CN104465879A - 一种太阳能电池的双面钝化方法 - Google Patents
一种太阳能电池的双面钝化方法 Download PDFInfo
- Publication number
- CN104465879A CN104465879A CN201410775995.9A CN201410775995A CN104465879A CN 104465879 A CN104465879 A CN 104465879A CN 201410775995 A CN201410775995 A CN 201410775995A CN 104465879 A CN104465879 A CN 104465879A
- Authority
- CN
- China
- Prior art keywords
- semiconductor device
- passivation
- device substrates
- double surfaces
- reaction chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000002161 passivation Methods 0.000 title claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 239000004065 semiconductor Substances 0.000 claims abstract description 54
- 238000006243 chemical reaction Methods 0.000 claims abstract description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000010703 silicon Substances 0.000 claims abstract description 28
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 28
- 238000000151 deposition Methods 0.000 claims abstract description 27
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 25
- 238000000137 annealing Methods 0.000 claims description 25
- 239000007789 gas Substances 0.000 claims description 20
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 18
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 4
- 230000008021 deposition Effects 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 5
- 239000012495 reaction gas Substances 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- 238000007725 thermal activation Methods 0.000 abstract 1
- 238000007740 vapor deposition Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 38
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 12
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- -1 during individualism Inorganic materials 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410775995.9A CN104465879B (zh) | 2014-12-15 | 2014-12-15 | 一种太阳能电池的双面钝化方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410775995.9A CN104465879B (zh) | 2014-12-15 | 2014-12-15 | 一种太阳能电池的双面钝化方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104465879A true CN104465879A (zh) | 2015-03-25 |
CN104465879B CN104465879B (zh) | 2017-11-10 |
Family
ID=52911611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201410775995.9A Active CN104465879B (zh) | 2014-12-15 | 2014-12-15 | 一种太阳能电池的双面钝化方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104465879B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106531848A (zh) * | 2016-12-30 | 2017-03-22 | 常州大学 | 基于黑硅的隧穿接触太阳能电池在线式制备设备 |
CN106531847A (zh) * | 2016-12-29 | 2017-03-22 | 常州大学 | 基于黑硅的隧穿接触太阳能电池在线式制备设备 |
CN108767070A (zh) * | 2018-06-27 | 2018-11-06 | 晶科能源科技(海宁)有限公司 | 一种光伏双面电池的新型退火方法 |
CN108878289A (zh) * | 2018-06-15 | 2018-11-23 | 常州亿晶光电科技有限公司 | 高效电池退火工艺 |
CN111129214A (zh) * | 2019-12-13 | 2020-05-08 | 阳光中科(福建)能源股份有限公司 | 一种制作n型pert双面太阳电池及其制备工艺 |
CN112670374A (zh) * | 2020-12-31 | 2021-04-16 | 广东爱旭科技有限公司 | 一种晶硅太阳能电池低压退火方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1834288A (zh) * | 2006-04-07 | 2006-09-20 | 中国科学院上海硅酸盐研究所 | 一种低温化学气相沉积制备氮化硅薄膜的方法 |
CN102136518A (zh) * | 2011-02-21 | 2011-07-27 | 芜湖明远新能源科技有限公司 | 双面钝化高效硅太阳电池及工艺流程 |
US20120291863A1 (en) * | 2011-05-19 | 2012-11-22 | Suh Dong-Chul | Solar cell and manufacturing method thereof |
CN103413860A (zh) * | 2013-07-17 | 2013-11-27 | 湖南红太阳光电科技有限公司 | 一种局域背面钝化晶体硅电池的制备方法 |
-
2014
- 2014-12-15 CN CN201410775995.9A patent/CN104465879B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1834288A (zh) * | 2006-04-07 | 2006-09-20 | 中国科学院上海硅酸盐研究所 | 一种低温化学气相沉积制备氮化硅薄膜的方法 |
CN102136518A (zh) * | 2011-02-21 | 2011-07-27 | 芜湖明远新能源科技有限公司 | 双面钝化高效硅太阳电池及工艺流程 |
US20120291863A1 (en) * | 2011-05-19 | 2012-11-22 | Suh Dong-Chul | Solar cell and manufacturing method thereof |
CN103413860A (zh) * | 2013-07-17 | 2013-11-27 | 湖南红太阳光电科技有限公司 | 一种局域背面钝化晶体硅电池的制备方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106531847A (zh) * | 2016-12-29 | 2017-03-22 | 常州大学 | 基于黑硅的隧穿接触太阳能电池在线式制备设备 |
CN106531848A (zh) * | 2016-12-30 | 2017-03-22 | 常州大学 | 基于黑硅的隧穿接触太阳能电池在线式制备设备 |
CN108878289A (zh) * | 2018-06-15 | 2018-11-23 | 常州亿晶光电科技有限公司 | 高效电池退火工艺 |
CN108878289B (zh) * | 2018-06-15 | 2021-09-14 | 常州亿晶光电科技有限公司 | 高效电池退火工艺 |
CN108767070A (zh) * | 2018-06-27 | 2018-11-06 | 晶科能源科技(海宁)有限公司 | 一种光伏双面电池的新型退火方法 |
CN111129214A (zh) * | 2019-12-13 | 2020-05-08 | 阳光中科(福建)能源股份有限公司 | 一种制作n型pert双面太阳电池及其制备工艺 |
CN112670374A (zh) * | 2020-12-31 | 2021-04-16 | 广东爱旭科技有限公司 | 一种晶硅太阳能电池低压退火方法 |
Also Published As
Publication number | Publication date |
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CN104465879B (zh) | 2017-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160530 Address after: 101204 Beijing city Pinggu District No. 316 West Industrial Square Applicant after: Beijing Flight Boda Electronics Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Applicant before: Qixinghuachuang Electronic Co., Ltd., Beijing |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190717 Address after: 100176 No. 8 Wenchang Avenue, Daxing Economic and Technological Development Zone, Beijing Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 101204 Beijing city Pinggu District No. 316 West Industrial Square Patentee before: Beijing Flight Boda Electronics Ltd. |