CN104439724A - 一种在陶瓷基板上利用激光加工导电通道的方法 - Google Patents
一种在陶瓷基板上利用激光加工导电通道的方法 Download PDFInfo
- Publication number
- CN104439724A CN104439724A CN201410626931.2A CN201410626931A CN104439724A CN 104439724 A CN104439724 A CN 104439724A CN 201410626931 A CN201410626931 A CN 201410626931A CN 104439724 A CN104439724 A CN 104439724A
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- Prior art keywords
- ceramic substrate
- laser
- lasers
- conductive channel
- laser processing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410626931.2A CN104439724B (zh) | 2014-11-10 | 2014-11-10 | 一种在陶瓷基板上利用激光加工导电通道的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410626931.2A CN104439724B (zh) | 2014-11-10 | 2014-11-10 | 一种在陶瓷基板上利用激光加工导电通道的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104439724A true CN104439724A (zh) | 2015-03-25 |
CN104439724B CN104439724B (zh) | 2016-06-29 |
Family
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Family Applications (1)
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CN201410626931.2A Expired - Fee Related CN104439724B (zh) | 2014-11-10 | 2014-11-10 | 一种在陶瓷基板上利用激光加工导电通道的方法 |
Country Status (1)
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CN (1) | CN104439724B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105489559A (zh) * | 2015-11-30 | 2016-04-13 | 中国电子科技集团公司第五十五研究所 | 一种微波功率管用氮化铝基板及其制造方法 |
CN106238918A (zh) * | 2016-09-27 | 2016-12-21 | 广东工业大学 | 一种超声辅助激光的陶瓷刻蚀系统及方法 |
JP2018101762A (ja) * | 2016-12-22 | 2018-06-28 | 日亜化学工業株式会社 | セラミック基板の製造方法、発光装置の製造方法 |
CN108568606A (zh) * | 2017-12-11 | 2018-09-25 | 武汉帝尔激光科技股份有限公司 | 一种mwt电池激光开孔及除渣方法及设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020102745A1 (en) * | 2000-08-03 | 2002-08-01 | Institute Of Materials Research & Engineering | Process for modifying chip assembly substrates |
JP2004241771A (ja) * | 2003-02-04 | 2004-08-26 | Internatl Business Mach Corp <Ibm> | 電子パッケージ修正プロセス |
CN103094126A (zh) * | 2013-01-16 | 2013-05-08 | 东莞市凯昶德电子科技股份有限公司 | 陶瓷元器件细微立体导电线路的制备方法 |
CN103188877A (zh) * | 2013-03-05 | 2013-07-03 | 深圳光韵达光电科技股份有限公司 | 一种陶瓷线路板快速高柔性制作的方法 |
CN103429010A (zh) * | 2012-05-25 | 2013-12-04 | 大毅科技股份有限公司 | 陶瓷散热基板导电插孔的形成方法 |
-
2014
- 2014-11-10 CN CN201410626931.2A patent/CN104439724B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020102745A1 (en) * | 2000-08-03 | 2002-08-01 | Institute Of Materials Research & Engineering | Process for modifying chip assembly substrates |
JP2004241771A (ja) * | 2003-02-04 | 2004-08-26 | Internatl Business Mach Corp <Ibm> | 電子パッケージ修正プロセス |
CN103429010A (zh) * | 2012-05-25 | 2013-12-04 | 大毅科技股份有限公司 | 陶瓷散热基板导电插孔的形成方法 |
CN103094126A (zh) * | 2013-01-16 | 2013-05-08 | 东莞市凯昶德电子科技股份有限公司 | 陶瓷元器件细微立体导电线路的制备方法 |
CN103188877A (zh) * | 2013-03-05 | 2013-07-03 | 深圳光韵达光电科技股份有限公司 | 一种陶瓷线路板快速高柔性制作的方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105489559A (zh) * | 2015-11-30 | 2016-04-13 | 中国电子科技集团公司第五十五研究所 | 一种微波功率管用氮化铝基板及其制造方法 |
CN105489559B (zh) * | 2015-11-30 | 2018-01-16 | 中国电子科技集团公司第五十五研究所 | 一种微波功率管用氮化铝基板及其制造方法 |
CN106238918A (zh) * | 2016-09-27 | 2016-12-21 | 广东工业大学 | 一种超声辅助激光的陶瓷刻蚀系统及方法 |
JP2018101762A (ja) * | 2016-12-22 | 2018-06-28 | 日亜化学工業株式会社 | セラミック基板の製造方法、発光装置の製造方法 |
CN108568606A (zh) * | 2017-12-11 | 2018-09-25 | 武汉帝尔激光科技股份有限公司 | 一种mwt电池激光开孔及除渣方法及设备 |
Also Published As
Publication number | Publication date |
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CN104439724B (zh) | 2016-06-29 |
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Effective date of registration: 20170814 Address after: 523000, building 4, building 1, building 407, innovation and Technology Park, Songshan hi tech Industrial Development Zone, Dongguan, Guangdong Patentee after: Dongguan Yanyuan Investment Co.,Ltd. Address before: 523000, room 418, building 1, Songshan science and Technology Park, Songshan Lake, Guangdong, Dongguan Patentee before: Dongguan Institute of Opto-Electronics Peking University |
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Effective date of registration: 20171214 Address after: Wujiang District of Suzhou City, Jiangsu province 215000 Lili town FENHU Road No. 558 Patentee after: SINOPOWER SEMICONDUCTOR CO.,LTD. Address before: 523000, building 4, building 1, building 407, innovation and Technology Park, Songshan hi tech Industrial Development Zone, Dongguan, Guangdong Patentee before: Dongguan Yanyuan Investment Co.,Ltd. |
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Granted publication date: 20160629 Termination date: 20211110 |
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CF01 | Termination of patent right due to non-payment of annual fee |