CN107553894A - 3 D-printing device and its Method of printing based on FED principles - Google Patents
3 D-printing device and its Method of printing based on FED principles Download PDFInfo
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- CN107553894A CN107553894A CN201710890912.4A CN201710890912A CN107553894A CN 107553894 A CN107553894 A CN 107553894A CN 201710890912 A CN201710890912 A CN 201710890912A CN 107553894 A CN107553894 A CN 107553894A
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- 238000007639 printing Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 239000011347 resin Substances 0.000 claims abstract description 61
- 238000010894 electron beam technology Methods 0.000 claims abstract description 44
- 239000007787 solid Substances 0.000 claims description 30
- 238000007711 solidification Methods 0.000 claims description 18
- 230000008023 solidification Effects 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 230000007812 deficiency Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 239000013589 supplement Substances 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 claims 1
- 238000001723 curing Methods 0.000 abstract description 23
- 238000000016 photochemical curing Methods 0.000 abstract description 17
- 238000007493 shaping process Methods 0.000 abstract description 15
- 230000001186 cumulative effect Effects 0.000 abstract 1
- 238000005265 energy consumption Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 11
- -1 ion radical Chemical class 0.000 description 10
- 150000003254 radicals Chemical class 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000010146 3D printing Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000003847 radiation curing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000005036 potential barrier Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001227 electron beam curing Methods 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
The invention discloses a kind of 3 D-printing device and its Method of printing based on FED principles, it includes computer system, controller, field launcher, hopper, workbench and lowering or hoisting gear.The sectional view that threedimensional model is split to obtain is sent in field launcher by computer system by controller, field launcher launches corresponding electron beam image, the solidified resin bombarded in hopper, the energy-curable that solidified resin absorbs electron beam is molded to obtain the laminate structure of correspondence image, and laminate structure obtains photocuring 3 D-printing product by the way that lowering or hoisting gear is cumulative.The present invention carries out electronic beam curing using field emitted electron beam, realizes the functions such as 3 D-printing device shaping speed is fast, precision is high, energy consumption is small, occupies little space.
Description
Technical field
The present invention relates to rapid three dimensional printing forming field, more particularly to a kind of electronic beam curing three based on FED principles
Tie up printing equipment and its Method of printing.
Background technology
The one kind of 3 D-printing as RP technique, is widely used in fields such as Making mold, industrial designs
Modeling, and now it is increasingly used for the direct manufacture of some products.Three-dimensional printing technology is increasingly popularized, to printing technique
It is required that also more and more higher.
SLA photocurings are RP techniques practical earliest, its mode being molded using a shaping or line, are led to
Cross and carry out curing photosensitive resin in the way of certain motion path point by point scanning working face using laser beam, photosensitive resin be from
Point starts solidification and then to line resolidification into a whole face, or since line solidification and then resolidification into a whole face, a whole face
Thin layer solid-state photosensitive resin obtains required physical model product by way of superposition.It has formed precision high, mechanical
The few advantage of moving component, but it is present the defects of shaping area is smaller, equipment manufacturing cost is expensive, print speed is slow.
DLP is molded and LCD shapings are all face molding modes, and LCD shapings are selectively shown on working face with liquid crystal display
Ultraviolet image solidifies to liquid photosensitive resin, and DLP shapings are then directly by projecting ultraviolet image to working face
Mode carrys out curing photosensitive resin, and the photosensitive thin resin layer of the solid-state for solidifying out is by being superimposed the physical model system so as to be needed
Part.
Chinese patent " ZL201320332935.0 " discloses one kind and is based on DLP projection photocurable three-dimensional printers, its profit
Photocuring is carried out with DLP projection system, is limited because DLP projects by DMD resolution ratio, and the optical lens of DLP projections is present
Optical distortion, cause curing efficiency low, the defects of low precision.
FED (Field Emission Display), i.e. field-emitter display, it is to utilize micro- sharp launching electronics rifle array
The beam bombardment fluorescent material of field emission and luminous display.The corresponding micro- sharp launching electronics rifle of each pixel, can
Address, launching electronics beam is operated alone.Traditional photocuring three-dimensional printing technology is using ultraviolet light as radiation curing energy source.And
It is of the invention then be using electron beam as radiation curing energy source.Electron beam irradiation is by a collection of electron stream institute group by accelerating
Into, in the presence of high-power electron beam, solidified resin produces free radical or ion radical, free radical or ion radical again with other things
Matter is cross-linked into network polymers, and compared with ultraviolet light, particle energy is significantly larger than ultraviolet light, can make air ionization, and electronics
Beam-curable is typically not required to light trigger, can directly trigger chemical reaction, also wideer than ultraviolet to the penetration power of material.Compared to
Other FPD of in the market, as LCD flat panel shows, OLED FPD, PDP FPD, FED FPD has brightness
The advantages such as height, high resolution, the fast, strong antijamming capability of response, have huge market potential.
FED is applied to rapid shaping field similarly very advantageous.Compared to traditional SLA, DLP, LCD photocuring three
Printing technique is tieed up, using the direct solidified resin of micro- sharp launching electronics rifle array field emitted electron beam, response is fast, curing rate
It hurry up, improve production efficiency to a certain extent；Because micro- sharp launching electronics rifle size is small, can show under the display surface of equal size
Show more pixels, the 3 D-printing product for higher precision can be solidified applied to electronic beam curing 3 D-printing；Due to its body
The characteristics of product is small, can meet the 3 D-printing device miniaturization market demand applied to photocuring 3 D-printing.
The content of the invention
It is a kind of based on the electronic beam curing 3 D-printing device of FED principles and its printing side it is an object of the invention to design
Method, mentioned in the prior art above with solution, the print speed present in conventional three-dimensional printing equipment is slow, precision is low, power consumption
Greatly, the problems such as equipment is big.
Technical scheme one is used by realize the object of the invention：
A kind of 3 D-printing device based on FED principles, including：Computer system, controller, field launcher, hopper,
Workbench and lowering or hoisting gear；The computer system, for carrying out image procossing to threedimensional model, threedimensional model is divided into one
Series has the sectional view of thickness, and controller can be controlled；The controller, on the one hand field launcher is carried out
Control, on the other hand control lowering or hoisting gear；The hopper, holds solidified resin, can supplement and return by glue-feeder and gum outlet
Receive solidified resin；The workbench, in hopper, immerse in solidified resin；The lowering or hoisting gear, is lifted workbench
Motion；The field launcher include set gradually lower cover, metal electrode, micro- sharp launching electronics rifle array, grid, isolation
Post, transparency electrode and upper cover plate；The metal electrode is fixed on lower cover, and micro- sharp launching electronics rifle array is arranged on gold
Belong on electrode, micro- sharp launching electronics rifle array includes some micro- sharp launching electronics rifles arranged with array-like, the tip of electron gun
Through grid towards upper cover plate direction；One electronics will be separated out by insulated column between transparency electrode and the tip of electron gun accelerate sky
Chamber, the one of transparency electrode accelerates cavity facing to electronics, and another side is fixed on upper cover plate；What micro- sharp emission array was launched
Electron beam punctured upper cover plate after electronics accelerates cavity；One inwall of the hopper is formed as the upper cover plate, electronics
Beam is injected in hopper after passing through upper cover plate；The table top of the workbench is towards upper cover plate, shape between workbench table top and upper cover plate
Into 3 D-printing region.
Preferably, the controller makes micro- point hair according to the sectional view by addressing selective launching electronics beam
Penetrate electron gun array and send corresponding electron beam image, corresponding electron beam image solidifies the thin resin layer for correspondence image.
Preferably, the upper cover plate is formed as bottom surface, top surface or the side of the hopper.
Preferably, the lowering or hoisting gear control workbench is doing lifting fortune on the direction on the upper cover plate surface
It is dynamic.
Preferably, it is vacuum environment that the electronics, which accelerates cavity,.
Preferably, the solidified resin is can be by the epoxy resin of electronic beam curing, or the composite wood containing epoxy resin
Material.
Preferably, the solidified resin is electron beam resist.
Preferably, the isolation column material is hot pressed silicon nitride (HPSN), aluminium oxide ceramics, zirconia ceramics or quartz glass.
Technical scheme two is used by realize the object of the invention：One kind is based on FED principles according to claim 1
3 D-printing device Method of printing, it is characterised in that printing start before, light-cured resin is injected in hopper；Shaping
Platform is moved to the position at a distance of unit distance with upper cover plate；Printing starts, and controller control field launcher optionally drives
Micro- sharp launching electronics rifle array emitter go out electron beam image corresponding with the sectional view through upper cover plate reach workbench it
Between 3 D-printing region in, liquid cured resin in the region starts the shape solidification according to electron-beam pattern, finally
One layer and the duplicate solid of threedimensional model sectional view are formed, while this layer of solid will be bonded at workbench bottom surface, not connect
The place for contacting electron beam is still liquid；After completing one layer of solidification solid, field launcher stops launching electronics beam, and workbench leads to
Lowering or hoisting gear is crossed towards the direction Moving Unit distance away from upper cover plate, at this moment field launcher, which starts to launch next frame electron beam, cuts
Face pattern, the liquid glue between formation solid and upper cover plate just can solidify the solid of one layer of unit thickness again, and two layers of solid glues
Strike up partnership, just solidification like this in layer is gone down, and the solid for being molded into certain structure is sticked on workbench 12, finally
Formation solid is removed from workbench, completes whole 3 D-printing process；If, can be from entering wherein in hopper during solidified resin deficiency
Solidified resin is injected in glue mouth, at the end of printing, then solidified resin can be reclaimed by gum outlet.
The operation principle of the present invention：Traditional photocuring three-dimensional printing technology is using ultraviolet light as radiation curing energy source.
And the present invention is then as radiation curing energy source using electron beam.Electron beam irradiation is by a collection of electron stream institute by accelerating
Composition, in the presence of high-power electron beam, solidified resin produces free radical or ion radical, free radical or ion radical again with other
Material is cross-linked into network polymers, and compared with ultraviolet light, particle energy is significantly larger than ultraviolet light, can make air ionization, and electricity
Beamlet solidification is typically not required to light trigger, can directly trigger chemical reaction, also wideer than ultraviolet to the penetration power of material.
Field emission displays are that cathode surface potential barrier reduces, be thinning in the presence of highfield, and electronics passes through tunnel-effect
Vacuum is transmitted into through potential barrier, bombardment is realized on fluorescent material after electronics accelerates shows.Three-dimensional of the invention based on FED principles is beaten
Print is that the drive circuit in field launcher, some specific micro- sharp electron guns allowed in micro tips array are controlled by using controller
Launch electronics, electronics accelerates bombardment to form specific beam bombardment group to working face in the electric field.In specific electron beam
Under the bombardment of group, solidified resin produces free radical or ion radical, and free radical or ion radical reticulate poly- with the crosslinking of other materials again
Compound forms the resin solidification thin layer of specific image, the product model of printing required for thin layer is obtained by superposition again.
Beneficial effect：It is of the present invention using the direct solidified resin of micro- sharp launching electronics rifle array field emitted electron beam
3 D-printing device, compare traditional photocuring 3 D-printing device response faster, curing rate faster, improves to a certain extent
Production efficiency；Because micro- sharp launching electronics rifle size is small, more pixels can be shown under the display surface of equal size, are applied to
The 3 D-printing device of electronic beam curing can compare traditional photocuring 3 D-printing device and solidify the 3 D-printing for higher precision
Product；Small volume, 3 D-printing device of the present invention can meet the 3 D-printing device miniaturization market demand.
As described above, the three-dimensional printer based on FED principles of the present invention, electronics is carried out using field emitted electron beam
Beam-curable, compared to the SLA three-dimensional photocurings using point, line curing molding, field emission three-dimensional electron beam curing molding uses
Be surface emitting source, there is higher shaping speed advantage；Compared to LCD three-dimensional photocurings, large scale printing can ensured
In the case of, the light solidified resin product for printing higher precision；Compared to DLP three-dimensional photocurings, the electronic beam curing of spontaneous emission
The loss of energy is greatly reduced, improves production efficiency to a certain extent, and saves the sky required for placement complex optical path
Between, be advantageous to compact apparatus production.
Brief description of the drawings
Fig. 1 is the structural representation of the ascending manner FED electronic beam curing 3 D-printing devices of embodiment of the present invention one；
Fig. 2 is the structural representation of the sunk type FED electronic beam curing 3 D-printing devices of embodiment of the present invention two.
Embodiment
In order to provide a better understanding of the technical solution of the present invention by those skilled in the art, below in conjunction with the accompanying drawings and embodiment
The present invention is described in further detail.
The ascending manner FED electronic beam curing 3 D-printing devices of embodiment of the present invention one include：Computer system 1；Control
Device 2；Lower cover 3；Metal electrode 4；Micro- sharp launching electronics rifle array 5；Grid 6；Insulated column 7；Transparency electrode 8；Upper cover plate 9；Material
Groove 10；Solidified resin 11；Workbench 12；Lowering or hoisting gear 13.
Wherein, computer system 1, image procossing is carried out to threedimensional model, threedimensional model be divided into a series of with thickness
The sectional view of degree, then treated data are transferred in controller 2 and field launcher successively by data wire.
In embodiments of the present invention mainly using lower cover 3, metal electrode 4, micro- sharp launching electronics rifle array 5, grid
6th, insulated column 7, transparency electrode 8, upper cover plate 9 are used as the transmitting that field launcher realizes electron beam image.
As shown in figure 1, metal electrode 4 is the top that negative electrode is located at lower cover 3, the top of metal electrode 4 is followed successively by micro- point
Launching electronics rifle array 5, grid 6, anode transparency electrode 8, upper cover plate 9.The controller 2 is drawn in processing computer system 1
A frame frame image data after, by the drive circuit in field launcher, apply between cathodic metal electrode 4 and grid 6
Voltage difference, electronics discharges in the presence of electric field from micro- sharp launching electronics rifle array 5, and applies in anode transparency electrode 8
Voltage electronics can be made to accelerate in a vacuum, eventually pass through upper cover plate 9, the bottom solidified resin 11 bombarded in hopper 10.Pass through
The launching electronics beam of selectivity is addressed, field launcher is sent corresponding electron beam image, corresponding electron beam image can be consolidated
Dissolve the thin resin layer of correspondence image.
The insulated column 7 is very thin, size uniform；With certain rigidity, intensity；With certain resistivity, while again
Excessive leakage current can not be produced；Discharge quantity is small.Isolation column material is hot pressed silicon nitride (HPSN), aluminium oxide ceramics, zirconia ceramics, stone
English glass etc..
The hopper 10 is located at the top of upper cover plate 9, and for holding various solidified resins 11, glue-feeder is provided with hopper 10
With gum outlet, solidified resin 11 can be supplemented in time from glue-feeder when hopper solidified resin 11 is insufficient, at the end of printing
Solidified resin 11 can be reclaimed by gum outlet.Workbench 12 can make vertical fortune using lowering or hoisting gear 13 above hopper 10
It is dynamic.It is the shaping work area of three-dimensional printer between the top of upper cover plate 9 and workbench 12.
Before printing starts, light-cured resin 11 is injected in hopper 10.Workbench 12 drops to and the top phase of upper cover plate 9
Position away from unit height.
Printing starts, controller 2 control field launcher (lower cover 3, metal electrode 4, micro- sharp launching electronics rifle array 5,
Grid 6, insulated column 7, transparency electrode 8, upper cover plate 9) selectivity driving transmitting electron beam image through upper cover plate 9 reach shaping
In the space of the lower section of platform 12, the liquid cured resin 11 in this space starts the shape solidification according to electron-beam pattern, finally
One layer and the duplicate solid of threedimensional model section pattern are formed, while this layer of solid will be bonded at the bottom surface of workbench 12, not have
The place for touching electron beam is still liquid.
Complete one layer solidification after field launcher (lower cover 3, metal electrode 4, micro- sharp launching electronics rifle array 5, grid 6,
Insulated column 7, transparency electrode 8, upper cover plate 9) stop launching electronics beam, workbench 12 raises unit height by lowering or hoisting gear 13,
At this moment field launcher starts to launch next frame beam cross section pattern, and the liquid glue below formation solid just can solidify one again
The solid of layer unit thickness, two layers of solid are bonded to one, and just solidification like this in layer is gone down, and will be molded into certain knot
The solid of structure is sticked below workbench 12, as long as last take out formation solid for 12 times from workbench, just completes whole three-dimensional
Print procedure.Wherein if solidified resin 11 is insufficient in hopper 10, solidified resin 11 can be injected from glue inlet, is terminated in printing
When, then solidified resin 11 can be reclaimed by gum outlet.
The sunk type FED electronic beam curing 3 D-printing devices of embodiment of the present invention two include：Computer system 1；Control
Device 2；Lower cover 3；Metal electrode 4；Micro- sharp launching electronics rifle array 5；Grid 6；Insulated column 7；Transparency electrode 8；Upper cover plate 9；Material
Groove 10；Solidified resin 11；Workbench 12；Lowering or hoisting gear 13.
As shown in Fig. 2 it is different from embodiment one, field launcher (lower cover 3, metal electrode 4, micro- point hair
Penetrate electron gun array 5, grid 6, insulated column 7, transparency electrode 8, upper cover plate 9) be located at whole device top, the hopper 10 with
Workbench 12 is located at the lower section of whole device.Workbench 12 can make vertical fortune using lowering or hoisting gear 13 in feeding device hopper
It is dynamic.It is the shaping work area of three-dimensional printer between the bottom surface of upper cover plate 9 and workbench 12.
Before printing starts, solidified resin 11 is filled in hopper 10.Workbench 12 is risen to the bottom surface of upper cover plate 9 apart
The position of unit height.
Printing starts, controller 2 control field launcher (lower cover 3, metal electrode 4, micro- sharp launching electronics rifle array 5,
Grid 6, insulated column 7, transparency electrode 8, upper cover plate 9) selectivity driving transmitting electron beam image through upper cover plate 9 reach shaping
In the space of the top of platform 12, the liquid cured resin 11 in this space starts the shape solidification according to electron-beam pattern, finally
One layer and the duplicate solid of threedimensional model section pattern are formed, while this layer of solid will be bonded at the top surface of workbench 12, not have
The place for touching electron beam is still liquid.
Complete one layer solidification after field launcher (lower cover 3, metal electrode 4, micro- sharp launching electronics rifle array 5, grid 6,
Insulated column 7, transparency electrode 8, upper cover plate 9) stop launching electronics beam, workbench 12 declines unit height by lowering or hoisting gear 13,
At this moment field launcher starts to launch next frame beam cross section pattern, and the liquid glue above formation solid just can solidify one again
The solid of layer unit thickness, two layers of solid are bonded to one, and just solidification like this in layer is gone down, and will be molded into certain knot
The solid of structure is sticked above workbench 12, as long as last take out formation solid for 12 times from workbench, just completes whole three-dimensional
Print procedure.Wherein if solidified resin 11 is insufficient in hopper 10, solidified resin 11 can be injected from glue inlet, is terminated in printing
When, then solidified resin 11 can be reclaimed by gum outlet.
In summary, and the present embodiment using electron beam as radiation curing energy source.Electron beam irradiation is by a collection of warp
Cross what the electron stream accelerated was formed, in the presence of high-power electron beam, solidified resin produces free radical or ion radical, free radical
Or ion radical is cross-linked into network polymers with other materials again, compared with ultraviolet light, particle energy is significantly larger than ultraviolet light, can
Make air ionization, and electronic beam curing is typically not required to light trigger, can directly trigger chemical reaction, to the penetration power of material
It is wideer than ultraviolet.
Field emission displays are that cathode surface potential barrier reduces, be thinning in the presence of highfield, and electronics passes through tunnel-effect
Vacuum is transmitted into through potential barrier, bombardment is realized on fluorescent material after electronics accelerates shows.Three-dimensional of the present embodiment based on FED principles
Printing is that the drive circuit in field launcher, some specific micro- sharp electronics allowed in micro tips array are controlled by using controller
Rifle launches electronics, and electronics accelerates bombardment to form specific beam bombardment group to working face in the electric field.In specific electron
Under the bombardment of beam bundle, solidified resin produces free radical or ion radical, and free radical or ion radical reticulate with the crosslinking of other materials again
Polymer forms the resin solidification thin layer of specific image, the product model of printing required for thin layer is obtained by superposition again.
Beaten described in the present embodiment using the three-dimensional of the direct solidified resin of micro- sharp launching electronics rifle array field emitted electron beam
Printing equipment is put, and compares traditional photocuring 3 D-printing device response faster, and curing rate faster, improves production effect to a certain extent
Rate；Because micro- sharp launching electronics rifle size is small, more pixels can be shown under the display surface of equal size, applied to electron beam
The 3 D-printing device of solidification can compare traditional photocuring 3 D-printing device and solidify the 3 D-printing product for higher precision；Body
Product is small, and the present embodiment 3 D-printing device can meet the 3 D-printing device miniaturization market demand.The present embodiment it is former based on FED
The three-dimensional printer of reason, electronic beam curing is carried out using field emitted electron beam, compared to using point, line curing molding
SLA three-dimensional photocurings, field emission three-dimensional electron beam curing molding have higher shaping speed excellent using surface emitting source
Gesture；, can be in the case where ensureing large scale printing compared to LCD three-dimensional photocurings, the light solidified resin for printing higher precision
Product；Compared to DLP three-dimensional photocurings, the electronic beam curing of spontaneous emission greatly reduces the loss of energy, carries to a certain extent
High production efficiency, and save and place space required for complex optical path, be advantageous to compact apparatus production.The present embodiment leads to
Cross and electronic beam curing source is used as using FED field launchers, realize the three-dimensional fast shaping of solidified resin, effectively improve
Resolution ratio and printing precision, reduce power consumption, improve productivity ratio, have certain industrial utilization.
The announcement and teaching of book according to the above description, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and changed.Therefore, the invention is not limited in embodiment disclosed and described above, to the one of invention
A little modifications and changes should also be as falling into the scope of the claims of the present invention.In addition, although used in this specification
Some specific terms, but these terms are merely for convenience of description, do not form any restrictions to the present invention.
Claims (9)
1. the 3 D-printing device based on FED principles, it is characterised in that including：Computer system, controller, field launcher,
Hopper, workbench and lowering or hoisting gear；
The computer system, for carrying out image procossing to threedimensional model, threedimensional model, which is divided into, a series of has thickness
Sectional view, and controller can be controlled；
The controller, is on the one hand controlled to field launcher, on the other hand controls lowering or hoisting gear；
The hopper, holds solidified resin, can supplement and reclaim solidified resin by glue-feeder and gum outlet；
The workbench, in hopper, immerse in solidified resin；
The lowering or hoisting gear, workbench is set to carry out elevating movement；
The field launcher include set gradually lower cover, metal electrode, micro- sharp launching electronics rifle array, grid, isolation
Post, transparency electrode and upper cover plate；The metal electrode is fixed on lower cover, and micro- sharp launching electronics rifle array is arranged on gold
Belong on electrode, micro- sharp launching electronics rifle array includes some micro- sharp launching electronics rifles arranged with array-like, the tip of electron gun
Through grid towards upper cover plate direction；One electronics will be separated out by insulated column between transparency electrode and the tip of electron gun accelerate sky
Chamber, the one of transparency electrode accelerates cavity facing to electronics, and another side is fixed on upper cover plate；What micro- sharp emission array was launched
Electron beam punctured upper cover plate after electronics accelerates cavity；
One inwall of the hopper is formed as the upper cover plate, and electron beam is injected in hopper after passing through upper cover plate；
The table top of the workbench forms 3 D-printing region towards upper cover plate between workbench table top and upper cover plate.
2. the 3 D-printing device according to claim 1 based on FED principles, it is characterised in that the controller foundation
The sectional view makes micro- sharp launching electronics rifle array send corresponding electron beam figure by addressing selective launching electronics beam
Picture, corresponding electron beam image solidify the thin resin layer for correspondence image.
3. the 3 D-printing device according to claim 1 based on FED principles, it is characterised in that the upper cover plate is formed
For the bottom surface of the hopper, top surface or side.
4. the 3 D-printing device according to claim 1 based on FED principles, it is characterised in that the lowering or hoisting gear control
Workbench processed moves up and down on the direction on the upper cover plate surface.
5. the 3 D-printing device according to claim 1 based on FED principles, it is characterised in that the electronics accelerates empty
Chamber is vacuum environment.
6. the 3 D-printing device according to claim 1 based on FED principles, it is characterised in that the solidified resin is
Can be by the epoxy resin of electronic beam curing, or the composite containing epoxy resin.
7. the 3 D-printing device according to claim 6 based on FED principles, it is characterised in that the solidified resin is
Electron beam resist.
8. the 3 D-printing device according to claim 1 based on FED principles, it is characterised in that the isolation column material
For hot pressed silicon nitride (HPSN), aluminium oxide ceramics, zirconia ceramics or quartz glass.
9. a kind of Method of printing of the 3 D-printing device based on FED principles according to claim 1, it is characterised in that beat
Before print starts, light-cured resin is injected in hopper；Workbench is moved to the position at a distance of unit distance with upper cover plate；
Printing starts, and controller control field launcher optionally drives micro- sharp launching electronics rifle array emitter to go out and described section
Figure corresponding electron beam image in face is reached through upper cover plate in the 3 D-printing region between workbench, liquid in the region
State solidified resin start according to electron-beam pattern shape solidification, ultimately form one layer it is just the same with threedimensional model sectional view
Solid, while this layer of solid will be bonded at workbench bottom surface, and the place for being not exposed to electron beam is still liquid；
After completing one layer of solidification solid, field launcher stops launching electronics beam, and workbench is by lowering or hoisting gear towards away from upper lid
The direction Moving Unit distance of plate, at this moment field launcher start launch next frame beam cross section pattern, formation solid with
Liquid glue between upper cover plate just can solidify the solid of one layer of unit thickness again, and two layers of solid is bonded to one, and just like this one
One layer of solidification of layer is gone down, and the solid for being molded into certain structure is sticked on workbench 12, finally by formation solid from workbench
Remove, complete whole 3 D-printing process；
If wherein in hopper during solidified resin deficiency, solidified resin can be injected from glue inlet, at the end of printing, then can pass through
Gum outlet reclaims solidified resin.
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| CN110466150A (en) * | 2018-05-10 | 2019-11-19 | 安世亚太科技股份有限公司 | A kind of electron beam heat reactive resin 3D printing and its application |
| CN110524875A (en) * | 2019-08-23 | 2019-12-03 | 源秩科技（上海）有限公司 | A kind of photocuring 3D printing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110466150A (en) * | 2018-05-10 | 2019-11-19 | 安世亚太科技股份有限公司 | A kind of electron beam heat reactive resin 3D printing and its application |
| CN109648850A (en) * | 2019-01-16 | 2019-04-19 | 深圳市信维通信股份有限公司 | A kind of forming method of 3D printing nozzle and liquid crystal polymer film |
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| CN110524875A (en) * | 2019-08-23 | 2019-12-03 | 源秩科技（上海）有限公司 | A kind of photocuring 3D printing device |
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| CN107553894B (en) | 2020-01-10 |
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