CN104404475B - The method strengthening parylene film and metal level adhesiveness - Google Patents
The method strengthening parylene film and metal level adhesiveness Download PDFInfo
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- CN104404475B CN104404475B CN201410541559.5A CN201410541559A CN104404475B CN 104404475 B CN104404475 B CN 104404475B CN 201410541559 A CN201410541559 A CN 201410541559A CN 104404475 B CN104404475 B CN 104404475B
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- parylene film
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Abstract
A kind of method strengthening parylene film and metal level adhesiveness, comprises the steps: step 1: take a substrate to be deposited;Step 2: at Grown parylene film;Step 3: use oxygen reactive ion etching process, the surface of parylene film is prepared as fine hair shape nanostructured;Step 4: deposit metal on the parylene film being prepared as fine hair shape nanostructured, complete preparation.The present invention carries out surface modification by oxygen reactive ion etching process, forms villous nanostructured on the surface of parylene film, improves the surface energy of parylene film, thus strengthens the adhesion strength between parylene film and metal level.
Description
Technical field
The present invention relates to technical field of micro and nano fabrication, particularly to one strengthen parylene film with
The method of metal level adhesiveness.
Background technology
In recent years, printed electronic research becomes one of current study hotspot.Printed electronic (English
Language: printed electronics) it is to utilize the many manufacture electronic devices on flexible substrates of printing
Method.Parylene (i.e. Dichloro-[2.2]-paracyc lophane, be abbreviated as Parylene)
As a kind of conventional flexible base material, there is the advantages such as transparent, good insulating, poly-to diformazan
On at the bottom of phenyl, evapontte ie meti yer prepares flexible device is requisite link.Parylene film and
Adhesiveness between metal level directly affects practicality and the reliability of device.
Parylene film material surface energy is low, chemical inertness and adhesive property poor, the most very
Difficulty is formed the most bonding with metal level.Along with Parylene is in printed electronic, micro-fluidic, raw
The expansion of the field such as thing medical science micro-system application and deeply, especially as flexible electrode substrate, research
Personnel are highly desirable realizes adhesive capacity superpower between parylene film and metal level.
At present, industry generally uses surface chemistry to adhesiveness between parylene film and metal level
Process (surface chemical modification) method strengthen parylene film with
Adhesiveness between metal level.Its general step is (Fig. 1):
Step 1: by Parylene performed polymer, uses vacuum vapor deposition technique, at substrate surface
Form the most conformal polymer thin membrane coat 101;
Step 2: the surface of parylene film is carried out silanization or the peace and quiet process of plasma 102;
Step 3: at the surface of the parylene film peace and quiet through silanization or plasma deposition gold
Belong to layer 103.
This kind of technique makes mainly even by increasing by one layer of silane between Parylene and metal
Connection agent, the most above-mentioned adhesive layer realize both combinations.This transition zone with poly-to diformazan
Benzene is compared, easily by the erosion generation degeneration of air or solution, then occur parylene film and
Peel off between metal level and come off, directly affect yield rate and the reliability of processing technology.To this end, this
The process of a kind of improvement of bright proposition, does not use silane coupler, but by Parylene
Surface processes and strengthens the adhesiveness between parylene film and metal level.
Summary of the invention
For above-mentioned the deficiencies in the prior art, it is an object of the invention to propose a kind of enhancing and gather diformazan
Benzene thin film and the method for metal level adhesiveness, carry out surface modification by oxygen reactive ion etching process,
Form villous nanostructured on the surface of parylene film, improve parylene film
Surface energy, thus strengthen the adhesion strength between parylene film and metal level.
The present invention provides a kind of method strengthening parylene film and metal level adhesiveness, including such as
Lower step:
Step 1: take a substrate to be deposited;
Step 2: at Grown parylene film;
Step 3: use oxygen reactive ion etching process, the surface of parylene film is prepared as
Fine hair shape nanostructured;
Step 4: deposit metal on the parylene film being prepared as fine hair shape nanostructured, complete
Become preparation.
The invention has the beneficial effects as follows: use oxygen reactive ion etching process to carry out surface modification so that
Adhesiveness between parylene film and metal level is greatly improved, in follow-up process engineering
It is not easily stripped between middle parylene film and metal level and comes off, thus improve the finished product of processing technology
Rate and reliability.
Accompanying drawing explanation
In order to be illustrated more clearly that the technology contents of the present invention, below in conjunction with embodiment and accompanying drawing specifically
Bright as after, wherein:
Fig. 1 is the process that tradition deposits metal level on parylene film;
Fig. 2 is to strengthen the technological process of adhesiveness between parylene film and metal level.
Detailed description of the invention
Referring to shown in Fig. 2, the present invention provides a kind of parylene film that strengthens to adhere to metal level
The method of property, comprises the steps:
Step 1: take a substrate to be deposited;
Step 2: at Grown parylene film;
Step 3: use oxygen reactive ion etching process, the surface of parylene film is prepared as
Fine hair shape nanostructured;
Step 4: deposit metal on the parylene film being prepared as fine hair shape nanostructured, complete
Become preparation.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is entered
Row clearly and completely describes.The vacuum phase deposition equipment that embodiment is used is SCS company of the U.S.
PDS2010 type depositing device;Parylene polymer performed polymer used is purchased from SCS company;
The reaction and plasma etching apparatus used is the RIE-1D type that Beijing wound micro-nano company produces.
2 illustrate between enhancing parylene film and the metal level that the present invention provides below in conjunction with the accompanying drawings
The process step of adhesiveness.
Step 1 (Fig. 2 a): prepare the silicon chip 21 that a thickness is 250 microns;
Step 2 (Fig. 2 b): growth thickness is the parylene film 22 of 3 microns on silicon chip 21;
Step 3 (Fig. 2 c): control the technological parameter of oxygen reactive ion etching equipment, utilize oxygen,
The surface of parylene film is carried out physics and chemical treatment, in parylene film surface shape
Become villous nanostructured 23;
Further, the technological parameter of oxygen reactive ion etching equipment described in step 3 includes, pressure
It is 1 × 10-6Pa-1×10-5Pa, gas flow is 20sccm, and radio-frequency power is 100-300W.Technique
The purpose of the control of parameter is to form one layer of villous nano junction on the surface of parylene film
Structure 23.
Further, using oxygen described in step 3, the time being passed through is 28 minutes.Use oxygen
Gas, can carry out physical and chemical reaction to the Parylene surface of solids simultaneously.Wherein, high energy etc. from
Daughter carries out physical treatment to Parylene surface;And this plasma can carry out the change of complexity equally
Learn reaction, at Parylene Surface Creation thin polymer film, thus realize chemical treatment.Meanwhile,
The time using oxygen plasma etching is unsuitable long, also unsuitable too short.Time is too short, and etching effect reaches
Less than villous nanostructured;Overlong time, parylene film may be etched completely.
Further, the parylene film surface described in step 3 forms villous nano junction
Structure 23, by the control of technological parameter, the surface of parylene film 22 is reacted deeply from
Son etching 1 microns, forms villous nanostructured 23, i.e. can obtain having enhancing metal and glue
The polyphenylene ethyl film structure of attached property, wherein the monomer height of fine hair shape nanostructured 23 be 50nm~
200nm.This fine hair nanostructured 23, in follow-up deposition process, can be sunk firmly in absorption
Long-pending metal level.
Step 4 (Fig. 2 d): at the parylene film 22 forming fine hair shape nanostructured 23
The method deposition metal level 24 of surface evaporation or sputtering, prepared Parylene sample has pole
After strong adhesiveness, and long-term placement, adhesion characteristics is still stable.
It it is adhesiveness between enhancing parylene film and the metal level of the present invention with reference to Fig. 2, Fig. 2
Process chart.
A kind of based on nanostructured the enhancing the Parylene above embodiment of the present invention provided
Between thin film and metal level, the process of adhesiveness is described in detail, used herein specifically
Principle and the embodiment of the present invention are set forth by individual example, and the explanation of above example is only intended to
Help to understand method and the core concept thereof of the present invention;Simultaneously for one of ordinary skill in the art,
According to the thought of the present invention, the most all will change, to sum up
Described, this specification content should not be construed as limitation of the present invention.
Claims (4)
1. the method strengthening parylene film and metal level adhesiveness, comprises the steps:
Step 1: take a substrate to be deposited;
Step 2: at Grown parylene film;
Step 3: use oxygen reactive ion etching process, the surface of parylene film is prepared as
Fine hair shape nanostructured;
Step 4: deposit metal on the parylene film being prepared as fine hair shape nanostructured, complete
Become preparation.
Enhancing parylene film the most according to claim 1 and the side of metal level adhesiveness
Method, wherein the oxygen reactive ion etching process of step 3, is prepared as the surface of parylene film
Fine hair shape nanostructured, it is not necessary to add other jointing material, utilizes this fluff structures, follow-up
Deposition process in, adsorb the metal level of deposition firmly.
Enhancing parylene film the most according to claim 1 and the side of metal level adhesiveness
Method, wherein metal is prepared by the technique using evaporation or sputtering.
Enhancing parylene film the most according to claim 3 and the side of metal level adhesiveness
Method, as the parylene film of substrate in wherein said evaporation or the technique preparation process of sputtering
Do not heat.
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CN104694879B (en) * | 2015-04-08 | 2017-03-15 | 上海斐腾新材料科技有限公司 | One kind exempts from the vacuum plating process that paints |
CN111874861A (en) * | 2020-05-20 | 2020-11-03 | 北京协同创新研究院 | Method for enhancing adhesion of parylene film and silicon |
CN112327116B (en) * | 2020-11-05 | 2021-07-20 | 北京理工大学 | Discharge detection system and method based on parylene film and charged particles |
CN114107922A (en) * | 2021-11-01 | 2022-03-01 | 中国科学院深圳先进技术研究院 | Flexible stretchable gold film electrode based on reactive ion etching and preparation method thereof |
CN114133611B (en) * | 2021-11-02 | 2023-02-07 | 北京大学 | Method for preparing nano cilium structure on surface of polymer material |
CN117187773B (en) * | 2023-11-03 | 2024-03-08 | 上海锐畅医疗科技有限公司 | Hydrophilic coating for interventional medical instrument and preparation method thereof |
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Surface modification for improved adhesion of a polymer-metal compound;E Dayss etal.;《Surface and Coatings Technology》;19991231;第116-119卷;第986页第1和2.2部分 * |
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