015198A1 (en) * | 2006-04-01 | 2007-10-11 | Semikron Elektronik Gmbh & Co. Kg | Connecting device for electronic components |
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2014
- 2014-12-31 CN CN201410849439.1A patent/CN104507264B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068174A (en) * | 2011-10-24 | 2013-04-24 | 悦虎电路(苏州)有限公司 | Manufacturing method for metallization slotted hole circuit board |
| CN104105354A (en) * | 2013-04-15 | 2014-10-15 | 上海嘉捷通电路科技有限公司 | Method of manufacturing high-aperture ratio fine printed circuit board |
| CN104080275A (en) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | Method for manufacturing stepped circuit board |
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| CN104507264A (en) | 2015-04-08 |
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Address after: 215011 No.189, Jinfeng Road, high tech Zone, Suzhou City, Jiangsu Province Patentee after: Fulaiying Electronics Co.,Ltd. Address before: 215000 Xiangcheng District Huangqiao headquarters economic Park, Suzhou, Jiangsu Patentee before: FOREWIN FPC (SUZHOU) Co.,Ltd. |