CN104422393A - Laser sensor measuring displacement - Google Patents

Abstract

The invention relates to a laser sensor measuring displacement. The sensor comprises a semiconductor laser, a lens, two sets of lens groups, a spectroscope, an optical path detector, a linear CMOS array device, a signal processor, a tuning knob, a red optical filter, and an housing. The operating principle is an optical triangle method. Light emitted by the semiconductor laser is collimated by the lens, and the laser emits visible red laser beam to the surface of a measured moving part. A diffuse reflection light spot of the surface of the measured moving part is received by the two sets of lens groups at different time, and the light focuses and forms an image on the linear CMOS array device. When the surface of the measured moving part changes relative to a reference plane, the light spots formed on the light sensitive surface of the linear CMOS array device by the diffuse light have corresponding displacement changes, the diffuse light being collected by the lens groups. The processing control circuit of the linear CMOS array device obtains the light spot displacement change information of the light sensitive surface, and transmits the information to the signal processor, and the signal processor calculates the displacement of the measured object.

Description

A kind of laser sensor measuring displacement

Technical field

The present invention relates to the measurement of armament systems moving component displacement, more particularly, the present invention relates to the precision measurement adopting Modern Laser ranging technology to carry out real-time large range displacement.

Background technology

In armament systems, have many moving components to need accurately to measure it in Canon launching process or running displacement, test to the design characteristics of armament systems, therefore, the measurement of each course movement part displacements is vital, is also absolutely necessary.The sensor of laser distance measuring principle is adopted to mainly contain at present both at home and abroad: laser triangulation principle, impulse method or time-sharing procedure and phase laser distance measurement instrument.Laser triangulation reflection ratio juris is that generating laser is surperficial by red color visible laser directive testee by camera lens, laser through reflections off objects passes through receiver camera lens, received by the CCD linear camera of inside, according to different distances, CCD linear camera " can see " this luminous point under a different angle, according to this angle and the distance between known laser and camera, digital signal processor just can calculate the distance between sensor and testee, and precision can reach micron order; Impulse method or time-sharing procedure principle are that the laser that stadimeter is launched is received by stadimeter again after the reflection of object being measured, the stadimeter time that recording laser is round simultaneously, the half of the product of the light velocity and two-way time is exactly the distance between stadimeter and object being measured.The precision of impulse method measuring distance is generally at about 1 meter; Phase laser distance measurement instrument is the frequency with radio wave band, carry out amplitude modulation(PAM) to laser beam and measure light modulated coming and going once the produced phase delay of survey line, again according to the wavelength of light modulated, the distance converted representated by this phase delay, its precision is generally grade.

Above-mentioned existing laser range sensor or measuring accuracy is lower, or measurement range is less, can not meet the measurement requirement of some parts high precision of armament systems, Large travel range completely and simultaneously.

Summary of the invention

The object of the invention is to propose a kind of sensor adopting laser ranging technique to carry out large range displacement precision measurement, measure with the real-time high-precision realizing the displacement of armament systems moving component.

The object of the invention is by following method realize.

Measure a laser sensor for displacement, it comprises: semiconductor laser, camera lens, two cover lens set, spectroscope, light path detecting device, linear CMOS array device, signal processor, adjustment knob, Red lightscreening plate and shells.

Described measurement position laser displacement sensor is optic triangle method according to principle of work, the red laser that semiconductor laser sends is after camera lens collimation, by measured for red color visible laser directive moving component surface, measured moving component surface diffuse reflectance light is imaged on linear CMOS array device through receiving lens set convergence formation hot spot, when receiving lens set and determining, the center of this scattering hot spot is determined by the distance between sensor and measured moving component surface, the displacement on measured moving component surface changes and causes imaging facula generation displacement above linear CMOS array, when the surperficial relative reference plane of measured moving component changes, also there is corresponding change in displacement in the hot spot formed on the photosensitive surface of Linear CMOS array device that diffuses collected by reception lens set, the information of hot spot change in displacement light-sensitive surface is obtained from the control and treatment circuit of linear CMOS array device, so just measure the change of measured moving component surface displacement, signal processor calculates the displacement of measured moving component,

The red laser beam of semiconductor laser, when operating distance is 2m, laser spot diameter is not more than 0.2mm;

Measured moving component surface is accurately projected through Red lightscreening plate after described camera lens makes laser alignment;

The irreflexive laser most cases of measured moving component is by two cover lens set, assembling formation hot spot at non-synchronization is imaged on linear CMOS array device, that is, the diffuse reflection light beam on measured moving component surface in most cases, can only be single collect by a set of lens set in two cover lens set and project on the light-sensitive surface of linear CMOS array device after assembling; Setting angle between two cover lens set is as the criterion with being connected mutually with the near distance spot measured by the second cover lens set away from semiconductor laser with most distant point measured by the first set lens set close to semiconductor laser;

Described spectroscope is arranged on second in two cover lens set and overlaps between lens set and linear CMOS array device, object is the light splitting carrying out light path through the irreflexive light beam of measured moving component the second cover lens set received, light splitting Hou mono-road light beam is received by the linear photodiode array in light path detecting device, and the beam projection on another road after light splitting is on the light-sensitive surface of linear CMOS array device;

Each photodiode of the linear photodiode array in described light path detecting device all can responsive incident light, its output is the analog voltage signal be directly proportional to incident intensity, pulse signal is formed after the A/D conversion in light path detecting device and shaping, be transferred to signal processor, represent that the irreflexive light beam of measured moving component is received by the second cover lens set, for ensureing the continuity measuring displacement, the near distance spot measured by most distant point measured by first set lens set and the second cover lens set be connected adopt part heavy and technology, therefore, linear CMOS array device can be there is and receive two spot signal representing the near distance spot measured by most distant point measured by first set lens set and the second cover lens set at synchronization, in this case, signal processor receives the pulse signal of light path detecting device, signal processor is got and is represented that the irreflexive light beam of measured moving component is the signal received by the second cover lens set, that is, get Linear CMOS array device carries out calculating measured moving component displacement near the spot displacement information that A holds,

Described linear CMOS array device only needs the hot spot that diffuses on the measured moving component surface of quick position in one-dimensional square position upwards, does not need to process complicated figure, so adopt linear CMOS array device just can meet the demands; The light beam that diffuses on the measured moving component surface that linear CMOS array device induction lens set is assembled, and output represents the information of this light beam induction hot spot change in displacement on the photosensitive surface of Linear CMOS array device that diffuses to signal processor;

Signal processor is first according to the pulse signal whether having light path detecting device to send, determine and select the computing formula of measured moving component displacement, if signal processor receives the pulse signal that light path detecting device sends, then adopt the displacement calculating formula of light beam by the second cover lens set that diffuse, otherwise adopt the displacement calculating formula of light beam by first set lens set that diffuse; According to the induction of linear CMOS array device through measuring this angle of the irreflexive laser facula of moving component and the distance between known semiconductor laser and linear CMOS array device, the displacement y that signal processor calculates measured moving component surface relative reference plane is:

$y=\frac{a_i{x}_i\sin {\mathrm{\β}}_i}{b_i\sin {\mathrm{\α}}_i\±x_i\sin ({\mathrm{\α}}_i+{\mathrm{\β}}_i)}i=\mathrm{1,2}$

In formula, a _i: the distance between reference planes and lens set;

B _i: the distance between the light-sensitive surface of linear CMOS array device and lens set;

α _i: the angle between the primary optical axis of lens set and incident ray;

β _i: the angle between the primary optical axis of lens set and the light-sensitive surface of linear CMOS array device;

X _i: the displacement that on linear CMOS array device light-sensitive surface, formed hot spot produces;

During i=1, it is first set lens set correlation parameter; During i=2, it is the second cover lens set correlation parameter;

When measured moving component surface is on the right of reference planes, in formula, " ± " number gets "+"; When measured moving component surface is on the reference planes left side, in formula, " ± " number gets "-" number;

Described Red lightscreening plate, its effect is conducive to penetrating and absorbing other coloured light of red light, and protect sensor internal not by the penetration of outside dust;

Described shell adopts aluminum alloy materials processing, hermetically sealed installation, to reach the object that sensor is lightweight, resist external interference and environmental pollution.

The essence of sensor of the present invention be employing two overlap lens set be connected follow the tracks of through the irreflexive laser facula of measured moving component, light path detecting device detect the laser spot reflected through measured moving component be by any the cover lens set in two cover lens set respond to by linear CMOS array, last by the mathematics computing model of signal processor according to corresponding lens set, calculate the displacement of measured moving component, the measurement problem of existing medium-large caliber type product large range displacement can be solved.

Accompanying drawing explanation

Fig. 1 is measuring principle schematic diagram of the present invention;

Fig. 2 is the partial enlarged drawing in Fig. 1;

Fig. 3 is sensor of the present invention composition schematic diagram.

Embodiment

Optimum implementation of the present invention is described in detail below in conjunction with each accompanying drawing.

As shown in Figure 1 and Figure 2, the irreflexive laser of measured moving component is generally by a set of lens set in two cover lens set 5,6, assembling formation hot spot at non-synchronization is imaged on linear CMOS array device 10, that is, measured moving component surface diffuse in most cases, can only be single be collected by a set of lens set in two cover lens set 5,6, and project on the light-sensitive surface of linear CMOS array device 10 after assembling; Setting angle between two cover lens set 5,6 is as the criterion with being connected with the near distance spot D phase measured by the second cover lens set 6 far away apart from semiconductor laser 1 with most distant point D measured by the first set lens set 5 near apart from semiconductor laser 1; Measured moving component, from position G, moves to position D through reference position C, diffuses to respond to the information of hot spot change in displacement on the light-sensitive surface of Linear CMOS array device 10 from point 23 by lens set 5, moves to a little 26 through putting 24; Measured moving component, from position D, moves to position F through reference position E, diffuses to respond to the information of hot spot change in displacement on the light-sensitive surface of Linear CMOS array device 10 from point 21 by lens set 6, moves to a little 25 through putting 22.For ensureing the continuity measuring displacement, the near distance spot D measured by most distant point D measured by first set lens set 5 and second cover lens set 6 be connected adopt part heavy and technology, therefore, linear CMOS array device 10 can be there is and receive two spot signal representing the near distance spot measured by most distant point measured by first set lens set 5 and the second cover lens set 6 at synchronization, in this case, signal processor 11 receives the pulse signal of light path detecting device 9, signal processor 11 is got and is represented that the irreflexive light beam of measured moving component is the signal received by the second cover lens set 6, that is, get the facula information that Linear CMOS array device 10 is held near A.

The red laser beam that semiconductor laser 1 is launched, after camera lens 2 makes laser alignment, when being 2m apart from measured moving component surface, laser spot diameter is not more than 0.2mm.

Fig. 3 is sensor of the present invention composition schematic diagram, the laser sensor measuring displacement primarily of semiconductor laser 1, camera lens 2, two overlap lens set 5,6, spectroscope 8, light path detecting device 9, linear CMOS array device 10, signal processor 11, adjustment knob 7, Red lightscreening plate 3,4 and shell 12 form.The red laser beam that semiconductor laser 1 is launched, after camera lens 2 makes laser alignment, projects measured moving component surface through Red lightscreening plate 3; Measured moving component surface diffuse reflectance light beam is assembled formation hot spot through Red lightscreening plate 4 through two cover lens set 5,6 and is imaged on the light-sensitive surface of linear CMOS array device 10; Two cover lens set 5,6 between setting angle with first set lens set 5 for benchmark, by regulating the second cover lens set 6 to realize with the angle of first set lens set 5 along optical axis, after regulating the second cover lens set 6 angle, the second cover lens set 6 fixed by Use Adjustment button 7; Spectroscope 8 is arranged on second in two cover lens set 5,6 and overlaps between lens set 6 and linear CMOS array device 10, object is the light splitting carrying out light path through the irreflexive light beam of measured moving component the second cover lens set 6 received, light splitting Hou mono-road light beam is received by the linear photodiode array in light path detecting device 9, and the beam projection on another road after light splitting is on the light-sensitive surface of linear CMOS array device 10; The pulse signal that light path detecting device 9 exports, is transferred to signal processor 11, represents that the irreflexive light beam of measured moving component is received by the second cover lens set; Shell 12 adopts aluminum alloy materials to process, hermetically sealed installation.

Claims (1)

1. measure the laser sensor of displacement for one kind, it comprises, semiconductor laser, camera lens, two cover lens set, spectroscope, light path detecting device, linear CMOS array device, signal processor, adjustment knob, Red lightscreening plate and shell, it is characterized in that: the irreflexive laser most cases of measured moving component is by two cover lens set, assembling formation hot spot at non-synchronization is imaged on linear CMOS array device, that is, measured moving component surface diffuse in most cases, can only be single collect by a set of lens set in two cover lens set and project on the light-sensitive surface of linear CMOS array device after assembling, for ensureing the continuity measuring displacement, the near distance spot measured by most distant point measured by first set lens set and the second cover lens set be connected adopt part heavy and technology, therefore, linear CMOS array device can be there is and receive two spot signal representing the near distance spot measured by most distant point measured by first set lens set and the second cover lens set at synchronization, in this case, signal processor receives the pulse signal of light path detecting device, signal processor is got and is represented that the irreflexive light beam of measured moving component is the signal received by the second cover lens set, that is, get Linear CMOS array device carries out calculating measured moving component displacement near the spot displacement information that A holds, spectroscope is arranged on second in two cover lens set and overlaps between lens set and linear CMOS array device, object is the light splitting carrying out light path through the irreflexive light beam of measured moving component the second cover lens set received, light splitting Hou mono-road light beam is received by the linear photodiode array in light path detecting device, and the beam projection on another road after light splitting is on the light-sensitive surface of linear CMOS array device, each photodiode of the linear photodiode array in light path detecting device all can responsive incident light, its output is the analog voltage signal be directly proportional to incident intensity, change through A/D and be shaped to pulse signal, be transferred to signal processor, represent that the irreflexive light beam of measured moving component is received by the second cover lens set, signal processor is first according to the pulse signal whether having light path detecting device to send, determine and select the computing formula of measured moving component displacement, if signal processor receives the pulse signal that light path detecting device sends, then adopt the displacement calculating formula of light beam by the second cover lens set that diffuse, otherwise adopt the displacement calculating formula of light beam by first set lens set that diffuse, according to the induction of linear CMOS array device through measuring this angle of the irreflexive laser facula of moving component and the distance between known semiconductor laser and linear CMOS array device, the displacement y that signal processor calculates measured moving component surface relative reference plane is:

$y=\frac{a_i{x}_i\sin {\mathrm{\β}}_i}{b_i\sin {\mathrm{\α}}_i\±x_i\sin ({\mathrm{\α}}_i+{\mathrm{\β}}_i)}i=\mathrm{1,2}$

In formula, α _i: the distance between reference planes and lens set;

B _i: the distance between the light-sensitive surface of linear CMOS array device and lens set;

α _i: the angle between the primary optical axis of lens set and incident ray;

β _i: the angle between the primary optical axis of lens set and the light-sensitive surface of linear CMOS array device;

X _i: the displacement that on linear CMOS array device light-sensitive surface, formed hot spot produces;

During i=1, it is first set lens set correlation parameter; During i=2, it is the second cover lens set correlation parameter;

When measured moving component surface is on the right of reference planes, in formula, " ± " number gets "+"; When measured moving component surface is on the reference planes left side, in formula, " ± " number gets "-" number.