CN104409363B - Pinboard and preparation method thereof, encapsulating structure - Google Patents
Pinboard and preparation method thereof, encapsulating structure Download PDFInfo
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- CN104409363B CN104409363B CN201410664902.5A CN201410664902A CN104409363B CN 104409363 B CN104409363 B CN 104409363B CN 201410664902 A CN201410664902 A CN 201410664902A CN 104409363 B CN104409363 B CN 104409363B
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- plate body
- pinboard
- surface side
- insulator
- hole
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Abstract
The invention discloses a kind of pinboard and preparation method thereof, encapsulating structure.The pinboard includes：Plate body, there is relative first surface and second surface, and the taper type through hole of the plate body is formed through between first surface and second surface；Insulator, it is filled in taper type through hole, is formed with the cylindrical hole through plate body；Electric conductor, it is filled in cylindrical hole；And first wire structures and the second wire structures, it is arranged on the first surface and second surface of plate body, and electrically connected with electric conductor.In pinboard provided by the invention, improve the integration density of device on pinboard, and then improve the integration density of whole encapsulating structure, and reduce electric conductor and plate body thermal stress issues caused by thermal coefficient of expansion mismatch etc. in glass pinboard, caused electricity question in silicon pinboard is avoided, therefore enhances the mechanically and electrically reliability of pinboard.
Description
Technical field
The present invention relates to encapsulation field, in particular it relates to a kind of pinboard and preparation method thereof, encapsulating structure.
Background technology
Three dimension system encapsulation is stacked with using chip, it is achieved thereby that different chips are in the efficient mutual of vertical direction
Even.Pinboard (interposer) serves the effect formed a connecting link in three dimension system is integrated so that signal output part cause for gossip
Now reallocate.The making of pinboard on its plate body mainly by punching, and fill electric conductor, so as to obtain the vertical biography of signal
Defeated passage.The bellmouth drilled through on the plate body of pinboard is more than the aperture at tip due to the aperture of its planar ends, and this structure makes
The electric conductor that must be filled occupies larger area in the planar ends side of bellmouth, so as to limit the integrated of device on pinboard
Number.Also, existing pinboard is mainly made up of glass and silicon, the fracture strength of glass through hole is relatively low, easily cause fragmentation,
The thermal and mechanical stress problem such as crackle.In silicon hole, transmission channel can produce the electricity such as parasitic capacitance, inductance and leakage current and ask
Topic.
The content of the invention
It is an object of the invention to provide a kind of device integration density it is larger, mechanically and electrically the stronger pinboard of reliability and
Its preparation method, encapsulating structure.
To achieve these goals, the present invention provides a kind of pinboard, and the pinboard includes：Plate body, have relative the
One surface and second surface, and the taper type for being formed through between the first surface and the second surface plate body leads to
Hole；Insulator, it is filled in the taper type through hole, the cylindrical hole of the plate body is formed through in the insulator；
Electric conductor, it is filled in the cylindrical hole；And first wire structures and the second wire structures, it is arranged in the plate
On the first surface and the second surface of body, and electrically connected with the electric conductor.
Preferably, the plate body is made up of at least one of following：Glass, silicon, carborundum and ceramics.
Preferably, the insulator is made up of macromolecule polymer material.
Preferably, the pinboard also includes：Passive device, be arranged in the plate body the first surface side and/or
The second surface side, and electrically connected with the wire structures of homonymy；And/or mems device, it is arranged in the plate body
The first surface side and/or the second surface side, and electrically connected with the wire structures of homonymy.
The present invention also provides a kind of preparation method of pinboard, and this method includes：From the first surface of the plate body of pinboard
Side is punched to the plate body, to form tapered blind hole in the plate body；Insulator is filled in the tapered blind hole；
The insulator is punched from the first surface side, to form blind cylindrical hole in the insulator；Described
Electric conductor is filled in blind cylindrical hole；The plate body is connected up in the first surface side, to be formed and the conduction
First wire structures of body electrical connection；From the second surface side of the plate body relative with the first surface to the plate body
It is thinned so that the electric conductor exposes from the plate body；And cloth is carried out to the plate body in the second surface side
Line, to form the second wire structures electrically connected with the electric conductor.
Preferably, the plate body is made up of at least one of following：Glass, silicon, carborundum and ceramics.
Preferably, the insulator is made up of macromolecule polymer material.
Preferably, this method also includes：After being connected up in the first surface side to the plate body, described
Passive device and/or mems device are arranged in one surface side so that the passive device and/or mems device with
First wire structures electrical connection, and then from the second surface side pair of the plate body relative with the first surface
The plate body is thinned.
Preferably, this method also includes：After being connected up in the second surface side to the plate body, described
Passive device and/or mems device are arranged in two surfaces side so that the passive device and/or mems device with
The second wire structures electrical connection.
The present invention also provides a kind of encapsulating structure for including pinboard provided by the invention.
Pass through above-mentioned technical proposal, insulator is filled in the tapered blind hole of pinboard, then beat cylinder in the insulator
Blind hole fills electric conductor so that the electric conductor finally filled is amendment back aperture less cylinder.Therefore, the present invention provides
Pinboard in, reduce the diameter of electric conductor, improve the integration density of device on pinboard, and then improve whole encapsulation
The integration density of structure.Also, the insulator filled in through hole has good electric property and mechanical performance, therefore, this is exhausted
Edge body can not reduce in glass pinboard electric conductor and plate body due to thermal coefficient of expansion not as the cushion of stress release
With thermal stress issues caused by grade, and the insulator avoids caused electricity question in silicon pinboard as insulating barrier, because
And enhance the mechanically and electrically reliability of pinboard.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Brief description of the drawings
Accompanying drawing is for providing a further understanding of the present invention, and a part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 a and Fig. 1 b are the schematic diagrames for the pinboard that two kinds of embodiments of the present invention provide；And
Fig. 2 a- Fig. 2 i are the schematic diagrames of the preparation method for the pinboard that embodiments of the present invention provide.
Description of reference numerals
The plate body 101a first surfaces of 100 pinboard 101
101b second surface 101c taper type through hole 101d tapered blind holes
102 insulator 102c cylindrical hole 102b blind cylindrical holes
103 electric conductor 104a the first wire structures the second wire structures of 104b
The carrying tablet of 105 passive device 106
Embodiment
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
Fig. 1 a and Fig. 1 b are the schematic diagrames for the pinboard that two kinds of embodiments of the present invention provide.Implementation as shown in Figure 1a
In mode, pinboard 100 can include plate body 101, insulator 102, the wire structures 104a of electric conductor 103 and first and second
Wire structures 104b.Wherein, plate body 101 has relative first surface 101a and second surface 101b, and in first surface
The taper type through hole 101c through the plate body 101 is could be formed between 101a and second surface 101b.Insulator 102 can be filled out
Fill in taper type through hole 101c, the cylindrical hole 102c through plate body 101 is could be formed with the insulator 102.It is conductive
Body 103 can be filled in cylindrical hole 102c.First wire structures 104a and the second wire structures 104b can distinguish cloth
Put on the first surface 101a and second surface 101b of plate body 101, and electrically connected with the electric conductor 103.
Wherein, plate body 101 can be made up of at least one of following：Glass, silicon, carborundum and ceramics.Insulator 102
It can be made up of macromolecule polymer material (for example, benzocyclobutene BCB, light-sensitive polyimide PSPI etc.).
It should be noted that enter in this specification accompanying drawing by taking two taper type through hole 101c and two electric conductors 103 as an example
Row explanation.It should be understood, however, that the number of through hole and electric conductor is exemplary effect of playing herein, and not as
Limitation of the scope of the invention.
It should be understood that taper type through hole 101c and cylindrical hole 102c shape are shown merely illustratively in accompanying drawing
The taper type and cylinder of rule, and taper type of the present invention (and the taper that will be discussed later) and cylinder are gone out
It is not limited to the taper type (taper) and cylindrical structural of stricti jurise.As long as approximate taper type (taper) and cylinder
Structure is included within protection scope of the present invention.
Preferably, in another embodiment as shown in Figure 1 b, the needs of circuit function are considered, the pinboard 100 may be used also
With including passive device 105 and/or mems device (not shown).The passive device 105 can be arranged in plate body 101
First surface 101a sides and/or second surface 101b sides, and electrically connect (not shown) with the wire structures of homonymy.Equally
Ground, mems device can also be arranged in the first surface 101a sides of plate body 101 and/or the second surface
101b sides, and electrically connected with the wire structures of homonymy.Wherein, passive device 105 for example can be resistance, electric capacity, wave filter,
Resonator and optical passive component etc..
Show that passive device 105 is disposed in more than the first surface 101a of plate body 101, those skilled in the art in Fig. 1 b
It is understood that the passive device 105 can also be disposed in below the first surface 101a of plate body 101, that is, the nothing
Source device 105 can be implanted to the inside of plate body 101.Similarly, if (and/or the MEMS device of passive device 105
Part) be disposed in second surface 101b sides if, it, which can also be disposed in more than second surface 101b, (is located at plate body 101
Outside) or be implanted to the inside of plate body 101.
It is understood that in Fig. 1 b only by taking a passive device 105 as an example, its quantity is in this and without limiting this hair
The meaning of bright interest field, multiple passive devices 105 can also be arranged in pinboard 100.
In pinboard 100 provided by the invention, by the filling of insulator 102, then formed and used on the insulator 102
In the through hole of filling electric conductor 103, the taper type through hole 101c on pinboard 100 can be modified to the less cylinder of diameter
Through hole 102c.Therefore, effective through hole that electric conductor 103 is filled is the less cylindrical hole 102c of diameter, reduces electric conductor
Diameter.If filling electric conductor 103 in original taper type through hole 101c, then must be separated between through hole certain
Distance, to avoid the occurrence of the situation of adjacent electric conductor misconnection.Using above-mentioned pinboard provided by the invention, it is possible to
It reduces mutual distance when making conical through-hole, may finally reduce to a certain extent between electric conductor 103
Distance.Therefore, in pinboard provided by the invention, through-hole aperture is reduced, that is, reduces the diameter of electric conductor, improves and turns
The integration density of device on fishplate bar, and then improve the integration density of whole encapsulating structure.Also, filled out in taper type through hole 101c
The insulator 102 filled has good electric property and mechanical performance, therefore, the buffering of the insulator 102 as stress release
Layer, reduce electric conductor 103 in glass pinboard and asked with the thermal stress caused by thermal coefficient of expansion mismatch etc. of plate body 101
Topic, as insulating barrier, avoids caused electricity question in silicon pinboard, thus enhances pinboard 100 mechanically and electrically
Reliability.
Fig. 2 a- Fig. 2 i are the schematic diagrames of the preparation method for the pinboard that embodiments of the present invention provide.
First, step 1, as shown in Figure 2 a, can be from the first surface 101a sides of the plate body 101 of pinboard 100 to plate
Body 101 is punched, to form tapered blind hole 101d in the plate body 101.Can be by laser drill in plate body 101 in technique
On drill through out tapered blind hole 101d.Wherein, plate body 101 can for example be made up of at least one of following：Glass, silicon, carbonization
Silicon and ceramics.
Next, step 2, as shown in Figure 2 b, can fill insulator 102 in tapered blind hole 101d.The insulator
102 of macromolecule polymer material (for example, benzocyclobutene BCB, light-sensitive polyimide PSPI) such as can be made up.
Next, step 3, as shown in Figure 2 c, can beat insulator 102 from the first surface 101a sides
Hole, to form blind cylindrical hole 102b in the insulator 102.Specifically, can be after filling insulator 102 (step 2)
First surface 101a planarization is carried out, and make hard mask (not shown), logical hard mask realizes beating in insulator 102
Hole.
Next, step 4, as shown in Figure 2 d, can fill electric conductor 103 in blind cylindrical hole 102b.For example, can
So that copper is filled into blind cylindrical hole 102b with electric plating method, copper electric conductor 103 is formed.Preferably, led in filling
Before electric body 103, can also first first deposit diffusion barriers and Seed Layer in blind cylindrical hole 102b, can so stop copper
Diffusion, and be easy to electroplate out copper wire.
Next, step 5, as shown in Figure 2 e, can be connected up, with shape in first surface 101a sides to plate body 101
Into the first wire structures 104a, and the first wire structures 104a and electric conductor 103 electrically connect.
Next, step 6, as shown in figure 2f, passive device 105 and/or micro- can be arranged in first surface 101a sides
Mechatronic Systems device so that the passive device 105 and/or mems device electrically connect (not with the first wire structures 104a
Show).The step 6 is the optional step depending on the preferred embodiment taken needed for circuit, can not also perform the step
Six, and directly follow the steps below.
Next, step 7, as shown in Figure 2 g, can be bonded (example temporarily in the first surface 101a sides of plate body 101
Such as, can be by way of being bonded glue in surface spin coating) carrying tablet 106.The carrying tablet 106 can be in ensuing reduction process
In play a part of protect pinboard 100 the first wire structures 104a.The step 7 is the optional step of preferred embodiment
Suddenly, the step 7 can not also be performed, and is directly followed the steps below.
Next, step 8, as shown in fig. 2h, can be from the second surface of the plate body 101 relative with first surface 101a
101b sides plate body 101 are thinned (for example, by dry etching, wet etching or other thining methods) so that are led
Electric body 103 exposes from plate body 101.Now, tapered blind hole 101d originally is changed into taper type through hole 101c, blind cylindrical hole 102b
It is changed into cylindrical hole 102c.
Next, step 9, as shown in fig. 2i, is connected up in second surface 101b sides to plate body 101, to form
Two wire structures 104b, and the second wire structures 104b and electric conductor 103 electrically connect.
Next, step 10, passive device 105 and/or micro-electro-mechanical systems are arranged in the second surface 101b sides of plate body 101
System device (not shown) so that the passive device 105 and/or mems device electrically connect with the second wire structures 104b.
The step 10 is the optional step of preferred embodiment, can not also perform the step.
Finally, on the basis of above-mentioned steps seven (bonding carrying tablet 106) are performed, step 11, can be moved from plate body 101
Except the carrying tablet 106.The pinboard after carrying tablet 106 is removed in Fig. 2 i as shown in Figure 1 b.
The present invention also provides a kind of encapsulating structure for including above-mentioned pinboard 100.
In summary, in the pinboard 100 of the present invention, by the filling of insulator 102, then on the insulator 102
The through hole for filling electric conductor 103 is formed, it is less the taper type through hole 101c on pinboard 100 can be modified to diameter
Cylindrical hole 102c.Therefore, effective through hole that electric conductor 103 is filled is the less cylindrical hole 102c of diameter.The present invention
In the pinboard 100 of offer, through-hole aperture is reduced, improves the integration density of the device on pinboard, and then is improved whole
The integration density of individual encapsulating structure.Also, the insulator 102 filled in taper type through hole 101c have good electric property and
Mechanical performance, therefore, the cushion of the insulator 102 as stress release, reduce electric conductor 103 and plate in glass pinboard
The thermal stress issues caused by thermal coefficient of expansion mismatch etc. of body 101, as insulating barrier, avoid caused in silicon pinboard
Electricity question, thus enhance the mechanically and electrically reliability of pinboard 100.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, still, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, a variety of letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, it can be combined by any suitable means.In order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (10)
1. a kind of pinboard, it is characterised in that the pinboard includes：
Plate body, there is relative first surface and second surface, and formed between the first surface and the second surface
There is the taper type through hole through the plate body；
Insulator, it is filled in the taper type through hole, the cylindrical hole of the plate body is formed through in the insulator,
The cylindrical hole to the insulator for filling up the taper type through hole from the first surface side by carrying out punching formation；
Electric conductor, it is filled in the cylindrical hole with electric plating method, is deposited between the insulator and the electric conductor
There is diffusion impervious layer；And
First wire structures and the second wire structures, it is arranged in the first surface of the plate body and the second surface
On, and electrically connected with the electric conductor.
2. pinboard according to claim 1, it is characterised in that the plate body is made up of at least one of following：Glass
Glass, silicon, carborundum and ceramics.
3. pinboard according to claim 1, it is characterised in that the insulator is made up of macromolecule polymer material.
4. pinboard according to claim 1, it is characterised in that the pinboard also includes：
Passive device, is arranged in the first surface side of the plate body and/or the second surface side, and with homonymy
Wire structures electrically connect；And/or
Mems device, is arranged in the first surface side of the plate body and/or the second surface side, and with
The wire structures electrical connection of homonymy.
5. a kind of preparation method of pinboard, it is characterised in that this method includes：
The plate body is punched from the first surface side of the plate body of pinboard, it is blind to form taper in the plate body
Hole；
Insulator is filled in the tapered blind hole；
The insulator is punched from the first surface side, to form blind cylindrical hole in the insulator；
The deposit diffusion barriers in the blind cylindrical hole, then fill electric conductor with electric plating method；
The plate body is connected up in the first surface side, to form the first wire bond electrically connected with the electric conductor
Structure；
The plate body is thinned from the second surface side of the plate body relative with the first surface so that described to lead
Electric body exposes from the plate body；And
The plate body is connected up in the second surface side, to form the second wire bond electrically connected with the electric conductor
Structure.
6. according to the method for claim 5, it is characterised in that the plate body is made up of at least one of following：Glass,
Silicon, carborundum and ceramics.
7. according to the method for claim 5, it is characterised in that the insulator is made up of macromolecule polymer material.
8. according to the method for claim 5, it is characterised in that this method also includes：
After being connected up in the first surface side to the plate body, passive device is arranged in the first surface side
And/or mems device so that the passive device and/or mems device are electrically connected with first wire structures
Connect, and then the plate body is thinned from the second surface side of the plate body relative with the first surface.
9. according to the method for claim 5, it is characterised in that this method also includes：
After being connected up in the second surface side to the plate body, passive device is arranged in the second surface side
And/or mems device so that the passive device and/or mems device are electrically connected with second wire structures
Connect.
A kind of 10. encapsulating structure of the pinboard in 1-4 including claim described in any claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410664902.5A CN104409363B (en) | 2014-11-19 | 2014-11-19 | Pinboard and preparation method thereof, encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410664902.5A CN104409363B (en) | 2014-11-19 | 2014-11-19 | Pinboard and preparation method thereof, encapsulating structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104409363A CN104409363A (en) | 2015-03-11 |
| CN104409363B true CN104409363B (en) | 2017-12-01 |
Family
ID=52646979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410664902.5A Active CN104409363B (en) | 2014-11-19 | 2014-11-19 | Pinboard and preparation method thereof, encapsulating structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN104409363B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112290338A (en) * | 2019-07-24 | 2021-01-29 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of adapter plate |
| CN113035834B (en) * | 2021-05-28 | 2021-07-30 | 浙江集迈科微电子有限公司 | Adapter plate and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176256A (en) * | 2000-12-06 | 2002-06-21 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
| CN1901782A (en) * | 2005-07-18 | 2007-01-24 | 台达电子工业股份有限公司 | Circuit base board with through hole circuit and its producing method |
| CN102569251A (en) * | 2012-02-22 | 2012-07-11 | 江苏物联网研究发展中心 | Intermetallic compound filled vertical through-hole interconnecting structure for three-dimensional package and preparation method thereof |
| CN102956540A (en) * | 2011-08-18 | 2013-03-06 | 中国科学院微电子研究所 | Production method of interconnection structure with materials containing polymer and metal through holes |
-
2014
- 2014-11-19 CN CN201410664902.5A patent/CN104409363B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176256A (en) * | 2000-12-06 | 2002-06-21 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
| CN1901782A (en) * | 2005-07-18 | 2007-01-24 | 台达电子工业股份有限公司 | Circuit base board with through hole circuit and its producing method |
| CN102956540A (en) * | 2011-08-18 | 2013-03-06 | 中国科学院微电子研究所 | Production method of interconnection structure with materials containing polymer and metal through holes |
| CN102569251A (en) * | 2012-02-22 | 2012-07-11 | 江苏物联网研究发展中心 | Intermetallic compound filled vertical through-hole interconnecting structure for three-dimensional package and preparation method thereof |
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| CN104409363A (en) | 2015-03-11 |
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