CN104409363A - Interposer, manufacturing method thereof and packaging structure - Google Patents

Abstract

The invention discloses an adapter board, a manufacturing method and a packaging structure thereof. The adapter plate includes: a plate body with opposite first and second surfaces, and a frustum-shaped through hole penetrating through the plate body is formed between the first surface and the second surface; an insulator is filled in the frustum-shaped through hole In the hole, a cylindrical through hole penetrating the board body is formed therein; the conductor is filled in the cylindrical through hole; and the first wiring structure and the second wiring structure are respectively arranged on the first surface and the second surface of the board body on, and electrically connected to the conductor. In the adapter board provided by the present invention, the integration density of devices on the adapter board is improved, thereby increasing the integration density of the entire packaging structure, and reducing the thermal expansion coefficient mismatch between the conductor and the board in the glass adapter board. The thermal stress problem of the silicon interposer avoids the electrical problems generated in the silicon interposer, thus enhancing the mechanical and electrical reliability of the interposer.

Description

Adapter board and its manufacturing method, packaging structure

technical field

The invention relates to the field of packaging, in particular to an adapter board, a manufacturing method thereof, and a packaging structure.

Background technique

The 3D system-in-package utilizes chips stacked on top of each other, thereby realizing efficient interconnection of different chips in the vertical direction. The interposer plays a connecting role in the three-dimensional system integration, enabling the redistribution of signal output ports. The production of the adapter board is mainly by punching holes in the board body and filling the conductors, so as to obtain the vertical transmission channel of the signal. The tapered hole drilled on the board body of the adapter board has a larger diameter of the plane end than the tip, this structure makes the filled conductor occupy a larger area on the side of the plane end of the tapered hole, thus limiting the transfer rate. The number of integrated devices on the board. Moreover, the existing adapter plate is mainly made of glass and silicon, and the fracture strength of the glass through hole is low, which easily causes thermomechanical stress problems such as fragmentation and cracks. In TSVs, the transmission channel will generate electrical problems such as parasitic capacitance, inductance, and leakage current.

Contents of the invention

The object of the present invention is to provide an adapter plate with high device integration density and strong mechanical and electrical reliability, its manufacturing method and packaging structure.

In order to achieve the above object, the present invention provides an adapter plate, which comprises: a plate body having a first surface and a second surface opposite to each other, and a plate body is formed between the first surface and the second surface There is a truncated cone-shaped through hole that runs through the board; an insulator is filled in the truncated cone-shaped through hole, and a cylindrical through hole that runs through the board is formed in the insulator; a conductor is filled in the cylindrical through-hole and a first wiring structure and a second wiring structure respectively arranged on the first surface and the second surface of the board and electrically connected to the conductor.

Preferably, the plate body is made of at least one of the following: glass, silicon, silicon carbide and ceramics.

Preferably, the insulator is made of high molecular polymer material.

Preferably, the adapter board further includes: passive components arranged on the side of the first surface and/or the side of the second surface of the board body, and electrically connected to the wiring structure on the same side; and and/or micro-electro-mechanical system devices arranged on the side of the first surface and/or the side of the second surface of the board body, and electrically connected to the wiring structure on the same side.

The present invention also provides a method for making an adapter board, the method comprising: punching holes in the board body of the adapter board from the side of the first surface of the board body, so as to form a tapered blind hole in the board body ; fill the insulator in the tapered blind hole; punch the insulator from the first surface side to form a cylindrical blind hole in the insulator; fill the conductive hole in the cylindrical blind hole Wiring the board on one side of the first surface to form a first wiring structure electrically connected to the conductor; from the second surface of the board opposite to the first surface Thinning the board body on one side, so that the conductor is exposed from the board body; and wiring the board body on the side of the second surface, so as to form a circuit that is electrically connected to the conductor body Second wiring structure.

Preferably, the plate body is made of at least one of the following: glass, silicon, silicon carbide and ceramics.

Preferably, the insulator is made of high molecular polymer material.

Preferably, the method further includes: after wiring the board on the side of the first surface, arranging passive devices and/or MEMS devices on the side of the first surface, so that the passive device And/or the MEMS device is electrically connected to the first wiring structure, and then the board is thinned from the side of the second surface of the board opposite to the first surface.

Preferably, the method further includes: after wiring the board on the side of the second surface, arranging passive devices and/or MEMS devices on the side of the second surface, so that the passive device And/or the MEMS device is electrically connected to the second wiring structure.

The present invention also provides a packaging structure including the adapter plate provided by the present invention.

Through the above technical solution, the insulator is filled in the tapered blind hole of the adapter plate, and the cylindrical blind hole is drilled in the insulator to fill the conductor, so that the final filled conductor is a cylindrical shape with a smaller aperture after correction. Therefore, in the adapter board provided by the present invention, the diameter of the conductor is reduced, the integration density of devices on the adapter board is increased, and the integration density of the entire packaging structure is further increased. Moreover, the insulator filled in the through hole has good electrical and mechanical properties. Therefore, the insulator can be used as a buffer layer for stress relief, reducing the heat loss caused by the thermal expansion coefficient mismatch between the conductor and the board in the glass interposer. Stress problem, and the insulator acts as an insulating layer, avoiding the electrical problems generated in the silicon interposer, thus enhancing the mechanical and electrical reliability of the interposer.

Other features and advantages of the present invention will be described in detail in the following detailed description.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the description, together with the following specific embodiments, are used to explain the present invention, but do not constitute a limitation to the present invention. In the attached picture:

Figure 1a and Figure 1b are schematic diagrams of adapter plates provided by two embodiments of the present invention; and

Fig. 2a-Fig. 2i are schematic diagrams of the manufacturing method of the adapter plate provided by the embodiment of the present invention.

Explanation of reference signs

100 Adapter board 101 Board body 101a First surface

101b second surface 101c frusto-conical through hole 101d conical blind hole

102 Insulator 102c Cylindrical through hole 102b Cylindrical blind hole

103 Conductor 104a First wiring structure 104b Second wiring structure

105 Passive components 106 Carrier

Detailed ways

Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, not to limit the present invention.

Fig. 1a and Fig. 1b are schematic diagrams of adapter plates provided by two embodiments of the present invention. In the embodiment shown in FIG. 1 a , the interposer board 100 may include a board body 101 , an insulator 102 , a conductor 103 , and a first wiring structure 104 a and a second wiring structure 104 b. Wherein, the plate body 101 has a first surface 101 a and a second surface 101 b opposite to each other, and a frustum-shaped through hole 101 c penetrating through the plate body 101 may be formed between the first surface 101 a and the second surface 101 b. The insulator 102 may be filled in the frustum-shaped through hole 101c, and the insulator 102 may be formed with a cylindrical through hole 102c penetrating the plate body 101 . The electrical conductor 103 may be filled in the cylindrical through hole 102c. The first wiring structure 104 a and the second wiring structure 104 b may be arranged on the first surface 101 a and the second surface 101 b of the board body 101 respectively, and be electrically connected to the conductor 103 .

Wherein, the plate body 101 may be made of at least one of the following: glass, silicon, silicon carbide and ceramics. The insulator 102 can be made of high molecular polymer material (for example, benzocyclobutene BCB, photosensitive polyimide PSPI, etc.).

It should be noted that, in the drawings of this specification, two truncated cone-shaped through holes 101c and two conductors 103 are taken as examples for illustration. However, it should be understood that the numbers of via holes and conductors herein are only exemplary and not intended to limit the scope of the present invention.

It should be understood that the shapes of the truncated cone-shaped through hole 101c and the cylindrical through-hole 102c in the accompanying drawings only show regular truncated cone-shaped and cylindrical shapes as examples, while the truncated-conical shape described in the present invention (and the shape to be described later) Conical) and cylindrical shapes are not limited to frustum-shaped (conical) and cylindrical structures in the strict sense. As long as the approximate frustum-shaped (conical) and cylindrical structures are included within the protection scope of the present invention.

Preferably, in another implementation manner as shown in FIG. 1 b , the interposer board 100 may further include passive devices 105 and/or MEMS devices (not shown) in consideration of circuit function requirements. The passive device 105 can be arranged on the side of the first surface 101a and/or the side of the second surface 101b of the board body 101, and is electrically connected to the wiring structure on the same side (not shown). Likewise, MEMS devices can also be arranged on the side of the first surface 101a and/or the side of the second surface 101b of the board body 101, and be electrically connected to the wiring structure on the same side. Wherein, the passive device 105 may be, for example, a resistor, a capacitor, a filter, a resonator, an optical passive device, and the like.

Figure 1b shows that the passive device 105 is arranged above the first surface 101a of the board body 101, those skilled in the art can understand that the passive device 105 can also be arranged below the first surface 101a of the board body 101 , that is, the passive device 105 can be implanted inside the board body 101 . Similarly, if the passive device 105 (and/or MEMS device) is arranged on the second surface 101b side, it can also be arranged above the second surface 101b (outside the board body 101) or implanted into the interior of the plate body 101.

It can be understood that only one passive device 105 is taken as an example in FIG. 1 b , and its number does not limit the scope of the present invention. Multiple passive devices 105 may also be arranged in the interposer board 100 .

In the adapter plate 100 provided by the present invention, by filling the insulator 102 and then forming a through hole for filling the conductor 103 on the insulator 102, the truncated cone-shaped through hole 101c on the adapter plate 100 can be modified to a diameter Smaller cylindrical through hole 102c. Therefore, the effective through hole filled by the conductor 103 is the cylindrical through hole 102c with a smaller diameter, which reduces the diameter of the conductor. If the conductors 103 are filled in the original frustum-shaped through-holes 101c, then the through-holes must be separated by a certain distance to avoid misconnection of adjacent conductors. By using the adapter plate provided by the present invention, the distance between them can be reduced when making tapered through holes, and finally the distance between conductors 103 can be reduced to a certain extent. Therefore, in the adapter board provided by the present invention, the aperture diameter of the through hole is reduced, that is, the diameter of the conductor is reduced, and the integration density of devices on the adapter board is increased, thereby increasing the integration density of the entire packaging structure. Moreover, the insulator 102 filled in the truncated cone-shaped through hole 101c has good electrical and mechanical properties. Therefore, the insulator 102 acts as a buffer layer for stress release, reducing the thermal expansion coefficient of the conductor 103 and the plate body 101 in the glass interposer. Thermal stress problems caused by mismatching, etc., act as an insulating layer to avoid electrical problems generated in the silicon interposer, thereby enhancing the mechanical and electrical reliability of the interposer 100 .

Fig. 2a-Fig. 2i are schematic diagrams of the manufacturing method of the adapter plate provided by the embodiment of the present invention.

Firstly, step 1, as shown in FIG. 2 a , can punch the board body 101 from the first surface 101 a side of the board body 101 of the adapter board 100 to form a tapered blind hole 101 d in the board body 101 . Technically, the tapered blind hole 101d can be drilled on the board body 101 by laser drilling. Wherein, the plate body 101 may be made of at least one of the following, for example: glass, silicon, silicon carbide and ceramics.

Next, step 2, as shown in FIG. 2 b , can fill the insulator 102 in the tapered blind hole 101 d. The insulator 102 can be made of, for example, a polymer material (eg, benzocyclobutene BCB, photosensitive polyimide PSPI, etc.).

Next, Step 3, as shown in FIG. 2 c , may drill holes in the insulator 102 from the side of the first surface 101 a to form cylindrical blind holes 102 b in the insulator 102 . Specifically, after the insulator 102 is filled (step 2), the first surface 101a may be planarized, and a hard mask (not shown) may be fabricated, and holes in the insulator 102 may be drilled through the hard mask.

Next, Step 4, as shown in FIG. 2d , the conductive body 103 may be filled in the cylindrical blind hole 102b. For example, copper can be filled into the cylindrical blind hole 102 b by electroplating to form a copper conductor 103 . Preferably, before filling the conductor 103, a diffusion barrier layer and a seed layer may be deposited in the cylindrical blind hole 102b, so as to block the diffusion of copper and facilitate the electroplating of copper lines.

Next, in step five, as shown in FIG. 2e , the board body 101 may be wired on the side of the first surface 101a to form a first wiring structure 104a, and the first wiring structure 104a is electrically connected to the conductor 103 .

Next, in step six, as shown in FIG. 2f, passive devices 105 and/or MEMS devices can be arranged on the side of the first surface 101a, so that the passive devices 105 and/or MEMS devices and the first wiring Structure 104a is electrically connected (not shown). The sixth step is an optional step in the preferred embodiment depending on the needs of the circuit, and it is also possible to directly perform the following steps without performing the sixth step.

Next, in step seven, as shown in FIG. 2g , the carrier sheet 106 may be temporarily bonded (for example, by spin-coating bonding glue on the surface) on the side of the first surface 101a of the plate body 101 . The carrying sheet 106 can protect the first wiring structure 104 a of the interposer 100 in the subsequent thinning process. This step seven is an optional step in the preferred implementation manner, and this step seven can also be directly performed without performing the following steps.

Next, in step eight, as shown in FIG. 2h, the plate body 101 can be thinned from the side of the second surface 101b of the plate body 101 opposite to the first surface 101a (for example, by dry etching, wet etching or other thinning methods), so that the conductor 103 is exposed from the plate body 101 . At this time, the original conical blind hole 101d becomes a truncated conical through hole 101c, and the cylindrical blind hole 102b becomes a cylindrical through hole 102c.

Next, step nine, as shown in FIG. 2 i , wiring the board body 101 on the side of the second surface 101 b to form a second wiring structure 104 b, and the second wiring structure 104 b is electrically connected to the conductor 103 .

Next, in step ten, a passive device 105 and/or a MEMS device (not shown) is arranged on the side of the second surface 101b of the board body 101, so that the passive device 105 and/or the MEMS device and the first The two wiring structures 104b are electrically connected. This step ten is an optional step in the preferred implementation manner, and this step may not be performed.

Finally, on the basis of performing the above step seven (bonding the carrier sheet 106 ), in step eleven, the carrier sheet 106 can be removed from the board body 101 . In FIG. 2i, the adapter board after removing the carrier sheet 106 is shown in FIG. 1b.

The present invention also provides a packaging structure including the above-mentioned adapter board 100 .

To sum up, in the adapter plate 100 of the present invention, through filling the insulator 102, and then forming a through hole for filling the conductor 103 on the insulator 102, the frustum-shaped through hole on the adapter plate 100 can be 101c is modified to a cylindrical through hole 102c with a smaller diameter. Therefore, the effective through hole filled by the conductor 103 is the cylindrical through hole 102c with a smaller diameter. In the adapter board 100 provided by the present invention, the diameter of the through hole is reduced, the integration density of the devices on the adapter board is increased, and the integration density of the entire packaging structure is further improved. Moreover, the insulator 102 filled in the truncated cone-shaped through hole 101c has good electrical and mechanical properties. Therefore, the insulator 102 acts as a buffer layer for stress release, reducing the thermal expansion coefficient of the conductor 103 and the plate body 101 in the glass interposer. Thermal stress problems caused by mismatching, etc., act as an insulating layer to avoid electrical problems generated in the silicon interposer, thereby enhancing the mechanical and electrical reliability of the interposer 100 .

The preferred embodiment of the present invention has been described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the specific details of the above embodiment, within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, These simple modifications all belong to the protection scope of the present invention.

In addition, it should be noted that the various specific technical features described in the above specific implementation manners may be combined in any suitable manner if there is no contradiction. In order to avoid unnecessary repetition, various possible combinations are not further described in the present invention.

In addition, various combinations of different embodiments of the present invention can also be combined arbitrarily, as long as they do not violate the idea of the present invention, they should also be regarded as the disclosed content of the present invention.

Claims (10)

1. An adapter plate, characterized in that the adapter plate comprises: a plate body having opposite first and second surfaces, and a frustum-shaped through hole penetrating through the plate body is formed between the first surface and the second surface; an insulator filled in the frustum-shaped through hole, and a cylindrical through hole penetrating through the plate body is formed in the insulator; an electrical conductor filled in the cylindrical through hole; and The first wiring structure and the second wiring structure are arranged on the first surface and the second surface of the board respectively, and are electrically connected to the conductor. 2. The adapter board according to claim 1, wherein the board body is made of at least one of the following: glass, silicon, silicon carbide and ceramics. 3. The adapter board according to claim 1, wherein the insulator is made of high molecular polymer material. 4. The adapter board according to claim 1, characterized in that, the adapter board further comprises: a passive device arranged on one side of the first surface and/or one side of the second surface of the board, and electrically connected to the wiring structure on the same side; and/or The MEMS device is arranged on the side of the first surface and/or the side of the second surface of the board body, and is electrically connected to the wiring structure on the same side. 5. A method for making an adapter plate, characterized in that the method comprises: punching the board body from the side of the first surface of the board body of the adapter board to form a tapered blind hole in the board body; Filling an insulator in the tapered blind hole; perforating the insulator from one side of the first surface to form cylindrical blind holes in the insulator; filling the conductive body in the cylindrical blind hole; Wiring the board on one side of the first surface to form a first wiring structure electrically connected to the conductor; thinning the plate body from a side of a second surface of the plate body opposite to the first surface so that the conductors are exposed from the plate body; and Wiring is performed on the board body on the side of the second surface to form a second wiring structure electrically connected to the conductor. 6. The method according to claim 5, wherein the plate body is made of at least one of the following: glass, silicon, silicon carbide and ceramics. 7. The method according to claim 5, wherein the insulator is made of high molecular polymer material. 8. The method according to claim 5, characterized in that the method further comprises: After wiring the board on the side of the first surface, a passive device and/or a MEMS device is arranged on the side of the first surface, so that the passive device and/or MEMS device and The first wiring structure is electrically connected, and then the board is thinned from the side of the second surface of the board opposite to the first surface. 9. The method according to claim 5, characterized in that the method further comprises: After wiring the board on the side of the second surface, arrange passive devices and/or MEMS devices on the side of the second surface, so that the passive devices and/or MEMS devices are connected with The second wiring structure is electrically connected. 10. A packaging structure comprising the interposer according to any one of claims 1-4.