CN104409651A - An OLED device structure and 3D printing technology based multiple-spray-head printing method thereof - Google Patents
An OLED device structure and 3D printing technology based multiple-spray-head printing method thereof Download PDFInfo
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- 238000007639 printing Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000010146 3D printing Methods 0.000 title claims description 12
- 238000005516 engineering process Methods 0.000 title description 10
- 239000000463 material Substances 0.000 claims abstract description 48
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 229920006280 packaging film Polymers 0.000 claims abstract description 13
- 239000012785 packaging film Substances 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 238000011049 filling Methods 0.000 claims abstract description 3
- 239000000843 powder Substances 0.000 claims description 36
- 239000007921 spray Substances 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims 2
- 238000007493 shaping process Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 230000005525 hole transport Effects 0.000 abstract description 8
- 238000013007 heat curing Methods 0.000 abstract description 7
- 239000010408 film Substances 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 3
- 230000017105 transposition Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000000174 L-prolyl group Chemical group [H]N1C([H])([H])C([H])([H])C([H])([H])[C@@]1([H])C(*)=O 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 238000013499 data model Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
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Abstract
本发明的目的在于提供一种OLED器件结构，包括设于底层的玻璃基板，其特征在于：所述玻璃基板上依次设有阳极层，空穴传输层，有机发光层，电子注入缓存层，阴极层和封装薄膜层。本发明采用在打印头上设置多喷头同时打印的方法，通过计算机预先设计OLED器件及封装薄膜的三维模型，在加热基板上精确定位各层结构的扫描路径，进而打印形成OLED器件，在打印的同时利用加热固化转置进行加热的处理，这种方法较传统器件打印方法大大简化，可一次性成型器件并实现封装，省去了多次装填材料的麻烦，大大缩减了工作时间，成型器件与传统层层打印的器件相比，旋转了90°，并实现了OLED器件的薄膜封装。
The object of the present invention is to provide a kind of OLED device structure, comprise the glass substrate that is arranged at bottom, it is characterized in that: described glass substrate is provided with anode layer, hole transport layer, organic light-emitting layer, electron injection buffer layer, cathode in sequence layer and encapsulation film layer. The invention adopts the method of setting multiple nozzles on the printing head to print simultaneously, pre-designing the three-dimensional model of the OLED device and the packaging film through the computer, and accurately positioning the scanning path of each layer structure on the heating substrate, and then printing to form the OLED device. At the same time, the heat treatment is carried out by heat curing and transposition. This method is greatly simplified compared with the traditional device printing method. It can form the device and realize packaging at one time, which saves the trouble of multiple filling materials and greatly reduces the working time. The forming device and Compared with the traditional layer-by-layer printed device, it has been rotated by 90°, and the thin-film packaging of OLED devices has been realized.
Description
技术领域 technical field
本发明涉及一种OLED器件结构及其基于3D打印技术的多喷头打印方法，属于OLED快速制造技术领域。 The invention relates to an OLED device structure and a multi-nozzle printing method based on 3D printing technology, and belongs to the technical field of OLED rapid manufacturing.
背景技术 Background technique
近几年来，有机电致发光（OLED）逐渐成为国内外广受关注的技术，这是由于OLED器件具有面板薄、色域广、反应时间短、自发光、全固化、发光效率高、驱动电压低和可弯曲面板等特性，OLED有可能成为下一代主流的平板显示器。传统的OLED制备工艺主要是采用真空蒸镀和旋涂工艺，随着技术的发展，也出现了一些层层打印OLED器件的技术，但是这种技术却有着微喷头需要多次状态材料和无法一次成型的缺点。 In recent years, organic electroluminescence (OLED) has gradually become a technology that has attracted wide attention at home and abroad. With features such as low profile and bendable panels, OLEDs are likely to become the next generation of mainstream flat-panel displays. The traditional OLED preparation process mainly adopts vacuum evaporation and spin coating process. With the development of technology, some technologies of layer-by-layer printing OLED devices have also appeared, but this technology has micro-spray heads that require multiple state materials and cannot be used once. Molding disadvantages.
发明内容 Contents of the invention
针对上述问题，本发明提供了一种OLED器件结构及其基于3D打印技术的多喷头打印方法，所述OLED器件及封装的实现可以借助多喷头同时打印各层材料并加热固化的技术，结合了3D打印的优势，解决了层层打印材料装填麻烦，工序复杂的问题，可以实现OLED器件和封装的一次性成型，大大缩减的制备成本并解决了耗时的问题。 In view of the above problems, the present invention provides an OLED device structure and its multi-nozzle printing method based on 3D printing technology. The realization of the OLED device and packaging can be achieved by using multi-nozzles to simultaneously print each layer of material and heat curing technology, which combines the The advantages of 3D printing solve the problems of layer-by-layer printing material loading and complicated procedures, and can realize one-time molding of OLED devices and packaging, greatly reducing the preparation cost and solving the time-consuming problem.
本发明的技术方案在于： Technical scheme of the present invention is:
一种OLED器件结构，包括设于底层的玻璃基板，其特征在于：所述玻璃基板上依次设有阳极层，空穴传输层，有机发光层，电子注入缓存层，阴极层和封装薄膜层。 An OLED device structure, comprising a glass substrate on the bottom layer, characterized in that: an anode layer, a hole transport layer, an organic light-emitting layer, an electron injection buffer layer, a cathode layer and an encapsulation film layer are sequentially arranged on the glass substrate.
其中，所述阳极层由ITO粉末构成；所述空穴传输层由NPB粉末、TPD粉末的一种或者两种混合构成；所述有机发光层由Alq3粉末构成；所述电子注入缓冲层由LiF粉末构成；所述阴极层由Al粉末、Ag粉末的一种或两种混合构成；所述封装薄膜层由Al2O3粉末和ZrO2粉末构成。 Wherein, the anode layer is made of ITO powder; the hole transport layer is made of NPB powder, TPD powder or a mixture of two kinds; the organic light-emitting layer is made of Alq 3 powder; the electron injection buffer layer is made of It is composed of LiF powder; the cathode layer is composed of one or two kinds of Al powder and Ag powder; the packaging film layer is composed of Al 2 O 3 powder and ZrO 2 powder.
本发明还提供了一种基于上述机构下的3D打印技术下的多喷头打印方法，其特征在于，按如下步骤进行： The present invention also provides a multi-nozzle printing method based on the 3D printing technology under the above-mentioned mechanism, which is characterized in that, the steps are as follows:
S1：利用计算机设计OLED器件各层结构以及封装薄膜结构的三维数字模型； S1: Use computer to design the three-dimensional digital model of each layer structure of OLED device and packaging film structure;
S2：对OLED器件结构进行横向的编排，在进行3D打印之前，在程序中编排OLED器件的结构，根据各层材料固化后的厚度来进行微喷头的材料的装填； S2: Arrange the structure of the OLED device horizontally. Before 3D printing, arrange the structure of the OLED device in the program, and fill the material of the micro-spray head according to the thickness of each layer of material after curing;
S3：打印头内各个微喷头的精确定位； S3: Precise positioning of each micro-spray head in the print head;
S4：进行各层材料的微喷打印； S4: Perform micro-jet printing of each layer of material;
S5：加热固化微喷出的OLED材料与封装材料。 S5: Heating and curing micro-jetted OLED materials and encapsulation materials.
其中，各层材料的厚度在1-100nm之间。 Wherein, the thickness of each layer of material is between 1-100nm.
打印头上配备的微喷头数等于材料种类数与封装薄膜种类数之和，材料按照结构顺序进行装填。 The number of micro-spray heads equipped on the print head is equal to the sum of the number of types of materials and the number of types of packaging films, and the materials are loaded according to the structural order.
控制微喷头的打印的起始点和截止点来精确控制各层材料的厚度。 The thickness of each layer of material can be precisely controlled by controlling the start point and end point of the printing of the micro-jet nozzle.
加热固化是采用在喷头的四周配有加热固化成型的装置，来加速材料的成型。 Heat curing is to use a heat curing molding device around the nozzle to accelerate the molding of the material.
本发明的优点在于： The advantages of the present invention are:
本发明其采用多喷头同时打印的方法，通过计算机预先设计OLED器件及封装薄膜的三维模型，并精确定位各层结构的扫描路径，进而打印形成OLED器件，在打印的同时进行加热固化的处理，这种方法较传统方法大大简化，可一次性成型器件并实现封装，省去了多次装填材料的麻烦，大大缩减了工作时间，成型器件与传统层层打印的器件相比，旋转了90°，并实现了OLED器件的薄膜封装。 The present invention adopts the method of multi-nozzle printing at the same time, pre-designs the three-dimensional model of the OLED device and the packaging film through the computer, and accurately locates the scanning path of each layer structure, and then prints to form the OLED device, and heats and cures it while printing. Compared with the traditional method, this method is greatly simplified. The device can be molded and packaged at one time, which saves the trouble of multiple filling materials and greatly reduces the working time. Compared with the traditional layer-by-layer printed device, the molded device is rotated by 90° , and realized the thin film encapsulation of OLED devices.
附图说明 Description of drawings
图1是本发明制作的打印OLED器件及封装结构示意图； Fig. 1 is a schematic diagram of a printed OLED device and a package structure made by the present invention;
图2是本发明制作的多喷头打印装置及加热固化装置示意图。 Fig. 2 is a schematic diagram of a multi-nozzle printing device and a heating and curing device produced by the present invention.
图3是本发明制作的喷头装置示意图。 Fig. 3 is a schematic diagram of the spray head device produced by the present invention.
图4是本发明制作的多喷头打印头装置示意图。 Fig. 4 is a schematic diagram of a multi-jet printing head device produced by the present invention.
图5是本发明制作的加热基板装置示意图。 Fig. 5 is a schematic diagram of a substrate heating device manufactured by the present invention.
其中：310-支撑基板；320-加热板。 Among them: 310-supporting substrate; 320-heating plate.
具体实施方式 Detailed ways
为让本发明的上述特征和优点能更明显易懂，下文特举实施例，结合附图作详细说明如下。 In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
以下将通过具体实施例对本发明做进一步的详细描述。 The present invention will be further described in detail through specific examples below.
参阅图1至图5，本发明涉及一种OLED器件结构，包括设于底层的玻璃基板，所述玻璃基板上依次设有阳极层，空穴传输层，有机发光层，电子注入缓存层，阴极层和封装薄膜层。 Referring to Fig. 1 to Fig. 5, the present invention relates to an OLED device structure, comprising a glass substrate arranged on the bottom layer, on which an anode layer, a hole transport layer, an organic light-emitting layer, an electron injection buffer layer, and a cathode are sequentially arranged on the glass substrate. layer and encapsulation film layer.
上述阳极层由ITO粉末构成；所述空穴传输层由NPB粉末、TPD粉末的一种或者两种混合构成；所述有机发光层由Alq3粉末构成；所述电子注入缓冲层由LiF粉末构成；所述阴极层由Al粉末、Ag粉末的一种或两种混合构成；所述封装薄膜层由Al2O3粉末和ZrO2粉末构成。 The above-mentioned anode layer is made of ITO powder; the hole transport layer is made of NPB powder, TPD powder or a mixture of two kinds; the organic light-emitting layer is made of Alq 3 powder; the electron injection buffer layer is made of LiF powder ; The cathode layer is composed of Al powder, Ag powder or a combination of two; the packaging film layer is composed of Al 2 O 3 powder and ZrO 2 powder.
本发明还涉及一种基于上述机构下的3D打印技术下的多喷头打印方法，按如下步骤进行： The present invention also relates to a multi-nozzle printing method based on the 3D printing technology under the above-mentioned mechanism, which is carried out according to the following steps:
S1：利用计算机设计OLED器件各层结构以及封装薄膜结构的三维数字模型； S1: Use computer to design the three-dimensional digital model of each layer structure of OLED device and packaging film structure;
S2：对OLED器件结构进行横向的编排，在进行3D打印之前，在程序中编排OLED器件的结构，根据各层材料固化后的厚度来进行微喷头的材料的装填； S2: Arrange the structure of the OLED device horizontally. Before 3D printing, arrange the structure of the OLED device in the program, and fill the material of the micro-spray head according to the thickness of each layer of material after curing;
S3：打印头内各个微喷头的精确定位； S3: Precise positioning of each micro-spray head in the print head;
S4：进行各层材料的微喷打印； S4: Perform micro-jet printing of each layer of material;
S5：加热固化微喷出的OLED材料与封装材料。 S5: Heating and curing micro-jetted OLED materials and encapsulation materials.
各层材料的厚度在1-100nm之间。 The thickness of each layer material is between 1-100nm.
打印头上配备的微喷头数等于材料种类数与封装薄膜种类数之和，材料按照结构顺序进行装填。 The number of micro-spray heads equipped on the print head is equal to the sum of the number of types of materials and the number of types of packaging films, and the materials are loaded according to the structural order.
控制微喷头的打印的起始点和截止点来精确控制各层材料的厚度。 The thickness of each layer of material can be precisely controlled by controlling the start point and end point of the printing of the micro-jet nozzle.
加热固化是采用在喷头的四周配有加热固化成型的装置，来加速材料的成型。 Heat curing is to use a heat curing molding device around the nozzle to accelerate the molding of the material.
具体实施过程： The specific implementation process:
本发明包括了以下几个步骤： The present invention has included the following steps:
（S11）利用计算机设计OLED器件各层结构以及封装薄膜结构的三维数字模型，可采用的三维画图软件包括Pro/E、SolidWorks、CATIA、UG、Solidege、AUTO CAD； (S11) Use computer to design the three-dimensional digital model of each layer structure of the OLED device and the packaging film structure. The three-dimensional drawing software that can be used includes Pro/E, SolidWorks, CATIA, UG, Solidege, and AUTO CAD;
（S12）将所设计的OLED器件各层结构以及封装薄膜结构模型输入到3D打印机程序中，根据所建数据模型得出每层二维平面上的材料和形状，设计出打印头210内各个微喷头220的打印材料、微喷打印的起始点、截止点、打印路径，加热固化温度，实现下面即将执行的步骤在计算机控制下，完成各层结构的打印成型； (S12) Input the designed OLED device layer structure and encapsulation film structure model into the 3D printer program, obtain the material and shape of each layer on the two-dimensional plane according to the built data model, and design each microstructure in the print head 210. The printing material of the nozzle 220, the starting point and the ending point of the micro-jet printing, the printing path, and the heating and curing temperature realize the following steps to be executed under the control of the computer to complete the printing and forming of each layer structure;
（S14）将经过预处理的柔性或玻璃基板110竖直放置于3D打印成型腔内，抽真空并通入惰性气体，如氩气，形成保护气氛； (S14) Place the pretreated flexible or glass substrate 110 vertically in the 3D printing molding cavity, vacuumize and inject an inert gas, such as argon, to form a protective atmosphere;
（S15）打印立体OLED器件和封装薄膜。 (S15) Printing a three-dimensional OLED device and an encapsulation film.
所述立体OLED器件的成型材料包括阳极层120，如ITO粉末等；空穴传输层层130，如NPB粉末、TPD粉末等；有机发光层层140，如Alq3粉末等；电子注入缓冲层150，如LiF粉末等；阴极层160，如Al粉末、Ag粉末等；封装薄膜层170，如Al2O3粉末和ZrO2粉末等； The molding material of described three-dimensional OLED device comprises anode layer 120, as ITO powder etc.; Hole transport layer layer 130, as NPB powder, TPD powder etc.; Organic light-emitting layer layer 140, as Alq 3 powder etc.; Electron injection buffer layer 150 , such as LiF powder, etc.; cathode layer 160, such as Al powder, Ag powder, etc.; packaging film layer 170, such as Al 2 O 3 powder and ZrO 2 powder, etc.;
所述立体OLED器件打印成型后各层材料为横向排列，如排列顺序为柔性或玻璃基板，阳极，空穴传输层，有机发光层，电子注入缓存层，阴极，封装薄膜层； After the three-dimensional OLED device is printed and formed, the materials of each layer are arranged horizontally, such as a flexible or glass substrate, an anode, a hole transport layer, an organic light-emitting layer, an electron injection buffer layer, a cathode, and a packaging film layer;
所述立体OLED器件打印可采用热固化微喷打印的方法，在打印的同时进行着加热固化，有利于材料的快速成型； The printing of the three-dimensional OLED device can adopt the method of thermal curing micro-jet printing, and heat curing is carried out while printing, which is conducive to the rapid prototyping of materials;
本实施例优选微喷打印固化加热OLED材料制作旋转90°放置的OLED器件，具体步骤如下： In this embodiment, micro-jet printing, curing and heating OLED materials are preferred to make OLED devices rotated by 90°. The specific steps are as follows:
（S151）各层结构打印参数确定。根据3D建模的数据，确定有序各层结构的参数，包括层结构的厚度、形状以及打印轨迹的路径；本实施优选长方体各层材料的厚度分别为200nm（阳极材料）、40nm（空穴传输材料）、60nm（有机发光材料）、0.4nm（电子注入缓存材料）、300nm（阴极材料）、300nm（薄膜封装材料）。 (S151) Determine the printing parameters of each layer structure. According to the data of 3D modeling, determine the parameters of each layer structure in order, including the thickness, shape and path of the printing track of the layer structure; in this implementation, the thickness of each layer material of the cuboid is preferably 200nm (anode material), 40nm (hole Transport material), 60nm (organic luminescent material), 0.4nm (electron injection buffer material), 300nm (cathode material), 300nm (thin film packaging material).
（S152）各个微喷打印喷头装填材料完毕后，按照程序设定的起始点沿设定路径开始进行材料打印，当各层达到各自的厚度后，各自停止打印。 (S152) After each micro-jet printing nozzle is filled with materials, it starts to print materials along the set path according to the starting point set by the program, and stops printing when each layer reaches its respective thickness.
（S153）在微喷打印的同时，利用四周装配有的加热固化装置240与加热基板230将打印的材料进行固化处理。 ( S153 ) While microjet printing is in progress, use the heating and curing device 240 and the heating substrate 230 installed around it to cure the printed material.
（S154）器件表面处理。将制造完成的器件移出3D打印设备，清理器件表面，包括微喷过程中残留在器件表面多余的材料。 (S154) Device surface treatment. The finished device is removed from the 3D printing equipment, and the surface of the device is cleaned, including the excess material remaining on the surface of the device during the micro-spraying process.
以上所述仅为本发明的较佳实施例，凡依本发明申请专利范围所做的均等变化与修饰，皆应属本发明的涵盖范围。 The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.
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