KR20140078269A - Organic Light Emitting Diode Display Device and Method for Manufacturing The Same - Google Patents

Abstract

According to an embodiment of the present invention, an organic electroluminescent display device includes: an organic light emitting element formed on a first substrate; a second substrate opposed to the first substrate; a color refiner formed on the second substrate; an encapsulation member which encapsulates the first substrate and the second substrate at edges; an inside filling part which fills in a space between the organic light emitting element and the color refiner inside the encapsulation member; and an outside filling part formed between the first substrate and the second substrate outside the encapsulation member.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display and a method of manufacturing the same, and more particularly, to an active organic light emitting display and a method of manufacturing the same.

Flat panel display devices, which have already become a necessity in the age of the development of a state-of-the-art information society, include a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode , And OLED).

The organic electroluminescent display device is a self-luminous device that emits light by itself, has a high response speed, high luminous efficiency, and a large viewing angle compared to a liquid crystal display device.

1 is a cross-sectional view illustrating a conventional organic light emitting display device.

1, a conventional organic light emitting display device includes a substrate 101, an anode electrode 110, an organic light emitting layer 120, a cathode electrode 130, and a sealing film 140.

First, an anode electrode 110 is formed on the substrate 101. A cathode electrode 130 facing the anode electrode 110 is formed on the anode electrode 110 and an organic light emitting layer 120 is formed therebetween. In the organic light emitting layer 120, an exciton formed by coupling holes and electrons injected from the anode 110 and the cathode 130 in the organic light emitting layer 120 is reduced from the excited state to the ground state, Energy is released. The energy is emitted in the form of light and the organic light emitting layer 120 emits light.

The amount of light is controlled by a signal from a thin film transistor (not shown) connected to the anode electrode 110 and a power supply line, and a desired image is displayed for each pixel by repeating the above process.

Next, a sealing film 140 is formed on the cathode electrode 130. The sealing film 140 may be composed of a plurality of layers formed of various materials. Generally, the sealing film 140 is formed by a vapor deposition method using an open mask. In this case, the thickness uniformity is lowered in the edge region of the sealing film 140, and the possibility of cracking is increased. If cracks are generated, humidity, air, and foreign matter penetrate into the cracks, and if the organic light emitting layer 120 is damaged, life of the organic light emitting display device is shortened.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an organic light emitting display capable of improving the lifetime of an organic light emitting display.

According to an aspect of the present invention, there is provided an organic light emitting display including: an organic light emitting diode formed on a first substrate; A second substrate facing the first substrate; A color refiner formed on the second substrate; A sealing member sealing the first substrate and the second substrate at an edge; An internal filling part filled between the organic light emitting element and the color refiner inside the sealing member; And an outer filling part formed between the first substrate and the second substrate outside the sealing member.

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display, including: forming a sealing member on a first substrate; Forming an organic light emitting device on the first substrate; Forming a color refiner on the second substrate; Filling an inner filling part between the organic light emitting element and the color refiner inside the sealing member; Bonding the first substrate and the second substrate; And forming an outer filling part between the first substrate and the second substrate to surround the outside of the sealing member.

According to still another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display, including: forming an organic electroluminescent device on a first substrate; Forming a sealing member on the second substrate; Forming a color refiner on the second substrate; Filling an empty space in the second substrate on which the sealing member is formed with an inner filling part; Bonding the first substrate and the second substrate; And forming an outer filling part which is formed between the first substrate and the second substrate and surrounds the outside of the sealing member.

According to the present invention, there is an effect that the laser joining of the sealing member exposed to the developer can be performed by controlling the laser joining condition.

According to the present invention, there is an effect that the position and height of the sealing member can be controlled more precisely by forming the sealing member in advance on the first substrate and bonding the sealing member to the second substrate to carry out the sealing process.

Further, according to the present invention, there is an effect that a sealing member having an excellent sealing force can be formed by previously forming the sealing member on the first substrate.

Further, according to the present invention, there is an effect that the sealing member is previously formed on the first substrate and the organic substance is filled in the sealing member without any empty space, thereby making it possible to more reliably prevent penetration of moisture and foreign matter from the outside.

Further, according to the present invention, filling of the outside of the sealing member with organic matter has the effect of preventing penetration of moisture and foreign matter from the outside and alleviating external impact.

1 is a cross-sectional view illustrating a conventional organic light emitting display device;
2 is a cross-sectional view illustrating an organic light emitting display device according to an embodiment of the present invention;
FIGS. 3A to 3E are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an exemplary embodiment of the present invention; FIGS. And
4A to 4C are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view illustrating an organic light emitting display according to an exemplary embodiment of the present invention.

2, an organic light emitting display according to an exemplary embodiment of the present invention includes a first substrate 201, a second substrate 202, an organic light emitting diode 210, a color refiner 220, An inner filling portion 230, a sealing member 240, and an outer filling portion 250.

First, a first substrate 201 and a second substrate 202 are provided. The first substrate 201 and the second substrate 202 may be formed of glass or a flexible plastic. For example, the first substrate 201 and the second substrate 202 may be formed of polyimide, polyethersulfone, polyetherimide (PEI), and polyethylene terephthalate (PET) .

Next, an organic light emitting diode 210 is formed on the first substrate 201. [ The organic light emitting device 210 may include an anode electrode (not shown), an organic light emitting layer (not shown), and a cathode electrode (not shown). An organic light emitting layer may be formed between the anode electrode and the cathode electrode. The organic light emitting layer receives holes from the anode electrode, receives electrons from the cathode electrode, and emits light by excitons coupled with the holes and the electrons.

Next, a color refiner 220 is formed on the second substrate 202. The color refiner 220 may be divided into red, green and blue for each pixel. Also, the color may be divided into yellow, cyan, and magenta colors, but it is not limited thereto. For example, various colors such as sky blue, dark blue, Can be used.

The distance between the color refiner 220 and the organic light emitting device 210 is preferably 10 μm or less. The distance between the color refiner 220 and the organic light emitting diode 210 is also referred to as a cell gap and the cell gap may be an important factor for determining the resolution of the organic light emitting display device. For example, when the cell gap is 8 μm in the stripe structure, a resolution of 270 ppi can be realized, and when the cell gap is 6 μm, a resolution of 443 ppi can be realized.

When the cell gap increases, it is difficult to accurately express the gradation when the emission of light emitted from the organic light emitting layer of one pixel passes through the color refiner 220 of the adjacent pixel, Normal operation of the device is impossible. Since the light leakage phenomenon occurs more severely as the size of the pixel decreases, it is important to prevent the light leakage phenomenon by decreasing the cell gap toward the higher resolution.

Next, the inner filling part 230 may be filled with no space between the organic light emitting diode 210 and the color refiner 220. The inner filling part 230 is filled between the organic light emitting device 210 and the color refiner 220 to prevent moisture permeation and foreign matter penetration into the organic light emitting device 210. In addition, the refractive index of the inner filling part 230 is formed of a material higher than the refractive index of air, so that the optical loss can be prevented from occurring due to the total reflection due to the refractive index difference.

Accordingly, the inner filling part 230 may be formed of a polymer. The polymer may be filled between the organic light emitting device 210 and the color refiner 220 in a liquid state having a viscosity and then cured at a high temperature exceeding 100 캜.

Next, a sealing member 240 is formed between the first substrate 201 and the second substrate 202. The sealing member 240 may be formed, for example, by curing a liquid sealing paste having a viscosity. The sealing member 240 may be formed on one of the first substrate 201 and the second substrate 202 by a screen printing technique and then may be formed into a desired shape and height through a developing process. Further, the first substrate 201 and the second substrate 202 may be adhered to each other through a process of being melted by laser irradiation and then cured again. That is, the sealing member 240 may be bonded to the first substrate 201 and the second substrate 202 in a different manner.

Next, an external filling portion 250 is formed between the first substrate 201 and the second substrate 202 outside the sealing member 240. The outer filling part 250 may be formed of the same material as the inner filling part 230, and may be formed of, for example, a polymer. The outer filling part 250 may be formed by curing a liquid polymer having a viscosity and may prevent permeation of moisture from the outside and penetration of impurities primarily and protect the organic light emitting element 210 from external impact have.

3A to 3E are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

First, as shown in FIG. 3A, a sealing member 240 is formed on a first substrate 201. The sealing member 240 may be formed by a screen printing method. The material for forming the sealing member 240 may be a sealing paste which is a kind of viscous liquid glass powder. First, the printing mask is placed on the first substrate 201. Thereafter, the sealing paste is placed on the printing mask and the sealing paste is applied on the first substrate 201 through the open area of the printing mask while being pushed by a urethane squeezer. Then, after drying for a predetermined time, the sintering treatment is repeated twice or three times at a high temperature of about 300 캜 or more to be cured. Thereafter, the cleaning process is performed to remove the foreign substances, and then the heat treatment process is performed to form the sealing member 240.

3B, the organic light emitting device 210 is formed on the first substrate 201 inside the sealing member 240 and the organic light emitting device 210 is formed on the organic light emitting device 210 inside the sealing member 240. Next, The inner filling portion 230 of the liquid phase having a viscosity is filled. The inner filling part 230 may be a liquid polymer.

Next, as shown in Fig. 3C, the sealant 260 is applied to the outside of the sealing member 240. Next, as shown in Fig. Thereafter, the second substrate 202 and the first substrate 201 are bonded to the sealant 260 so as to be in contact with the upper end of the sealing member 240. At this time, ultraviolet rays may be irradiated to the sealant 260 to be bonded. The sealant 260 may be removed after the sealing member 240 and the second substrate 202 are bonded. That is, the sealant 260 is a bonding member for temporarily bonding the first substrate 201 and the second substrate 202 to bond the sealing member 240 and the second substrate 202. A color refiner 220 is formed on the second substrate 202 and the first substrate 201 and the second substrate 202 are bonded together by a sealant (not shown) with the color refiner 220 facing the organic light emitting device 210 260 are joined together.

A laser is irradiated to the second substrate 202 corresponding to the sealing member 240 while the first substrate 201 and the second substrate 202 are bonded together by the sealant 260. [ At this time, the upper end of the sealing member 240 contacting with the second substrate 202 by the laser is melted and hardened again, so that the sealing member 240 and the second substrate 202 can be bonded.

At this time, the sealing member 240 is exposed to the developer during a number of developing processes in the process of forming the organic light emitting device 210. In this case, defective joining of the sealing member 240 may occur. If the sealing member 240 is subjected to the bonding process while lowering the power of the laser and adjusting the scanning speed of the laser to reduce the instantaneous temperature change to prevent the bonding failure as described above, May be bonded to the second substrate 202.

Next, as shown in Fig. 3D, the sealant 260 is removed.

3E, an outer filling part 250 is applied to the outside of the sealing member 240, and the first substrate 201 and the second substrate 202 are scribed, Sized panel can be manufactured.

4A to 4C are plan views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

4A to 4C are plan views illustrating a method of simultaneously forming a plurality of organic light emitting devices 210 on a single substrate. Here, the organic light emitting device 210 refers to a panel of a module concept that can operate independently.

4A, a plurality of organic light emitting devices 210 are formed on a first substrate 201, a second substrate 202 on which a color refiner (not shown) is formed, a sealant 260 As shown in Fig. The sealing member 240 is formed on the first substrate 201 and is in contact with the second substrate 202 joined together by the sealant 260. The sealant 260 is applied on the first substrate 201 and may be positioned at the edge of the first substrate 201 outside the plurality of organic light emitting devices 210. After the sealant 260 is applied, the sealant 260 may be irradiated with ultraviolet rays in a state in contact with the second substrate 202.

Next, as shown in FIG. 4B, when a laser is irradiated on the upper portion of the second substrate 202 corresponding to the sealing member 240, the upper end of the sealing member 240 is melted and hardened again The second substrate 202 and the sealing member 240 may be bonded.

Next, as shown in FIG. 4C, the first substrate 201 and the second substrate 202, which are bonded to each other by the sealing member 240, are cut along a scribing line to form a plurality of organic A light emitting device 210 panel may be formed. The scribing line is required to prevent damages of the sealing member 240 and to set the external filling part 250 with a little margin to be formed. The external filling part 250 may be filled between the first substrate 201 and the second substrate 202 before the scribing process and may be formed after the scribing process by using the first substrate 201 and the second substrate 202 202, respectively.

As described above, since the plurality of organic light emitting devices 210 can be simultaneously manufactured through a single process, the efficiency of the process can be improved.

Meanwhile, the sealing member 240 may be formed on the second substrate 202 first. After the sealing member 240 is formed on the second substrate 202 by the above-described process, the first substrate 201 and the second substrate 202 are joined to each other with the sealant 260, The upper end of the member 240 and the first substrate 201 can be joined. The substrate on which the sealing member 240 is formed can be formed on either the first substrate 201 or the second substrate 202. After the sealing member 240 is formed, Or the color refiner 220 is exposed to the developing solution while being subjected to a number of developing processes. In order to bond the sealing member 240 exposed to the developing solution with a laser, the sealing member 240 can be bonded by finely controlling the laser power and the scanning speed.

Hereinafter, various manufacturing methods of the organic light emitting display device in which the process conditions of the sealing member 240 and the laser joining process are variously changed will be described.

The first manufacturing method will be described. First, a first substrate 201 based on a low-temperature polysilicon thin film transistor is prepared, a printing mask is placed on a first substrate 201, and then a glass powder of a liquid having a viscosity is squeezed by a squeezer, The glass substrate 201 is coated with glass powder. The speed of the squeegee is 90 mm / sec, and the thickness of the emulsion is set to 10 m.

Next, heat treatment is carried out in the order of 60 ° C, 90 ° C and 120 ° C in the state of the liquid having the viscosity yet, and the liquid glass powder is dried, and the solvent contained therein is discharged to the outside.

Next, a first sintering process is performed at about 300 DEG C for about 1 hour, and a second sintering process is performed at about 400 DEG C for about 30 minutes to cure the dried glass powder to form the sealing member 240 .

Next, the sealing member 240 is exposed once to the developing solution which can be used in the developing process which can be performed while forming the thin film transistor and the organic light emitting element 210.

Next, a sealant 260 having a maximum size of about 6 mm is coated on the first substrate 201 outside the sealing member 240, and the second substrate 202 on which the color refiner 220 is formed is opposed to the sealant 260 And the first substrate 201 and the second substrate 202 are irradiated with ultraviolet light to be bonded together via a sealant 260. [ The sealant gap is set to about 200 mu m, and ultraviolet rays are irradiated in vacuum for about 180 seconds.

Next, a laser beam is irradiated to melt the upper end of the sealing member 240, and then the second sealing member 240 is hardened again to bond the sealing member 240 and the second substrate 202 together. The laser power is set to about 38%, and the laser scanning speed is 12 mm / sec.

Through the above process, it was confirmed that the sealing member 240 exposed to the developer can also be laser-bonded.

Next, a second manufacturing method will be described. In the second manufacturing method, after the sealing member 240 is sintered and cured and exposed to a developing solution, a cleaning step and a heat treatment step which are not performed in the first manufacturing method are added. The cleaning process is performed using deionized water as a cleaning liquid, and the heat treatment process is performed at about 150 ° C for about 35 minutes.

Next, the sealant 260 is applied on the first substrate 201 outside the sealing member 240 at a coating rate of 100 mm / sec, and the sealant 260 has a width of up to 3 mm .

Next, the second substrate 202 on which the color refiner 220 is formed is confronted and adhered, and then the first substrate 201 and the second substrate 202 are irradiated with ultraviolet rays to be combined with each other through the sealant 260 All. The sealant gap is set to about 200 mu m, and ultraviolet rays are irradiated in vacuum for about 180 seconds.

Next, a laser beam is irradiated to melt the upper end of the sealing member 240, and then the second sealing member 240 is hardened again to bond the sealing member 240 and the second substrate 202 together. The laser power is set to about 38% to 37%, and the laser scanning speed is 12 mm / sec to 10 mm / sec.

Through the above process, it can be confirmed that the sealing member 240 exposed to the developer can also be laser bonded. In addition, by adding the cleaning process and the heat treatment process, the yield of the scribing process can be improved .

Next, a third manufacturing method will be described. In the third manufacturing method, after the cleaning step, the heat treatment temperature was raised to about 230 DEG C, and the number of times of exposure to the developer was performed once or twice. The remaining conditions are the same as in the second manufacturing method.

As the number of times of exposure to the developer increases, the surface roughness of the sealing member 240 increases, and the laser power and the scanning speed are lowered, so that the laser welding can be performed. More specifically, when the developer is exposed once, the sealing member 240 is bonded by setting the laser power to 38% and the laser scanning speed to 12 mm / sec. However, when the developer is exposed twice, The sealing member 240 can be bonded to the sealing member 240 by setting the power to be relatively low at 35% and the scanning speed of the laser at a relatively low level of 6 mm / sec. When the laser power is set at 36% It can be seen that the laser joining of the sealing member 240 can be performed even if the height is increased up to 8 mm.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

201: first substrate 202: second substrate
210: organic light emitting device 220: color refiner
230: inner filling part 240: sealing member
250: External filling part

Claims (11)

An organic light emitting element formed on the first substrate;
A second substrate facing the first substrate;
A color refiner formed on the second substrate;
A sealing member sealing the first substrate and the second substrate at an edge;
An internal filling part filled between the organic light emitting element and the color refiner inside the sealing member; And
And an external filling part formed between the first substrate and the second substrate outside the sealing member.
The method according to claim 1,
And the thickness of the sealing member increases toward the first substrate.
The method according to claim 1,
And the thickness of the sealing member increases toward the second substrate.
The method according to claim 1,
Wherein the refractive index of the inner filling part is larger than the refractive index of air.
The method according to claim 1,
Wherein the external filling portion is formed of the same material as the internal filling portion.
Forming a sealing member on the first substrate;
Forming an organic light emitting device on the first substrate;
Forming a color refiner on the second substrate;
Filling an inner filling part between the organic light emitting element and the color refiner inside the sealing member;
Bonding the first substrate and the second substrate; And
And forming an external filling part between the first substrate and the second substrate to surround the outside of the sealing member.
The method according to claim 6,
Wherein forming the sealing member on the first substrate comprises:
Applying a sealing paste to the edge of the first substrate by a screen printing method;
Heat treating the applied sealing paste to remove the solvent in the sealing paste;
Cleaning the sealing paste, and then curing the sealing paste by heat treatment.
The method according to claim 6,
Wherein the step of bonding the first substrate and the second substrate comprises:
Applying a sealant on the first substrate outside the sealing member;
Irradiating the sealant with ultraviolet rays to combine the first substrate and the second substrate;
Irradiating the sealing member with a laser to melt one end of the sealing member in contact with the second substrate; And
And bonding the sealing member to the second substrate by curing the molten sealing member.
Forming an organic electroluminescent device on the first substrate;
Forming a sealing member on the second substrate;
Forming a color refiner on the second substrate;
Filling an empty space in the second substrate on which the sealing member is formed with an inner filling part;
Bonding the first substrate and the second substrate; And
And forming an external filling part formed between the first substrate and the second substrate and surrounding the outside of the sealing member.
10. The method of claim 9,
Wherein forming the sealing member on the second substrate comprises:
Applying a sealing paste to the edge of the second substrate by a screen printing method;
Heat treating the applied sealing paste to remove solvent in the sealing paste;
Cleaning the sealing paste, and then curing the sealing paste by heat treatment.
10. The method of claim 9,
Wherein the step of bonding the first substrate and the second substrate comprises:
Applying a sealant on the second substrate outside the sealing member;
Irradiating the sealant with ultraviolet rays to combine the first substrate and the second substrate;
Irradiating the sealing member with a laser to melt one end of the sealing member in contact with the first substrate; And
And bonding the sealing member to the first substrate by curing the molten sealing member.

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