CN104485407A - 一种带控制芯片的led灯 - Google Patents
一种带控制芯片的led灯 Download PDFInfo
- Publication number
- CN104485407A CN104485407A CN201410571430.9A CN201410571430A CN104485407A CN 104485407 A CN104485407 A CN 104485407A CN 201410571430 A CN201410571430 A CN 201410571430A CN 104485407 A CN104485407 A CN 104485407A
- Authority
- CN
- China
- Prior art keywords
- led
- control chip
- chip
- substrate
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000001681 protective effect Effects 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 230000001012 protector Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410571430.9A CN104485407B (zh) | 2014-10-23 | 2014-10-23 | 一种带控制芯片的led灯 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410571430.9A CN104485407B (zh) | 2014-10-23 | 2014-10-23 | 一种带控制芯片的led灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104485407A true CN104485407A (zh) | 2015-04-01 |
CN104485407B CN104485407B (zh) | 2017-05-24 |
Family
ID=52759932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410571430.9A Expired - Fee Related CN104485407B (zh) | 2014-10-23 | 2014-10-23 | 一种带控制芯片的led灯 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104485407B (zh) |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000133844A (ja) * | 1998-10-26 | 2000-05-12 | Omron Corp | 積層基板構造及び同構造を用いた光デバイス |
JP2005039167A (ja) * | 2003-07-15 | 2005-02-10 | Macroblock Inc | 駆動集積回路チップ内蔵の発光半導体素子 |
CN101154656A (zh) * | 2006-09-30 | 2008-04-02 | 香港微晶先进封装技术有限公司 | 多芯片发光二极管模组结构及其制造方法 |
CN101392896A (zh) * | 2007-09-21 | 2009-03-25 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管 |
CN201494096U (zh) * | 2009-08-28 | 2010-06-02 | 珠海天威飞马打印耗材有限公司 | 一种芯片固定结构 |
CN102054829A (zh) * | 2010-11-05 | 2011-05-11 | 深圳市华星光电技术有限公司 | 发光二极管封装构造 |
CN102064172A (zh) * | 2010-11-10 | 2011-05-18 | 瑞声声学科技(深圳)有限公司 | 发光二极体封装构造 |
CN102082142A (zh) * | 2009-11-30 | 2011-06-01 | 光明电子有限公司 | 封装结构 |
DE102012101560A1 (de) * | 2011-10-27 | 2013-05-02 | Epcos Ag | Leuchtdiodenvorrichtung |
CN203760472U (zh) * | 2013-12-17 | 2014-08-06 | 四川新力光源股份有限公司 | 一种系统级led封装器件 |
CN204167355U (zh) * | 2014-10-23 | 2015-02-18 | 浙江寰龙电子技术有限公司 | 一种带控制芯片的led灯 |
-
2014
- 2014-10-23 CN CN201410571430.9A patent/CN104485407B/zh not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000133844A (ja) * | 1998-10-26 | 2000-05-12 | Omron Corp | 積層基板構造及び同構造を用いた光デバイス |
JP2005039167A (ja) * | 2003-07-15 | 2005-02-10 | Macroblock Inc | 駆動集積回路チップ内蔵の発光半導体素子 |
CN101154656A (zh) * | 2006-09-30 | 2008-04-02 | 香港微晶先进封装技术有限公司 | 多芯片发光二极管模组结构及其制造方法 |
CN101392896A (zh) * | 2007-09-21 | 2009-03-25 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管 |
CN201494096U (zh) * | 2009-08-28 | 2010-06-02 | 珠海天威飞马打印耗材有限公司 | 一种芯片固定结构 |
CN102082142A (zh) * | 2009-11-30 | 2011-06-01 | 光明电子有限公司 | 封装结构 |
CN102054829A (zh) * | 2010-11-05 | 2011-05-11 | 深圳市华星光电技术有限公司 | 发光二极管封装构造 |
CN102064172A (zh) * | 2010-11-10 | 2011-05-18 | 瑞声声学科技(深圳)有限公司 | 发光二极体封装构造 |
DE102012101560A1 (de) * | 2011-10-27 | 2013-05-02 | Epcos Ag | Leuchtdiodenvorrichtung |
CN203760472U (zh) * | 2013-12-17 | 2014-08-06 | 四川新力光源股份有限公司 | 一种系统级led封装器件 |
CN204167355U (zh) * | 2014-10-23 | 2015-02-18 | 浙江寰龙电子技术有限公司 | 一种带控制芯片的led灯 |
Also Published As
Publication number | Publication date |
---|---|
CN104485407B (zh) | 2017-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: He Jiebin Inventor before: Wu Yong Inventor before: Lin Song |
|
COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170111 Address after: Feng Qi Cun Pu Qi Wang Chuan Zhen Huian County, Fujian province 362103 No. 222 Applicant after: He Jiebin Address before: District Zhejiang Huanlong Electronic Technology Co. Ltd. 313100 Zhejiang city of Huzhou province Changxing County Xian Xiang Industry Applicant before: ZHEJIANG HUANLONG ELECTRONIC TECHNOLOGY CO.,LTD. |
|
CB03 | Change of inventor or designer information |
Inventor after: Chen Yuhua Inventor before: He Jiebin |
|
CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170328 Address after: 551700 Bijie Economic Development Zone, Jinsha County, Guizhou Province Electronic Information Industry Park C District, building 16 Applicant after: GUIZHOU XINGHAOHUA ELECTRONIC TECHNOLOGY CO.,LTD. Address before: Feng Qi Cun Pu Qi Wang Chuan Zhen Huian County, Fujian province 362103 No. 222 Applicant before: He Jiebin |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170524 Termination date: 20211023 |
|
CF01 | Termination of patent right due to non-payment of annual fee |