CN104801463A - Dispensing device and dispensing method - Google Patents

Dispensing device and dispensing method Download PDF

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Publication number
CN104801463A
CN104801463A CN201510225126.3A CN201510225126A CN104801463A CN 104801463 A CN104801463 A CN 104801463A CN 201510225126 A CN201510225126 A CN 201510225126A CN 104801463 A CN104801463 A CN 104801463A
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plastic emitting
sebific duct
glass paste
expansion
different
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CN104801463B (en
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陈林豆
史凯
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Abstract

The invention provides a dispensing device and a dispensing method. The dispensing device comprises a rubber pipe (10), and a plurality of baffle plates (20) arranged in the rubber pipe (10) along the glue discharging direction of the rubber pipe (10), wherein the rubber pipe (10) comprises a main body (11) and a dispensing head (13) at the tail end of the main body (11); the inner part of the rubber pipe (10) is divided into a plurality of glue discharging channels in parallel mutually through the baffle plates (20); the glue discharging channels are used for respectively connecting different rubber boxes; the different rubber boxes are used for storing glass frits with different sintering temperatures and expansion coefficients; during dispensing, the glass frits with the different sintering temperatures and expansion coefficients are dispensed from different glue discharging channels, so that the difference of expansion degrees caused by non-uniform heating when the glass frits are irradiated by laser is reduced or avoided, the smoothness of the glass frits is improved, and the packaging effect is improved.

Description

Point glue equipment and dispensing method
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of point glue equipment and dispensing method.
Background technology
ORGANIC ELECTROLUMINESCENCE DISPLAYS (Organic Light Emitting Display, OLED) device not only has very excellent display performance, also have that self-luminous, structure are simple, ultra-thin, fast response time, wide viewing angle, low-power consumption and can the characteristics such as Flexible Displays be realized, be described as " dreamlike display ", obtain the favor of Ge great display producer, become the main force of third generation display device in Display Technique field.
OLED display device belongs to self-emission type display device, generally include the pixel electrode, public electrode and the organic luminous layer that is located between pixel electrode and public electrode that are used separately as anode and negative electrode, make when suitable voltage is applied in anode and negative electrode, luminous from organic luminous layer.Organic luminous layer includes the hole injection layer be located on anode, be located at the hole transmission layer on hole injection layer, be located at the luminescent layer on hole transmission layer, be located at the electron transfer layer on luminescent layer, be located at the electron injecting layer on electron transfer layer, its luminescence mechanism is under certain voltage drives, electronics and hole are injected into electron injecting layer and hole injection layer from negative electrode and anode respectively, electronics and hole move to luminescent layer respectively through electron transfer layer and hole transmission layer, and meet in luminescent layer, form exciton and light emitting molecule is excited, the latter sends visible ray through radiative relaxation.
Because described organic luminous layer is formed by organic material, very responsive to moisture, oxygen etc., therefore it is rotten to be easy to because of the intrusion of moisture, oxygen etc. deterioration, thus shorten the life-span of OLED display device, thus encapsulation technology seems necessary and crucial in OLED technology.In OLED shop test is produced, ensured the validity of OLED display device by management and control package quality.OLED encapsulation mainly contains following several mode: drier encapsulation, UV rubber seal dress (Dam Only), UV glue and drier fill encapsulation (Dam & Fill), glass paste encapsulation (Frit) etc.Wherein glass paste encapsulation, with advantages such as its packaging effect are good, reliability is good, is more and more applied in OLED industry.
Refer to Fig. 1, Fig. 2, Fig. 1, Fig. 2 are encapsulation process schematic diagram and the profile of the encapsulation of a kind of glass paste, as shown in Figure 1 and Figure 2, in encapsulation process, OLED display device master comprises top glass substrate 2, lower glass substrate 3, the OLED that is located at the glass paste between upper and lower glass substrate 2,3 and is encapsulated between two substrates.Upper and lower glass substrate 2,3 is fitted by glass paste, forms airtight volume, and is arranged in this airtight volume by OLED unit, can complete encapsulation between upper and lower glass substrate 2,3, effectively intercepts steam and oxygen.The principle of glass paste encapsulation is the characteristic utilizing glass paste fusing point lower, and heating makes it melt, and can intercept steam and oxygen, complete encapsulation after glass paste cooled and solidified.The directive property of laser beam and convergence good, the impact on other regions can be avoided when its encapsulation as far as possible, be specially adapted to herein to the step that glass paste heats, concrete, as shown in Figure 1, the laser that generating laser 4 is launched is heated by the glass paste in a mask plate 1 pair of precalculated position be located in top glass substrate 2.But, as shown in Figure 2, when laser is irradiated to glass paste by top glass substrate 2, the glass paste 6 of the first half and the temperature suffered by glass paste 5 of the latter half different, corresponding degrees of expansion is also different, the temperature suffered by glass paste 6 of the first half is higher, degrees of expansion is comparatively large, and the temperature suffered by glass paste 5 of the latter half is lower, and degrees of expansion is less, thus affect the planarization of glass paste, and then affect packaging effect.
Summary of the invention
The object of the present invention is to provide a kind of point glue equipment, can reduce or avoid the difference of the degrees of expansion caused due to inequality of being heated in glass paste encapsulation process, thus improve the planarization of glass paste, promote packaging effect.
The present invention also aims to provide a kind of dispensing method, can reduce or avoid the difference of the degrees of expansion caused due to inequality of being heated in glass paste encapsulation process, thus improve the planarization of glass paste, promote packaging effect.
For achieving the above object, the present invention provide firstly a kind of point glue equipment, comprising:
Sebific duct and be located at several baffle plates of described sebific duct inside along the plastic emitting direction of sebific duct, what described sebific duct comprised body and was located at body tip drips glue head;
The plastic emitting passage that sebific duct interior separation becomes several to be parallel to each other by described baffle plate, several plastic emitting passages described are used for connecting different glue boxes respectively, and described different glue box is for storing the different glass paste of sintering temperature, the coefficient of expansion.
Described body comprises a vertical portion and horizontal part connected vertically with vertical portion, and described glue head is connected to described horizontal part one end away from vertical portion; Described sebific duct inside is provided with a baffle plate, and the interior separation of sebific duct is become to be positioned at the first plastic emitting passage of below and is positioned at the second plastic emitting passage of top by described baffle plate.
Described baffle plate is located at 1/2nd places of described sebific duct internal diameter.
Described glue head is downward-sloping relative to described horizontal part, and the end face of described glue head is to the inclined-plane near described vertical portion lopsidedness relative to described vertical portion.
The cross section of described glue head is rectangle, circle or rectangle and circular combination.
The present invention also provides a kind of dispensing method, comprises the steps:
Step 1, provide a point glue equipment and glass substrate; Described point glue equipment comprises:
Sebific duct and be located at several baffle plates of described sebific duct inside along the plastic emitting direction of sebific duct, what described sebific duct comprised body and was located at body tip drips glue head;
The plastic emitting passage that sebific duct interior separation becomes several to be parallel to each other by described baffle plate, several plastic emitting passages described are used for connecting different glue boxes respectively, and described different glue box is for storing the different glass paste of sintering temperature, the coefficient of expansion;
Step 2, in several plastic emitting passages of sebific duct, to be injected the different glass paste of sintering temperature, the coefficient of expansion respectively by different glue boxes;
The different glass paste of step 3, described sintering temperature, the coefficient of expansion oozes from dripping a glue head via several plastic emitting passages described respectively, at the uniform velocity move described sebific duct in the horizontal direction, thus on described glass substrate, form several layers of different glass paste of sintering temperature, the coefficient of expansion.
Described body comprises a vertical portion and horizontal part connected vertically with vertical portion, and described glue head is connected to described horizontal part one end away from vertical portion; Described sebific duct inside is provided with a baffle plate, and sebific duct interior separation is become to be positioned at the first plastic emitting passage of below and is positioned at the second plastic emitting passage of top by described baffle plate, and described baffle plate is located at 1/2nd places of described sebific duct internal diameter.
Described glass substrate is top glass substrate, the sintering temperature of the glass paste in described first plastic emitting passage is higher than the sintering temperature of the glass paste in described second plastic emitting passage, and the coefficient of expansion of the glass paste in described first plastic emitting passage is lower than the coefficient of expansion of the glass paste in described second plastic emitting passage.
Described glass substrate is lower glass substrate, the sintering temperature of the glass paste in described first plastic emitting passage is lower than the sintering temperature of the glass paste in described second plastic emitting passage, and the coefficient of expansion of the glass paste in described first plastic emitting passage is higher than the coefficient of expansion of the glass paste in described second plastic emitting passage.
Described glue head is downward-sloping relative to described horizontal part, and the end face of described glue head is to the inclined-plane near described vertical portion lopsidedness relative to described vertical portion; The cross section of described glue head is rectangle, circle or rectangle and circular combination.
Beneficial effect of the present invention: the invention provides a kind of point glue equipment, by arranging baffle plate in the sebific duct of point glue equipment, sebific duct is divided into multiple different plastic emitting passage, ooze from different plastic emitting passages and there is different sintering temperatures and the glass paste of the coefficient of expansion, with the difference of the degrees of expansion reduced or avoid glass paste when laser irradiates causing due to inequality of being heated, thus improve the planarization of glass paste, promote packaging effect.The present invention also provides a kind of dispensing method, by arranging baffle plate in the sebific duct of point glue equipment, sebific duct is divided into multiple different plastic emitting passage, ooze from different plastic emitting passages and there is different sintering temperatures and the glass paste of the coefficient of expansion, thus prepare the compound glass slurry with different sintering temperature and the coefficient of expansion, with the difference of the degrees of expansion reduced or avoid glass paste when laser irradiates causing due to inequality of being heated, thus improve the planarization of glass paste, promote packaging effect.
In order to further understand feature of the present invention and technology contents, refer to following detailed description for the present invention and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for being limited the present invention.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention describe in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is the encapsulation process schematic diagram of existing a kind of glass paste encapsulation;
The encapsulation process profile that Fig. 2 encapsulates for glass paste shown in Fig. 1;
Fig. 3 is the schematic diagram of point glue equipment of the present invention;
Fig. 4 is the schematic cross-section dripping the first embodiment of glue head of point glue equipment of the present invention;
Fig. 5 is the schematic cross-section dripping the second embodiment of glue head of point glue equipment of the present invention;
Fig. 6 is the flow chart of dispensing method of the present invention.
Detailed description of the invention
For further setting forth the technological means and effect thereof that the present invention takes, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
Refer to Fig. 3, first the present invention provides a kind of point glue equipment, comprising:
Sebific duct 10 and be located at several baffle plates 20 of described sebific duct 10 inside along the plastic emitting direction of sebific duct 10, what described sebific duct 10 comprised body 11 and was located at body 11 end drips glue head 13.
The plastic emitting passage that sebific duct 10 interior separation becomes several to be parallel to each other by described baffle plate 20; Several plastic emitting passages described are used for connecting different glue boxes respectively, and described different glue box is for storing the different glass paste of sintering temperature, the coefficient of expansion.
Especially, the quantity of described baffle plate 20 is more, the level of the glass paste oozed is more, the sintering temperature of glass paste and the change of the coefficient of expansion more level off to continuously, but too increase manufacturing cost and the requirement to glass paste simultaneously, preferably, described body 11 comprises a vertical portion 111 and horizontal part 112 connected vertically with vertical portion 111, and described glue head 13 is connected to described horizontal part 112 one end away from vertical portion 111.Described sebific duct 10 inside is provided with a baffle plate 20, and the interior separation of sebific duct 10 is become to be positioned at the first plastic emitting passage 14 of below and is positioned at the second plastic emitting passage 15 of top by described baffle plate 20; Baffle plate 20 is located at 1/2nd places of described sebific duct 10 internal diameter.
Concrete, described glue head 13 is downward-sloping relative to described horizontal part 112, the end face of described glue head 13 is to the inclined-plane near described vertical portion 111 lopsidedness relative to described vertical portion 111, for ensureing that the glass paste in the first plastic emitting passage 14 first oozes early than the glass paste in the second plastic emitting passage 15, to form comparatively clearly demarcated glass paste level, two kinds of oozed glass pastes are avoided to mix mutually in a glue head outlet.
Particularly, when carrying out glue, can according to the fill order of different choice glass paste of glass substrate treating a glue.When the glass substrate of a glue is top glass substrate, the sintering temperature of the glass paste in described first plastic emitting passage 14 is higher than the sintering temperature of the glass paste in described second plastic emitting passage 15, and the coefficient of expansion of the glass paste in described first plastic emitting passage 14 is lower than the coefficient of expansion of the glass paste in described second plastic emitting passage 15.
When the glass substrate of a glue is lower glass substrate, the sintering temperature of the glass paste in described first plastic emitting passage 14 is lower than the sintering temperature of the glass paste in described second plastic emitting passage 15, and the coefficient of expansion of the glass paste in described first plastic emitting passage 14 is higher than the coefficient of expansion of the glass paste in described second plastic emitting passage 15.
So, when laser is irradiated to glass paste by glass substrate, although different from the temperature suffered by the glass paste oozed the second plastic emitting passage 15 from the first plastic emitting passage 14, but because two kinds of glass pastes have different sintering temperatures and the coefficient of expansion, thus can ensure that two kinds of glass pastes degrees of expansion is at different temperatures identical, the flatness of glass paste is higher, and packaging effect is good.
Particularly, refer to Fig. 4, Fig. 5, the cross section of described glue head 13 can be rectangle, circle or rectangle and circular combination.
Above-mentioned point glue equipment, by arranging baffle plate in the sebific duct of point glue equipment, sebific duct is divided into multiple different plastic emitting passage, ooze from different plastic emitting passages and there is different sintering temperatures and the glass paste of the coefficient of expansion, with the difference of the degrees of expansion reduced or avoid glass paste when laser irradiates causing due to inequality of being heated, thus improve the planarization of glass paste, promote packaging effect.
Refer to Fig. 6, the present invention also provides a kind of dispensing method, comprises the steps:
Step 1, provide a point glue equipment and glass substrate.Described point glue equipment comprises:
Sebific duct 10 and be located at several baffle plates 20 of described sebific duct 10 inside along the plastic emitting direction of sebific duct 10, what described sebific duct 10 comprised body 11 and was located at body 11 end drips glue head 13.
The plastic emitting passage that sebific duct 10 interior separation becomes several to be parallel to each other by described baffle plate 20, several plastic emitting passages described are used for connecting different glue boxes respectively, and described different glue box is for storing the different glass paste of sintering temperature, the coefficient of expansion.
Preferably, described body 11 comprises a vertical portion 111 and horizontal part 112 connected vertically with vertical portion 111, and described glue head 13 is connected to described horizontal part 112 one end away from vertical portion 111.Described sebific duct 10 inside is provided with a baffle plate 20, and sebific duct 10 interior separation is become to be positioned at the first plastic emitting passage 14 of below and is positioned at the second plastic emitting passage 15 of top by described baffle plate 20; Baffle plate 20 is located at 1/2nd places of described sebific duct 10 internal diameter.
Particularly, described glue head 13 is downward-sloping relative to described horizontal part 112, and the end face of described glue head 13 is to the inclined-plane near described vertical portion 111 lopsidedness relative to described vertical portion 111; The cross section of described glue head 13 can be rectangle, circle or rectangle and circular combination.
Step 2, in several plastic emitting passages of sebific duct 10, to be injected the different glass paste of sintering temperature, the coefficient of expansion respectively by different glue boxes.
Particularly, in the first embodiment of dispensing method of the present invention, described glass substrate is top glass substrate, the sintering temperature of the glass paste in described first plastic emitting passage 14 is higher than the sintering temperature of the glass paste in described second plastic emitting passage 15, and the coefficient of expansion of the glass paste in described first plastic emitting passage 14 is lower than the coefficient of expansion of the glass paste in described second plastic emitting passage 15.
The different glass paste of step 3, described sintering temperature, the coefficient of expansion oozes from dripping a glue head 13 via several plastic emitting passages described respectively, at the uniform velocity move described sebific duct 10 in the horizontal direction, thus on described glass substrate, form the different compound glass slurry of sintering temperature, the coefficient of expansion.
Particularly, when described glass paste drops in top glass substrate, glass paste in described first plastic emitting passage 14 first oozes early than the glass paste in the second plastic emitting passage 15, forms comparatively clearly demarcated glass paste level, avoids two oozed class glass pastes and mixes mutually in a glue head outlet.
Now, when laser is irradiated to glass paste by top glass substrate, from the temperature suffered by the glass paste that the first plastic emitting passage 14 oozes higher than the temperature suffered by the glass paste oozed from the second plastic emitting passage 15, but due to the sintering temperature of the glass paste that the sintering temperature of the glass paste oozed in the first plastic emitting passage 14 oozes higher than the second plastic emitting passage 15, the coefficient of expansion of the glass paste oozed in corresponding first plastic emitting passage 14 is also lower than the glass paste that the second plastic emitting passage 15 oozes, thus can ensure that two kinds of glass pastes degrees of expansion is at different temperatures identical, the flatness of glass paste is higher, packaging effect is good.
Second embodiment of dispensing method of the present invention and the difference of the first embodiment are, described glass substrate is lower glass substrate, the sintering temperature of the glass paste in described first plastic emitting passage 14 is lower than the sintering temperature of the glass paste in described second plastic emitting passage 15, the coefficient of expansion of the glass paste in described first plastic emitting passage 14 is higher than the coefficient of expansion of the glass paste in described second plastic emitting passage 15, all the other steps and principle are all identical with the first embodiment, are not repeating herein.
Above-mentioned dispensing method, by arranging baffle plate in the sebific duct of point glue equipment, sebific duct is divided into multiple different plastic emitting passage, ooze from different plastic emitting passages and there is different sintering temperatures and the glass paste of the coefficient of expansion, thus prepare the compound glass slurry with different sintering temperature and the coefficient of expansion, with the difference of the degrees of expansion reduced or avoid glass paste when laser irradiates causing due to inequality of being heated, thus improve the planarization of glass paste, lifting packaging effect.
In sum, the invention provides a kind of point glue equipment, by arranging baffle plate in the sebific duct of point glue equipment, sebific duct is divided into multiple different plastic emitting passage, ooze from different plastic emitting passages and there is different sintering temperatures and the glass paste of the coefficient of expansion, with the difference of the degrees of expansion reduced or avoid glass paste when laser irradiates causing due to inequality of being heated, thus improve the planarization of glass paste, lifting packaging effect.The present invention also provides a kind of dispensing method, by arranging baffle plate in the sebific duct of point glue equipment, sebific duct is divided into multiple different plastic emitting passage, ooze from different plastic emitting passages and there is different sintering temperatures and the glass paste of the coefficient of expansion, thus prepare the compound glass slurry with different sintering temperature and the coefficient of expansion, to reduce or the difference of avoid glass paste to be heated when laser irradiates degrees of expansion that inequality causes, thus improve the planarization of glass paste, lifting packaging effect.
The above, for the person of ordinary skill of the art, can make other various corresponding change and distortion according to technical scheme of the present invention and technical conceive, and all these change and be out of shape the protection domain that all should belong to the claims in the present invention.

Claims (10)

1. a point glue equipment, is characterized in that, comprising:
Sebific duct (10) and be located at the inner several baffle plates (20) of described sebific duct (10) along the plastic emitting direction of sebific duct (10), what described sebific duct (10) comprised body (11) and was located at body (11) end drips glue head (13);
The plastic emitting passage that sebific duct (10) interior separation becomes several to be parallel to each other by described baffle plate (20), several plastic emitting passages described are used for connecting different glue boxes respectively, and described different glue box is for storing the different glass paste of sintering temperature, the coefficient of expansion.
2. point glue equipment as claimed in claim 1, it is characterized in that, described body (11) comprise a vertical portion (111) and with vertical portion (111) horizontal part connected vertically (112), described glue head (13) is connected to described horizontal part (112) one end away from vertical portion (111); Described sebific duct (10) inside is provided with a baffle plate (20), and the interior separation of sebific duct (10) is become to be positioned at the first plastic emitting passage (14) of below and is positioned at the second plastic emitting passage (15) of top by described baffle plate (20).
3. point glue equipment as claimed in claim 2, it is characterized in that, described baffle plate (20) is located at 1/2nd places of described sebific duct (10) internal diameter.
4. point glue equipment as claimed in claim 2, it is characterized in that, described glue head (13) is downward-sloping relative to described horizontal part (112), and the end face of described glue head (13) is to the inclined-plane near described vertical portion (111) lopsidedness relative to described vertical portion (111).
5. point glue equipment as claimed in claim 1, is characterized in that, the cross section of described glue head (13) is rectangle, circle or rectangle and circular combination.
6. a dispensing method, is characterized in that, comprises the steps:
Step 1, provide a point glue equipment and glass substrate, described point glue equipment comprises:
Sebific duct (10) and be located at the inner several baffle plates (20) of described sebific duct (10) along the plastic emitting direction of sebific duct (10), what described sebific duct (10) comprised body (11) and was located at body (11) end drips glue head (13);
The plastic emitting passage that sebific duct (10) interior separation becomes several to be parallel to each other by described baffle plate (20), several plastic emitting passages described are used for connecting different glue boxes respectively, and described different glue box is for storing the different glass paste of sintering temperature, the coefficient of expansion;
Step 2, in several plastic emitting passages of sebific duct (10), to be injected the different glass paste of sintering temperature, the coefficient of expansion respectively by different glue boxes;
The different glass paste of step 3, described sintering temperature, the coefficient of expansion oozes from dripping a glue head (13) via several plastic emitting passages described respectively, at the uniform velocity move described sebific duct (10) in the horizontal direction, thus on described glass substrate, form several layers of different glass paste of sintering temperature, the coefficient of expansion.
7. dispensing method as claimed in claim 6, it is characterized in that, described body (11) comprise a vertical portion (111) and with vertical portion (111) horizontal part connected vertically (112), described glue head (13) is connected to described horizontal part (112) one end away from vertical portion (111); Described sebific duct (10) inside is provided with a baffle plate (20), sebific duct (10) interior separation is become to be positioned at the first plastic emitting passage (14) of below and is positioned at the second plastic emitting passage (15) of top by described baffle plate (20), and described baffle plate (20) is located at 1/2nd places of described sebific duct (10) internal diameter.
8. dispensing method as claimed in claim 7, it is characterized in that, described glass substrate is top glass substrate, the sintering temperature of the glass paste in described first plastic emitting passage (14) is higher than the sintering temperature of the glass paste in described second plastic emitting passage (15), and the coefficient of expansion of the glass paste in described first plastic emitting passage (14) is lower than the coefficient of expansion of the glass paste in described second plastic emitting passage (15).
9. dispensing method as claimed in claim 7, it is characterized in that, described glass substrate is lower glass substrate, the sintering temperature of the glass paste in described first plastic emitting passage (14) is lower than the sintering temperature of the glass paste in described second plastic emitting passage (15), and the coefficient of expansion of the glass paste in described first plastic emitting passage (14) is higher than the coefficient of expansion of the glass paste in described second plastic emitting passage (15).
10. dispensing method as claimed in claim 7, it is characterized in that, described glue head (13) is downward-sloping relative to described horizontal part (112), and the end face of described glue head (13) is to the inclined-plane near described vertical portion (111) lopsidedness relative to described vertical portion (111); The cross section of described glue head (13) is rectangle, circle or rectangle and circular combination.
CN201510225126.3A 2015-05-05 2015-05-05 Point glue equipment and dispensing method Active CN104801463B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106890740A (en) * 2017-03-17 2017-06-27 深圳市华星光电技术有限公司 Glue spreading apparatus and its self cleaning method
CN110323144A (en) * 2019-06-24 2019-10-11 通富微电子股份有限公司技术研发分公司 A kind of electromagnetic shielding packaging and preparation method thereof
CN113714043A (en) * 2021-10-09 2021-11-30 常州天宇宏图电子有限公司 Two-way deep hole adhesive deposite device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060049396A1 (en) * 2004-09-09 2006-03-09 Karl Pichler Sealing of electronic device using absorbing layer for glue line
JP2010140848A (en) * 2008-12-15 2010-06-24 Canon Inc Manufacturing method of organic light emitting device
CN102221784A (en) * 2010-04-19 2011-10-19 北京京东方光电科技有限公司 Glue coating device and glue coating method
CN103413897A (en) * 2013-08-07 2013-11-27 深圳市华星光电技术有限公司 OLED packaging structure and packaging method
CN103490016A (en) * 2013-09-24 2014-01-01 京东方科技集团股份有限公司 Packaging structure of OLED device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060049396A1 (en) * 2004-09-09 2006-03-09 Karl Pichler Sealing of electronic device using absorbing layer for glue line
JP2010140848A (en) * 2008-12-15 2010-06-24 Canon Inc Manufacturing method of organic light emitting device
CN102221784A (en) * 2010-04-19 2011-10-19 北京京东方光电科技有限公司 Glue coating device and glue coating method
CN103413897A (en) * 2013-08-07 2013-11-27 深圳市华星光电技术有限公司 OLED packaging structure and packaging method
CN103490016A (en) * 2013-09-24 2014-01-01 京东方科技集团股份有限公司 Packaging structure of OLED device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106890740A (en) * 2017-03-17 2017-06-27 深圳市华星光电技术有限公司 Glue spreading apparatus and its self cleaning method
CN110323144A (en) * 2019-06-24 2019-10-11 通富微电子股份有限公司技术研发分公司 A kind of electromagnetic shielding packaging and preparation method thereof
CN110323144B (en) * 2019-06-24 2021-07-13 通富微电子股份有限公司技术研发分公司 Electromagnetic shielding packaging device and preparation method thereof
CN113714043A (en) * 2021-10-09 2021-11-30 常州天宇宏图电子有限公司 Two-way deep hole adhesive deposite device

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